LeBen Semiconductor Inc. PRODUCTS. 216, Doha-ri Munbaek-myeon, Jincheon-gun, Chungcheongbuk-do, , KOREA http ://

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1 LeBen Semiconductor Inc. PRODUCTS 216, Doha-ri Munbaek-myeon, Jincheon-gun, Chungcheongbuk-do, , KOREA http ://

2 Company Intoduction Company name : LeBen Semiconductor Inc. President : Lee, Hee Woo Seoul office : 2 nd FL., Daeyoon Building, , Seo Cheo -Dong, Seo Cheo-Gu, Seoul, , KOREA Tel : FAX : Factory : 216, Doha-ri Munbaek-myeon, Jincheon-gun, Chungcheongbuk-do , KOREA Tel : FAX : Website : dhseo@lebensemi.com 2 LeBen Semiconductor Inc.

3 Key Concept of LACP Best Replacement Solution for Ceramic Package Air cavity for optimizing initial performance of devices Saw-singulated leadless type for miniaturization All transfer molded housing for physical stability Three dimensional frame structure stacking two leadframes by solder joint, for high electrical and thermal performance Hole & gang seal with multi-lid for high reliability and productivity 3 LeBen Semiconductor Inc.

4 Package portfolio Package Body size Pin Count Application PKG Height Note 3x3 3mm x 3mm phemt 1.53mm Available On going On going LACP 4x4 5x6 4mm x 4mm 5mm x 6mm LNA, Down Converter, RF GHz Power Amp 1.53mm 1.75mm Available On going On going Available On going On going 6x6 6mm x 6mm Phase Shifter, RF 14 GHz 1.75mm Available On going On going PMBG 12LD 24LD 5mm x 5mm 7mm x 7mm Power Amp Drive Amp, Down Converter 1.75mm 1.75mm On going On going Available On going On going Available 4 LeBen Semiconductor Inc.

5 Package Structure PMBG (Plastic Molded Bottom Grounded PKG) A-stage Epoxy Liquid for Hole Sealing Plastic Lid PATENT Molded Plastic Walls Leadframe P.A Chip set wire epoxy Heatsink As a Special Packaging Technology required of Air-atmosphere, Performed its Sealing by using Alpha-stage Epoxy for Tight Hermeticity. No. PACKAGE BODY SIZE (W,L,T) LEAD PITCH CAV. SIZE (W,L,T) BOTTOM GROUND (HEAT SINK) SIZE 1 PMBG-SOIC x.200 x x.110 x x.190 x PMBG- SQFP x.200 x x.110 x x.195 x PMBG- SOIC x.406 x x.220 x x.401 x PMBG-SQFP x.282 x x.152 x x.230 x PMBG-SOIC x.612 x x.460 x x.607 x PMBG-SQFP x.200 x x.110 x x.192 x LeBen Semiconductor Inc.

6 Package Structure Plastic Molded Bottom Ground Package (2) PMBG-SQFP 12LD PMBG-SQFP 24-1LD 6 LeBen Semiconductor Inc.

7 Package Structure Developed & Granted Patent Status Applied Year Description Section View Applied Country Registered Patent No. 96 Method of making an air tight cavity in an assembly package and product made by the method; (PMFL) PMFL U.S.A, Taiwan ( ), ( ) 96 Method of making an air tight cavity in an assembly package and product made by the method; (PMBG with Hole Seal) PMBG U.S.A ( ) 96 Method of making an air tight cavity in an assembly package and product made by the method; (Pre-Mold Base Bottom) U.S.A, Thailand ( ) 97 Method of making package bases for Semiconductor Devices; (4 ways of Double Molded Base Bottom to Reduce Flash & Burrs) Korea ( ) 7 LeBen Semiconductor Inc.

8 Package Structure LACP Package (Leadless Air Cavity Plastic Package) PATENT PMF Base PATENT LACP_MONO_ 3x3, 4x4, 6x6 PCB Base 8 LeBen Semiconductor Inc.

9 Package Structure LACP Package (Leadless Air Cavity Plastic Package) PATENT LACP_CAVE_5x6 PATENT TDF Structure (3 rd Dimensional Frame) 9 LeBen Semiconductor Inc.

10 Package Structure Air Cavity Plastic Flanged Type PATENT Plastic Molded Lid Plastic Molded Cavity Wall Epoxy Adhesive Epoxy Sealant Solder Joint Copper Leadframe Copper Heat Sink 10 LeBen Semiconductor Inc.

11 Package Structure Air Cavity Plastic Micro-X PATENT 11 LeBen Semiconductor Inc.

12 Package Structure TDF (Three Dimensional Frame ) PATENT FRONT REAR 12 LeBen Semiconductor Inc.

13 Package Structure PMF (Pre-molded Frame) PATENT Plastic Package Base for CMOS Image Sensor 13 LeBen Semiconductor Inc.

14 Package Structure Conversion & Improvement for MMIC Package AIR-CAVITY PACKAGE CERAMIC Leadless Air Cavity Plastic Package for High Performance PLASTIC Ceramic SOIC 08 5x7 PMBG PATENT Plastic Molded Bottom Ground Package 5x7 LACP Leadless Air Cavity Plastic Package LACP_CAVE_5x6 14 LeBen Semiconductor Inc.

15 Process Flow Wafer Pre-molded Frame & Lid Mold Die Bonding Electrical Test Wire Bonding Tape & Reel Lid Attach Hole Sealing QC Gate Shipping Marking Sawing Package Singulation 15 LeBen Semiconductor Inc.

