Specifications subject to change Packaging

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1 VCSEL Standard Product Packaging Options All standard products are represented in the table below. The Part Number for a standard product is determined by replacing the x in the column Generic Part Number with a valid Package designator from the column labeled Package. (Example: The Part Number for a 680S-0000-x0y1 with a TO-46 package (i.e., a B designator) results in a Part Number of 680S-0000-B0y1.) Wavelength Output Power (1) Package(s) (2) Model Number (2) Notes Single Mode VCSELs (single aperture) nm 0.7 mw B, G I0-0680S-0000-x0y1 Line Width 100MHz nm 0.7 mw B, G I0-0680Q-0000-x0y1 Spectral Width 1.5 nm nm 0.7 mw B, E, G, I I0-0680S-0000-xCy1 Integrated TEC for wavelength tolerance: ± 10 pm nm 0.15 mw B, G I0-0795S-0000-x0y1 Wavelength tolerance: ± 4.0 nm 795 nm 0.15 mw B, G I0-0795S-0000-x0y2 Wavelength tolerance: ± 0.5 nm 795 nm 0.15 mw B, E, G, I I0-0795S-0000-xCy1 Single Mode VCSELs (arrays) Integrated TEC for wavelength tolerance: ± 10 pm nm 0.7 mw (3) F I0-0680Q-0000-xAy1 1x4 (4 apertures) Communications Grade VCSELs (single aperture) nm 3.5 mw B, D, G I0-0680C-0000-x0y1 Up to 3 Gbps Multi-mode VCSELs (single aperture) nm 6 mw B, D, G I0-0680M-0000-x0y nm 3 mw B, D, G I0-0795M-0000-x0y1 850 nm 1.3 mw B, G I0-0850M-0000-xCy1 Multi-mode VCSELs (arrays) Integrated MPD & Temp. Sensor for constant output power nm 2.5 mw (3,5) F I0-0680M-0000-xAy1 2x8 (16 apertures) nm 30 mw (4,5) B, G I0-0680M-0000-xPy1 4x4 (16 apertures) Multi-Wavelength VCSEL Assemblies 680, 795, 850 nm 1 mw B, G I0-MULTM-0000-x0y1 High efficiency 680, 795, 850 nm 8 mw B, G I0-MULTM-0000-x0y2 High Power (1) At 25 C and 75% of Peak Output Power (2) "x" and "y"denote the character positions of options explained in the respective datasheets. (3) Output Power of each of the multiple apertures, which are modulated independently. (4) This product is a "power array" in which all apertures are electrically connected and modulated together. (5) This is simply an example of what is possible in an array product. Array products are custom designed for each customer, Package Designator A B C D E F G H I Package Type no package (bare die) TO-46 (non-hermetic) PLCC-4 (non-std pkg) PLCC-2 TO-5 (non-hermetic) 20 leaded QFN TO-46 (hermetic) 8 leaded QFN TO-5 (hermetic)

