Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network
|
|
- Candice Richards
- 6 years ago
- Views:
Transcription
1 OSOP Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network OSOP Series resistor networks feature a space saving 25 mil lead pitch versus the current 50 mil pitch standard. This allows users to reduce board space more than 50 % over current standards. The OSOP series features 16, 20, and 24 pin variations with isolated and last pin common schematics. Custom schematics and resistor values are also available, consult factory. SCHEMATIC FEATURES 0.068" (1.73 mm) maximum seated height Rugged molded case construction with no Available internal solder JEDEC MO-137 variation AB = 16 pin, Available AD = 20 pin, AE = 24 pin Material categorization: for definitions of compliance please see Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details TYPICAL PERFORMANCE ABSOLUTE TRACKING R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 TCR 25 5 ABSOLUTE RATIO OSOP 16 B OSOP 20 A OSOP 24 C TOL STANDARD RESISTANCE OFFERING (R 1 =) k 1 k 20 k 2 k 50 k 5 k 100 k OSOP 16 E OSOP 20 D OSOP 24 F Note Consult factory for additional values and schematics STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material Passivated nichrome - Pin / Lead Number 16, 20, 24 - Resistance Range 500 to 100 k per resistor - TCR: Absolute ± 25 ppm/ C -55 C to +125 C TCR: Tracking ± 5 ppm/ C -55 C to +125 C Tolerance: Absolute ± 0.1 % to 1 % +25 C Tolerance: Ratio ± % to 0.5 % +25 C Power Rating: Resistor 100 mw Maximum at +70 C Power Rating: Package 400 mw Maximum at +70 C Stability: Absolute R ± 0.05 % 2000 h at +70 C Stability: Ratio R ± % 2000 h at +70 C Voltage Coefficient < 0.1 ppm/v (typical) - Working Voltage 100 V max. not to exceed P x R - Operating Temperature Range -55 C to +125 C - Storage Temperature Range -55 C to +150 C - Noise < -30 db - Thermal EMF 0.08 μv/ C - Shelf Life Stability: Absolute R ± 0.01 % 1 year at +25 C Shelf Life Stability: Ratio R ± % 1 year at +25 C Revision: 03-Mar-17 1 Document Number: 60002
2 OSOP DIMENSIONS AND IMPRINTING in inches and millimeters Logo PIN 1 Locator A D H J B Date Code Part Number Marking E F G C I A J DIMENSION INCHES MILLIMETERS 16 pin ± , 24 pin ± B C D E ± ± 0.05 F G H ± ± 0.05 I pin pin pin MECHANICAL SPECIFICATIONS Resistive Element Substrate Material Body Terminals Lead (Pb)-free Option Tin Lead Option Tin Lead and Lead (Pb)-free Finish Passivated nichrome Silicon Molded epoxy Copper alloy 100 % matte tin Sn90 Plated GLOBAL PART NUMBER INFORMATION New Global Part Numbering: OSOPA1002BUF O S O P A B U F O S O P T A A T 1 GLOBAL MODEL (4 or 5 digits) SCHEMATIC RESISTANCE TOLERANCE AND RATIO TOLERANCE PACKAGING OSOP (Tin Lead) OSOPT (Lead (Pb)-free) (e3) A = 20 pin 10 isolated resistors B = 16 pin 8 isolated resistors C = 24 pin 12 isolated resistors D = 20 pin 19 resistors pin 20 common E = 16 pin 15 resistors pin 16 common F = 24 pin 23 resistors pin 24 common First 3 digits are significant figures and the last digit specifies the number of zeroes to follow. Example: 1002 = 10K 1003 = 100K Abs. Tol. A = 0.1 % B = 0.1 % C = 0.25 % D = 0.5 % F = 1 % Z = 0.1 % (1) Ratio 0.05 % 0.1 % 0.1 % 0.1 % 0.5 % % TAPE AND REEL T0 = 100 min., 100 mult T1 = 1000 min., 1000 mult (2) T3 = 300 min., 300 mult T5 = 500 min., 500 mult TF = Full reel 2500 TS = 100 min., 1 mult UF = TUBED Historical Part Number example: OSOPA5000B (for reference purposes only) OSOP A 5000 B SERIES SCHEMATIC RESISTANCE TOLERANCE AND RATIO TOLERANCE Notes (1) Tolerance available 1K and up (2) Preferred packaging code Revision: 03-Mar-17 2 Document Number: 60002
3 1. Scope This technical note provides sample land patterns for SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin Film recommends that the user contacts their PC board supplier for actual land patterns required. The pads are intended for lead (Pb)-free and tin / lead solder types. 2. Product Series Thin Film Surface Mount Chip Resistors (FC, L, P, PTN, PLT, PLTT. PLTU, PAT, PATT, PNM, M/D55342 QPL Series) 0402 Land Pattern (1.829) (0.610) (0.559) (0.635) 0502 Land Pattern (2.083) (0.686) (0.508) (0.787) 0505 Land Pattern (2.108) (1.321) (0.533) (0.787) 0603 Land Pattern (2.337) (0.864) (0.762) (0.787) 0705 Land Pattern (2.667) (1.092) (0.787) (1.321) 1005 Land Pattern (3.302) 1010 Land Pattern (3.327) 1206 Land Pattern (3.962) 1505 Land Pattern (4.826) (1.676) (0.813) (1.321) (1.651) (0.838) (2.565) (2.134) (0.914) (1.702) (2.946) (0.940) (1.372) 2010 Land Pattern (6.401) 2208 Land Pattern (6.985) 2512 Land Pattern (7.620) (2.540) (1.930) (3.175) (1.245) (3.912) (4.445) (1.245) (5.131) Revision: 11-Oct-17 1 Document Number: 60119