16 Process Flow Process flow chart for PMBG package Wafer/Tape/Frame Wafer mount scribing QC Incoming Inspection 2nd Visual Inspection(Die) QC Front Gate (AQL4.0%) Die Attach Visual Monitor Min. 2 Times/Shift Epoxy Cure Wire Bond Visual Monitor Min. 2 Times/Shift B.P.T : Min. Once/Shift 3 rd Optical Inspection QC Front Gate (LTPD 5/0) Lid Attach Visual Monitor Min. 2 Times/Shift Epoxy Cure X - Ray Monitor Min. Once/Shift Hole Seal Solder Plating(Outside) QC Incoming Inspection Laser Marking Form/Singulation Dimension Monitor Min. Once/Shift Solder-ability Test : Min. Once/Week Sampling Gross Leak Test (AQL 0.1%) External Visual Inspection Gross Leak Monitor : Min. Once/Shift LTPD 5/0 T.C.T : Once/Week T.S.T : Once/Week QC Backend Gate(AQL 0.1%) Packing Final Gate B.S.T : Min. Once/Shift Store 16 LeBen Semiconductor Inc.

17 Frame attach ( Pre-molded frame & Lid mold ) 17 LeBen Semiconductor Inc.

18 Reliability Test Reliability Test Test Sequence Aging Process MIL-STD Condition Dry 150ºC /10Min Dry Gross Leak Bubble Detection without Bombing AGING PROCESS DRY GROSS LEAK TEST RESULT PROCESS CONDITION CYCLE / TIME LACP_CAVE_5x6 LACP_MONO_6x6 LACP_MONO_4x4 Thermal Shock 125ºC, -55ºC x 500 0/22 0/22 0/22 Temperature / Humidity 85ºC, 85%RH 500 Hrs 0/22 0/22 0/22 Storage Life 150 ºC 500 Hrs 0/22 0/22 0/22 Preconditioning for G/L 45 PSI 8 Hrs 0/22 0/22 0/22 Solder Pot Dipping 245 ºC x 3 / 10 Sec 0/10 0/10 0/10 18 LeBen Semiconductor Inc.

19 Moisture Sensitivity Classification Moisture Sensitivity Classification Process Condition (JESD22-A113 A113-B) Pre- conditioning Electrical Test Visual Inspection Dry Gross Leak Test (Additional) Temp. Cycle Bake Soak IR / Convection Reflow Flux Immersion Electrical Test <-40ºC, >60ºC C / 5cycles (Optional) 125(±5) 5)ºC C / >24 hrs 3ºC/sec Ramp-up 125(±5) 5)ºC/120sec 183 ºC/150sec 220~235ºC/20sec - 6ºC/sec Ramp-down Bubble Detection in DO2 Solution, 125 ºC Level 1 85ºC C /85%RH, 168Hrs Level 2 85ºC C /60%RH, 168Hrs Level 2a 30ºC C /60%RH, 696Hrs Level 3 30ºC C /60%RH, 192Hrs Level 4 30ºC C /60%RH, 96Hrs Level 5 85ºC C /60%RH, 728Hrs Level 5a 30ºC C /60%RH, 48Hrs Level 6 30ºC C /60%RH, 6Hrs Result of Preconditioning Test Rank Level 1 Package LACP_MONO_4x4 Device Down Converter MMIC for DBS LNB 19 LeBen Semiconductor Inc.

20 Process Capacity Process Monthly Note Frame attach / Hole seal 800 K Assembly 1000 K Test Customer Dependent 20 LeBen Semiconductor Inc.

21 Basic structure of LACP ACP_MONO_SLIM ACP_FLAT_1 ACP_CAVE ACP_MONO_HEAVY ACP_FLAT_2 ACP_CAVE_2 21 LeBen Semiconductor Inc.

22 Application Based on our patented technologies, we provide the new air-cavity plastic packages further improved for Customer s applications such as : MMICs for slim Mobile Handset, for Satellite Broadcast Receiver, as well as for Wireless Communication System SAW Filter, Power & RF Discrete, CMOS Image Sensor, MEMS and etc. 22 LeBen Semiconductor Inc.

23 Easy Access for Development Our new technology of air-cavity plastic packages can support and meet effectively the recent MMIC package demands in small lots and varieties, as in the case of the ceramic package development : Remarkable Reduction of Tool Charge ; $ 5,000 ~ $ 30,000 (small lot orders accessible) Quick Delivery by volume Production within 2 months (after receipt of Customer Design Requirement) Specialized Engineering for Flexible and Diverse Designs (to Meet Customer s Requirement and Convenience) Highest Pass Rate of Package Development and Stable Quality Assurance Reasonable Reliability and Refined Performance 23 LeBen Semiconductor Inc.

24 Competitive Edge Our new RF packages also can give you a unique competitiveness distinguished from other similar ones, as follows : Economic Packaging Price : Comparing with Ceramic Packages Miniaturization pursuing towards the trend of State-of-the-Art Packaging Technology Excellent Hermeticity and Stability of Thermo-Set Plastic Base Higher Productivity by Minimized Investment Ideal Package Design for Higher Thermal Dissipation and Lower Parasitic Noise 24 LeBen Semiconductor Inc.

25 Performance New air cavity plastic packages will satisfy the key specifications requiring RF and heat sink performance : High Frequency applicable : ~ upto 20 GHz Higher Heat Dissipation ability : θ ja =15 C/W Air Tight Cavity : Higher than Moisture Sensitivity Level 2 25 LeBen Semiconductor Inc.

26 Engineering Support Upon customer request, engineering service for design, proto samples STR run volume production of RF packaging as well as RF test would be provided. Review of Requirement & Package Design for Free Charge Step-by-Step Open-Tool Line-up, finally aiming at Free Tool Charge 26 LeBen Semiconductor Inc.