CONTACTING - MODULES TEST SOLUTIONS ENGINEERED TO CONNECT
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1 ENGINEERED TO CONNECT CONTACTING - MODULES TEST SOLUTIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING - SEMICONDUCTOR 3
2 CONTACTING - MODULES QSEVEN - TEST ADAPTER COMEXPRESS - TEST ADAPTER CUSTOM - BEC TEST ADAPTER 4 AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
3 QSEVEN TEST ADAPTER Operating Temp. : -3 C to +85 C Pitch:.5mm 1, (expected) (mechanical contact cycles at room temperature depending on customer environmental conditions) Flex/Rigid: Impedance Controlled Layerstack architecture according customer requirements and Qseven YED N - Q7 - *** Series Pin Count Pitch Design No. (internal) Housing: Peek / Anodized Aluminium Contacts: Beryllium Copper / Gold Plated over Nickel Flex/Rigid: Epoxy/Polymid, Multilayer Contact Pad Surface: Hard Gold Performance controlled system acc. to Qseven Compatible to MXM Connector / Board Edge Connector 23 Pins (BEC) Flexible in module size In-line volume test Volume test ready TYPICAL OUTSIDE DIMENSIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 5
4 COMEXPRESS TEST ADAPTER Operating Temp. : -3 C to +85 C Pitch:.5mm 5, (expected) (mechanical contact cycles at room temperature depending on customer environmental conditions) Housing: Peek / Anodized Aluminium Contacts: Beryllium Copper / Gold Plated over Nickel Contact Pad Surface: Hard Gold YED N - CE - *** Series Pin Count Pitch Design No. (internal) Reliable Probe Pin Technology Compatible to Standard ComExpress Flexible in module size In-line volume test Volume test ready Other Computer to Module Test Systems on request CONTACTING - MODULES PCB 6 AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
5 CUSTOM BEC TEST ADAPTER Operating Temp. : -3 C to +85 C Pitch:.5mm 1, (expected) (mechanical contact cycles at room temperature depending on customer environmental conditions) Flex/Rigid: Impedance Controlled layerstack architecture according customer requirements Series Application: - Testadapter - Flash (Programming) Design No. (internal) YED274 - BEC -TESTADAPTER - *** Housing: Peek / Anodized Aluminium Contacts: Beryllium Copper / Gold Plated over Nickel Flex/Rigid: Epoxy/Polymid, Multilayer Contact Pad Surface: Hard Gold Performance controlled system acc. to customized pinout Compatible to MXM Connector / Board Edge Connector 23 Pins (BEC) Flexible in module size In-line volume test Volume test ready TYPICAL OUTSIDE DIMENSIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 7
6 CONTACTING - MODULES MEMORY MODULES 8 AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
