Canada s National Design Network from nano to macro Ian McWalter

Transcription

1 Canada s National Design Network from nano to macro Ian McWalter NGC / CSTC 2009 McMaster University 1

2 Agenda About CMC Microsystems The National Design Network Who? 750 Faculty members at 45 Universities What? Design, Make, Test The opportunity Outcomes emsyscan The Roadmap 2

3 CMC Microsystems An organization with a 25-year history of stimulating R&D Discovery (leading to publications) and Innovation (leading to products); Involving micro- and nano-scale technologies; Through delivery of research infrastructure (tools) and A path to commercialization. A not-for-profit organization: Industry, university and other members. Headquarters in Kingston (Innovation Park at Queen s University) National test lab operation (U Toronto, McGill U, U Manitoba, Queen s U) Photonic project R&D office at the Canadian Photonics Fabrication Centre (NRC, Ottawa) CMC enables and supports the creation and application of micro- and nano-system knowledge by providing a national infrastructure for excellence in research and a path to commercialization of related devices, components and systems. 3

4 Positioning The National Design Network Strategic Goals 1. Enable excellence in microsystems/nanosystems research As indicated by scientific advancement and recognition. 2. Enrich the research training environment leading to increasingly qualified people As indicated by post-graduates who join Canadian industry. 3. Foster multidisciplinary activities As indicated by collaborative ventures and their Outcomes. 4. Deliver infrastructure for microsystems/nanosystems prototyping As indicated by experimental integration prototypes and related quality measures. 5. Provide a path to proof-of-concept demonstration and commercialization As indicated by startup companies, patents and licenses.

5 Registered University Users Faculty Members by Discipline/Department, 2007 Physic 5% Chemistry 3% Other 1% Eng. Physics 2% Other Engineering 3% More than 60 holders of Canada Research Chairs Computer Science 10% Mechanical Eng. 9% ECE/EE 67% ~750 Registered Faculty Members

6 Trend: The Changing Preferences of NDN Researchers in Areas of Application Examples of Other include: Natural Resources (Energy), Environment, Agriculture Registered faculty members whose interests were known : 163, 2003: 292, 2006: 504, 2007: 639, 2008: 753

7 The Supply Chain: Some of the CMC Suppliers MOSIS 7

8 Prototyping Technologies Used for about 400 NDN Projects Annually Advanced and mature CMOS prototype manufacturing services from national and international manufacturers: 65nm - 90-nm micron 0.18 micron micron micron Starting to use of 45 nm CMOS 2.5 GHz bipolar linear array (single layer metalization) MEMS prototyping :Surface/SOI; CMOS Microfluidics prototyping: Dual plane in-channel electrode metallization technology; Closed microchannels glass networks Photonics/Optoelectronics prototyping (silicon or III/V) 8 Technologies sourced from: CPFC/NRC, DALSA, Sound Design Technologies, Micralyne, IBM, MEMSCAP, STMicroelectronics, TSMC, CMP, MOSIS, IMEC

9 Operating 4 Test Laboratories Photonics (Queen s) PI: John Cartledge 40 GB/s and 10 GB/s BERTs Device testing for E/O, O/O and O/E Signal characterization (electrical and optical) System characterization Gb/s Multi-channel, multi-span transmission Digital (Toronto) PI: Glenn Gulak Verigy Tester MHz MHz 3 channels 6 GHz (modulated) Digital virtual test via emulation 20 GS/s digital storage scope Mixed Signal (McGill ) PI: Gord Roberts Teradyne FLEX Tester 96 CH 200 MHz 24 bit analog I/O 16 bit high speed analog RF to 6 GHz High power pulse RF(mm-wave) (Manitoba) PI: Greg Bridges 40 MHz to 110 GHz RF test capability Semi-automatic wafer prober Signal characterization to 110 GHz Signal generation to 110 GHz Noise figure analysis Power measurement 9

10 Photonics Products and Services Overview CAD tools for Mode solving BPM simulation Design optimization Physical layout and verification of optical components, customized for CMC s prototype fabrication services Prototyping III-V and silicon-based prototyping services provided in partnership with the Canadian Photonics Fabrication Center (CPFC) New: SOI passive waveguide photonics through IMEC (Belgium) Extensive test resources, including Laser/waveguide test station Vertical fibre coupling Advanced Photonic Systems Lab Training Silicon Nanophotonics Fabrication Graduate Course (in partnership with UBC) 10

11 Opportunity Microsystems Influence All Sectors: Jobs, Growth, R&D MEMS Environment Microelectronics Transportation Photonics Security Agriculture Energy Health Care Embedded Software Aerospace Communication s Biotechnology Microfluidics 11

12 This Conclusion, in 2003 for the NDN, shown here from the ITRS in 2007 and used at Semicon West in 2008, has been reaffirmed globally and continually.