4 Thin Film Surface Mount Chip Resistors (PHP, PCAN Series) 0603 Land Pattern Land Pattern Land Pattern Land Pattern Thin Film Surface Mount Chip Resistors Long Axis Termination (L Series) 0508 Land Pattern Land Pattern (2.311) 1020 Land Pattern (3.327) 1225 Land Pattern (3.912) (2.286) (0.406) (0.762) (3.708) (5.334) (6.909) (0.787) (0.762 ) (1.803) (0.762) (2.134) (0.889) Revision: 11-Oct-17 2 Document Number: 60119
5 Surface Mount Networks (MPM, MP3, MP4 Series) SOT-23 (MPM, MPMA) (1.016) SC70-3 (MP3) SC70-4 (MP4) (1.499) (1.499) (0.635) (0.635) (2.197) (1.016) (1.016) (1.397) (1.943) (1.143) (0.749) (1.943) (1.334) (0.965) (1.143) Surface Mount Networks SOIC Narrow Body 150 mils (ORN, CSO, MOMC, HTRN, AORN, MORN Series) SOIC-8 (ORN, HTRN, AORN, CSO-8) SOIC-14 (NOMC-14, NOMCA-14, CSO-14) (2.159) (2.159) (5.207) (5.207) SOIC-16 (NOMC-16, NOMCA-16, CSO-16, VSOR-16) MORN MSOP MO-187AA (MORN-8) (2.159) (5.207) Revision: 11-Oct-17 3 Document Number: 60119
6 Surface Mount Networks SOIC Medium Body 220 mils (TOMC Series) SOIC-16 (TOMC) (2.032) (6.985) Surface Mount Networks SOIC Wide Body 300 mils (WOMC Series) SOIC-16 (WOMC-16) SOIC-20 (WOMC-20) (2.159) (2.159) (9.144) (9.144) Revision: 11-Oct-17 4 Document Number: 60119
7 Surface Mount Networks High Density SSOP, TSOP (VSSR, VTSR Series) SSOP MO-137 OSOP-16, VSSR (0.406) OSOP-20, VSSR-20 OSOP-24, VSSR-24, HD-CSO (0.406) (0.406) (5.690) (5.690) (5.690) (0.635) (0.635) (0.635) TSSOP MO-153 VTSR-16 VTSR-20 VTSR (0.356) (0.356) (0.356) (6.096) (6.096) (6.096) (0.650) (0.650) (0.650) Revision: 11-Oct-17 5 Document Number: 60119
8 Surface Mount Leadless Networks (LCC Series) 16 Pin LCC 20 Pin LCC Surface Mount Leadless Networks (MPH Series) 4 Pin LCC Surface Mount Leadless Packages DUAL/ QUAD Flat No Lead (DFN, QFN Series) DFN MLP QFN MLP DFN-8 4 x 5 mm Sq QFN-20 5 x 5 mm Sq (3.500) (0.356) (0.696) (0.356) (0.696) (3.896) (2.700) (4.595) (3.150) (0.800 ) (0.065) Revision: 11-Oct-17 6 Document Number: 60119
9 Surface Mount Leadless Resistor Arrays (PR Series) PR 100 (2 to 8 resistors) PR 135 (2 to 8 resistors) PR 182 (2 to 8 resistors) Note All dimensions in inches (mm) Flatpack 14 Pin Bottom Brazed Flatpack 16 Pin Bottom Brazed Flatpack Revision: 11-Oct-17 7 Document Number: 60119
10 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 08-Feb-17 1 Document Number: 91000
Molded, 50 mil Pitch, Dual-In-Line Thin Film Divider, Surface Mount Resistor Network
ORNV (Divider) Molded, 50 mil Pitch, Dual-In-Line Thin Film Divider, Surface Mount Resistor Network ORNV series voltage dividers provide optimum ratio precision, small size and exceptional stability for
More informationMolded, SOT-23 Thin Film Resistor, Surface Mount Divider Network
MPM (Divider) Molded, SOT-23 Thin Film Resistor, Surface Mount Divider Network MPM Series Dividers provide ± 2 ppm/ C tracking and a ratio tolerance as tight as 0.01 %, small size, and exceptional stability
More informationCeramic Sandwich, Single-In-Line Thin Film Resistor, Through Hole Network (Low Profile 0.20 Custom)
CS Ceramic Sandwich, Single-In-Line Thin Film Resistor, Through Hole Network (Low Profile 0.20 Custom) Actual Size presents a design concept in precision thin film resistor networks. The essence of this
More informationHigh Frequency (up to 40 GHz) Resistor, Thin Film Surface Mount Chip
FC High Frequency (up to 40 GHz) Resistor, Thin Film Surface Mount Chip FC series chip resistors are designed with low internal reactance. They function as almost pure resistors on a very high range of
More informationHigh Power Thin Film Wraparound Chip Resistor
High Power Thin Film Wraparound Chip Resistor FEATURES High purity ceramic substrate Power rating to 2.5 W Resistance range 10 to 30.1 k Resistor tolerance to ± 0.1 % TCR to ± 25 ppm/ C Flame resistant
More informationVishay Dale Thin Film Land Patterns
1. Scope This technical note provides sample land patterns for SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are
More information25 mil or 50 mil Pitch, Termination Thin Film Surface Mount Resistor/Capacitor Network
25 mil or 50 mil Pitch, Termination Thin Film Surface Mount Resistor/Capacitor Network Small outline, surface mount, EMI/RFI reduction If your design calls for the elimination of transmission line effects
More informationThick Film Resistor Networks, Dual-In-Line, Molded DIP
Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES Isolated, bussed, and dual terminator schematics available 0.160" (4.06 mm) maximum seated height and rugged, molded case construction Thick
More informationThick Film Resistor Networks, Dual-In-Line, Molded DIP
Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES Isolated, bussed, and dual terminator schematics available 0.160" (4.06 mm) maximum seated height and rugged, molded case construction Thick
More informationHigh Frequency (up to 20 GHz) Resistor, Thin Film Surface Mount Chip
High Frequency (up to 20 GHz) Resistor, Thin Film Surface Mount Chip series chip resistors are designed with low internal reactance. They function as almost pure resistors on a very high range of frequencies.
