David B. Miller Vice President & General Manager September 28, 2005
|
|
- Samson Newman
- 5 years ago
- Views:
Transcription
1 Electronic Technologies Business Overview David B. Miller Vice President & General Manager September 28, 2005
2 Forward Looking Statement During the course of this meeting we may make forward-looking statements. All statements that address expectations or projections about the future are forwardlooking statements. Some of these statements include words such as expects, anticipates, plans, intends, projects, and indicates. Although they reflect our current expectations, these statements are not guarantees of future performance, but involve a number of risks, uncertainties, and assumptions. We urge you to review DuPont s SEC filings, particularly its latest annual report on Form 10-K and quarterly report on Form 10-Q, for a discussion of some of the factors which could cause actual results to differ materially. Regulation G The attached charts include company information that does not conform to generally accepted accounting principles (GAAP). Management believes that an analysis of this data is meaningful to investors because it provides insight with respect to ongoing operating results of the company and allows investors to better evaluate the financial results of the company. These measures should not be viewed as an alternative to GAAP measures of performance. Furthermore, these measures may not be consistent with similar measures provided by other companies. This data should be read in conjunction with the company s earnings news release, dated July 26, 2005, for the second quarter which has been furnished to the SEC on Form 8-K, and which is available on the Investor Center of 1
3 Glossary 2 DuPont Electronic Technologies Businesses EP: Electronic Polymers EKC: EKC Technology HPM: High Performance Materials MCM: Microcircuit Materials PCM: Printed Circuit Materials DANM: DuPont Air Products Nanomaterials HDMS: HD Microsystems (Hitachi-DuPont) Technical Terms ARC: Anti-Reflective Coating BGA: Ball Grid Array CMP: Chemical Mechanical Planarization CSP: Chip Scale Package Cu: Copper FC: Flip Chip FED: Field Emission Display IC: Integrated Circuit; Semiconductor LCD: Liquid Crystal Display PDP: Plasma Display Panel PKG: Package PWB: Printed Wiring Board QFP: Quad Flat Pack TMT: Transfer Materials Technology
4 DuPont Electronic Technologies - Overview Microcircuit Materials Business Portfolio Printed Circuit Materials Business Description: Mission: Become Business a Description: leader in enabling the fabrication and connection of ICs to the outside world by extending from circuit materials into IC packaging and IC fabrication materials Industries Served: Communications, Computer, Automotive, Military, Consumer, Medical Employees 2250 Manufacturing Sites: 20 Technology Centers 11 Joint Ventures/Alliances 9 3 Semiconductor Fabrication Europe Americas High Performance Materials Asia Geographic Sales
5 DuPont Electronic Technologies - Global Reach 4 Manufacturing Site R&D Center
6 High Performance Materials 5 A leading supplier of polyimide film and flexible polyimide laminate used in flexible circuits, wire/cable, and specialty parts enabling portability and function in electronic systems. (Brands: Kapton, Pyralux, Microlux ) Segments: Consumer, telecom, computer, automotive, aerospace and military electronics.
7 Microcircuit Materials 6 A leading supplier of thick film compositions that enable miniaturization and improved functionality in electronics, displays and communication systems. (Brands: Fodel, Solamet, GreenTape, Birox ) Segments: Automotive Reliability and Safety, Telecom/ Wireless, Military, Displays, Solar Cells, Embedded Passives, and other specialty applications
8 Printed Circuit Materials 7 A leading supplier of dry film photoresist and photo-tooling film enabling high density printed wiring boards. (Brand: Riston ) Segments: Printed wiring boards for all electronic equipment applications, chemical milling.
