Sherlock Solder Models
|
|
|
- Pamela Butler
- 5 years ago
- Views:
Transcription
1 Introduction: Sherlock Solder Models Solder fatigue calculations in Sherlock are accomplished using one of the many solder models available. The different solder models address the type of package that is used for an individual component. Knowing which solder model to select requires knowing and being able to identify the package type of a component. This document will outline which packages use each of the solder models as well as how to identify packages. Solder Models: The available solder models available are listed below: BGA CBGA CC CGA Die LCCC Leaded QFN Thruhole BGA Model The BGA model is used for all BGA (Ball Grid Array) Packages. These are IC packages that have a grid pattern on the bottom made of solder balls. These solder balls melt during reflow and solder the BGA package to the PCB. The BGA solder model is valid for wire bonded BGAs as well as flip chip BGAs. Figure 1: BGA (Ball Grid Array) Packages
2 CBGA Model The CBGA model is used for BGAs with a ceramic substrate. This package can look very similar to a normal BGA as the substrate is often covered with overmold and therefore it can be difficult to see if the substrate is ceramic. The datasheet will however indicate if the substrate is ceramic. CC Model The CC model is used for all leadless chip carrier packages. These packages can be used for a variety of functions from resistors and capacitors to ferrites and diodes. These components are terminated at opposite ends and then attached to a PCB by soldering the end caps to copper pads on the board. It is important that the correct material is attributed to the component depending on its application as this will affect the solder fatigue results. As CC components have no leads, the dimensions of the pads on the board are critical for determining the solder area. Figure 2: Various CC (Chip Carrier) Packages
3 CGA Model The CGA model is used for column grid array components. These components are like BGAs in appearance however instead of using solder balls as the interface between the component and the PCB, CGAs uses solder columns. Figure 3:CGA (Column Grid Array) Package Die Model The Die model is use when a die is attached directly to a PCB. Die attach material is used to glue the die to the PCB and then wirebonds are used to connect the die electrically to the PCB. The whole die can then be encapsulated to create a glob top to protect the die and wirebonds. Figure 4: Die Attached Package
4 LCCC Model The LCCC model is used for leaded ceramic chip carriers. These are IC components that have leadless pins around the sides of the components. The sides are often castellated, and solder is applied in these areas. Figure 5: LCCC (Leadless Ceramic Chip Carrier) Packages Leaded Model The leaded model is used for all leaded components regardless of the lead geometry. Lead geometry can take many forms such as C-Leads, J-Leads, L-Leads, Gullwing Leads and Stub Leads. It is important that for leaded parts the dimensions of the leads are correctly defined as the solder model uses these dimensions to determine the solder application area. Figure 6 (L to R): C-Lead, J-Lead, L-Lead, Gullwing & Stub Lead Packages
5 QFN Model The QFN model is used for quad flat no-leads packages as well as DFN (dual flat no-leads) packages. These are IC packages that have pins around the perimeter of the package. These pins can be along two parallel edges in the case of DFNs or all four edges for QFNs. The distinguishing feature that of a DFN or QFN is that is has a thermal pad, referred to as a flag, underneath the component. This is important as solder is applied to the flag and therefore must be accounted for in the solder model. This flag can also take the form of multiple smaller flags. If this is the case, the areas of these flags can be summed and entered as a single flag in the Parts Properties. Figure 7 (L to R:) DFN (Dual Flat No-Leads) & QFN (Quad Flat No-Leads) Package Thruhole Model The thruhole model is used for any components that are attached to the PCB using leads soldered into thruholes instead of surface mounting. Thruhole components can take many forms and provide different functions, however the solder applied is always the same and failure is a result of lead dimensions. Figure 8: Various Thruhole Components
Electronics Materials-Stress caused by thermal mismatch
Electronics Materials-Stress caused by thermal mismatch The point was well made in the early 1970s by David Boswell that surface mount assemblies have many issues in common with civil engineering. For
Electronic materials and components-semiconductor packages
Electronic materials and components-semiconductor packages Semiconductor back-end processes We will learn much more about semiconductor back end processes in subsequent modules, but you need to understand
BGA/CSP Re-balling Bob Doetzer Circuit Technology Inc.