More information50 W Power Resistor, Thick Film Technology, TO-220
50 W Power Resistor, Thick Film Technology, TO-220 FEATURES 50 W at 25 C heatsink mounted Adjusted by sand trimming Leaded or surface mount versions High power to size ratio Non inductive element Material
More informationThin Film Bar MOS Capacitors
Thin Film Bar MOS Capacitors FEATURES Robust MOS construction Allows for multiple wire bonds. At the lowest values, case A will accept 7 bonds and case B will accept 15. Low D, high Q Excellent load life
More informationINTERACTIVE. data book. Vishay Dale thin film products. vishay Dale thin film
VISHAY INTERTECHNOLOGY, INC. INTERACTIVE data book Vishay Dale thin film products vishay Dale thin film vse-db0024-1309 s: 1. To navigate: a) Click on the Vishay logo on any datasheet to go to the Contents
More informationThick Film Resistor Networks, Military, MIL-PRF Qualified, Type RZ010 and RZ020 Dual-In-Line, Molded DIP
MDM (Military M831/1 and /2) Thick Film Resistor Networks, Military, MIL-PRF-831 Qualified, Type RZ1 and RZ2 Dual-In-Line, Molded DIP STANDARD ELECTRICAL SPECIFICATIONS VISHAY DALE MODEL/ PIN NO. MIL STYLE
More informationSingle-Line ESD Protection in SOT-23
Single-Line ESD Protection in 3 1 2 20421 MARKING (example only) XX YYY XX 20512 YYY = type code (see table below) XX = date code 20357 1 FEATURES Single-line ESD-protection device ESD-protection acc.
More informationESCC ( ) 4001/023 Qualified R Failure Rate High Precision (10 ppm/ C, 0.05 %) Thin Film Chip Resistors
ESCC ( ) 4001/023 Qualified R Failure Rate High Precision (10 ppm/ C, 0.05 %) Thin Film Chip Resistors DESIGN SUPPORT TOOLS Models Available click logo to get started Sfernice Thin Film division holds
More informationThick Film Resistor Networks, Dual-In-Line, Medium Body, Small Outline, Molded DIP, Surface Mount
Thick Film Resistor Networks, Dual-In-Line, Medium Body, Small Outline, Molded DIP, Surface Mount FEATURES Isolated, bussed and dual terminator schematics available 4, 6, or 2 terminal package Molded case
More informationSmall Signal Switching Diode, Dual
Small Signal Switching Diode, Dual 3 1 2 18108_1 DESIGN SUPPORT TOOLS click logo to get started FEATURES Silicon epitaxial planar diode Fast switching dual diode with common cathode AEC-Q101 qualified
More informationSurface Mounted Power Resistor Thick Film Technology
Surface Mounted Power Resistor Thick Film Technology DIMENSIONS in millimeters FEATURES AEC-Q200 qualified 25 W at 25 C case temperature Surface mounted resistor - TO-252 (DPAK) style package Wide resistance
More informationThick Film Resistor Networks, Dual-In-Line, Molded DIP
STANDARD ELECTRICAL SPECIFICATIONS POWER RATING / ELEMENT (1) RANGE NO. OF P 70 C PINS Ω W MDP 14 MDP 16 01 05 01 05 0.2 0.2 Consult factory Consult factory Notes (1) For resistor power ratings at + 25
More informationBidirectional Symmetrical (BiSy) Low Capacitance, Dual-Line ESD-Protection Diode in SOT-323
VCAN26A2-3G Bidirectional Symmetrical (BiSy) Low Capacitance, Dual-Line ESD-Protection Diode in SOT-323 3 1 2 22742 MARKING (example only) 22743 WW VY ABC ABC = type code (see table below) WW = date code
More informationBidirectional Symmetrical (BiSy) Low Capacitance, Dual-Line ESD Protection Diode in SOT-23