13 Design Tools 2.5X increase in capability from 2004 Microelectronics/microsystems Cadence - 38 universities Mentor HEP - 36 universities Synopsys - 37 universities Xilinx - 36 universities Celoxica - 23 universities Coware - 27 universities Forte - 16 universities Matlab - 34 universities MEMS/microfluidics ANSYS - 16 universities MEMSPro - 22 universities COMSOL - 9 universities Coventor - 9 universities Photonics Design Workshop - 18 universities Optiwave - 7 universities Rsoft - 9 universities ustom Integration Projects upport for 64 custom tegration projects in areas such : Flip chipping Surface functionalization Ceramic carriers Photonic packaging Folded PCBs Selective encapsulation Implantable electrodes Vacuum packaging Design Hardware Infrastructure and IP 70% increase in FPGA-based platforms; 20X- 60X increase in CAD tool disk capacity FPGA-based System-level Prototyping Systems (700) o Xilinx Virtex-II Pro FPGA (310 systems) ARM Rapid Prototyping Platforms with Mentor RTOS (58) Multi-Processor SOC Methodology Platforms (8) o System-level simulation and FPGA implementation MEMS-FPGA Platforms (8) o Analog-interfacing, HV amplifier Tensilica-configurable processor IP o FPGA netlist generation Supported Technology Configuration (STC) Disks (36): o 3TB (23)/2TB (4)/1TB (1) ; 50GB-219GB (8) MIPS microprocessor (6) Tensilica-configurable processor IP o FPGA netlist generation NATIONAL DESIGN NETWORK 2008 Impact Over 750 academic faculty and 2000 PhD and MSc students at 45 universities benefitted from NDN services in areas related to microsystems research. More than 450 CAD tool licenses were distributed, 370 chip designs fabricated, some 200 test transactions conducted and 35 custom integration projects completed. Methodology and Kits Strong emphasis on accelerating research results through development and dissemination of flows, user guides and Application Notes Embedded Software, Memory Integration and DFT Flows 52 Application Notes 20 Tutorials 40 Getting-Started/User Guides 10 Methodology Guides 100 kits and kit upgrades 10 Reference Designs Digital, Analog, RF and MEMS Flows 13 <Project Name> DP1 Test and Measurement National Microelectronics and Photonics Testing Collaboratory implemented and MEMS/microfluidics testing solutions delivered. Microfluidics System Prototyping Carrier Platform 140-pieces leading-edge photonic test equipment including 10 GB/s and 40GB/s BERTs, DQPSK Industry-standard ATE o Verigy Digital /RF SOC Tester o Teradyne FLEX mixed signal tester RF Test capability spanning 40MHz to 110 GHz MEMS/microfluidics parametric testing, high-speed actuation analysis Denotes products/ services introduced to the NDN during the period Microsystems Fabrication Over 1800 designs fabricated for 160 researchers in 27 universities Microelectronics CMOS (nm): 65, 90 CMOS (micron): 0.13; 0.18; 0.35; 0.5 ; GHz Linear Array Photonics InP; GaAs ; SOI MEMS PolyMUMPs ; SOI ; MetalMUMPS Microfluidics Glass-based, single channel Integrated electronics MEMS post-processing on 0.8-micron CMOS Microfluidics with embedded electrodes MNT Lab Access MNT Facilities Catalog MNT Travel & Fabrication Awards Training and Support 2X training events with focus on MEMS and photonics CAD Training Courses : Matlab, Altera MIPS Microprocessor : ANSYS; Coventor ; MEMSPro; Tensilica Microprocessor : Design Workshop ; Tensilica; Xilinx : ANSYS; Comsol ; Coventor; MEMSPro Over 1000 support interactions annually

14 Performance Management MODEL Outcomes 2008 Deliver Products and Services Outputs Activities Immediate Outcomes (<1 year) Intermediate Outcomes (2-4 years) Design Tools and Methodologies Designs Microelectronics Microsystems 339 PG Courses 362 UG Courses Fabrication Services Fabricated Designs Microelectronics Microsystems Testing Product and Services 753 Faculty (including 68 CRCs, 7 NSERC Chairs, 3 both) Tested Prototypes Microelectronics Microsystems Cost-effective Research Excellence Enabled Students More Capable of Using Industry Standard Tools Students More Skilled in Microelectronic/Microsystems Design, Build and Test 180 Awards 2275 Publications Increased Commercialization of Microsystems Research Including Spinoffs A Larger Pool of Highly Skilled Microsystems Professionals 1997 PG Students Deliver Training and Support Tutorials Workshops Forums User Groups 503 PG students move to Canadian Industry 268 Faculty Promoting, Liaising, Networking with Clients, Industry, and Other Stakeholders Meetings/Symposia Promotional Material Success Stories Newsletters Collaboratory Discussion Groups Increased Awareness of CMC s Role More Timely, Informed, and Consistent Messaging Among Partners and Stakeholders Better Alignment of CMC and Client Expectations More Integrated, Multi-sectorial Teams of Innovators Increased Opportunities and Resources for Collaborative Research in Microsystems 285 University collaborations with Canadian industry for $14.9M Support; 22 Licenses; 72 Patents; 6 Startups; 75 University collaborations with foreign industry for $2.7M Support Ultimate Outcomes (5+ years) Legend An Increasingly Competitive Microsystems Industry UG: undergraduate (both Nationally and Internationally) with Significant PG: postgraduate Economic and Social Benefits for Canada 14 CRC: Canada Research Chairs More Highly Skilled Microsystems Professionals Enabled Updated: 31 March

