Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap

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1 Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap Peter De Dobbelaere Luxtera Inc. 09/19/2016 Luxtera Proprietary

Luxtera Company Introduction $100B+ Shift in technology spend to the Cloud changed the market.

Semiconductor companies have placed their bet on Luxtera Founded in 2001, Luxtera has the world s only Silicon Photonics platform proven

Scaling production of new 100G Optics products which lead the market on price/performance and availability Fundamental IP position with

After 1H 16 market delay, strengthening demand for Luxtera s 100G products Roadmap: Pluggable optics, embedded modules at 100Gb, 400Gb,

2 Luxtera Company Introduction $100B+ Shift in technology spend to the Cloud changed the market. Cloud Operators require reliable & cost effective 100G Single Mode Optics at high volume scale Major Cloud Operators, System OEMs, Semiconductor companies have placed their bet on Luxtera Founded in 2001, Luxtera has the world s only Silicon Photonics platform proven in volume transceiver production, in continuous production since 2008 with ~1Mu deployed. Scaling production of new 100G Optics products which lead the market on price/performance and availability Fundamental IP position with 180+ WW Patent filings including 122 issued US Patents. After 1H 16 market delay, strengthening demand for Luxtera s 100G products Roadmap: Pluggable optics, embedded modules at 100Gb, 400Gb, and 1Tb+, ultimately leading to SoC/ASIC integration Continuing R&D Investment: Roadmap supports 5 year hypergrowth cycle of 25/50/100/400G SMF transceivers leading to broad scale SoC integration. 100Gb WDM, PAM, 400Gb PSM4 and WDM4 Photonic Interposers For ASIC/SoC Luxtera Inc. Proprietary 10/11/2016 Page 2

Luxtera s Silicon Photonics Technology Platform & Milestones Luxtera s technology leverages strongly from Si IC industry: Wafer manufacturing in commercial fabs Design methodologies & design

interconnect with electronic ICs Simplification of packaging and test Luxtera s Silicon Photonics Milestones: 2006: First WDM (4x10 Gbps) silicon photonics transceiver: o 4x10 Gbps NRZ, duplex o

3 Luxtera s Silicon Photonics Technology Platform & Milestones Luxtera s technology leverages strongly from Si IC industry: Wafer manufacturing in commercial fabs Design methodologies & design automation Wafer level testing, built in self test Wafer Level assembly, low cost packaging Luxtera s technology enables highest level of integration: Increased functionality & density Dense interconnect with electronic ICs Simplification of packaging and test Luxtera s Silicon Photonics Milestones: 2006: First WDM (4x10 Gbps) silicon photonics transceiver: o 4x10 Gbps NRZ, duplex o Monolithic integration of photonics & electronics o Integrated controls for modulator and wavelength mux/demux 2009: First commercial PSM4 silicon photonics transceiver: o 4x10 Gbps NRZ, 4x14 Gbps NRZ, low cost PSM solution o Monolithic integration of photonics and electronics o Single micro packaged CW LD light source o Volume: > 1 Million units shipped (2016) o Reliable: > 10 billion failure free operating hours 2011: First 100 Gbps silicon photonics transceiver: o 4x25 Gbps NRZ o Monolithic integration of photonics and electronics o Single micro packaged CW LD light source 2014: First 200 Gbps silicon photonics transceiver: o 8x25 Gbps NRZ o Hybrid integration of photonics and electronics o Single micro packaged CW LD light source Silicon Photonics IC integrating > 500 photonics devices 2015: First 100G PSM4 silicon photonics transceiver: o 4x25 Gbps NRZ o Hybrid integration of photonics and electronics o Single micro packaged CW LD light source Luxtera Inc. Proprietary 10/11/2016 Page 3

Integration Photonics & Electronics Monolithic Integration Single chip solution Lower

Less area efficient Moving to advanced nodes is complicated & very expensive

Higher parasitics between photonic and electronics Photonics & electronics fabrication

advanced e node Flexible electronic node selection (CMOS, BiCMOS,.