VCAN26A2-3S Bidirectional Symmetrical (BiSy) Low Capacitance, Dual-Line ESD Protection Diode in SOT-23 FEATURES 3 For CAN and FLEX-Bus applications Small SOT-23 package AEC-Q1 qualified available 1 2 22742
More informationThick Film Resistor Networks, Dual-In-Line, Molded DIP
MDP 01,, 05 STANDARD ELECTRICAL SPECIFICATIONS POWER RATING / ELEMENT (1) RANGE NO. OF P 70 C PINS Ω W MDP 14 MDP 16 01 05 01 05 0.2 0.2 Consult factory Consult factory Notes (1) For resistor power ratings
More informationPower Resistor, for Mounting onto a Heatsink Thick Film Technology
Power Resistor, for Mounting onto a Heatsink Thick Film Technology FEATURES 5 W to 50 W High power rating DESIGN SUPPORT TOOLS Models Available click logo to get started High overload capabilities up to
More informationSingle-Line ESD Protection in SOT-23
Single-Line ESD Protection in FEATURES 3 Single-line ESD-protection device ESD-protection acc. IEC 61000-4-2 contact discharge air discharge 1 2 20421 20512 1 Space saving package AEC-Q101 qualified e3-
More informationSurface Mount Power Resistor Thick Film Technology
Surface Mount Power Resistor Thick Film Technology FEATURES AEC-Q200 qualified 20 W at 25 C case temperature Surface mounted resistor - TO-263 (D 2 PAK) style package Wide resistance range from 0.01 to
More informationSMN. Vishay Foil Resistors
High Precision Surface Mount 4 Resistor Network Dual-In-Line Package with TCR Tracking 0.5 ppm/ C, Tolerance Match of 0.01 % and Ratio Stability of 0.005 % Any value and any ratio available within resistance
More informationSmall Signal Switching Diode
Small Signal Switching Diode 2 DESIGN SUPPORT TOOLS click logo to get started 3 FEATURES Silicon epitaxial planar diode Fast switching diode in case SOT-23, especially suited for automatic insertion AEC-Q
More informationIMPROVED PRODUCT SMN. Vishay Foil Resistors. RoHS* FEATURES Temperature Coefficient of Resistance (TCR) (- 55 C to C, + 25 C Ref): INTRODUCTION
High Precision Surface Mount 4 Resistor Network Dual-In-Line Package with TCR Tracking 0.5 ppm/ C, Tolerance Match of 0.01 % and Ratio Stability of 0.005 % Any value and any ratio available within resistance
More informationVout SMNZ. Note RESISTANCE RATIO R1/R2 = 1 1 < R1/R < R1/R2 100
(Z-Foil) Ultra High Precision Z-Foil Surface Mount 4 Resistor Network Dual-In-Line Package with TCR Tracking of 0.1 ppm/ C, PCR Tracking of 5 ppm at Rated Power, and Tolerance Match of 0.01 % Any value
More informationDual High Voltage Trench MOS Barrier Schottky Rectifier
MBRF9CT-M3, MBRFCT-M3 Dual High Voltage Trench MOS Barrier Schottky Rectifier TMBS ITO-22AB 2 3 PIN PIN 2 PIN 3 PRIMARY CHARACTERISTICS I F(AV) 2 x 5. A V RRM 9 V, V I FSM 2 A V F.75 V T J max. 5 C Package
More informationDual High Voltage Trench MOS Barrier Schottky Rectifier
V300C, VI300C Dual High Voltage Trench MOS Barrier Schottky Rectifier Ultra Low V F = 0.455 V at I F = 5 A TO-220AB 2 3 V300C PIN PIN 2 PIN 3 CASE TMBS TO-262AA K 2 3 VI300C PIN PIN 2 PIN 3 K FEATURES
More informationSingle-Line ESD Protection in SOT-23
Single-Line ESD Protection in 3 1 2 20421 MARKING (example only) XX YYY XX 20512 YYY = type code (see table below) XX = date code 20357 1 FEATURES Single-line ESD-protection device ESD-protection acc.