9 Semiconductor Fabrication Materials 8 A leading supplier of removers, polymers for advanced photoresists, polyimide stress buffers, and CMP and silicon polishing slurries that enable advanced semiconductors. EKC Technology Electronic Polymers HD Microsystems DuPont-Air Products Nanomaterials Segments: Photoresist makers and semiconductor fabricators
10 Electronics Supply Chain 9 Semiconductor Design Semiconductor Manufacturing Semiconductor Packaging PWB Materials & Manufacturing Solutions PWB Subassemblies Electronic Assembly Note: Area of focus Electronic Equipment Systems
11 Electronic Industry Value Chain (2005) 10 Electronic Equipment $1312Bn Computers $415Bn Communications $270Bn Other Electronics $627Bn Electronic Components $519Bn IC/Semiconductors IC/Semiconductors Package & Test PWB/ Interconnect Substrates Passives Photonic Devices Data Storage Flat Panel Displays Batteries Connectors, Wires, Heat sinks, etc. Electronic Materials $86Bn Fab Materials Wafers, Bulk Gas, Spec Gas, Wet Chem, CMP, Trgt/Precursor, Resists, Ancillaries, Masks Packaging Materials Leadframes, Mold Comp, Die Attach, Encaps, Substrates Interconnect Materials Laminate, Resist and Ancillaries, Ceramic Modules, Solder Masks, Strip and Etch, Plating Chem Passive Materials Embedded Passives, Powders, Electrode Metals, Film, Foil, Separator Photonics Optical Fiber, Glass, Dielectrics, Substrates, Semi Materials Data Storage Disk Substrates, Film Substrates, Mag Materials, Record Heads Flat Panel Displays Glass, Color Filters, Films, Optical Element, Resists, Polymers, Precursors, Thick Film Mat Batteries Lithium, Carbon, NiCad, Film, Metal Can Assembly, Thermal, EMI Solder Paste, Interface Materials, Gaskets, Adhesives Industrial Materials $28Bn Metal Strip, Petrochemicals, Acids, Salts, Ferrosilicon, Oxide Powders, etc. Raw Materials $14Bn Source: Prismark 2005, Henderson Electronic Outlook, DuPont Internal Oil, Gases, Silica, Bauxite, etc. Red Text = DuPont Participation n83.034bes
12 Selected Materials & Components Markets 11 IC Fabrication WW Growth Circuits, IC Pkg, WW Growth Shipments (CAGR) Displays Shipments (CAGR) Silicon Wafers $8B 8% Flexible Circuits $7B 10% Wet Chemicals $800M 4% PWB Laminate $3B 4% Specialty Semi Gases $1B 5% PWB Dry Film Resist $600M 4% IC Photoresists $950M 8% LCD Displays $43B 16% Advanced IC Photoresists $500M 15% PDP Displays $5B 25% CMP Materials $600M 12% BGA Substrates $5B 8% Remover Chemistry $350M 8% IC Molding Compounds $1B 2% Bulk Gases $1B 4% Passive Components $39B 7% Sources: Dataquest, Prismark, DisplaySearch, SEMI, Techcet, Others Red Text = DuPont Participation
13 Market Direction (Last 12 Months/Current Trends) 12 End Markets & Systems Components Geography Cell Phones +/+ Integrated Circuits 0/+ Americas -/0 Telecom Infrastructure -/0 Circuits/Packaging +/+ Europe 0/0 Computers +/+ Flat Panel Displays +/+ Japan +/0 Auto +/0 SE Asia +/+ Military +/0 China +/+
14 Evolution of the Complexity of Integrated Circuit Packages Plastic Quad Flat Pack 13 Wire bonded to lead frame IC Ball Grid Array IC Wire bonded to circuitized substrate, leads replaced with solder bumps Flip Chip IC IC PKG Circuit Wire bonds replaced with solder bumps by flip clip technology, circuitized substrate that will include embedded passives devices in the future (e.g., resistors, capacitors)
15 Industry Trends are Continually Creating New Opportunities Key Device Trends New Capabilities Needed 14 Increasing Speed/bandwidth Drive toward personal portability (wireless, handheld) Increasing functionality, density, and miniaturization Continuing Cost Pressures More demanding thermal management Thin, Large Area Displays Semiconductor Fabrication Chemical Mechanical Planarization (CMP) Copper Interconnect Advanced Photolithography Systems (e.g., resist polymers, ARC polymers, immersion fluids) Semiconductor Packaging Embedded Passives High-Speed Substrates (low loss laminates) Microvia Dielectrics Thermal Solutions Flat Panel Displays Plasma Display Materials Next-Gen Technology (e.g., FEDs) MFG Shift to Asia
16 Strategy Summary 15 Leverage DuPont Science and our strong circuit materials position (and emerging IC fabrication materials position) into Semiconductor Fabrication, Semiconductor Packaging, and Large Area Displays Key Strategic Elements: Become more relevant to the semiconductor industry by leveraging DuPont science and M&A into select opportunities Develop/acquire critical products/ technology to enable next generation integrated IC packages Capture growth from the increasing complexity of ICs and packages and the interaction between the two Commercialize new technologies for large area displays (e.g., FED, TMT) Strengthen Asia Pacific capability Semiconductor Fabrication Applications Lab Production (e.g., Kapton, Microlux, Pyralux ) Displays Applications Lab 13% 1% 5% 16% 2001 Revenue Semiconductor P&C Displays Semiconductor Fab 94% 2005 Revenue Semiconductor P&C Displays Semiconductor Fab 71%
