Model C1517J5003AHF. Ultra Low Profile db, 90 Hybrid Coupler

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1 Model C57J53AHF Ultra Low Profile 85 3 db, 9 Hybrid Coupler Description The C57J53AHF is a low cost, low profile sub-miniature high performance 3 db coupler in an easy to use surface mount package. The C57J53AHF is ideal for balanced power and low noise amplifiers, plus signal distribution and other applications where low insertion loss and tight amplitude and phase balance are required. The C57J53AHF is available on tape and reel for pick and place high volume manufacturing. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability. All parts have been subjected to rigorous qualification testing and units are % RF tested. Detailed Electrical Specifications: Specifications subject to change without notice. Features: 5 7 MHz.7mm Height Profile High Isolation & Low Loss LTE Bands: 4 Surface Mountable Tape & Reel Non-conductive Surface RoHS Compliant Halogen-Free % RF Tested 5 C to 85 C ROOM (5 C) Parameter Min. Typ. Max Unit Frequency 5 7 MHz Port Impedance 5 Ω Return Loss 5 db Isolation 4 8 db Insertion Loss*..3 db Amplitude Balance.4. db Phase Balance (relative to 9 ).7 4 Degrees Power Handling 4 Watts Operating Temperature ºC Group Delay (.5-.7GHZ) (nsec) * Insertion Loss stated at room temperature (Insertion Loss is approximately. db higher at +85 ºC) Outline Drawing Top View (Nearside).4±..7±.7 Side View Min. Typ. Max x.37 x.5 Bottom View (Farside) 3.9±. 6x.98 6x. Orientation Marker Denotes Pin Location Pin Configuration- Configuration- Orientation Marker Denotes Pin Location Configuration-3 Configuration x.65 6x.3 Mechanical Outline -Dimensions are in Millimeters -Tolerances are Non-Cumulative (35) (8)

2 Model C57J53AHF Typical Broadband Performance: 5 MHz. to 6 MHz (35) (8)

3 Model C57J53AHF Typical Performance: 4 MHz. to 8 MHz (35) (8)

4 Model C57J53AHF Definition of Measured Specifications Parameter Definition Mathematical Representation i, j, k, m is denoted as the port index of input, isolated, direct and coupled port for specific pin configuration shown in the table Return Loss Isolation Insertion Loss Amplitude Balance Phase Balance The impedance match of the coupler to a 5Ω system. Return Loss is an alternate means to express VSWR. The input power divided by the sum of the power at the two output ports. The input power divided by the sum of the power at the two output ports. log ( S ) log ii S ji log ( S + S ) The difference in power between the two outputs. The difference in phase angle between the two output ports. mi Ski log ( ) S mi ki S S + 9 o ki mi Group Delay Group delay is defined as the average of the mean group delay of the coupling path and the mean group delay of the direct path. Group delay (ns) = Mean GD S ( ( mi) ) + Mean( GD( Ski) ) where " Mean" is the arithmetic mean of the group delay over a frequency band. *% RF test is performed per spec definition for pin configuration and port (input port) is connected to pin, port (isolated port) is connected to pin 3, port 3 (direct port) is connected to pin 4 and port 4 (isolated) is connected to pin 6. (35) (8)

5 Model C57J53AHF Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from organic PTFE based composites which possess excellent electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier. An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. 6x.35 4x.3 6x x.5 4x Transmission Line Plated thru holes to ground Circuit Pattern Footprint Pad (s) Solder Resist Dimensions are in Millimeters Mounting Footprint (35) (8)

6 Model C57J53AHF Packaging and Ordering Information Parts are available in reel and are packaged per EIA 48-. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4 per reel. See Model Numbers below for further ordering information (35) (8)