BGA/CSP Re-balling Bob Doetzer Circuit Technology Inc. www.circuittechnology.com The trend in the electronics interconnect industry towards Area Array Packages type packages (BGA s, CSP s, CGA s etc.)
Benzocyclobutene Polymer dielectric from Dow Chemical used for wafer-level redistribution.
Glossary of Advanced Packaging: ACA Bare Die BCB BGA BLT BT C4 CBGA CCC CCGA CDIP or CerDIP CLCC COB COF CPGA Anisotropic Conductive Adhesive Adhesive with conducting filler particles where the electrical
Library Expert Through hole Families
Non polarized Axial Diameter Leaded Component Library Expert Through hole Families Resistor (RESAD) Capacitor Non polarized (CAPAD) Fuse Axial Diameter (FUSAD) Inductor Axial Diameter (INDAD) Non polarized
MICROELECTRONICS ASSSEMBLY TECHNOLOGIES. The QFN Platform as a Chip Packaging Foundation
West Coast Luncheon January 15, 2014. PROMEX PROMEX INDUSTRIES INC. MICROELECTRONICS ASSSEMBLY TECHNOLOGIES The QFN Platform as a Chip Packaging Foundation 3075 Oakmead Village Drive Santa Clara CA Ɩ 95051
EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN March 2008 DL SM SL VL TH LW A_A A_A Figure 1: Suggested Board Layout of Soldered Pads for BGA Packages Notes: 1. Table 2a through Table 6
Workshop Part Identification Lecture N I A G A R A C O L L E G E T E C H N O L O G Y D E P T.
Workshop Part Identification Lecture N I A G A R A C O L L E G E T E C H N O L O G Y D E P T. Identifying Resistors Resistors can be either fixed or variable. The variable kind are called potentiometers
USING SIGNATURE IDENTIFICATION FOR RAPID AND EFFECTIVE X-RAY INSPECTION OF BALL GRID ARRAYS
USING SIGNATURE IDENTIFICATION FOR RAPID AND EFFECTIVE X-RAY INSPECTION OF BALL GRID ARRAYS Gil Zweig Glenbrook Technologies, Inc. Randolph, New Jersey USA gzweig@glenbrooktech.com ABSTRACT Although X-ray
Specifications subject to change Packaging
VCSEL Standard Product Packaging Options All standard products are represented in the table below. The Part Number for a standard product is determined by replacing the x in the column Generic Part Number
An Introduction to Electronics Systems Packaging. Prof. G. V. Mahesh. Department of Electronic Systems Engineering
An Introduction to Electronics Systems Packaging Prof. G. V. Mahesh Department of Electronic Systems Engineering India Institute of Science, Bangalore Module No. # 02 Lecture No. # 08 Wafer Packaging Packaging
Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability
Order Number: AN1850/D Rev. 0, 5/2000 Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Motorola introduced the ßip-chip plastic ball grid array (FC PBGA) packages as an alternative to,
Two major features of this text
Two major features of this text Since explanatory materials are systematically made based on subject examination questions, preparation
INDEX BY DEVICE TYPE OF REGISTERED MICROELECTRONIC OUTLINES (MO) REGISTRATION NO.
AXIAL QUAD 1.56 mm (.065") Pitch MO-010 Pins: 12 2.54 mm (.100") Pitch MO-017 Pins: 52, 64 BALL GRID ARRAY (BGA) Tape BGA 1, 1.27. 1.5 mm Pitch Pins: 100 thru 2401 Plastic BGA 1, 1.27, 1.5mm Pitch Pins:
Chapter 2. Literature Review
Chapter 2 Literature Review 2.1 Development of Electronic Packaging Electronic Packaging is to assemble an integrated circuit device with specific function and to connect with other electronic devices.