17 DuPont s Electronic Pipeline 16 Immersion Lithography Fluids Advanced Lithography for Packages FED Materials Advanced Photolithography Polymers Next-Generation Photovoltaic Conductors Advanced Laminate Materials Copper Remover Copper-Based CMP Slurries Embedded Passives Next-Generation PDP Conductors Early Development Adv. Development Early Launch Target Markets IC Fabrication IC Packaging & Interconnect Displays
18 Financial Performance History and Forecast Revenue CAGR 28% 9% Sales ($MM) Outlook
Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November
Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November 2006 Forward Looking Statement The presentation today may
More information!"#$"%&' ()#*+,-+.&/0(
!"#$"%&' ()#*+,-+.&/0( Multi Chip Modules (MCM) or Multi chip packaging Industry s first MCM from IBM. Generally MCMs are horizontal or two-dimensional modules. Defined as a single unit containing two
More information21 st Annual Needham Growth Conference
21 st Annual Needham Growth Conference Investor Presentation January 15, 2019 Safe Harbor Statement The information contained in and discussed during this presentation may include forward-looking statements
More informationYole Developpement. Developpement-v2585/ Publisher Sample
Yole Developpement http://www.marketresearch.com/yole- Developpement-v2585/ Publisher Sample Phone: 800.298.5699 (US) or +1.240.747.3093 or +1.240.747.3093 (Int'l) Hours: Monday - Thursday: 5:30am - 6:30pm
More informationElectronic Material Systems
Electronic Material Systems Barry Russell Operating Vice President 1 Safe Harbor Statement Today s presentations may contain forward-looking statements within the meaning of the Private Securities Litigation
More informationWah Lee Industrial Corp. was founded in In order to integrate the industry development of Taiwan with the overall operation requirement of Wah
2010 10 Wah Lee Industrial Corp. was founded in 1968. In order to integrate the industry development of Taiwan with the overall operation requirement of Wah Lee, we defined our mission as "Introduce and
More informationProcesses for Flexible Electronic Systems
Processes for Flexible Electronic Systems Michael Feil Fraunhofer Institut feil@izm-m.fraunhofer.de Outline Introduction Single sheet versus reel-to-reel (R2R) Substrate materials R2R printing processes
More informationTrends in Advanced Packaging Technologies An IMAPS UK view
Trends in Advanced Packaging Technologies An IMAPS UK view Andy Longford Chair IMAPS UK 2007 9 PandA Europe IMAPS UK IeMRC Interconnection event December 2008 1 International Microelectronics And Packaging
More informationThe Future of Packaging ~ Advanced System Integration
The Future of Packaging ~ Advanced System Integration Enabling a Microelectronic World R. Huemoeller SVP, Adv. Product / Platform Develop June 2013 Product Segments End Market % Share Summary 2 New Product
More informationAdvanced High-Density Interconnection Technology
Advanced High-Density Interconnection Technology Osamu Nakao 1 This report introduces Fujikura s all-polyimide IVH (interstitial Via Hole)-multi-layer circuit boards and device-embedding technology. Employing
More informationEMERGING SUBSTRATE TECHNOLOGIES FOR PACKAGING
EMERGING SUBSTRATE TECHNOLOGIES FOR PACKAGING Henry H. Utsunomiya Interconnection Technologies, Inc. Suwa City, Nagano Prefecture, Japan henryutsunomiya@mac.com ABSTRACT This presentation will outline
More informationAn Introduction to Electronics Systems Packaging. Prof. G. V. Mahesh. Department of Electronic Systems Engineering
An Introduction to Electronics Systems Packaging Prof. G. V. Mahesh Department of Electronic Systems Engineering India Institute of Science, Bangalore Module No. # 02 Lecture No. # 08 Wafer Packaging Packaging
More information23. Packaging of Electronic Equipments (2)
23. Packaging of Electronic Equipments (2) 23.1 Packaging and Interconnection Techniques Introduction Electronic packaging, which for many years was only an afterthought in the design and manufacture of
More informationLithography in our Connected World
Lithography in our Connected World SEMI Austin Spring Forum TOP PAN P R INTING CO., LTD MATER IAL SOLUTIONS DIVISION Toppan Printing Co., LTD A Broad-Based Global Printing Company Foundation: January 17,
More informationMarket and technology trends in advanced packaging
Close Market and technology trends in advanced packaging Executive OVERVIEW Recent advances in device miniaturization trends have placed stringent requirements for all aspects of product manufacturing.
More informationChapter 2. Literature Review
Chapter 2 Literature Review 2.1 Development of Electronic Packaging Electronic Packaging is to assemble an integrated circuit device with specific function and to connect with other electronic devices.
