EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
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1 EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN March 2008
2 DL SM SL VL TH LW A_A A_A Figure 1: Suggested Board Layout of Soldered Pads for BGA Packages Notes: 1. Table 2a through Table 6 on page 11 contain the recommended guidelines for board layout soldered pad dimensions for the following Actel packages (including pad dimension for prototyping socket accordingly): CS (Chip Scale BGA, 0.8 mm pitch), FG (Fine Pitch BGA, 1.00 mm pitch), BG (Plastic Ball Grid Array, 1.27 mm pitch, CG (Ceramic Column Grid Array, 1.27 mm pitch), CG adapter socket, QN (Quad Fine Pitch No-Lead QFN, 0.5 mm pitch). 2. For E-tec prototyping socket soldering, Actel recommends using non-silver type solder paste with 6 mils thickness. 2 EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
3 Table 1a: Recommended PCB design guidelines for Actel CS (0.5 mm pitch BGA) package Dim. CS81 CS121 CS196 CS201 CS281 Component Land Pad Diameter (SMD) Solder Land Diameter (SL) Solder Mask Opening Diameter (SM) Solder Ball Land Pitch () Line Width Between Via and Solder Land (LW) 0.15 to to to to to 0.20 Distance Between Via and Solder Land (DL) Via Land Diameter (VL) Through Hole Diameter (TH) to to to to to to to to to to Line Width (L) Line Width (L) If Inner Outer Via's Staggered. NA NA NA NA 0.10 Line Space (S) Pad Array Full Full Full Perimeter Perimeter Pad Matrix 9x9 11x11 14x14 15x15 19x19 Periphery Rows 4, 1, 5 2, 2, 7 Table 2a: Recommended PCB Design Guidelines for Actel CS (0.8 mm Pitch BGA) Package Dimension CS49 CS128 CS180 Component Land Pad Diameter (SMD) Solder Land Diameter (SL) Solder Mask Opening Diameter (SM) Solder Ball Land Pitch () Line Width Between Via and Solder Land (LW) Distance Between Via and Solder Land (DL) Via Land Diameter (VL) Through Hole Diameter (TH) Pad Array Full Perimeter Perimeter Pad Matrix Periphery Rows 4 5 EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN 3
4 Table 2b: Recommended PCB Design Guidelines for Socket of CS Package Dimension CS49 SE-CS49-H CS128 SE-CS128-H CS180 SE-CS180-H Socket Pin Diameter Solder Land Diameter (SL) Solder Mask Opening Diameter (SM) Solder Ball Land Pitch () Line Width Between Via and Solder Land (LW) Distance Between Via and Solder Land (DL) Via Land Diameter (VL) Through Hole Diameter (TH) Pad Array Full Perimeter Perimeter Pad Matrix Periphery Rows EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
5 Table 3a: Recommended PCB Design Guidelines for Actel FG (1.00 mm Pitch BGA) Package Dimension FG144 FG256 FG324 FG FG484 FG676 FG896 FG1152 Component Land Pad Diameter (SMD) Solder Land Diameter (SL) Solder Mask Opening Diameter (SM) Solder Ball Land Pitch () Line Width Between Via and Solder Land (LW) Distance Between Via and Solder Land (DL) Via Land Diameter (VL) Through Hole Diameter (TH) Pad Array Full Full Full Full Perimeter Full Full Full Pad Matrix Periphery Rows Table 3b: Recommended PCB Design Guidelines for Socket of FG Package Dimension FG144 SE-FG144-H FG256 SE-FG256-HU FG324 SE-FG324-H FG SE-FG484-S-H FG484 SE-FG484-H FG676 SE-FG676-H FG896 SE-FG896 FG1152 SE-FG1152 Socket Pin Diameter Solder Land Diameter (SL) Solder Mask Opening Diameter (SM) Solder Ball Land Pitch () Line Width Between Via and Solder Land (LW) Distance Between Via and Solder Land (DL) Via Land Diameter (VL) Through Hole Diameter (TH) Pad Array Full Full Full Full Perimeter Full Full Full Pad Matrix Periphery Rows EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN 5
6 Table 4a: Recommended PCB Design Guidelines for Actel BG (1.27 mm Pitch BGA) Package Dimension BG272 BG313 BG329 BG456 BG729 Component Land Pad Diameter (SMD) Solder Land Diameter (SL) Solder Mask Opening Diameter (SM) Solder Ball Land Pitch () Line Width Between Via and Solder Land (LW) Distance Between Via and Solder Land (DL) Via Land Diameter (VL) Through Hole Diameter (TH) Pad Array Perimeter Staggered Perimeter Perimeter Full Pad Matrix Periphery Rows Table 4b: Recommended PCB Design Guidelines for Socket of BG Package Dimension BG272 SM-BG272-B BG313 SM-BG313-B BG329 SM-BG329-B BG456 SM-BG456-B BG729 SE-BG729 Socket Pin Diameter Solder Land Diameter (SL) Solder Mask Opening Diameter (SM) Solder Ball Land Pitch () Line Width Between Via and Solder Land (LW) Distance Between Via and Solder Land (DL) Via Land Diameter (VL) Through Hole Diameter (TH) Pad Array Perimeter Staggered Perimeter Perimeter Full Pad Matrix Periphery Rows EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