Product Information. Allegro Hall-Effect Sensor ICs. By Shaun Milano Allegro MicroSystems, LLC. Hall Effect Principles. Lorentz Force F = q v B V = 0
Product Information Allegro Hall-Effect Sensor ICs y Shaun Milano Allegro MicroSystems, LLC is a world leader in developing, manufacturing, and marketing high-performance Halleffect sensor integrated circuits.
Chapter 11 Testing, Assembly, and Packaging
Chapter 11 Testing, Assembly, and Packaging Professor Paul K. Chu Testing The finished wafer is put on a holder and aligned for testing under a microscope Each chip on the wafer is inspected by a multiple-point
A passive circuit based RF optimization methodology for wireless sensor network nodes. Article (peer-reviewed)
Title Author(s) Editor(s) A passive circuit based RF optimization methodology for wireless sensor network nodes Zheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian Wu,
Thermal Cycling and Fatigue
Thermal Cycling and Fatigue Gil Sharon Introduction The majority of electronic failures are thermo-mechanically related by thermally induced stresses and strains. The excessive difference in coefficients
PCB Design (with EAGLE tutorial) TA: Robert Likamwa ELEC 424, Fall 2010
PCB Design (with EAGLE tutorial) TA: Robert Likamwa ELEC 424, Fall 2010 Printed Circuit Boards What are they? How can I make one? 424 Project description Eagle Tutorial http://www.electronicmanufacturers.co.za/
TAIPRO Engineering. Speaker: M. Saint-Mard Managing director. TAIlored microsystem improving your PROduct
TAIPRO Engineering MEMS packaging is crucial for system performance and reliability Speaker: M. Saint-Mard Managing director TAIPRO ENGINEERING SA Michel Saint-Mard Administrateur délégué m.saintmard@taipro.be
!"#$"%&' ()#*+,-+.&/0(
!"#$"%&' ()#*+,-+.&/0( Multi Chip Modules (MCM) or Multi chip packaging Industry s first MCM from IBM. Generally MCMs are horizontal or two-dimensional modules. Defined as a single unit containing two
Enabling concepts: Packaging Technologies
Enabling concepts: Packaging Technologies Ana Collado / Liam Murphy ESA / TEC-EDC 01/10/2018 ESA UNCLASSIFIED - For Official Use Enabling concepts: Packaging Technologies Drivers for the future: Higher
Aim. Lecture 1: Overview Digital Concepts. Objectives. 15 Lectures
Aim Lecture 1: Overview Digital Concepts to give a first course in digital electronics providing you with both the knowledge and skills required to design simple digital circuits and preparing you for
Application Bulletin 240
Application Bulletin 240 Design Consideration CUSTOM CAPABILITIES Standard PC board fabrication flexibility allows for various component orientations, mounting features, and interconnect schemes. The starting
Innovations Push Package-on-Package Into New Markets. Flynn Carson. STATS ChipPAC Inc Kato Rd Fremont, CA 94538
Innovations Push Package-on-Package Into New Markets by Flynn Carson STATS ChipPAC Inc. 47400 Kato Rd Fremont, CA 94538 Copyright 2010. Reprinted from Semiconductor International, April 2010. By choosing
Min Tao, Ph. D, Ashok Prabhu, Akash Agrawal, Ilyas Mohammed, Ph. D, Bel Haba, Ph. D Oct , IWLPC
PACKAGE-ON-PACKAGE INTERCONNECT FOR FAN-OUT WAFER LEVEL PACKAGES Min Tao, Ph. D, Ashok Prabhu, Akash Agrawal, Ilyas Mohammed, Ph. D, Bel Haba, Ph. D Oct 18-20 2016, IWLPC 1 Outline Laminate to Fan-Out
CAD Layout Recommendations for the PowerBlox Family