More informationIMPACT OF 450MM ON CMP
IMPACT OF 450MM ON CMP MICHAEL CORBETT MANAGING PARTNER LINX CONSULTING, LLC MCORBETT@LINX-CONSULTING.COM PREPARED FOR CMPUG JULY 2011 LINX CONSULTING Outline 1. Overview of Linx Consulting 2. CMP Outlook/Drivers
More informationSAMPLE SLIDES & COURSE OUTLINE. Core Competency In Semiconductor Technology: 2. FABRICATION. Dr. Theodore (Ted) Dellin
& Digging Deeper Devices, Fabrication & Reliability For More Info:.com or email Dellin@ieee.org SAMPLE SLIDES & COURSE OUTLINE In : 2. A Easy, Effective, of How Devices Are.. Recommended for everyone who
More informationTwo major features of this text
Two major features of this text Since explanatory materials are systematically made based on subject examination questions, preparation
More informationPackaging Roadmap: The impact of miniaturization. Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007
Packaging Roadmap: The impact of miniaturization Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007 The Challenges for the Next Decade Addressing the consumer experience using the converged
More informationCMOS Digital Integrated Circuits Lec 2 Fabrication of MOSFETs
CMOS Digital Integrated Circuits Lec 2 Fabrication of MOSFETs 1 CMOS Digital Integrated Circuits 3 rd Edition Categories of Materials Materials can be categorized into three main groups regarding their
More informationApplication Bulletin 240
Application Bulletin 240 Design Consideration CUSTOM CAPABILITIES Standard PC board fabrication flexibility allows for various component orientations, mounting features, and interconnect schemes. The starting
More informationR&D Requirements from the 2004 inemi Roadmap. April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi
R&D Requirements from the 2004 inemi Roadmap April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi Topics Covered Overview of inemi and the 2004 Roadmap Situation Analysis Highlights from the
More informationIntegrated Photonics using the POET Optical InterposerTM Platform
Integrated Photonics using the POET Optical InterposerTM Platform Dr. Suresh Venkatesan CIOE Conference Shenzhen, China Sept. 5, 2018 POET Technologies Inc. TSXV: PUBLIC POET PTK.V Technologies Inc. PUBLIC
More informationFan-Out Wafer Level Packaging Patent Landscape Analysis
Fan-Out Wafer Level Packaging Patent Landscape Analysis Source: Infineon Source: TSMC Source: ASE November 2016 Source: Deca Technologies Source: STATS ChipPAC Source: Nepes KnowMade Patent & Technology
More informationTechnology Trends and Future History of Semiconductor Packaging Substrate Material
Review 6 Technology Trends and Future History of Semiconductor Packaging Substrate Material Yoshihiro Nakamura Advanced Performance Materials Operational Headquarters Advanced Core Materials Business Sector
More informationCHAPTER I. Introduction. 1.1 Overview of Power Electronics Packaging
CHAPTER I Introduction 1.1 Overview of Power Electronics Packaging Basically, power electronics packages provide mechanical support, device protection, cooling and electrical connection and isolation for
More informationAssembly/Packagng RF-PCB. Thick Film. Thin Film. Screening/Test. Design Manual
Thick Film Thin Film RF-PCB Assembly/Packagng Screening/Test Design Manual RHe Design Manual The following rules are effective for the draft of circuit boards and hybrid assemblies. The instructions are
More informationPlan Optik AG. Plan Optik AG PRODUCT CATALOGUE
Plan Optik AG Plan Optik AG PRODUCT CATALOGUE 2 In order to service the high demand of wafers more quickly, Plan Optik provides off the shelf products in sizes from 2 up to 300mm diameter. Therefore Plan
More informationDisplay Materials and Components Report - Glass Slimming 2013
Display Materials and Components Report - Glass Slimming 2013 May 2013 Doo.Kim@ihs.com www.displaybank.com 1/130 No material contained in this report may be reproduced in whole or in part without the express
More informationFlexline - A Flexible Manufacturing Method for Wafer Level Packages (Extended Abstract)
Flexline - A Flexible Manufacturing Method for Wafer Level Packages (Extended Abstract) by Tom Strothmann, *Damien Pricolo, **Seung Wook Yoon, **Yaojian Lin STATS ChipPAC Inc.1711 W Greentree Drive Tempe,
More informationHigh efficient heat dissipation on printed circuit boards
High efficient heat dissipation on printed circuit boards Figure 1: Heat flux in a PCB Markus Wille Schoeller Electronics Systems GmbH www.schoeller-electronics.com Abstract This paper describes various
More informationNewport Corporation Company Overview
Newport Corporation Company Overview Forward Looking Statements Other than the historical financial data, statements in this presentation are forward-looking statements that are based on current expectations
More informationTape Automated Bonding
Tape Automated Bonding Introduction TAB evolved from the minimod project begun at General Electric in 1965, and the term Tape Automated Bonding was coined by Gerard Dehaine of Honeywell Bull in 1971. The
More information64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array
64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array 69 64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array Roland Jäger and Christian Jung We have designed and fabricated
More informationshaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS
shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS WHO ARE WE? XTPL S.A. is a company operating in the nanotechnology segment. The interdisciplinary team of XTPL develops on a global scale
More informationLaminate Based Fan-Out Embedded Die Technologies: The Other Option
Laminate Based Fan-Out Embedded Die Technologies: The Other Option Theodore (Ted) G. Tessier, Tanja Karila*, Tuomas Waris*, Mark Dhaenens and David Clark FlipChip International, LLC 3701 E University Drive
More informationTechSearch International, Inc. Corporate Overview E. Jan Vardaman, President
TechSearch International, Inc. Corporate Overview E. Jan Vardaman, President Corporate Background Founded in 1987 and headquartered in Austin, Texas Recognized around the world as a leading consulting
More informationHermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films
Hermetic Packaging Solutions using Borosilicate Glass Thin Films 1 Company Profile Company founded in 2006 ISO 9001:2008 qualified since 2011 Headquarters and Production in Dresden, Germany Production
More informationNanotechnology and its effect on Electronics Manufacturing
Nanotechnology and its effect on Electronics Manufacturing Dr. Alan Rae Vice President, Market & Business Development, NanoDynamics, Inc. Dr. Robert C. Pfahl, Jr. VP of Operations, inemi Topics Covered
More informationMICROBUMP CREATION SYSTEM FOR ADVANCED PACKAGING APPLICATIONS
MICROBUMP CREATION SYSTEM FOR ADVANCED PACKAGING APPLICATIONS Andrew Ahr, EKC Technology, & Chester E. Balut, DuPont Electronic Technologies Alan Huffman, RTI International Abstract Today, the electronics
More informationChapter 11 Testing, Assembly, and Packaging
Chapter 11 Testing, Assembly, and Packaging Professor Paul K. Chu Testing The finished wafer is put on a holder and aligned for testing under a microscope Each chip on the wafer is inspected by a multiple-point
More informationSemiconductor and LED Markets. Jon Sabol Vice President and General Manager Semiconductor and LED Division
Semiconductor and LED Markets Jon Sabol Vice President and General Manager Semiconductor and LED Division Semiconductor & LED Investing in Semiconductor and LED $ Millions 300 200 27% CAGR 100 0 * FY06
More informationIndicators Point to Sustainable Semiconductor Market Recovery
Gartner Dataquest Alert Indicators Point to Sustainable Semiconductor Market Recovery Positive leading indicators out of Asia/Pacific and Japan, as well as improved guidance from selected U.S. and European
More informationCompression Molding. Solutions for 3D TSV and other advanced packages as well as cost savings for standard package applications
Compression Molding Solutions for 3D TSV and other advanced packages as well as cost savings for standard package applications 1. Company Introduction 2. Package Development Trend 3. Compression FFT Molding
More informationEnd-of-line Standard Substrates For the Characterization of organic
FRAUNHOFER INSTITUTe FoR Photonic Microsystems IPMS End-of-line Standard Substrates For the Characterization of organic semiconductor Materials Over the last few years, organic electronics have become
More information(a) (d) (e) (b) (c) (f) 3D-NAND Flash and Its Manufacturing Process
3D-NAND Flash and Its Manufacturing Process 79 (d) Si Si (b) (c) (e) Si (f) +1-2 (g) (h) Figure 2.33 Top-down view in cap oxide and (b) in nitride_n-2; (c) cross-section near the top of the channel; top-down
More informationGLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS
GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS SMC057C August Margareth Gagliardi Project Analyst ISBN: 1-62296-338-5 BCC Research 49 Walnut Park, Building 2 Wellesley, MA 02481
More informationA Perspective on Semiconductor Equipment. R. B. Herring March 4, 2004
A Perspective on Semiconductor Equipment R. B. Herring March 4, 2004 Outline Semiconductor Industry Overview of circuit fabrication Semiconductor Equipment Industry Some equipment business strategies Product
More informationEMBEDDED ACTIVE DEVICE PACKAGING TECHNOLOGY FOR REAL DDR2 MEMORY CHIPS
EMBEDDED ACTIVE DEVICE PACKAGING TECHNOLOGY FOR REAL DDR2 MEMORY CHIPS Yin-Po Hung, Tao-Chih Chang, Ching-Kuan Lee, Yuan-Chang Lee, Jing-Yao Chang, Chao-Kai Hsu, Shu-Man Li, Jui-Hsiung Huang, Fang-Jun
More informationElectroless Bumping for 300mm Wafers
Electroless Bumping for 300mm Wafers T. Oppert Internepcon 2006 Tokyo Big Sight, Japan Outline Short Company Profile Electroless Ni/Au Under Bump Metallization UBM for Copper Devices Solder Bumping: Stencil
More informationB. Flip-Chip Technology
B. Flip-Chip Technology B1. Level 1. Introduction to Flip-Chip techniques B1.1 Why flip-chip? In the development of packaging of electronics the aim is to lower cost, increase the packaging density, improve
More informationIWORID J. Schmitz page 1. Wafer-level CMOS post-processing Jurriaan Schmitz
IWORID J. Schmitz page 1 Wafer-level CMOS post-processing Jurriaan Schmitz IWORID J. Schmitz page 2 Outline Introduction on wafer-level post-proc. CMOS: a smart, but fragile substrate Post-processing steps
More informationPHGN/CHEN/MLGN 435/535: Interdisciplinary Silicon Processing Laboratory. Simple Si solar Cell!