More informationPower Resistor, for Mounting onto a Heatsink Thick Film Technology
Power Resistor, for Mounting onto a Heatsink Thick Film Technology FEATURES 5 W to 50 W High power rating Manufactured in cermet thick film technology, these power resistors exhibit remarkable characteristics
More informationSmall Signal Zener Diodes
BZX8-Series PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT range nom.. to V Test current T ; specification Pulse current Int. construction Single Small Signal Zener Diodes FEATURES Silicon planar Zener diodes
More informationSurface Mount Power Voltage-Regulating Diodes
Surface Mount Power Voltage-Regulating Diodes DO-24AC (SMA) FEATURES Low profile package Ideal for automated placement Low Zener impedance Low regulation factor Meets MSL level, per J-STD-2, if maximum
More informationTrench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection
www.vishay.com Trench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection Ultra Low V F = 0.28 V at I F = 5 A TMBS ITO-220AC PIN PIN 2 PRIMARY CHARACTERISTICS I F(DC) 40 A V RRM 45 V I FSM
More informationHigh Temperature Stability and High Reliability Conditions FEATURES
Surface Mount PAR Transient Voltage Suppressors High Temperature Stability and High Reliability Conditions DO-28AB PRIMARY CHARACTERISTICS V BR 27 V P PPM ( x μs) 36 W P D 5 W V WM 22 V I RSM 7 A I FSM
More informationCeramic Disc Capacitors Class 2, 500 V DC, 1 kv DC, General Purpose
Ceramic Disc Capacitors Class 2, 500 V DC, 1 kv DC, General Purpose FEATURES High capacitance in small size Kinked (preferred) or straight leads Compliant to RoHS Directive 2011/65/EU APPLICATIONS Bypassing
More informationSurface Mounted Power Resistor Thick Film Technology
DIMENSIONS in millimeters FEATURES AEC-Q200 qualified 35 W at 25 C case temperature Surface mounted resistor - TO-263 (D 2 PAK) style package Wide resistance range from 0.01 to 550 k Non inductive Resistor
More informationPower Resistors for Mounting onto a Heatsink Thick Film Technology
Power Resistors for Mounting onto a Heatsink Thick Film Technology FEATURES 1% tolerance available High power rating = 200 W Wide ohmic value range = 0.046 to 1 M Non inductive Easy mounting Low thermal
More informationHigh Temperature Stability and High Reliability Conditions FEATURES. PARAMETER SYMBOL VALUE UNIT with 10/1000 μs waveform Peak pulse power dissipation
Surface Mount PAR Transient Voltage Suppressors High Temperature Stability and High Reliability Conditions PRIMARY CHARACTERISTICS V WM 1 V to 36 V V BR 11.1 V to 44.2 V P PPM (1 x 1 μs) 36 W P PPM (1
More informationDual Common Cathode Ultrafast Plastic Rectifier
Dual Common Cathode Ultrafast Plastic Rectifier TO-2AB UGE8xCT PIN PIN 2 3 2 FEATURES Power pack Glass passivated pellet chip junction Ultrafast recovery time Low switching losses, high efficiency Low
More informationSMD Photovoltaic Solar Cell Protection Rectifier
SMD Photovoltaic Solar Cell Protection Rectifier esmp Series 2 Anode Cathode Anode 2 FEATURES Very low profile - typical height of. mm Ideal for automated placement Glass passivated pellet chip junction
More informationFEATURES. Package. PARAMETER SYMBOL PB3506 PB3508 PB3510 UNIT Maximum repetitive peak reverse voltage V RRM V 35 T A = 25 C (2) 4.
PB356, PB358, PB35 Enhanced isocink+ TM Bridge Rectifiers + isocink+ ~ ~ - - ~ ~ + ~ ~ Case Style PB FEATURES UL recognition file number E32394 (QQQX2) UL 557 (see *) Enhanced high-current density single
More informationHigh-Voltage Trench MOS Barrier Schottky Rectifier
V2050SG, VI2050SG High-Voltage Trench MOS Barrier Schottky Rectifier Ultra Low V F = 0.57 V at I F = 5 A TO-220AB V2050SG PIN PIN 2 PIN 3 CASE TMBS TO-262AA K 2 3 2 3 VI2050SG PIN PIN 2 PIN 3 K FEATURES
More informationTrench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection
www.vishay.com Trench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection Ultra Low V F = 0.4 V at I F = 5 A VBT045BP-E3 TMBS DESIGN SUPPORT TOOLS Models Available PRIMARY CHARACTERISTICS
More informationFEATURES. Package. PARAMETER SYMBOL PB4006 PB4008 PB4010 UNIT Maximum repetitive peak reverse voltage V RRM V
Enhanced isocink+ TM Bridge Rectifiers + isocink+ ~ ~ - - ~ ~ + ~ ~ Case Style PB FEATURES UL recognition file number E32394 (QQQX2) UL 557 (see *) Enhanced high-current density single in-line package
More informationUltrafast Rectifier FEATURES
Ultrafast Rectifier TO-AC ITO-AC BYW9 Series BYWF9 Series PIN PIN CASE D PA (TO-63AB) BYWB9 Series PIN HEATSIN DESIGN SUPPORT TOOLS click logo to get started FEATURES Power pack Glass passivated pellet
More informationSurface Mount Multilayer Ceramic Chip Capacitors for High Frequency Applications
Surface Mount Multilayer Ceramic Chip Capacitors for High Frequency Applications FEATURES Ultra-stable dielectric offering a Temperature Coefficient of Capacitance (TCC) of 0 ppm/ C ± 30 ppm/ C over the
More informationZener Diodes with Surge Current Specification
Zener Diodes with Surge Current Specification SMA (DO-4AC) PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT V Z range nom. to 7 V Test current I ZT to 5 ma V BR 9.4 to 5 V V WM 8. to V P PPM 3 W T J max. 5
More informationSurface Mount Ceramic Chip Antennas for 2.4 GHz
Surface Mount Ceramic Chip Antennas for 2.4 GHz chip antenna The VJ5106W240 series are small form-factor, high-performance chip-antennas designed to be used in wireless, bluetooth and ISM band 2.4 GHz.
