3D PLUS technology and offer

Transcription

1 3D PLUS technology and offer By Dr Pascal Couderc, 3D PLUS 408, Rue Hélène Boucher BUC France Phone: TM P.COUDERC 3D PLUS technology and offer 1

2 Outline - Introduction - 3D PLUS technology - Product examples - Conclusions P.COUDERC 3D PLUS technology and offer 2

3 Introduction - Spin off from Thales (1996) - Located in Buc (France ), South of Paris - From September 2011, 3D PLUS is a 100% subsidiary of HEICO company - Strong R&D from the 3D PLUS launching - Active patenting policy - Space certifications from CNES, ESA, NASA, JPL,JAXA, CAST etc ( more than modules in space including ROSETTA mission cameras ) - Exportation: 90% - Workforce : R&D : 11 including 5 PhD P.COUDERC 3D PLUS technology and offer 3

4 3D PLUS technology 1 ) - Flex Design 4 ) Layers Stacking 5 ) Cube Molding FLOW 2 process 7 ) Cube Plating ( Ni + Au ) 2 ) Components attachment 8 ) Circuit interconnection by laser grooving 3 ) - Circuit Test & Screening 6 ) Cube Sawing 9 ) Cube Test & Screening P.COUDERC 3D PLUS technology and offer 4

5 WDoD (1) initial criteria WDoD TM technology Use of multi sourcing wafers Stacking of 5 to 10 levels per mm Size: 200µm around the larger Die Stacking of Known Good Rebuilt Wafer (KGRW) Possibility of several dice of different dimensions of the same level Parallel processing/panelization from A to Z Possibility to stack PCB levels ( flow 2) and rebuilt wafers in order to optimize performances and costs (1) Wirefree Die on Die Trade Mark from 3D PLUS P.COUDERC 3D PLUS technology and offer 5

6 WDoD TM technology P.COUDERC 3D PLUS technology and offer 6

7 WDoD TM technology Dielectric passivation layer Metal track 2D routing: RDL Si Molding resin Al Pads P.COUDERC 3D PLUS technology and offer 7

8 WDoD TM technology 300 mm wafer Single unit 2 layers RDL with ground plane Via interconnect at Al pad level RDL cross section P.COUDERC 3D PLUS technology and offer 8

9 WDoD TM technology P.COUDERC 3D PLUS technology and offer 9

10 WDoD TM technology Laser patterning P.COUDERC 3D PLUS technology and offer 10

11 WDoD TM technology PoP and WDoD package relative sizes P.COUDERC 3D PLUS technology and offer 11

12 Product example 1 : Leadless pacemaker Dimensions : 2.3 x 5.2 x 7.3 mm (courtesy of SORIN CRM) The module has 5 layers stacked using 3D PLUS WDoD TM process. The layers are stacked at wafer level. 2 layers have known good passive (30) and active components (3) and are reconstituted wafers using fan out WLP technology ewlb. RDL pitch is 50µm. The 3 other layers are PCB based(mixed flow2 and WDoD) P.COUDERC 3D PLUS technology and offer 12

13 Bank2 Bank5 Bank4 Product Example 2 :Embedded programmable module Same footprint as a single SPARTAN 6 CSG484 The two dimensional area gain on a board is about 58 % Embedded decoupling capacitors 8Mx16 166MHz mddr 8Mx16 166MHz mddr 64Mb 104MHz NOR SPI Spartan 6 FPGA 6 CMT 4 GTPs JTAG Bank3 Bank1 Bank caps P.COUDERC 3D PLUS technology and offer 13

14 Product Example 2 : Embedded programmable module MODULE DIMENSIONS : 19 x19 x 3 mm BALLING : 484 SAC305 balls SAME BALL OUT THAN FPGA COMPONENT P.COUDERC 3D PLUS technology and offer 14

15 Conclusions-Offer With 3D PLUS technologies patented portfio, we can design, manufacture and performed electrical tests on 3D modules We have a large portfolio of standard 3D modules We can also develop and manufacture 3D modules for specific customers applications Our technologies are good alternatives to flex-folded, TSV, PoP, Chip-On-Chip technologies. P.COUDERC 3D PLUS technology and offer 15

16 Questions? Ultra Dense 3-D Micro system with WDoD Thank you for your attention P.COUDERC 3D PLUS technology and offer 16