Where were we? Simple Si solar Cell! Two Levels of Masks - photoresist, alignment Etch and oxidation to isolate thermal oxide, deposited oxide, wet etching, dry etching, isolation schemes Doping - diffusion/ion
More informationAMD ATI TSMC 28 nm Gate Last HKMG CMOS Process
AMD ATI 7970 215-0821060 TSMC 28 nm Gate Last HKMG CMOS Process Package Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Package Analysis Some of the
More informationLecture: Integration of silicon photonics with electronics. Prepared by Jean-Marc FEDELI CEA-LETI
Lecture: Integration of silicon photonics with electronics Prepared by Jean-Marc FEDELI CEA-LETI Context The goal is to give optical functionalities to electronics integrated circuit (EIC) The objectives
More informationTAIPRO Engineering. Speaker: M. Saint-Mard Managing director. TAIlored microsystem improving your PROduct
TAIPRO Engineering MEMS packaging is crucial for system performance and reliability Speaker: M. Saint-Mard Managing director TAIPRO ENGINEERING SA Michel Saint-Mard Administrateur délégué m.saintmard@taipro.be
More informationUltra-Thin, Highly Flexible Cables and Interconnections for Low and High Frequencies
Ultra-Thin, Highly Flexible Cables and Interconnections for Low and High Frequencies Hans Burkard a, Tobias Lamprecht b, Thomas Morf b, Bert Jan Offrein b, Josef Link a a Hightec MC AG, Fabrikstrasse,
More informationStrip Tinning China & Asia. Strip Tinning Ltd UK. Listen, Research, Innovate, Design...
Listen, Research, Innovate, Design... Strip Tinning Ltd UK Arden Business Park Arden Road Birmingham B45 0JA United Kingdom Tel.: +44 (0)121 457 7675 Fax.: +44 (0)121 453 6532 sales@striptinning.com Strip
More informationInnovations Push Package-on-Package Into New Markets. Flynn Carson. STATS ChipPAC Inc Kato Rd Fremont, CA 94538
Innovations Push Package-on-Package Into New Markets by Flynn Carson STATS ChipPAC Inc. 47400 Kato Rd Fremont, CA 94538 Copyright 2010. Reprinted from Semiconductor International, April 2010. By choosing
More informationHigh-yield Fabrication Methods for MEMS Tilt Mirror Array for Optical Switches
: MEMS Device Technologies High-yield Fabrication Methods for MEMS Tilt Mirror Array for Optical Switches Joji Yamaguchi, Tomomi Sakata, Nobuhiro Shimoyama, Hiromu Ishii, Fusao Shimokawa, and Tsuyoshi
More informationCMP for More Than Moore
2009 Levitronix Conference on CMP Gerfried Zwicker Fraunhofer Institute for Silicon Technology ISIT Itzehoe, Germany gerfried.zwicker@isit.fraunhofer.de Contents Moore s Law and More Than Moore Comparison:
More informationMCO Applications. 24th January 2011, Washington DC. JSTC 24 January
MCO Applications 24th January 2011, Washington DC JSTC 24 January 2011 1 Semiconductor as enabling industry Semiconductors are everywhere and can be found as advanced solutions in (examples): PC Power
More informationManufacturing Development of a New Electroplated Magnetic Alloy Enabling Commercialization of PwrSoC Products
Manufacturing Development of a New Electroplated Magnetic Alloy Enabling Commercialization of PwrSoC Products Trifon Liakopoulos, Amrit Panda, Matt Wilkowski and Ashraf Lotfi PowerSoC 2012 CONTENTS Definitions
More informationCTS Corporate Profile. CTS Today. Your Partner in Smart Solutions. Introduction
Your Partner in Smart Solutions CTS Corporate Profile Introduction CTS Corporation (NYSE: CTS), founded in 1896 as Chicago Telephone Supply Company, is a global leader in the design and manufacturing of
More informationCHAPTER 11: Testing, Assembly, and Packaging
Chapter 11 1 CHAPTER 11: Testing, Assembly, and Packaging The previous chapters focus on the fabrication of devices in silicon or the frontend technology. Hundreds of chips can be built on a single wafer,
More informationPowerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M 512 Megabit DDR2 SDRAM Structural Analysis
February 23, 2007 Powerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationSectional Design Standard for High Density Interconnect (HDI) Printed Boards
IPC-2226 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Sectional Design Standard for High Density Interconnect (HDI) Printed Boards Developed by the HDI Design Subcommittee (D-41) of the HDI Committee
More informationApplication-Based Opportunities for Reused Fab Lines
Application-Based Opportunities for Reused Fab Lines Semicon China, March 17 th 2010 Keith Best Simax Lithography S I M A X A L L I A N C E P A R T N E R S Outline Market: Exciting More than Moore applications