7 SERIES IC-554 DUAL INLINE MEMORY MODULE (DIMM) 72 PINS - TH Insulation Resistance: 1,MΩ min. at 5V DC Dielectric Withstanding Voltage: 7V AC for 1 minute 3mΩ max. at 1mA/2mV max. Operating Temperature Range: 55 C to +17 C 1, insertions IC MF 1 = 72 Pins MF = Flanged Unmarked = Not Flanged 72 contact pins Card thickness 1.mm RECOMMENDED PCB LAYOUT 89. ± ± R x35=44.45 ± x17=21.59 Ref 1.27x18=22.86 Ref 1.27 ± Thru hole (1.27x17=21.59) 1.27 ± ± x35=44.45 ±.1 (1.27x18=22.86) ± x 35=44.45 ± ± ± ± x35=44.45 ±.5 8. ± ±.4 8. Ref Ref 34.1 Ref ±.1 Front MATCHING MODULE DIMENSIONS ±.5 w.4 x t Front ±.3 Back (2.) ± ± (1.27x17=21.59) x35=44.45 ±.5 (1.27x18=22.86) Back 1.8±.5 AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 9
8 SERIES IC-497 DUAL INLINE MEMORY MODULE (DIMM) 144 PINS - TH Insulation Resistance: 1,MΩ min. at 5V DC Dielectric Withstanding Voltage: 7V AC for 1 minute 3mΩ max. at 1mA/2mV max. Operating Temperature Range: 55 C to +17 C 1, insertions min. IC * MF Design No. Postioning Detail (see sec "A") MF = Flanged Unmarked = Not Flanged 144 contact pins Card thickness 1.mm 4 different positioning indicators ±.5.8x29=23.2 ±.2 (4.6±.1) (.4) 11. ± ±.5.8x41=32.8 ±.2.8 ±.5 RECOMMENDED PCB LAYOUT ± ± ±.5.8x29=23.2 ±.1.8x41=32.8 ±.1.8 ±.5 (.4) 4.6 ± MEMORY MODULES - DIMM x29=23.2 ±.2.8x41=32.8 ± ± ± ± ±.4 7.7±.5 4.5±.5.8x29=23.2 ± ±.5.8 ±.5 (.4).8x41=32.8 ± ±.5 (91.5) (65.) R (36.5) ±.1 R 1.7 MATCHING MODULE DIMENSIONS Section "A" 2. min 3.5 ±.5 w.3 x t.3 POSITIONING PINS Section "A" R (25.4~38.1) ± ±.1.8.8x29=23.2 R ±.5.8x41= ±.15 Front ± max IC ** IC ** ±.5.8x41= x29= see Sec. "A" 1.5 ±.1.8 Back IC ** IC ** 1 AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
9 SERIES IC-438 DUAL INLINE MEMORY MODULE (DIMM) 168 PINS - TH Insulation Resistance: 1,MΩ min. at 5V DC Dielectric Withstanding Voltage: 7V AC for 1 minute 3mΩ max. at 1mA/2mV max. Operating Temperature Range: 55 C to +17 C 1, insertions min. IC * - * - MF Possitioning Detail 1 (see Sec. "A") Possitioning Detail 2 (see Sec. "B") MF = Flanged Unmarked = Not Flanged 168 contact pins Card thickness 1.27mm 7 different positoning indicators Possible customer DIMM modules: Toshiba, NEC, OKI, Hitachi, Fujitsu, Siemens and Infineon RECOMMENDED PCB LAYOUT 43.18± ± ± x29=36.83 ± x9=11.43 ± ± x43=54.61 ± ± x9=11.43 ± x29= ± x43=54.61 ±.2 (6.35) 6.35± ± ± ± Sec. "A" (128.) Sec. "B" 15.48± ±.5 5.8± ±.5 w.4 x t.3 POSITIONING PIN DETAILS MATCHING MODULE DIMENSIONS Section "A" (DRAM Key Indicators) IC *-** IC *-** IC *-** R -.8 R ± R 1. 2-R 2. DRAM SDRAM UDRAM Section "B" (Voltage Key Indicators) IC-438-*-1-** IC-438-*-2-** IC-438-*-3-** IC-438-*-4-** ± Component area Sec. "A" Sec. "B" no indication 3.3V 5V less than 3.3V AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 11