Solved by APPLICATION NOTE ANP4 TM CAD Layout Recommendations for the PowerBlox Family Introduction The Sipex PowerBlox family of parts offers designers a very high power density solution for wide input
Prepared by Qian Ouyang. March 2, 2013
AN075 Rework Process for TQFN Packages Rework Process for TQFN Packages Prepared by Qian Ouyang March 2, 2013 AN075 Rev. 1.1 www.monolithicpower.com 1 ABSTRACT MPS proprietary Thin Quad Flat package No
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads Li Ma, Fen Chen, and Dr. Ning-Cheng Lee Indium Corporation Clinton, NY mma@indium.com; fchen@indium.com; nclee@indium.com Abstract
Flip Chip Installation using AT-GDP Rework Station
Flip Chip Installation using AT-GDP Rework Station Introduction An increase in implementation of Flip Chips, Dies, and other micro SMD devices with hidden joints within PCB and IC assembly sectors requires
B. Flip-Chip Technology
B. Flip-Chip Technology B1. Level 1. Introduction to Flip-Chip techniques B1.1 Why flip-chip? In the development of packaging of electronics the aim is to lower cost, increase the packaging density, improve
(12) United States Patent (10) Patent No.: US 6,387,795 B1
USOO6387795B1 (12) United States Patent (10) Patent No.: Shao (45) Date of Patent: May 14, 2002 (54) WAFER-LEVEL PACKAGING 5,045,918 A * 9/1991 Cagan et al.... 357/72 (75) Inventor: Tung-Liang Shao, Taoyuan
Flip Chips. FA10-200x200 FA10-400x400 FA10-600x x 200 mils 400 x 400 mils
Flip Chip FlipChip International Flip Chip describes the method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe, then provides the connection
The Novel Thin Flexible PCB Module for 3D Packages
The Novel Thin Flexible PCB Module for 3D Packages Bo Zhang Institute of Microelectronics Chinese Academy of Sciences, Beijing, China Email: zhangbo1@ime.ac.cn Outlines Laboratory introduction Project
Component Miniaturization and High-Density Technologies in Space Applications
Component Miniaturization and High-Density Technologies in Space Applications Norio NEMOTO Parts Program Office Safety and Mission Assurance Department JAXA 2014/10/23 MEWS 27 1 1. JAXA EEE Parts Organization
GaAs MMIC Non-Linear Transmission Line. Packag e. Refer to our website for a list of definitions for terminology presented in this table.
GaAs MMIC Non-Linear Transmission Line NLTL-6273SM 1. Device Overview 1.1 General Description NLTL-6273SM is a MMIC non-linear transmission line (NLTL) based comb generator. This NLTL offers excellent
INTERNATIONAL STANDARD
INTERNATIONAL STANDARD IEC 61188-7 Edition 1.0 2009-05 Printed boards and printed board assemblies Design and use Part 7: Electronic component zero orientation for CAD library construction IEC 61188-7:2009(E)
SMP-CGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS
38.500 SMP-CGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +155C ) xga IC High current capability (up to 4A ) Excellent signal integrity
High efficient heat dissipation on printed circuit boards
High efficient heat dissipation on printed circuit boards Figure 1: Heat flux in a PCB Markus Wille Schoeller Electronics Systems GmbH www.schoeller-electronics.com Abstract This paper describes various
BGA inspection and rework with HR 600/2 Failure analysis and assembly repair
Even today some assemblies including BGA components still show soldering failures that require as a consequence to rework the BGA. The following example can be seen as a typical case for today s inspection
Inspection Method Sheet
