Silver Ball Matrix BGA Socket

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1 A1 corner Silver Ball Matrix BGA Socket Features Wide temperature range (-55C to +0C). Current capability is 4A per pin. Over 40GHz for edge pins. Low and stable contact resistance for reliable production yield. Highly compliant to accommodate wide co-planarity variations. Capacitance under 0.pF 49.5 SM elastomer TOP VIEW: lid removed escription: Socket rawing SHEET: 1 OF 5

2 4.600 Lid open Area 6mm Max component Height (x4) A1 corner 9.60(x4).5mm Max Component Height X 0.85 THRU ALL Non-Plated Hole (x4) pad X 1.70±0.10 THRU ALL Non-Plated Hole R4 (x4) ± (x8) 8 1mm Max component Height escription: Recommended PCB layout 4.60 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask SHEET: OF 5 SCALE: :1

3 Y Compatible BGA device (x4) 6.80(x4) X A 1.16 REF b 0.08 Z 0. Z X Y 0. Z E 0.80 typ. A (x4) imensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M IM MIN MAX A A b BSC E BSC e x38 Array imension b is measured at the maximum solder ball diameter, parallel to datum plane Z. atum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. escription: Compatible BGA evice SHEET: 3 OF 5

4 ITEM NO. escription Material 1 Hinge Pin and Snap Ring, 3mm O, 30mm long, 1045 Stl, Blk Oxide AISI 1045 Steel, cold drawn Screw, M3 x 1mm, Low Head Cap, SS 18-8 Stainless Steel 3 Precision Compression Spring, Zinc-Plated Music Wire, 1/" Length,0.1" O,.016" Wire Zinc Plated Music Wire 4 SM Socket Base clamshell 31mm 7075-T6 Aluminum Alloy 5 CBT Black Anodized backing plate 31mm 7075-T6 Aluminum Alloy 6 7 owel Pin, 1/3" x 3/16", SS #0-80 x 0.5, SH Cap Screw Chrome Stainless Steel Material <not specified> 8 Latch 7075-T6 Aluminum Alloy 9 Spring Clamshell lid assembly Steel Music Wire 10 Socket Lid 7075-T6 Aluminum Alloy 11 Heat sink Compression Screw M4 threads 7075-T6 Aluminum Alloy 1 BGA190 31x31mm, 0.8mm pitch, 38x38 array Silmat Ball guide BGA190 31x31mm, 0.8mm pitch, 38x38 array Kapton Polyimide/Cirlex 14 PCB 31x31mm, 0.8mm pitch, 38x38 array BGA190 FR4 BGA190 31x31mm, 0.8mm pitch, 38x38 array FR4 Standard 16 Fan 40X10MM 1VC 1.6W 9.9CFM Material <not specified> 17 Screw, #4-40 X 7/8", Cap Alloy Steel 18 Compression plate 31mm no shift with thermocouple hole 7075-T6 Aluminum Alloy 19 Alignment Pin 1/3" dia. x 1/8" lng Chrome Stainless Steel (x8) posts (x8) R1.6 All corners #19 NOT SHOWN escription: Socket assembly R1.60 All Inside corners (x4) posts (x8) Insulation Plate Specification ENG: REQ. ENG. INITIALS SHEET: 4 OF 5 SCALE: 1.3:1

5 A1 corner Thermo couple opening SECTION - escription: Socket SHEET: 5 OF 5

Description: SM-BGA socket for BGA223 19x15 array 0.5mm pitch 8mm x 10mm x 1.2mm DUT

Description: SM-BGA socket for BGA223 19x15 array 0.5mm pitch 8mm x 10mm x 1.2mm DUT Silver Ball Matrix BG Socket Recommended Torque 1.5 in-lb. Features Wide temperature range (-55C to +150C). Current capability is 4 per pin. Over 40GHz bandwidth @-1dB for edge pins. Low and stable contact

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