More informationLegacy & Leading Edge Both are Winners
Legacy & Leading Edge Both are Winners Semicon CMP User Group July 16, 2015 Sue Davis 408-833-5905 CMP Team Contributors: Mike Fury, Ph.D. Karey Holland, Ph.D. Jerry Yang, Ph.D. www.techcet.com 1 Outline
More informationCORE EXPERTISE IN YOUR TECHNOLOGIES
CORE EXPERTISE IN YOUR TECHNOLOGIES MERSEN INSIDE MERSEN INSIDE MERSEN INSIDE MERSEN INSIDE CORPORATE PROFILE Global expert in electrical power and advanced materials, Mersen designs innovative solutions
More informationSiP packaging technology of intelligent sensor module. Tony li
SiP packaging technology of intelligent sensor module Tony li 2016.9 Contents What we can do with sensors Sensor market trend Challenges of sensor packaging SiP technology to overcome challenges Overview
More informationAntennas For Aerospace and Defense
Antennas For Aerospace and Defense Applying TE s Leading Consumer and Composite Technologies to Deliver Lighter, Smaller Solutions for Harsh Environments in Aerospace and Defense Advanced Antennas The
More informationThe Development of the Semiconductor CVD and ALD Requirement
The Development of the Semiconductor CVD and ALD Requirement 1 Linx Consulting 1. We create knowledge and develop unique insights at the intersection of electronic thin film processes and the chemicals
More informationUltra-thin, highly flexible RF cables and interconnections
Ultra-thin, highly flexible RF cables and interconnections Hans Burkard, Hightec MC AG, Lenzburg, Switzerland Urs Brunner, Hightec MC AG, Lenzburg, Switzerland Karl Kurz, Hightec MC AG, Lenzburg, Switzerland
More informationBenzocyclobutene Polymer dielectric from Dow Chemical used for wafer-level redistribution.
Glossary of Advanced Packaging: ACA Bare Die BCB BGA BLT BT C4 CBGA CCC CCGA CDIP or CerDIP CLCC COB COF CPGA Anisotropic Conductive Adhesive Adhesive with conducting filler particles where the electrical
More informationEMERGING INKJET PRINTING TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS
EMERGING INKJET PRINTING TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS AVM091B November 2014 Andrew McWilliams Project Analyst ISBN: 1-56965-999-0 BCC Research 49 Walnut Park, Building 2 Wellesley, MA
More informationNational Centre for Flexible Electronics
National Centre for Flexible Electronics Tripartite Partnership Government FlexE Centre - A platform for a meaningful interaction between industry and academia. An interdisciplinary team that advances
More informationSemiconductor Process Diagnosis and Prognosis for DSfM
Semiconductor Process Diagnosis and Prognosis for DSfM Department of Electronic Engineering Prof. Sang Jeen Hong Nov. 19, 2014 1/2 Agenda 1. Semiconductor Manufacturing Industry 2. Roles of Semiconductor
More informationAGC Glass Technology Solution to Highly Functional Display Needs
AGC Glass Technology Solution to Highly Functional Display Needs Takahiro IKEZAKI Vice President Electronics Glass General Division, AGC Electronics, Asahi Glass Co., Ltd. June 5, 2012 -Contents- AGC Strengths
More informationFlip-Chip for MM-Wave and Broadband Packaging
1 Flip-Chip for MM-Wave and Broadband Packaging Wolfgang Heinrich Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH) Berlin / Germany with contributions by F. J. Schmückle Motivation Growing markets
More information3D TSV Micro Cu Column Chip-to-Substrate/Chip Assmbly/Packaging Technology
3D TSV Micro Cu Column Chip-to-Substrate/Chip Assmbly/Packaging Technology by Seung Wook Yoon, *K. T. Kang, W. K. Choi, * H. T. Lee, Andy C. B. Yong and Pandi C. Marimuthu STATS ChipPAC LTD, 5 Yishun Street
More informationPASSIVE COMPONENT MARKET OUTLOOK:
PASSIVE COMPONENT MARKET OUTLOOK: C A PA C I T O R S, R E S I S T O R S & I N D U C T O R S A NEW MARKET RESEARCH REPORT FROM PAUMANOK PUBLICATIONS, INC. FOR 2007 ABOUT THE REPORT: This report addresses
More informationSilicon Interposers enable high performance capacitors
Interposers between ICs and package substrates that contain thin film capacitors have been used previously in order to improve circuit performance. However, with the interconnect inductance due to wire
More informationPOSSUM TM Die Design as a Low Cost 3D Packaging Alternative
POSSUM TM Die Design as a Low Cost 3D Packaging Alternative The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration
More informationSESUB - Its Leadership In Embedded Die Packaging Technology
SESUB - Its Leadership In Embedded Die Packaging Technology Sip Conference China 2018 TDK Corporation ECBC, PAF, SESUB BU Kofu, Japan October 17, 2018 Contents SESUB Introduction SESUB Process SESUB Quality
More informationHigh Efficient Heat Dissipation on Printed Circuit Boards. Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH
High Efficient Heat Dissipation on Printed Circuit Boards Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH m.wille@se-pcb.de Introduction 2 Heat Flux: Q x y Q z The substrate (insulation)
More informationAccelerating Growth and Cost Reduction in the PV Industry
Accelerating Growth and Cost Reduction in the PV Industry PV Technology Roadmaps and Industry Standards An Association s Approach Bettina Weiss / SEMI PV Group July 29, 2009 SEMI : The Global Association
More informationThermal Cycling and Fatigue
Thermal Cycling and Fatigue Gil Sharon Introduction The majority of electronic failures are thermo-mechanically related by thermally induced stresses and strains. The excessive difference in coefficients
More informationFirst Demonstration of Panel Glass Fan-out (GFO) Packages for High I/O Density and High Frequency Multi-Chip Integration
First Demonstration of Panel Glass Fan-out (GFO) Packages for High I/O Density and High Frequency Multi-Chip Integration Tailong Shi, Chintan Buch,Vanessa Smet, Yoichiro Sato, Lutz Parthier, Frank Wei
More informationThe Future of Packaging and Cu Wire Bonding Advances. Ivy Qin
The Future of Packaging and Cu Wire Bonding Advances Ivy Qin Introduction Semiconductors have been around for over 70 years Packaging is playing a more and more important role, providing low cost high
More informationUV Nanoimprint Stepper Technology: Status and Roadmap. S.V. Sreenivasan Sematech Litho Forum May 14 th, 2008
UV Nanoimprint Stepper Technology: Status and Roadmap S.V. Sreenivasan Sematech Litho Forum May 14 th, 2008 Overview Introduction Stepper technology status: Patterning and CD Control Through Etch Alignment
More informationPrinted Electronics: success stories and future commercial applications
Printed Electronics: success stories and future commercial applications Dr Guillaume Chansin @gchansin June 2017 Helping you profit from emerging technologies Advantages of printed electronics Mass production
More informationNanotechnology, the infrastructure, and IBM s research projects
Nanotechnology, the infrastructure, and IBM s research projects Dr. Paul Seidler Coordinator Nanotechnology Center, IBM Research - Zurich Nanotechnology is the understanding and control of matter at dimensions
More informationIntel Demonstrates High-k + Metal Gate Transistor Breakthrough on 45 nm Microprocessors
Intel Demonstrates High-k + Metal Gate Transistor Breakthrough on 45 nm Microprocessors Mark Bohr Intel Senior Fellow Logic Technology Development Kaizad Mistry 45 nm Program Manager Logic Technology Development
More informationProperty right statement: Copyright of charts, tables and sentences in this report belongs to
The Vertical Portal for China Business Intelligence. Semiconductor Equipment Industry Report, 2009 Nov/2009 Property right statement: Copyright of charts, tables and sentences in this report belongs to
More information3M XYZ-Axis Electrically Conductive Adhesive Transfer Tape (ECATT) 9723
Technical Data November, 2009 M XYZ-Axis Electrically Conductive Adhesive Transfer Tape (ECATT) 972 Product Description M XYZ-Axis Electrically Conductive Adhesive Transfer Tape (ECATT) 972 is an isotropically
More informationNanofluidic Diodes based on Nanotube Heterojunctions
Supporting Information Nanofluidic Diodes based on Nanotube Heterojunctions Ruoxue Yan, Wenjie Liang, Rong Fan, Peidong Yang 1 Department of Chemistry, University of California, Berkeley, CA 94720, USA
More informationOrganic Packaging Substrate Workshop Overview
Organic Packaging Substrate Workshop Overview Organized by: International Electronics Manufacturing Initiative (inemi) Mario A. Bolanos November 17-18, 2009 1 Organic Packaging Substrate Workshop Work
More informationMICROELECTRONICS ASSSEMBLY TECHNOLOGIES. The QFN Platform as a Chip Packaging Foundation
West Coast Luncheon January 15, 2014. PROMEX PROMEX INDUSTRIES INC. MICROELECTRONICS ASSSEMBLY TECHNOLOGIES The QFN Platform as a Chip Packaging Foundation 3075 Oakmead Village Drive Santa Clara CA Ɩ 95051
More information