Inspection Method Sheet Part Number: Generic Part Name: PCB Filters Drawing Number: Generic Operation: In Process / Final Page 1 of 10 Written By: Myra Cope Doc. #: TT-PC-0378 Rev. 14 Date: 10-15-08 Applicable
(12) Patent Application Publication (10) Pub. No.: US 2011/ A1
(19) United States (12) Patent Application Publication (10) Pub. No.: US 2011/0001230 A1 Li et al. US 2011 000 1230A1 (43) Pub. Date: Jan. 6, 2011 (54) (75) (73) (21) (22) SYSTEMIS AND METHODS OF IMPROVED
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices Rachel Short Photo Stencil Colorado Springs Benefits and Challenges QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular
5 6.4 GHz 2 Watt Power Amplifier
5 6.4 GHz 2 Watt Power Amplifier Features Frequency Range : 5 6.4GHz 32.5 dbm output P1dB 9 db Power gain 32% PAE High IP3 Input Return Loss > 12 db Output Return Loss > 12 db Dual bias operation No external
BEE 2233 Digital Electronics. Chapter 1: Introduction
BEE 2233 Digital Electronics Chapter 1: Introduction Learning Outcomes Understand the basic concept of digital and analog quantities. Differentiate the digital and analog systems. Compare the advantages
Vishay Dale Thin Film Land Patterns
1. Scope This technical note provides sample land patterns for SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are
سمینار درس تئوری و تکنولوژی ساخت
نام خدا به 1 سمینار درس تئوری و تکنولوژی ساخت Wire Bonding استاد : جناب آقای محمدنژاد دکتر اردیبهشت 93 2 3 Content IC interconnection technologies Whats wirebonding Wire Bonding Processes Thermosonic Wirebond
The Inductance Loop Power Distribution in the Semiconductor Test Interface. Jason Mroczkowski Multitest
The Inductance Loop Power Distribution in the Semiconductor Test Interface Jason Mroczkowski Multitest j.mroczkowski@multitest.com Silicon Valley Test Conference 2010 1 Agenda Introduction to Power Delivery
TN016. PCB Design Guidelines for 5x5 DFN Sensors. Introduction. Package Marking
PCB Design Guidelines for 5x5 DFN Sensors Introduction This technical note is intended to provide information about Kionix s 5 x 5 mm DFN (non wettable flank, i.e. standard) packages and guidelines for
General Rules for Bonding and Packaging
General Rules for Bonding and Packaging at the Else Kooi Laboratory 3 CONTENT Rules for assembly at EKL 4 Introduction to assembly 5 Rules for Saw Lane 7 Rules for Chip Size 8 Rules for Bondpads 9 Rules
Digital Logic ircuits Circuits Fundamentals I Fundamentals I
Digital Logic Circuits Fundamentals I Fundamentals I 1 Digital and Analog Quantities Electronic circuits can be divided into two categories. Digital Electronics : deals with discrete values (= sampled
MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS. Reza Ghaffarian
FACTA UNIVERSITATIS Series: Electronics and Energetics Vol. 29, No 4, December 2016, pp. 543-611 DOI: 10.2298/FUEE1604543G MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS
SATECH INC. The Solutions Provider!
Quality Verification with Real-time X-ray By Richard Amtower One can look at trends in packaging and assembly and predict that geometries will continue to shrink and PCBs will become more complex. As a
UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD. BROADCOM CORPORATION Petitioner v. TESSERA, INC. Patent Owner.
UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD BROADCOM CORPORATION Petitioner v. TESSERA, INC. Patent Owner. Patent No. 6,856,007 Issue Date: February 15, 2005 Title:
Switcher Assembly guide. Switcher Assembly guide 1. Soldering. 2. Switcher3 vs Switcher2. 3. PCB split.