4 Integration Photonics & Electronics Monolithic Integration Single chip solution Lower parasitics between photonics and electronics More complex wafer fabrication process Less area efficient Moving to advanced nodes is complicated & very expensive Monolithic SiP IC Electronics + Photonics Hybrid Integration Multi chip solution Higher parasitics between photonic and electronics Photonics & electronics fabrication processes decoupled Efficient use of area: photonics doesn t take area on (expensive) advanced e node Flexible electronic node selection (CMOS, BiCMOS,..), enabling integration with 3rd party IP Micro bumps Electronic IC Photonic IC Luxtera Inc. Proprietary 10/11/2016 Page 4

Light Source, Test & Assembly Light Source Silicon

Lid wafer: cavity with mirror Hermeticity obtained

technology (multiple suppliers) Include an isolator

Wafer level assembly, packaging and test Use

Fully automated optical test of wafers on industrial

Fully automated assembly Chip to chip bonding by Cu

5 Light Source, Test & Assembly Light Source Silicon Laser Micro Package: Base wafer: silicon micro bench Lid wafer: cavity with mirror Hermeticity obtained by solder seal Features: Use mature InP laser diode technology (multiple suppliers) Include an isolator in the system Use efficient optical coupling scheme Wafer level assembly, packaging and test Use established wafer level burn in method Optical Test Fully automated optical test of wafers on industrial platform (TEL): 200 mm & 300 mm Outstanding test gage: 0.1 db for IL test Chip to chip & Optical Assembly Fully automated assembly Chip to chip bonding by Cu Pi technology High throughput single mode connection by active alignment Luxtera Inc. Proprietary 10/11/2016 Page 5

PSM4 4x28 Gbps Chipset in QSFP28 Module Electronic IC: 28 nm technology (TSMC N28HPM) MZI drivers & TIAs + controls E interfaces w/ bypassable CDR & programmable signal conditioning (CTLE) BIST

6 PSM4 4x28 Gbps Chipset in QSFP28 Module Electronic IC: 28 nm technology (TSMC N28HPM) MZI drivers & TIAs + controls E interfaces w/ bypassable CDR & programmable signal conditioning (CTLE) BIST (electrical high speed loopback) Laser diode driver Digital core with MCU 2 wire communication QSFP28 Module Application: QSFP28 Modules plugged in switch front panel Luxtera Inc. Proprietary Photonic IC: Mach Zehnder high speed modulators Ge high speed photodetectors Ge monitor photodetectors for control and monitoring BIST (optical high speed loopback) Photonics assembly features 10/11/2016 Page 6

nm) Wire bonding for electrical connections: High speed differential pairs

7 8x28 Gbps PSM 8 Chipset & 200 Gbps Module Chipset mounted on PCBA: Si Photonics IC (1310 nm) Electronic IC (TSMC 28 nm) Single light source (1310 nm) Wire bonding for electrical connections: High speed differential pairs Power & ground Low speed communication Luxtera Inc. Proprietary 10/11/2016 Page 7

supports the business Thousands of companies with 100-1,000s of servers Hundreds of companies with 1,000-10,000s of

8 High Speed Interconnect: Cloud Service vs Enterprise Web/Cloud: Computing is the business: Datacenter = Computing Factory ~50% of servers in 2018 (E) Small number of large-scale web/cloud service providers Enterprise: Computing supports the business Thousands of companies with 100-1,000s of servers Hundreds of companies with 1,000-10,000s of servers Cloud Computing increases rapidly and takes market share of Enterprise Computing Luxtera Inc. Proprietary 10/11/2016 Page 8

20 m: Single Mode Fiber Single mode fiber: Fiber infrastructure can be reused when data rate

9 High Speed Interconnect: Datacenter Optical Infrastructure Optical interconnect technology: In the rack: will likely stay electrical for now TOR LEAF: Can be AOC (technology independent) L> 20 m: Single Mode Fiber Single mode fiber: Fiber infrastructure can be reused when data rate scales up Fiber cost lower, optical connector cost higher Luxtera Inc. Proprietary 10/11/2016 Page 9

High Speed Interconnect: Two Bottlenecks Data streams limited at 2 bottlenecks: ASIC: number of electrical

COBO MSA initiative) o Transceivers internal to shelf (instead of z pluggable modules on face plate) o High