2 Page 2 of 10 General Notes for Vixar Packages: 1. Vixar s VCSELs are very sensitive to Electrical Over Stress (EOS) events (which include ESD). VCSELs can be damaged with EOS events of 200V or less (IEC , human body contact model). For applications that require additional protection against EOS events, Vixar can include a bi-directional back-to-back ESD protection diode that protects the VCSEL against ESD events of 1 KV or higher. Contact Vixar for details regarding ESD protection options for your application. 2. Package Designation A is for bare die. Vixar s die are qualified for die attachment processes using silver filled conductive epoxies or adhesives. Vixar has not qualified die attach processes that use solder or flip chip bonding. Contact Vixar to discuss attachment processes other than conductive epoxy attachment. (See note 6 for special considerations with regard to polarization.) 3. Vixar s VCSELs emit a linearly polarized diverging beam. For red VCSELs (wavelengths from 670 nm to 690 nm) the direction of polarization with respect to the die is as follows: Direction of Polarization for Red VCSELs 4. Since the orientation of the die is dependent on which VCSEL device (1, 2, 3, or 4) is used, the direction of polarization with respect to the package is device dependent. Vixar sends documentation with each shipment that indicates the direction of polarization with respect to the package. 5. Vixar s 795 nm VCSELs also emit a linear polarized beam. Contact Vixar for details regarding the direction of polarization for the 795 nm devices. Polarization of 795 nm devices can be impacted by die attach process (see Note 6) and encapsulants (see Note 8). 6. Vixar s red VCSELs (wavelengths from 670 nm to 690 nm) can be die attached using conductive epoxy with curing temperatures up to 125 o C without impacting the polarization state. However, when curing 795 nm die, Vixar recommends an epoxy curing process of 80 C for 3 hours since higher temperatures and/or faster cure times induce stresses that affect polarization. 7. Package Designation B is for a standard TO-46 package with 5 leads (4 + 1 Case). For small prototype orders these are assembled at Vixar s lab and the window caps or lids are attached in air using an epoxy. Thus these are not hermetic and should not be used for any long term reliability or environmental stress testing. For larger production volumes, the TO-46 packaged devices are sealed in nitrogen and tested for hermeticity. The TO-46 package is a proven solution that is robust and can survive damp heat testing. 8. Package Designation D is for a Plastic Leadless Chip Carrier (PLCC) type package. This is manufactured in very high volumes (e.g., for packaging LEDs) and are therefore very low cost packages when assembled in high volumes. The open cavity of the package is filled with a clear optical chip encapsulant material to protect the VCSEL die and wire bond. These packages are not recommended for 795 nm devices (see Note 5).

3 Page 3 of Vixar uses 2 types of optical encapsulation materials for the PLCC (and QFN) packages. One is a very soft silicone gel type material. The other is a harder epoxy type material. The VCSEL die are sensitive to mechanical stress. Since the PLCC is a surface mount type package, it is typically solder reflowed to a PCB (or flex circuit) using industry standard solder processes. When using the higher temperature Pb-free (RoHS compliant) SnAgCu (SAC) solder processes with peak reflow temperatures of 250 o C, the combination of the high solder reflow temperatures and hard epoxy type encapsulation can results in reliability issues. Vixar has qualified the PLCC packages for SAC reflow when using the softer silicone gel type encapsulants. The harder epoxy type encapsulant is used for applications that require attachment of the top of the package within an assembly, for example if a larger core fiber is to be attached to epoxy. However, Vixar recommends that either a lower temperature solder process be used or a silver filled conductive epoxy be used for making the electrical connection from the PLCC leads to the PCB when using the harder epoxy type encapsulant. Contact Vixar to discuss the details of the application and processing of the PLCC packages. 10. The QFN 16 leaded package has been used to mount 3 die of different wavelengths for tri-wave medical imaging applications. The QFN 20 leaded version is used for packaging the 2x8 VCSEL array with each laser individually selectable (connected). Vixar has not yet fully qualified the QFN type packages. Since these packages incorporate a copper base for which the die are mounted and the copper base should be soldered to a thermal pad (inclusion of thermal vias in the PCB layout) on the PCB, Vixar believes that there are no reliability issues associated with soldering this package to the PCB using the higher temperature SAC solder process in combination with the harder epoxy type encapsulant. Contact Vixar to discuss the details of the application and processing of the QFN packages. 11. The PLCC and QFN plastic packages are Class 2A moisture/reflow sensitive parts per IPCJEDEC J-STD- 033B. Vixar requires that these parts be pre-baked at 125 C for 12 hours prior to solder reflow. After prebaking, they should be solder-reflowed to the PCB/Flex within 7 days, provided that they are stored at 30 C/60% relative humidity. 12. Package Designation E is a TO-5 package that may, depending on the specific model number, incorporate an internal TE-Cooler for either temperature stabilization (and therefore wavelength stabilization) or temperature sweep (wavelength sweep) applications. This package is a proven hermetic package and an ESD protection diode can be included, in addition to the thermistor and TEC components. Vixar can also develop a smaller TO-46 package with a TE-Cooler and optional ESD diode, but the level of electrical isolation between TEC, laser, and thermistor is compromised (i.e. fewer leads requires that electrical connections share leads).