10 SERIES IC-595 DUAL INLINE MEMORY MODULE (DIMM) 184 AND 24 PINS - TH Insulation Resistance: 1,MΩ min. at 5V DC Dielectric Withstanding Voltage: 7V AC for 1 minute 3mΩ max. at 1mA/2mV max. Operating Temperature Range: 55 C to +17 C 1, insertions IC * - * - MF - * 1= 184 Pins 2 = 24 Pins Design No. MF = Flanged Unmarked = Not Flanged Key Indicator (please contact Yamaichí) 184 and 24 contact pins Card thickness 1.27mm with 1.mm pitch 122. ±.2 1.x45=45. ± ±.2 1.x45=45. ± Thru hole 11.5±.1 RECOMMENDED PCB LAYOUT (IC ONLY) 122. ±.1 1.x45=45. ± ±.1 1.x45=45. ±.1 1.± ± Thru hole MEMORY MODULES - DIMM 1. ± ± ± ±.2 8.±.5 4.8± Thru hole 1. ± ± ref 128. ref MATCHING MODULE DIMENSIONS (IC ONLY) ±.1 Section "A" 3. 2.±.1 4.± ±.5 w.3 x t R ± x45=45. ± x45=45. ± ±.1 2.3± ±.15 Section "A" (IC only) 12 AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
11 SERIES IC-589 DUAL INLINE MEMORY MODULE (DIMM) 184 PINS - TH Insulation Resistance: 1,MΩ min. at 5V DC Dielectric Withstanding Voltage: 7V AC for 1 minute 3mΩ max. at 1mA/2mV max. Operating Temperature Range: 55 C to +17 C 1, insertions min. IC MF Design No. MF = Flanged Unmarked = Not Flanged 184 contact pins with 1.27mm pitch Card thickness 1.27mm RECOMMENDED PCB LAYOUT 3.2 Thru hole ± x51=64.77 ± x39=49.53 ± ref ± ± x51=64.77 ± x39=49.53 ± ± Thru hole ± ± ± ± ±.5 5.8± Thru hole 1.27 ± ± ref MATCHING MODULE DIMENSIONS 128. ref ref ±.1 2.3± ±.5 W.4 x t ± x51=64.77 ± x39=49.53 ± AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 13
12 SERIES IC-657 DUAL INLINE MEMORY MODULE (DIMM) 144, 172 AND 2 PINS - TH Insulation Resistance: 1,MΩ min. at 5V DC Dielectric Withstanding Voltage: 7V AC for 1 minute 3mΩ max. at 1mA/2mV max. Operating Temperature Range: 55 C to +17 C 1, insertions min. IC * - * MF 1 = 2 pins with.6mm Pitch 2 = 172 pins with.5mm Pitch 3 = 144 pins with.5mm Pitch Design No. MF = Flanged Unmarked = Not Flanged 144 and 172 contact pins with.5mm pitch 2 contact pins with.6mm pitch Part Number IC x19=11.4 ± Thru hole ±.1.6x79=47.4 ±.2.6 ±.15.6 ± ± ± ±.4 RECOMMENDED PCB LAYOUT Part Number IC ± ±.1.6x19=11.4 ±.1.6x79=47.4 ±.1.6 ±.5 1.7±.5 7.5± Thru hole.6 ± Thru hole +.1 MEMORY MODULES - DIMM Part Numbers IC / IC Thru hole.5x71=35.5.5x85=42.5 (IC-657-3**) (IC-657-2**) Part Numbers IC / IC (IC-657-3**) / 77.8 (IC-657-2**).5x71=35.5 (IC-657-3**).5x85=42.5 (IC-657-2**) ±.5 Thru hole Thru hole (IC657-3**) (IC657-2**).5 ± (IC-657-3**) / 68.8 (IC-657-2**) 7.3 (IC-657-3**) / 77.8 (IC-657-2**) 79.3 (IC-657-3**) / 86.8 (IC-657-2**) 91.5 (ref) 65. (ref) 1.8±.5 7.6±.5 3.2Thru hole MATCHING MODULE DIMENSIONS Part Number IC (ref) Part Number IC ± x79=47.4 ± ±.5 W.3 x t.25.6x19=11.4 ± (IC-657-3**) / 67.3 (IC-657-2**) Part Numbers IC657-3 / IC657-2 (ref) 3. Front Side (IC-657-3**) / 42.5 (IC-657-2**) 3.5 W.3 x t (IC-657-3**) / 44.5 (IC-657-2**).8 14 AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