15 NDN Researchers Preferred Areas of Technology Application, 2008 and Projected to : Actual for 753 Researchers 2014: Projected for 1185 Researchers 15

16 Form-Factor Relevant Integrated Microsystem Prototypes

17 Example: Validation, Proof-of- Concept, Development System Optical Analysis Instrumentation Control, Data Acquisition: host computer user interface Dedicated Instrument Drivers and Controllers Microfluidic Interfacing: Programmable pump/valve Flow sensor Pressure sensor Tubing, fittings, adapters Fixture interface for microfluidic chip FPGA-based Coprocessing and Control Microfluidic Chip

18 Example: Proof-of-Concept Development Sensor head 3-axis accelerometer IDC20 Data acquisition Master processor and radio reverse side view chip antenna EMR shield layer

19 Example: Form-Factor Relevant Proofof-Concept Development System Master processor and radio Signal filtering Gyroscope and accelerometer DAQ Power source Intermodule connections System interface and datacoms Wireless Temp Sensor Data cable Thermistor TI cc2430 processor/radio SOC

20 Compact, low energy, wireless-enabled microsystem development platform 20

21 emsyscan National Infrastructure for 37 Universities Microsystems Rapid-Prototyping, Characterization and Integration Labs 4 Universities: UBC UManitoba Queen s École Polytechnique Minimized development cycle prototyping and performance measurement Integration for field testing All 37 Universities Multi-Technology Design Environment System architecture exploration Multi-technology simulation Design of custom devices for manufacturing Development Systems System validation and proof-of-concept demonstration License Management Appliance Installed Design Environment Development System Hardware Secure, Managed Access Real-Time Embedded Software Lab University of Waterloo Design, analysis, debug of real-time software on nextgeneration processor systems Management & Operations Includes selection; procurement; configuration; installation and delivery; access and utilization management; engineering/technical support; Train-the-Trainer events; emsyscan Advisory Group coordination; reporting, legal and financial administration. License Management Server (LMS)

22 The Resulting Infrastructure Technology Roadmap Integrated Microsystem Architecture Attributes Design Methodology Technology for Devices, Structures and Transducers (sensors and actuators) Test Methodology Legend: Arrows indicate continuing enhancement or new options. Footprint: 10 cm 3 (includes folded PCB) Footprint: 1 cm 3 Stack: 5 layers, boards Power: mw 2 (accelerometer, temp).. Add-in sensor options 8 Hours/days.. Operating time Years/indefinite Stack: TSV devices Power: nw RF centre: 430MHz, 870MHz, 2.5GHz passive, COTS, chip-scale Antenna active, tunable, monolithically integrated Programmability: small footprint Mixed-signal FPGA Programmability: SDR, flash, register setup reconfigurable hardware Kit: digital Design-for-assembly (flow) Kit: analog Standard, scalable system High-speed clock and data Interfaces optimised for Condition telemetry Kit: RF driver and test interface recovery modules bench-top multi-sensor (hardware, software) Kit: MEMS system prototyping Kit: microfluidics Kit: real-time operations Communications protocol stack tools Kit: Multi-tech prototyping flow Multi-processor debug Code parallelization tools Simulation: co-simulation methods and portfolio of point simulators on-demand Power: battery Power: scavenging Power: PV/solar Power: scavenging/implantable CMOS: 800nm to 45nm CMOS: 32nm GaN: 0.8µm Ft~ 20GHz GaN: 0.4µm Ft~ 60GHz GaN: Ft~ 125GHz Photonic crystals/soi III-V Qdot lasers III-V Qwell intermixing Photonics/GaN III-V Qcascade structures MEMS Microfluidics Si-photonics Si-fluidics Si-other enhancements SiC substrate technologies Nanotechnology region epi lift-off Coatings: inorganic Coatings: organic Coatings: bio-compatible Interposer: embedded passives SIP test interface Interposer: embedded active Substrate: LTCC Substrate: RF signal optimised Substrate: RF+ microfluidic optimised Substrate: photonic+ microfluidic optimised Fixturing/assembly: small footprint optics Fixturing: microfluidics Fixturing: multi-technology Fixturing: 600MHz digital Fixturing: photonics Nano-scale wire interconnect MEMS MEMS test module Portable environmental 100 GHz BERT Instrument signal sensitivity resonator (optical, 20 KHz) test chambers on femto-scale Near IR λ test Visible λ test 100 Ghz Telecom test THz component test Embedded software New baseline instrumentation Extend rack options for select debug and on-line lab. cage and racked instruments technologies (photonics/microfluidics) Roadmap Period of Interest: April 2009 to March 2015