Bosch Sensortec BMP180 Pressure Sensor
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1 Bosch Sensortec BMP180 MEMS Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel:
2 MEMS Process Review Some of the information in this report may be covered by patents, mask, and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. MPR JMRK Revision 1.0 Published: November 25, 2011
3 MEMS Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 Device Overview 2.1 BMP180 Package 2.2 Inside the Package 2.3 BMP180 Die 2.4 ASIC Die 2.5 Package Cross Section 3 Control ASIC Basic Process Analysis 3.1 Overview 3.2 General Structure 3.3 Die Edge, Die Seal, and Bond Pad 3.4 STI, Poly, and Transistors 3.5 Metallization and Dielectrics 4 MEMS Process Analysis 4.1 Cross Section Locations 4.2 General Die Structure 4.3 Dielectrics 4.4 Metallization 4.5 Bond Pad, Vias, and Contacts 4.6 Si Membrane, Cavity, Resistors, and Wells 5 MEMS Architectural Analysis 5.1 Architectural Overview 6 Critical Dimensions 6.1 BMP180 Critical Dimensions 7 References 8 Statement of Measurement Uncertainty and Scope Variation About Chipworks
4 Overview Overview 1.1 List of Figures 2 Device Overview Top Package View Bottom Package View Plan-View Package X-Ray Side-View Package X-Ray Side A Side-View Package X-Ray Side B Package Cap Removed Package Cap Pressure Sensing Hole Package with Cap Removed Optical Plan View Package with Cap Removed SEM Plan View Package with Cap Removed Tilt View Connections Between Die and ASIC BMP180 Die Photograph Die Markings Cavity Die Corner A Die Corner C Minimum Pitch Bond Pads Bond Pad ASIC Die Photograph ASIC Die Markings ASIC Die Markings ASIC Die Corner A ASIC Die Corner C ASIC Minimum Pitch Bond Pads ASIC Bond Pad Package Cross Section Optical Package Cross Section Composite SEM Detail of Left Edge of Package SEM Detail of Left Edge of Package Optical Package Cross Section, Detail of Gap Between the ASIC and Dies Package Cross Section, Detail of Die Attach 3 Control ASIC Basic Process Analysis General Structure of ASIC Die Edge Die Edge Detail Die Seal Bond Pad Ball Bond Poly over STI Observed Minimum Width STI Minimum MOS Transistor Embedded Flash Cell Over STI
5 Overview Metal 1 and PMD Metal 2 and IMD Metal 3 and IMD 2 4 MEMS Process Analysis BMP180 Die Cross Section Locations General Structure of CMD 173 Die (P6S3) CMD 173 Die Overview Cross Section (P6S3) CMD 173 Die Edge Tilt View CMD 173 Die Right Edge in Detail (P2BS1) CMD 173 Die Left Edge in Detail (P2BS1) SCM of CMD 173 Die Edge Overview (P2BS4) SCM of CMD 173 Die Edge Detail (P2BS4) Dielectric Stack in Periphery (P2BS2) Dielectric Stack Over Contact (P2BS4) Detail of Passivation and Dielectric Stack Near the End of Periphery (P2BS3) PMD 2 in Detail (P2BS4) Dielectric Stack Over Membrane (P2BS4) Minimum Pitch Metal 1 (P2BS2) Minimum Width Metal 1 (P2BS2) Metal 2 and Metal 1 Thicknesses (P2BS2) Bond Pad (P2BS2) Left Edge of Bond Pad (P2BS2) Minimum Width Via (P6S1) Minimum Width Contact (P2BS4) Left Edge of Contact (P2BS4) Right Edge Of Contact (P2BS4) M1 Al Connection to Contact (P6S2) Overview of Si Membrane and Cavity (P6S3) Si Membrane and Cavity (P2BS2) Optical Plan View of R2 Resistor Cross Section Location Overview of R2 Resistor SEM Si Etch (P2BS3) Pair of R2 Resistors SEM Si Etch (P2BS3) Single R2 Resistor in Detail SEM Si Etch (P2BS3) Dip in Resistor Top Surface SEM Si Etch (P2BS2) SCM of Well Structure at the Edge of the Cavity (P2BS4) SCM of P-Well 1 in Detail (P2BS4) P-Well 2 R2 Resistor (P2BS3) P-Well 2 and P-well 3 R4 Resistor (P2BS3) P-Well 2 and P-well 3 R1 Resistor Strip 1 (P6S2) P-Well 2 R1 Resistor Strip 2 (P6S2) Plan-View Optical Image of Ground Contact Cross Section Location P-Well 3 Ground Contact (P6S2)
6 Overview MEMS Architectural Analysis CMD 173 Circuit Overview of CMD 173 Die Features R2 Resistor and Interconnect SEM Tilt View R2 Resistor and Interconnect Optical Plan View R1 Resistor and Interconnect SEM Tilt View R1 Resistor and Interconnect Optical Plan View R1 Resistor Contacts and Ground Contacts Via Between M2 and M1 Optical Plan View 1.2 List of Tables 1 Overview Digital Features Device Summary MEMS Die Control ASIC Die MEMS Die ASIC Die 2 Device Overview BMP180 Die Dimensions ASIC Die Dimensions 3 Control ASIC Basic Process Analysis Observed ASIC Critical Dimensions 4 MEMS Process Analysis Die Dielectric Thicknesses Die Metallization Dimensions Die Bond Pad, Via and Contact Dimensions Si Membrane, Cavity, and Resistors Dimensions Die Wells Thickness 6 Critical Dimensions BMP180 Die Dimensions ASIC Die Dimensions Observed ASIC Critical Dimensions Die Dielectric Thicknesses Die Metallization Dimensions Die Bond Pad, Via and Contact Dimensions Si Membrane, Cavity and Resistors Dimensions Die Wells Dimensions
7 About Chipworks About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at Chipworks 3685 Richmond Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T F Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
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