More informationEnhanced isocink+ Bridge Rectifiers
Enhanced isocink+ Bridge Rectifiers - ~ ~ + isocink+ Case Style BU PRIMARY CHARACTERISTICS Package BU I F(AV) 5 A V RRM 6 V, 8 V, V I FSM 2 A I R 5 μa V F at I F = 7.5 A.87 V T J max. 5 C Circuit configuration
More informationHigh Power Aluminum Nitride, Wraparound Surface Mount, Precision Thin Film Non-Magnetic Chip Resistor (up to 6 W)
High Power Aluminum Nitride, Wraparound Surface Mount, Precision hin Film Non-Magnetic Chip Resistor (up to 6 W) FEAURES High thermal conductivity aluminum nitride substrate Power rating up to 6.0 W Resistance
More informationThick Film Resistor Networks, Military, MIL-PRF Qualified, Type RZ040 to RZ090, Single-In-Line, Molded SIP
Thick Film Resistor Networks, Military, -PRF-83401 Qualified, Type RZ040 to RZ090, Single-In-Line, Molded SIP FEATURES Isolated, bussed and dual terminator schematics available -PRF-83401 qualified 0.195"
More informationDual Common-Cathode Ultrafast Rectifier
Dual Common-Cathode Ultrafast Rectifier TO-22AB BYV32 Series PIN PIN 3 CASE 2 3 TO-263AB ITO-22AB 2 3 BYVF32 Series PIN PIN 3 2 FEATURES Power pack Glass passivated pellet chip junction Ultrafast recovery
More informationHigh Current Density Surface Mount Trench MOS Barrier Schottky Rectifier
High Current Density Surface Mount Trench MOS Barrier Schottky Rectifier Ultra Low V F = 0.34 V at I F = 4 A TMBS esmp Series TO-77A (SMPC) Anode Cathode Anode PRIMARY CHARACTERISTICS I F(AV) 8.0 A V RRM
More informationUF4001, UF4002, UF4003, UF4004, UF4005, UF4006, UF4007 Ultrafast Plastic Rectifier
UF400, UF4002, UF4003, UF4004, UF4005, UF4006, UF4007 Ultrafast Plastic Rectifier FEATURES Glass passivated chip junction Ultrafast reverse recovery time Low forward voltage drop Low switching losses,
More informationESD Protection Diode in LLP1006-2L
ESD Protection Diode in LLP6-2L 2 1 2856 MARKING (example only) XY Bar = cathode marking X = date code Y = type code (see table below) 21121 2855 DESIGN SUPPORT TOOLS click logo to get started FEATURES
More informationLower Voltage Ceramic Singlelayer DC Disc Capacitors 1 kv DC to 3 kv DC Low Dissipation Factor
Lower Voltage Ceramic Singlelayer DC Disc Capacitors 1 kv DC to 3 kv DC Low Dissipation Factor FEATURES Low losses High stability Low DF minimizes self heating at HF Ideal for high switching to khz Radial
More informationHigh Current Density Surface Mount Ultrafast Rectifiers
High Current Density Surface Mount Ultrafast Rectifiers esmp Series PRIMARY CHARACTERISTICS I F(AV).0 A V RRM 0 V, 50 V, 200 V t rr 25 ns V F 0.90 V T J max. 75 C Package Diode variations Single die FEATURES
More informationSingle Phase Rectifier Bridge, 1.9 A
Single Phase Rectifier Bridge, 1.9 A PRIMARY CHARACTERISTICS I O 1.9 A V RRM 5 V to 1 V Package Circuit configuration Single phase bridge FEATURES Suitable for printed circuit board mounting Leads on standard
More informationLow Capacitance ESD Protection Diodes for High-Speed Data Interfaces FEATURES
www.vishay.com Low Capacitance ESD Protection Diodes for High-Speed Data Interfaces FEATURES 2 746 MARKING (example only) XX 2052 YYY XX Bar = cathode marking YYY = type code (see table below) XX = date
More informationMetal Film Resistors, Non-Magnetic, Industrial, Precision
CMF Non-Magnetic Metal Film Resistors, Non-Magnetic, Industrial, Precision STANDARD ELECTRICAL SPECIFICATIONS GLOBAL HISTORICAL MAXIMUM WORKING VOLTAGE (1) V (1) Continuous working voltage shall be P x
More informationSingle Phase Bridge Rectifier, 2 A
Single Phase Bridge Rectifier, 2 A FEATURES Suitable for printed circuit board mounting Compact construction High surge current capability Material categorization: for definitions of compliance please
More informationSchottky Rectifier Surface-Mount
Schottky Rectifier Surface-Mount esmp Series SMF (DO-29AB) DESIGN SUPPORT TOOLS Models Available MECHANICAL DATA 2309 Case: SMF (DO-29AB) Polarity: color band denotes cathode end Weight: approx. 5 mg Packaging
More informationHigh Power Aluminum Nitride, Wraparound Surface Mount, Precision Thin Film Chip Resistor (up to 6 W)
High Power Aluminum Nitride, Wraparound Surface Mount, Precision hin Film Chip Resistor (up to 6 W) series chip resistors are designed on aluminum nitride ceramic substrates with enlarged backside terminations
More informationESCC 4001/026 Qualified ( ) High Stability Thick Film Resistor Chips
ESCC 4001/026 Qualified ( ) High Stability Thick Film Resistor Chips DESIGN SUPPORT TOOLS click logo to get started FEATURES SMD wraparound chip resistor Generic specification ESCC 4001 Detailed specification