10 High Speed Interconnect: Two Bottlenecks Data streams limited at 2 bottlenecks: ASIC: number of electrical I/Os limited by packaging constraints Shelf: front plate density limited by size of optical modules A. Krishnamoorty (Oracle) How to resolve? Increase bit/baud rate: 10 Gbps > 25 Gbps > 56 Gbps Use embedded optics (e.g. COBO MSA initiative) o Transceivers internal to shelf (instead of z pluggable modules on face plate) o High density optical connectors at face plate Longer term: Integrate high density optical I/O with ASIC allowing higher density (MCM or photonic interposer) Ethernet Switch) Luxtera Inc. Proprietary 10/11/2016 Page 10

11 High Speed Interconnect: High port count, high data rate, low power CONTEMPORARY Today EMERGING 2016/17 Next QSFP28 Module 200 Gbps Mid Board Optics Module MZI TSV PD ASIC with photonic I/O on interposer Switch ASIC Re timer Optical Module Switch ASIC Embedded optical module Fiber Switch ASIC w/ photonics Fiber PCBA PCBA PCBA Luxtera Inc. Proprietary 10/11/2016 Page 11

Data Rate Scaling Data Rates Keep Increasing Data Rate Scaling vectors Scaling Trade Offs Modulation Cost PAM 4 NRZ Power dissipation Link budget margin 56 26 14 10 1 2 4 8 Further Scalability Baud

12 Data Rate Scaling Data Rates Keep Increasing Data Rate Scaling vectors Scaling Trade Offs Modulation Cost PAM 4 NRZ Power dissipation Link budget margin Further Scalability Baud rate # WDM wavelengths or fibers SMF Standards in Development: Single wavelength (PSM4/Breakout) 400GBase DR4 200GBase DR4 50GBase FR/LR 25GBase LR Multi wavelength 400GBase FR8/LR8 200GBase FR4 200GBase LR4 Under Consideration 100G over 2km o 100G FR Proposed 100G two lane over 500m o 100G DR2 Proposed Luxtera Inc. Proprietary 10/11/2016 Page 12

for power and ground Shorter electrical interconnect lengths on photonic die (voltage drop) More compact packaging form factors

13 Through Substrate Via (TSV) & Silicon Photonics E die E die Cu Pi Bond wire P die Cu Pi C4 bumps P die Package Substrate Package Substrate TSVs in the photonic die eliminate power supply wire bonds from photonic die to package: Lower inductance interconnect for power and ground Shorter electrical interconnect lengths on photonic die (voltage drop) More compact packaging form factors (no need for bond pad ring) TSVs allow lower parasitics for the high speed interfaces Luxtera Inc. Proprietary 10/11/2016 Page 13

Silicon Photonics for optical transceivers for Cloud applications Large consumption of optical transceivers is in networking/computing and mobile infrastructure, in particular

High performance Silicon Photonics optical transceiver products have been commercialized since 2009 and are being deployed in advanced datacenter applications.

Enables low cost single mode fiber interconnect Single mode fiber enables scalability to higher data rates, advanced modulation and WDM without penalizing reach External

14 Silicon Photonics for optical transceivers for Cloud applications Large consumption of optical transceivers is in networking/computing and mobile infrastructure, in particular Cloud applications. High performance Silicon Photonics optical transceiver products have been commercialized since 2009 and are being deployed in advanced datacenter applications. Why silicon photonics for optical transceivers? Enables low cost single mode fiber interconnect Single mode fiber enables scalability to higher data rates, advanced modulation and WDM without penalizing reach External modulation of light Simple mode of operation Light source does not have to be integrated with transceiver Reliability: Use of mature InP laser diodes and inherent reliability of Si Photonics More than 10 billion accumulated transceiver operating hours: random failure rate < 0.1 FIT Roadmap to ASIC integration by combining silicon photonics with 3D electrical integration System power reduction Ultimately no more stand alone transceivers Luxtera Inc. Proprietary 10/11/2016 Page 14

15 Acknowledgement: This presentation contains work of the entire Luxtera team and its technology partners, their contributions are greatly acknowledged. Thank you for your interest. Luxtera Proprietary

Si Photonics Technology Platform for High Speed Optical Interconnect. Peter De Dobbelaere 9/17/2012

Si Photonics Technology Platform for High Speed Optical Interconnect Peter De Dobbelaere 9/17/2012 ECOC 2012 - Luxtera Proprietary www.luxtera.com Overview Luxtera: Introduction Silicon Photonics: Introduction