Beyond Moore the challenge for Europe

Transcription

1 Beyond Moore the challenge for Europe Dr. Alfred J. van Roosmalen Vice-President Business Development, NXP Semiconductors Company member of MEDEA+/CATRENE/AENEAS/Point-One FIT-IT 08 Spring Research Wien, May 8, 2008

2 Agenda Value chain de-verticalization Expanding European strengths Ecosystem collaboration 2

3 The semiconductor value chain has become very complex and very multinational e.g. design center wafer fab assembly center customer site 3

4 The semiconductor landscape is changing Increasingly demanding market Disparity in innovation life cycle between semiconductor technologies (typically 3 yrs) and final applications (down to 6 months) Complete reference designs required, first-time-right and zero-defect Leading to ongoing value chain de-verticalization Increasing outsourcing of shareable tasks to Original Design Manufacturers (IP) and Electronic Manufacturing Services (foundries) Growing role of semiconductor companies in defining the final applications 4

5 Chip makers are moving up the value chain Legislator regulations Content provider Gateway mgmt Service provider Content protection Delivery network System integrator Application System mgmt Infrastructure Chip maker Software Semi equipment Wafer foundry Semi materials From the hardware supply side into the final application 5

6 Why are CMOS foundries so successful? Ramp-up of any new wafer fab must be as fast as possible to allow for quick learning and rapid yield improvement To be cost-effective, the scale of CMOS wafer fabs must increase significantly in each new technology node (every 2-3 yrs) Foundries can reach the necessary volume in ramp-up AND final production by combining many chip designs in one unified technology For individual chip makers, this foundry / fablite model is becoming the most cost-effective way to manufacture CMOS digital logic Early engagement in manufacturing technology R&D continues to be needed to guide future chip design methodologies and architectures 6

7 The growing role of chip makers Building intelligent systems for the future requires close collaboration between the innovation teams of chip suppliers and chip customers The electronic part of final applications is increasingly determined and designed by semiconductor chip makers Customer interface is shifting to the boundary between the embedded code in the semiconductor device and the application software 7

8 Intelligent systems need a brain, but they also need arms, legs, ears and eyes Processor Multiple solutions are possible Radio Storage Power Sensor Actuator 8

9 Following Moore s Law is one approach: Monolithic CMOS logic System-on-Chip Processor Storage Radio Advantage: -Smallest footprint Disadvantage: -Limited functionality Power Sensor Actuator More Moore 9

10 Adding More-than-Moore is another: System-on-Chip and System-in-Package Processor Storage Radio Advantage: -Full functionality Disadvantage: -Complex supply chain Power Sensor Actuator More Moore More than Moore 10

11 More-than-Moore adds a non-scaling dimension More than Moore: Diversification Analog/RF Passives HV / Power Sensors Actuators Bio-logic More Moore: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm Information Processing Digital content System-on-Chip (SoC) Interacting with people and environment Non-digital content System-in-Package (SiP) Combining SoC and SiP: Higher Value Systems Beyond Moore 11

12 Creating value in important new applications Health Transport Security Energy Communication Infotainment 12

13 Addressing key societal challenges in the 21 st century Ageing society Personal health monitors Ambient intelligence care Global warming / CO 2 emission Intelligent power control Electric vehicles and solar power All-day traffic jams Electronic road tolling Systems for guided individual transport Terrorism epassport Public security while retaining personal privacy More-than-Moore is the essential element everywhere! 13

14 Building on European strengths Europe has a successful history of structured collaboration between equipment and materials suppliers, chip makers, and final application designers Mobile communication, smartcards, automotive, avionics Europe has a strong fabric of large multinationals, innovative SMEs, and renowned academic institutes, and a broad expertise in setting standards Industries: e.g. semiconductors, lithography, SOI Institutes: e.g. IMEC, CEA-LETI, FhG Standards: e.g. GSM, MPEG, DVD, Bluetooth, DVB, NFC More-than-Moore can be sourced from past generation CMOS infrastructures, thereby enabling effective reuse of existing wafer fabs 14

15 More-than-Moore dimensions are lagging 15

16 It is much more than just miniaturization and cost-effective packaging Multi - functionality Multi - discipline Multi - scale Multi - technology Multi - process and design Multi - material and interface Multi - variability Multi - failure mode 16

17 Need for leveraging critical workforce skills 17

18 Collaboration of all stakeholders is needed The number of More-than-Moore options increases, while the availability of resources (money and people) in Europe is limited Regional competence clusters (e.g. PdCs, Silicon Saxony, PointOne) provide a fertile breeding ground by bringing all R&D actors together Transnational collaboration creates the economy of scale needed to address the growing diversity of More-than-Moore Public-private partnership is a key element in harnessing the European innovation ecosystem vis-a-vis global competition 18

19 Because we are not alone 19

20 Summary Semiconductor industry in Europe is healthy More-than-Moore adds competitive value through new functionalities More-than-Moore supports European public priorities and application strongholds More-than-Moore builds on knowhow and infrastructure in Europe Public-private partnership is a critical enabler for global success 20

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