13 SERIES IC-176 SINGLE INLINE MEMORY MODULE (SIMM) - TH Insulation Resistance: 1,MΩ min. at 5V DC Dielectric Withstanding Voltage: 7V AC for 1 minute 3mΩ max. at 1mA/2mV max. Current Rating: 1A max. Operating Temperature Range: 4 C to +15 C 1, insertions min. Polyethersulphone (PES), glass-filled IC * - MF Design No. MF = Flange Unmarked = Not Flanged Card thickness 1.27mm Kelvin type contact which utiiizes both sides of the contact system Easy insertion and extraction by latch RECOMMENDED PCB LAYOUT (IC **) 1.27 x 35 = x 35 = A B MATCHING MODULE DIMENSIONS (IC **) C Pitch min 3.18 R Component area min 1.27MM PITCH min Part Number Pin Count A B C IC ** IC ** IC ** MM PITCH Part Number Pin Count A B C IC ** IC ** AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 15
14 SERIES IC-176 SINGLE INLINE MEMORY MODULE (SIMM) - TH RECOMMENDED PCB LAYOUT (IC **) MATCHING MODULE DIMENSIONS (IC **) x 29 = RECOMMENDED PCB LAYOUT (IC **) R Component area MATCHING MODULE DIMENSIONS (IC **) min MEMORY MODULES - SIMM x 34 = min 3.18 R Component area min min RECOMMENDED PCB LAYOUT (IC **) 8.28±.5 5.8± ± x 31= ± ± x 31= ± ± ± RECOMMENDED PCB LAYOUT (IC **) 8.28±.5 5.8± ± x 49 = ± ± x 49 = ± ± ± AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
15 CONTACTING - MODULES CARD EDGE CONNECTORS
16 SERIES PS42 18 CARD EDGE CONNECTORS, 2.54MM PITCH - TH Insulation Resistance: Dielectric Withstanding Voltage: Current Rating: Operating Temperature Range: Terminals: Solder Plating over Nickel Card thickness 1.6mm 2 terminal types available 1,MΩ min. at 5V DC 1V AC for 1 minute 1mΩ max. at 1mA/2mV max. 3A 4 C to +17 C 5 (1.75mm max. PCB thickness) Contact Pitch 4 = 2.54 Design No. (internal use only) Contact Arrangement 4 = Independent contacts on both sides Terminal Type: D = Solder Dip PS * - * 16 H = Eyelet No. of Pairs (No. of pairs = No. of Poles x2) Design No (internal use only) A B C E D CONTACT DETAIL PS42-44D D PS42-44H F MATCHING PCB DIMENSIONS Poles RECOMMENDED PCB LAYOUT 1.5 (6.) contact pos..5~ ± ~ x (No. of poles 1) = A 1.6±.19 D C.5~1. 3 ~45 5.8± x (No.of poles 1) = A 2.54±.5 Pin count MM PITCH Part Number Pin Count A B C D E F PS42-44* PS42-44* AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
17 SERIES PS44 18 CARD EDGE CONNECTORS, 2.54MM PITCH - TH Insulation Resistance: Dielectric Withstanding Voltage: Current Rating: Operating Temperature Range: Terminals: Solder Plating over Nickel Card thickness 1.6mm 2 terminal types available 1,MΩ min. at 5V DC 1V AC for 1 minute 1mΩ max. at 1mA/2mV max. 3A 4 C to +17 C 5 (1.75mm max. PCB thickness) Contact Pitch 4 = 2.54 Design No. (internal use only) Contact Arrangement 4 = Independent contacts on both sides Terminal Type: D = Solder Dip PS * - * 11 H = Eyelet No. of Pairs (No. of pairs = No. of Poles x2) Design No (internal use only) A B C E D CONTACT DETAIL J PS44-44D D PS44-44H MATCHING PCB DIMENSIONS 1.5 (6.) contact pos..5~ ±.5 Poles F C.5~1. 3 ~ ~1. D 1.6±.19 G 5.8±.1 RECOMMENDED PCB LAYOUT Pin count 1.1 H ±.2 D 2.54± MM PITCH Part Number Pin Count A B C D E F G H J PS44-44* PS44-44* PS44-44* PS44-44* PS44-44* PS44-44* AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 19