More informationHigh Temperature Stability and High Reliability Conditions FEATURES
Surface Mount PAR Transient Voltage Suppressors High Temperature Stability and High Reliability Conditions DO-218 Compatible PRIMARY CHARACTERISTICS V BR 11.1 V to 52.8 V P PPM (1 x μs) 66 W P PPM (1 x
More informationHigh Current Density Surface Mount Trench MOS Barrier Schottky Rectifier
High Current Density Surface Mount Trench MOS Barrier Schottky Rectifier Ultra Low V F = 0.29 V at I F = 5 A TMBS esmp Series 2 Anode Cathode Anode 2 PRIMARY CHARACTERISTICS I F(AV) 25 A V RRM 60 V I FSM
More informationMetal Film Resistors, Industrial, Precision
Metal Film Resistors, Industrial, Precision FEATURES Small size - conformal coated Flame retardant epoxy coating Controlled temperature coefficient Excellent high frequency characteristics Exceptionally
More informationMetal Film Resistors, Non-Magnetic, Industrial, Precision
CMF Non-Magnetic Metal Film Resistors, Non-Magnetic, Industrial, Precision STANDARD ELECTRICAL SPECIFICATIONS GLOBAL HISTORICAL MAXIMUM WORKING VOLTAGE (1) V (1) Continuous working voltage shall be P x
More informationTrench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection
Trench MOS Barrier Schottky Rectifier for PV Solar Cell Bypass Protection Ultra Low V F = 0.33 V at I F = A TMBS 2 VBT6045CBP PIN PIN 2 HEATSIN PRIMARY CHARACTERISTICS I F(AV) 2 x 30 A V RRM 45 V I FSM
More informationSmall Signal Zener Diodes
Small Signal Zener Diodes FEATURES Zener voltage specified at 5 μa Maximum delta V Z given from μa to μa Very high stability Low noise AEC-Q qualified Material categorization: For definitions of compliance
More informationRF PIN Diodes - Dual, Common Cathode in SOT-323
BAR64V-5W R PIN Diodes - Dual, Common Cathode in SOT-323 DESIGN SUPPORT TOOLS click logo to get started Models Available DESCRIPTION Characterized by low reverse capacitance the PIN diodes BAR64V-5W was
More informationHigh Voltage Schottky Rectifier
MB0H90, MB0H, MF0H High Voltage Schottky Rectifier High Barrier Technology for Improved High Temperature Performance ITO-220AC D 2 PA (TO-263AB) 2 2 MB0H90 MF0H MB0H PIN PIN PIN 2 PIN 2 HEATSIN PRIMARY
More informationUltrafast Plastic Rectifier
Ultrafast Plastic Rectifier 6xT, F6xT, B6xT TO-0AC 6xT Series PIN CASE ITO-0AC F6xT Series PIN D PA (TO-63AB) B6xT Series PIN HEATSIN FEATURES Power pack Glass passivated pellet chip junction Ultrafast
More informationGlass Passivated Power Voltage-Regulating Diodes
Z4KE0A thru Z4KE200A Glass Passivated Power Voltage-Regulating Diodes DO-204AL (DO-4) FEATURES Plastic MELF package Ideal for automated placement Glass passivated chip junction Low Zener impedance Low
More informationZener Diodes FEATURES
ZPYV9 to ZPY Zener Diodes PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT FEATURES Silicon planar power Zener diodes For use in stabilizing and clipping circuits with high power rating The Zener voltages
More informationICTE5 thru ICTE18C, 1N6373 thru 1N6386. TRANSZORB Transient Voltage Suppressors. Vishay General Semiconductor.
TRANSZORB Transient Voltage Suppressors Case Style 1.5KE PRIMARY CHARACTERISTICS V WM 5. V to 18 V V BR (uni-directional) 6. V to 21.2 V V BR (bi-directional) 9.2 V to 21.2 V P PPM 1 W P D 6.5 W I FSM
More informationZener Diodes FEATURES
ZMYV9 to ZMY Zener Diodes PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT range nom..9 to V FEATURES Silicon planar power Zener diodes For use in stablilizing and clipping circuits with high power rating
More information5KP8.5A thru 5KP188A. TRANSZORB Transient Voltage Suppressors. Vishay General Semiconductor. FEATURES TYPICAL APPLICATIONS
TRANSZORB Transient Voltage Suppressors P6 PRIMARY CHARACTERISTICS V WM 8.5 V to 188 V V BR 9.4 V to 231 V P PPM 5 W P D 8. W I FSM 5 A T J max. 175 C Polarity Uni-directional Package P6 FEATURES P6 glass
More informationZener Diodes with Surge Current Specification
Zener Diodes with Surge Current Specification 17249 PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT V Z range nom. 3.6 to 200 V Test current I ZT 5 to 0 ma V BR 7 to 188 V V WM 6.2 to 160 V P PPM 150 W T
More informationHigh Current Density Surface Mount Trench MOS Barrier Schottky Rectifier
V5PL50 High Current Density Surface Mount Trench MOS Barrier Schottky Rectifier Ultra Low V F = 0.8 V at I F = 5 A TMBS esmp Series Anode Cathode Anode PRIMARY CHARACTERISTICS I F(AV) 5 A V RRM 50 V I
More informationSurface Mount Glass Passivated Rectifier
Surface Mount Glass Passivated Rectifier DO-24AC (SMA) PRIMARY CHARACTERISTICS I F(AV) 2.0 A V RRM 200 V, 400 V, 600 V, 800 V, 00 V I FSM 50 A I R 5.0 μa V F at I F = 2.0 A (T A = 25 C) 0.90 V T J max.