7 Figure 2: Recommended PCB Design Guidelines for Actel CCGA (Ceramic Column Grid Array, or CG) Package Table 5: Recommended PCB Design Guidelines for Actel CCGA (Ceramic Column Grid Array, or CG) Package The recommended guidelines for the 1.27 mm pitch package pertain to the Actel CG624 package, the CG624 to FG484 Adapter Socket, and the CG624 to FG896 Adapter The 1.00 mm pitch recommendations relate to the Actel CG1152 and CG1272 packages. Solder Mask Window (Diameter A) A 45 Typical Diameter B 2 Mounting Pad (Diameter B) 2 Diameter C Via Solder Mask Window (Diameter D) Via (Diameter E) Land (Diameter F) G Typical.3 mm Line All dimensions are in mm unless otherwise specified. A H Solderable Surface 1 Section A-A CG624 CG1152/1272 Diameter 1.27 mm Pitch 1.00 mm Pitch A mm 0.80 mm B mm 0.70 mm D mm 0.67 mm D mm 0.38 mm E mm 0.20 mm F mm 0.46 mm G mm 0.50 mm H mm 0.50 mm Notes: 1. Functional surface 2. Normal diameter at Copper/Polyimate interface with typical edge angle EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN 7
8 SL SM SL SM ØTH LS LS LW1 LS Note: This suggested board layout is for SMD. To use NSMD, swap SL and SM dimensions. Figure 3: Suggested Board Layout of Soldered Pads for QFN (Top) Packages 8 EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
9 LW1 LW2 ØTH ØVL LW1 LV LV Figure 4: Suggested Board Layout of Soldered Pads for QFN (Bottom) Packages EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN 9
10 SL SM SM ØTH SO LW1 SL SO 1250 SO 1250 Figure 5: Suggested Board Layout of Soldered Pads for QFN Packages (PCB Bottom Layer) This Suggested board layout is for reduced thermal pad, NSMD, to use SMD swap SL and SM dimensions. 10 EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
11 ØTH LW1 LW2 ØVL LW1 LV LV Figure 6: Suggested Board Layout of Soldered Pads for QFN Packages (PCB Bottom Layer), Reduced Thermal Pad Table 6 contains the recommended Guidelines for board layout soldered pad dimension for Actel QN (0.5 mm pitch QFN) packages only. Table 6: Recommended QFN Design Guidelines Dimension QN108 QN132 QN180 Component Land Pad Diameter (SMD) Solder Land Diameter (SL) Solder Mask Opening Diameter (SM) Solder Land To Solder Land () Solder Mask Overlap (SO) Solder Land Pitch () Line Width Between Via and Via Land (LW2) Line Width Between Via out side Via Land (LW1) Line to Via Land (LV) Via Land Diameter (VL) Through Hole Diameter (TH) Die Attach Pad (DP) x x x Pad Array Perimeter Perimeter Perimeter Body Size 8x8 8x8 10x10 Periphery Rows EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN 11
12 PCB Land Pattern Design File You can download the QN132 PCB Land Patter design file from Actel s website. This can be used to assist the layout of the board. Download the file from List of Changes The following table lists critical changes that were made in the current version of the document. Previous Version Changes in Current Version Page /2.08* Table 1a: Recommended PCB design guidelines for Actel CS (0.5 mm pitch BGA) page 3 package was updated to include CS201 and CS281. Figure 5:Suggested Board Layout of Soldered Pads for QFN Packages (PCB Bottom Layer) This Suggested board layout is for reduced thermal pad, NSMD, to use SMD swap SL and SM dimensions. is new. page 10 Figure 6:Suggested Board Layout of Soldered Pads for QFN Packages (PCB Bottom page 11 Layer), Reduced Thermal Pad is new. Table 6: Recommended QFN Design Guidelines was updated. page 11 Note: *The part number is located on the last page of the document. 12 EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
13 For more information, visit our website at Actel Corporation 2061 Stierlin Court Mountain View, CA USA Phone Fax Actel Europe Ltd. River Court, Meadows Business Park Station Approach, Blackwatery Camberley Surrey GU17 9AB United Kingdom Phone +44 (0) Fax +44 (0) Actel Japan EXOS Ebisu Building 4F Ebisu Shibuya-ku Tokyo 150 Japan Phone Fax Actel Hong Kong Room 2107, China Resources Building 26 Harbour Road Wanchai, Hong Kong Phone Fax Actel Corporation. All rights reserved. Actel and the Actel logo are trademarks of Actel Corporation. All other brand or product names are the property of their respective owners /3.08/
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