4 Page 4 of 10 TO-46 Package Dimensions ( B package designator, in the case when the only packaged component is a single die VCSEL): Pin mm Thick Window Pin to VCSEL 2.63 Pin 4 Pin 1 Pin Top View of Header with Pin Locations Bottom View Pin Number Connection 1 N/C 2 Laser Anode 3 N/C 4 N/C 5 Case /Ground

5 Page 5 of 10 TO-46 Package Dimensions (continued): TO-46 Five Leaded Package Thermistor Thermal Electric Cooler (TEC) VCSEL VCSEL #2 Thermistor VCSEL ϕ 0.15 A VCSEL Aperture #3 #1 Thermistor #5 Case Lead #4 A Pin Number Connection 1 Laser Anode 2 TEC (-) 3 TEC (+) 4 Thermistor (A) 5 Case / Laser Cathode / Thermistor (B)

6 Page 6 of 10 TO-5 Package Dimensions ( E package designator, shown with TEC & thermistor which are not inherently included with all E packaged products): LD Anode LD Cathode Thermistor-A TO-Can Gnd ESD Diode Thermistor-B VCSEL die Note: All 8 Leads are Isolated, except for 2 Leads that are connected with wire bonds (4X) to the header. Higher current TEC leads are separated from smaller signal laser and thermistor connections by the 2 ground leads. TEC(-) TEC(+) TO-Can Gnd TO-Can Tab

7 Page 7 of 10 PLCC-2 Package Dimensions ( D package designator): 3 mm 2 mm Anode Cathode VCSEL Aperture Centered ± 75μm (shown with a 4-aperture die) VCSEL Die VCSEL ht. above PCB bond pad** mm ± mm** Shown with Lead Frame from Array of PLCC-2 packages (to be cut off during trimming process) Total thickness of package is 1.2 mm (plastic) or 1.3 mm with leads VCSEL is mounted on the top of the lead frame with 20 µm ± 5 µm of epoxy. VCSEL thickness is mm +/ mm VCSEL height above PCB bond pad** = ( ) = mm ± mm** ** Plus the thickness of the solder between PCB and PLCC

8 Page 8 of 10 QFN (20 leaded) Dimensions ( F package designator): NOTES 1. MATERIALS: LEAD FRAME: Copper 194FH, THK = / ; BODY: Semiconductor Molding Epoxy 2. FINISH: LEAD FRAME: Electroless Nickel per MIL-C-26074, Class 1; 100 to 300 Micro-inches (2.5um - 7.6um) thick; Gold Plate per MIL-G-45204, Type 3, Grade A, Class 1 ( 40 to 80 micro-inches [1um - 2um] thick) BODY SURFACE FINISH: VDI ( Ra) 3. PACKAGE MISMATCH: Body offset to lead frame mm Max 4. Unless otherwise specified, radius on all molded edges and corners = 0.25mm Max 5. Package conforms to JEDEC MO-220

9 Page 9 of 10 QFN (8 leaded) Dimensions ( H package designator): NOTES 1. MATERIALS: BODY: SEMICONDUCTOR MOLDING EPOXY, CONTACT QUIK-PAK FOR DETAILS. LEAD FRAME: COPPER 194FH, THK = 0.203± FINISH: LEAD FRAME: ELECTROLESS NICKEL PER MIL-C-26074, CLASS 1, 100 TO 300 MICROINCHES (2.5um - 7.6um) THICK. GOLD PLATE PER MIL-G-45204, TYPE 3, GRADE A, CLASS 1 (40 to 80 microinches (1um - 2um) thick). BODY SURFACE FINISH: VDI ( Ra). 3. PACKAGE MISMATCH: BODY OFFSET TO LEAD FRAME = 0.076mm MAX 4. UNLESS OTHERWISE SPECIFIED, RADIUS ON ALL MOLDED EDGES AND CORNERS = 0.25mm MAX. 5. PACKAGE CONFORMS TO JEDEC MO-220.

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