Safety warning The kits are main powered and use potentially lethal voltages. Under no circumstance should someone undertake the realisation of a kit unless he has full knowledge about safely handling
AC & DC Characteristics Over Guaranteed Operating Temperature Range
V2 / 9-23-14 Data Sheet The most important thing we build is trust Description: The MADRMA0001 family of quad bias drivers can either be configured to translate TTL signals into the negative voltages required
23. Packaging of Electronic Equipments (2)
23. Packaging of Electronic Equipments (2) 23.1 Packaging and Interconnection Techniques Introduction Electronic packaging, which for many years was only an afterthought in the design and manufacture of
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. gsmith@fctassembly.com This paper and presentation was first presented at the 2017 IPC Apex Expo Technical
Chip Assembly on MID (Molded Interconnect Device) A Path to Chip Modules with increased Functionality
T e c h n o l o g y Dr. Werner Hunziker Chip Assembly on MID (Molded Interconnect Device) A Path to Chip Modules with increased Functionality The MID (Molded Interconnect Device) technology enables the
Ceramic Sandwich, Single-In-Line Thin Film Resistor, Through Hole Network (Low Profile 0.20 Custom)
CS Ceramic Sandwich, Single-In-Line Thin Film Resistor, Through Hole Network (Low Profile 0.20 Custom) Actual Size presents a design concept in precision thin film resistor networks. The essence of this
Getting the FLI Lead Out. Thomas J. De Bonis Assembly & Test Technology Development Technology and Manufacturing Group
Getting the FLI Lead Out Thomas J. De Bonis Assembly & Test Technology Development Technology and Manufacturing Group Lead has been used in flip chip FLI for decades. RoHS Exemption 15 was enacted in recognition
Ceramic Monoblock Surface Mount Considerations
Introduction Technical Brief AN1016 Ceramic Monoblock Surface Mount Considerations CTS ceramic block filters, like many others in the industry, use a fired-on thick film silver (Ag) metallization. The
Yole Developpement. Developpement-v2585/ Publisher Sample
Yole Developpement http://www.marketresearch.com/yole- Developpement-v2585/ Publisher Sample Phone: 800.298.5699 (US) or +1.240.747.3093 or +1.240.747.3093 (Int'l) Hours: Monday - Thursday: 5:30am - 6:30pm
Thin Film Resistor Integration into Flex-Boards
Thin Film Resistor Integration into Flex-Boards 7 rd International Workshop Flexible Electronic Systems November 29, 2006, Munich by Dr. Hans Burkard Hightec H MC AG, Lenzburg, Switzerland 1 Content HiCoFlex:
a gif (12) United States Patent 2OO US 6,355,502 B1 Mar. 12, 2002 Kang et al. (45) Date of Patent: (10) Patent No.: (54) SEMICONDUCTOR PACKAGE AND
(12) United States Patent Kang et al. USOO63555O2B1 (10) Patent No.: (45) Date of Patent: US 6,355,502 B1 Mar. 12, 2002 (54) SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME (75) Inventors: Kun-A Kang;
High Efficient Heat Dissipation on Printed Circuit Boards. Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH
High Efficient Heat Dissipation on Printed Circuit Boards Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH m.wille@se-pcb.de Introduction 2 Heat Flux: Q x y Q z The substrate (insulation)
ADVANCED HAND SOLDERING TECHNIQUES TRAINING CERTIFICATION TEST (DVD-111C) v.1
This test consists of twenty multiple-choice questions. All questions are from the video: Advanced Hand Soldering Techniques DVD-111C. Use the supplied Answer Sheet and circle the letter corresponding
Cost-minimized Double Die DRAM Packaging for Ultra-High Performance DDR3 and DDR4 Multi-Rank Server DIMMs
Cost-minimized Double Die DRAM Packaging for Ultra-High Performance DDR3 and DDR4 Multi-Rank Server DIMMs Richard Crisp 1, Bill Gervasi 2, Wael Zohni 1, Bel Haba 3 1 Invensas Corp, 2902 Orchard Parkway,
An Introduction to Electronics Systems Packaging. Prof. G. V. Mahesh. Department of Electronic Systems Engineering
An Introduction to Electronics Systems Packaging Prof. G. V. Mahesh Department of Electronic Systems Engineering Indian Institute of Science, Bangalore Module No. # 07 Lecture No. # 33 Reflow and Wave
Challenges of Evolving Technology in the Workplace. Tips. Bubba Powers. Board Density. Best Rework Soldering Practices. Power. Substrates.
Real Estate Finishes Power Component Technology Board Density Tips Challenges of Evolving Technology in the Workplace Substrates Component Size Bubba Powers Manager of Technical Services Weller North America
AND8211/D. Board Level Application Notes for DFN and QFN Packages APPLICATION NOTE
Board Level Application Notes for DFN and QFN Packages Prepared by: Steve St. Germain ON Semiconductor APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Dual
Testing of Chips Used for Artificial Intelligence. PH Chen, Project Management KeyStone Alan Liao, Product Marketing FormFactor
Testing of Chips Used for Artificial Intelligence PH Chen, Project Management KeyStone Alan Liao, Product Marketing FormFactor Agenda Artificial Intelligence Evolution and Market Space Why AI Today AI
Throughout the course best practice will be observed as described in International Standard IPC 610.