18 SERIES PS61 18 CARD EDGE CONNECTORS, 3.96MM PITCH - TH Insulation Resistance: Dielectric Withstanding Voltage: Current Rating: Operating Temperature Range: Terminals: Solder Plating over Nickel Card thickness 1.6mm 2 terminal types available 1,MΩ min. at 5V DC 1V AC for 1 minute 1mΩ max. at 1mA/2mV max. 3A 4 C to +17 C 5 (1.75mm max. PCB thickness) Contact Pitch 6 = 3.96 Design No. (internal use only) Contact Arrangement 4 = Independent contacts on both sides Terminal Type: D = Solder Dip No. of Pins PS * - * 11 H = Eyelet Design No (internal use only) A B C E D CONTACT DETAIL PS61-44D D 1.4 PS61-44H MATCHING PCB DIMENSIONS 1.5 (6.) contact pos..5~ MM PITCH 3.96±.5 F C.5~1. 3 ~ min..5~1. D J 1.6±.19 G 5.8±.1 RECOMMENDED PCB LAYOUT H D 3.96±.5 No. of pins 1.1 Part Number Pin Count A B C D E F G H J PS61-44* PS61-44* PS61-44* PS61-44* PS61-44* AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
19 CONTACTING - MODULES FFC / FPC CLIP CONNECTOR TCP / TAB (TAPE PACKAGES) AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 21
20 SERIES LC FPC / FFC CLIP CONNECTOR Contact Force: Operating Temp. Range: <5mΩ ~3g (typical) 2 C to +85 C >1, times LC Series Pitch Size Pin Count Design No. Clip type socket Proven stamped contact Outstanding contact reliability with wiping action Ultra low pitch capability (.3mm staggered) Minimized pad damage Elevator FPC stage (protect FPC and contact damage) APPLICATION Testing Jig for modules with FPC / FFC BASE SOCKET FOR ALL OTHER CONNECTORS LC5-6-9 *in planning Base Socket FPC Pitch (mm) Pin Count Dim. W x L x Ht. Dim. W x L x Ht. with PCB LC mm (staggered) up to x 54.5 x x 91. x 2. LC mm (staggered) 4 to x 54.5 x x 91. x 2. LC mm (in-line)* up to x 54.5 x x 91. x 2. LC mm (in-line) up to x 54.5 x x 91. x 2. LC mm (in-line) 31 to 6 4. x 54.5 x x 91. x AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES
21 SERIES IC51 TAPE CARRIER PACKAGE / TAPE AUTOMATED BONDING - TH Insulation Resistance: 1,MΩ min. at 1V DC Withstanding Voltage: 5V AC for 1 minute 3mΩ max. at 1mA/2mV max. Operating Temp.Range: 4 C to +15 C Contact Force: 11gf per pin approx. Polyethersulphone (PES), glass-filled IC * No. of Contact Pins Number of Sides with Contacts Design Number EXAMPLE CROSS SECTION FOR A 35MM TAPE.4MM PITCH 244 PINS Guide Post Guide Pin Floating Platform Lid Insulator Contact Tail Locator SOCKET Part Number Tape Size Pitch IC mm.5 mm IC mm.4 mm IC mm.3 mm IC mm.3 mm IC mm.25 mm IC mm.5 mm IC mm.5 mm CARRIER Part Number Tape Size Window Size Super Width Carrier Style TAB mm 24. mm X Hinge Type TAB mm 24. mm X Sandwich Type TAB mm 32.8 mm X Sandwich Type TAB mm 32.8 mm X Sandwich Type TAB-79 7mm 52. mm X 1 Pc. Type TAB-719 7mm 52. mm X Sandwich Type TAB-722 7mm 52. mm X Sandwich Type AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING MODULES 23
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