More informationHigh Voltage Schottky Rectifier
MBR0H, MBRF0H, MBRB0H High Voltage Schottky Rectifier High Barrier Technology for Improved High Temperature Performance TO-0AC MBR0H PIN CASE MBRB0H PIN D PA (TO-63AB) ITO-0AC MBRF0H PIN HEATSIN FEATURES
More informationDSMZ (Z-Foil) Vishay Foil Resistors FEATURES
Ultra High Precision Bulk Metal Z-Foil Surface Mount Voltage Divider, TCR Tracking of < 0.1 ppm/ C, PCR of ± 5 ppm at Rated Power and Stability of ± 0.005 % (50 ppm) INTRODUCTION Bulk Metal Z-Foil technology
More informationSchottky Barrier Rectifier
Schottky Barrier Rectifier TO-0AC ITO-0AC FEATURES Power pack Low power loss, high efficiency Low forward voltage drop High forward surge capability High frequency operation CASE D PA (TO-63AB) MBRF045
More informationHigh Power Aluminum Nitride, Wraparound Surface Mount, Precision Thin Film Chip Resistor (up to 6 W)
High Power Aluminum Nitride, Wraparound Surface Mount, Precision hin Film Chip Resistor (up to 6 W) series chip resistors are designed on aluminum nitride ceramic substrates with enlarged backside terminations
More informationIMPROVED PRODUCT. DSMZ (Z-Foil)
Ultra High Precision Bulk Metal Z-Foil Surface Mount Voltage Divider, TCR Tracking of < 0.1 ppm/ C, PCR of ± 5 ppm at Rated Power and Stability of ± 0.005 % (50 ppm) INTRODUCTION Bulk Metal Z-Foil technology
More informationDual Common Cathode Ultrafast Plastic Rectifier
6xT, F6xT, B6xT Dual Common Cathode Ultrafast Plastic Rectifier TO-220AB ITO-220AB FEATURES Power pack Glass passivated pellet chip junction Ultrafast recovery time Low switching losses, high efficiency
More informationDual Common Cathode Ultrafast Rectifier
UGEBCT, UGECCT, UGEDCT Dual Common Cathode Ultrafast Rectifier PIN PIN 3 UGExCT PIN 2 CASE PRIMARY CHARACTERISTICS 2 3 I F(AV) 2 x 5.0 A V RRM 0 V, 50 V, 200 V I FSM 55 A t rr 25 ns V F 0.895 V T J max.
More informationHigh Current Density Surface Mount Schottky Barrier Rectifiers
SSP3C, SSP4C High Current Density Surface Mount Schottky Barrier Rectifiers esmp Series 2 Anode FEATURES Very low profile - typical height of. mm Available Ideal for automated placement Low forward voltage
More informationESD-Protection Diode in LLP1006-2L
VESD5A1A-HD1 ESD-Protection Diode in LLP16-2L 2855 MARKING (example only) XY Bar = cathode marking X = date code Y = type code (see table below) 2 1 21121 2856 FEATURES Ultra compact LLP16-2L package Low
More informationSmall Signal Zener Diodes
Small Signal Zener Diodes PRIMARY CHARACTERISTICS PARAMETER VALUE UNIT V Z range nom. 2.4 to 75 V Test current I ZT.7 to 2 ma V Z specification Thermal equilibrium Int. construction Single FEATURES Silicon
More informationHigh Current Density Surface Mount Trench MOS Barrier Schottky Rectifier
V40PWM2C High Current Density Surface Mount Trench MOS Barrier Schottky Rectifier Ultra Low V F = 0.50 V at I F = 5 A TMBS esmp Series 2 SlimDPAK (TO-252AE) PIN K K FEATURES Very low profile - typical
More informationMetal Film Resistors, Military, MIL-R Qualified, Precision, Type RN and MIL-PRF Qualified, Type RL
Metal Film Resistors, Military, Qualified, Precision, Type RN and Qualified, Type RL FEATURES Very low noise (- 40 db) Very low voltage coefficient (5 ppm/v) Controlled temperature coefficient Flame retardant
More informationHigh Current Density Surface Mount Glass Passivated Rectifiers
SPB, SPD, SPG, SPJ, SPK, SPM High Current Density Surface Mount Glass Passivated Rectifiers esmp Series DO-22AA (SMP) FEATURES Very low profile - typical height of. mm Available Ideal for automated placement
More informationLead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors FEATURES High pulse performance (time/power) Metal glaze on high quality ceramic Protective overglaze Lead (Pb)-bearing solder contacts on Ni barrier
More informationFast Avalanche Sinterglass Diode
Fast Avalanche Sinterglass Diode DESIGN SUPPORT TOOLS 949588 click logo to get started FEATURES Glass passivated Hermetically sealed package Very low switching losses Low reverse current High reverse voltage
More information