SOLDERING COURSE 560: 3 DAYS: Max 8 Candidates This provides all the skills necessary to work on modern electronic printed circuit boards. It is intended for candidates who have an understanding of electronics
Bob Willis Process Guides
What is a Printed Circuit Board Pad? What is a printed circuit board pad, it may sound like a dumb question but do you stop to think what it really does and how its size is defined and why? A printed circuit
High Power Thin Film Wraparound Chip Resistor
High Power Thin Film Wraparound Chip Resistor FEATURES High purity ceramic substrate Power rating to 2.5 W Resistance range 10 to 30.1 k Resistor tolerance to ± 0.1 % TCR to ± 25 ppm/ C Flame resistant
GaAs MMIC Non-Linear Transmission Line. Description Package Green Status
GaAs MMIC Non-Linear Transmission Line NLTL-6273 1. Device Overview 1.1 General Description NLTL-6273 is a MMIC non-linear transmission line (NLTL) based comb generator. This NLTL offers excellent phase
SSRP LTC1746 Assembly Manual V0.1 Check the most recent version
SSRP LTC1746 Assembly Manual V0.1 Check the most recent version http://oscar.dcarr.org/ssrp/hardware/ltc1746/ltc1746.php Introduction This manual details the general assembly process for the SSRP LTC1746
BGA (Ball Grid Array)
BGA (Ball Grid Array) National Semiconductor Application Note 1126 November 2002 Table of Contents Introduction... 2 Package Overview... 3 PBGA (PLASTIC BGA) CONSTRUCTION... 3 TE-PBGA (THERMALLY ENHANCED
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. gsmith@fctassembly.com This paper and presentation was first presented at the 2017 IPC Apex Expo Technical
MIL-STD-883E METHOD BOND STRENGTH (DESTRUCTIVE BOND PULL TEST)
BOND STRENGTH (DESTRUCTIVE BOND PULL TEST) 1. PURPOSE. The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength
mcube LGA Package Application Note
AN-001 Rev.02 mcube LGA Package Application Note AN-001 Rev.02 mcube, Inc. 1 / 21 AN-001 Rev.02 Guidelines for Printed Circuit Board (PCB) Design and Assembly with mcube Land Grid Array (LGA) Package Sensors
Circuit Board Assembly Instructions for Babuinobot 1.0
Circuit Board Assembly Instructions for Babuinobot 1.0 Brett Nelson January 2010 1 Features Sensor4 input Sensor3 input Sensor2 input 5v power bus Sensor1 input Do not exceed 5v Ground power bus Programming
TOLERANCE FORGOTTEN: IMPACTS OF TODAY S COMPONENT PACKAGING AND COPPER ROUTING ON ELECTRONIC
TOLERANCE FORGOTTEN: IMPACTS OF TODAY S COMPONENT PACKAGING AND COPPER ROUTING ON ELECTRONIC Presented By: Dale Lee E-mail: Dale.Lee@Plexus.Com April 2013 High Layer Counts Wide Range Of Component Package
QLG1 GPS Receiver kit
QLG1 GPS Receiver kit 1. Introduction Thank you for purchasing the QRP Labs QLG1 GPS Receiver kit. This kit will provide a highly sensitive, highly accurate GPS receiver module, using the popular MediaTek
AND8345/D. WDFN6 2x2 Cool 506AN Dual MOSFET Package Board Level Application Notes and Thermal Performance APPLICATION NOTE
WDFN6 2x2 Cool 506AN Dual MOSFET Package Board Level Application Notes and Thermal Performance Prepared by: Anthony M. Volpe ON Semiconductor APPLICATION NOTE Introduction New ON Semiconductor Cool MOSFETs
C30737 Array Series Silicon Avalanche Photodiode Arrays (APD Arrays) for LiDAR, range finding and laser meters
PRELIMINARY DATASHEET Photon Detection C30737 Array Series Silicon Avalanche Photodiode Arrays (APD Arrays) for LiDAR, range finding and laser meters Key Features High gain at low bias voltage Low breakdown
Application Note. Soldering Guidelines for Module PCB Mounting Rev 13
Application Note Soldering Guidelines for Module PCB Mounting Rev 13 OBJECTIVE The objective of this application note is to provide ANADIGICS customers general guidelines for PCB second level interconnect
Parameter Frequency (GHz) Min. Typ. Max. Units DC GHz GHz GHz Attenuation Range DC GHz 31.5 db
Typical Applications The is ideal for: 3G Infrastructure & access points Cellular/3G, LTE & UMB WiMAX, WiBN & Fixed Wireless Test Equipment and Sensors GSM, WCDMA & TD-SCDMA Functional Diagram Features.5
Parameter Frequency (GHz) Min. Typ. Max. Units DC GHz GHz GHz Attenuation Range DC GHz 31.5 db
v..5 LSB GaAs MMIC 6-BIT DIGITAL Typical Applications The is ideal for: 3G Infrastructure & access points Cellular/3G, LTE & UMB WiMAX, WiBN & Fixed Wireless Test Equipment and Sensors GSM, WCDMA & TD-SCDMA
Module No. # 07 Lecture No. # 35 Vapour phase soldering BGA soldering and De-soldering Repair SMT failures
An Introduction to Electronics Systems Packaging Prof. G. V. Mahesh Department of Electronic Systems Engineering Indian Institute of Science, Bangalore Module No. # 07 Lecture No. # 35 Vapour phase soldering
Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network
OSOP Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network OSOP Series resistor networks feature a space saving 25 mil lead pitch versus the current 50 mil pitch standard. This allows
DATASHEET ISL9021A. Features. Pinouts. Applications. 250mA Single LDO with Low I Q, Low Noise and High PSRR LDO. FN6867 Rev 2.
NOT RECOMMENDED FOR NEW DESIGNS RECOMMENDED REPLACEMENT PART ISL9021A 250mA Single LDO with Low I Q, Low Noise and High PSRR LDO DATASHEET FN6867 Rev 2.00 The ISL9021 is a single LDO providing high performance
The Design Challenge to Integrate High Performance Organic Packaging into High End ASIC Strategic Space Based Applications.
The Design Challenge to Integrate High Performance Organic Packaging into High End ASIC Strategic Space Based Applications May 8, 2007 Abstract: The challenge to integrate high-end, build-up organic packaging
Application Note 5026
Surface Laminar Circuit (SLC) Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction This document outlines the design and assembly guidelines for surface laminar circuitry
Introduction to PLED Open LED Protection Devices
Introduction to PLED Open LED Protection Devices Outline LED Lighting Series Strings of LED s Voltages in LED Strings LED Failure Modes Open LED Protection PWM Dimming LED s with Integrated Zeners Key
Advanced Packaging - Pulsed-laser Heating for Flip Chip Assembly
Page 1 of 5 Pulsed-laser Heating for Flip Chip Assembly A stress-free alternative By Thorsten Teutsch, Ph.D., Pac Tech USA, Elke Zakel, Ph.D., and Ghassem Azdasht, Pac Tech GmbH As flip chip applications
Polyphase network kit
Polyphase network kit 1. Introduction This polyphase network module is designed to be used with the QRP Labs receiver module kit. It takes as inputs, four phase audio from the Quadrature Sampling Detector
LT3755-2, LT HIGH VOLTAGE LED CONTROLLER DESCRIPTION DEMO CIRCUIT 1268B QUICK START GUIDE
LT3755-2, LT3755-1 HIGH VOLTAGE LED CONTROLLER DESCRIPTION Demonstration circuit 1268B-A, 1268B-B is a high voltage and high current LED driver controller. The VIN pin input voltage is as high as 40V.
GaAs MMIC Power Amplifier
GaAs MMIC Power Amplifier December 2012 Rev0 DESCRIPTION AMCOM s AM357037WM is a broadband GaAs MMIC Power Amplifier. It has a nominal CW performance of 26dB small signal gain, and 37dBm (5W) saturated