Fiber Optics for Harsh Environments ICSO Chuck Tabbert

Transcription

1 Fiber Optics for Harsh Environments ICSO 2016 Chuck Tabbert VP Sales & Marketing Ultra Communications (505) If anyone would like copy of briefing please drop business card at Ultra Comm exhibit booth

2 Ultra Communications Overview 2006 Spin-out of Peregrine Semiconductor 25 employees $4.2M revenue 2015 (Real Products & R&D) Fiber optic communications for harsh environments Build transceivers with unique features for platforms Fiber optic component packaging and circuit design Built-in-test (including OTDR) Wide temperature operation & survival Primarily R&D (Gov t and Customers) Low rate production (50-75 units / month) today Finetech Fineplacer (0.5 micron accuracy) Business Sectors Aerospace & Military: Avionics, UAVs, Ships, Space Embedded computing Data Center, Automobiles Fiber Sensing Market Single Photon Detection for Quantum Key Distribution (QKD) networks Transceiver Test Station with unique Optical Power Monitoring During Burn-In 2

3 Ultra Comm Roadmap Size, Data Rate & Functionality RVCON Fiber Connector SFP+ with integrated OTDR X80-J JSF 2.5Gbps/ch X80-Q QFN 10Gbps/ch Commercial Form-Factor X200-CSP CSP 25Gbps/ch 12 mm (OTDR capability in productization) 25 mm 3

4 X80-Q Flip-Chip Transceiver Construction Stack of flip-chip bonded waferprocessed materials Advanced submicron flip-chip bonder 10 flip-chip bonding steps RVCON Rugged Vertical Connector (RVCON ) Ribbon fiber connector <0.5dB loss from laser to end of pigtail over temp -120C to 180C Lens guide Collimating optics Transparent carrier Transceiver ASIC 1 x 4 PIN array CORE Wafer Scale Stack 2 nd ASIC Options: ucontroller OTDR ASIC 1 x 4 VCSEL array CORE Ceramic Interposer 4

5 Transceiver Status Ultra Comm has secured investment funds for capital expansion Manpower on second shift Funding for initial capital expansion Baselined configuration in fabrication for qualification testing to both avionic and space requirements Both markets are requiring MIL-PRF Class L like testing Element Evaluation Module Screening (Group A & in-line Group B) Qualification (Group C Testing ) Space Qual Testing - Competed Vibration Sept 2016, Completing 1000 hour 24 Oct 2016 Required 2000 hour life test at this time X80-Q baselined into 7 space programs worldwide Core is common to both packaging configurations Recent Customer Space Environmental Testing Shock/vibration / Thermal Vacuum Space Qualification Testing Completed Radiation Space Qualification Radiation Testing (TID, Proton & SEE) Completed Summary Data available upon request with Test Conditions!! Space Customer completing SEE (higher MeV-TAMU), Neutron, TID & ELDRS Quality Systems Installation Full time Quality Engineer hired and have concluded initial customer audits AS9100 certification Dec Plan to certify to MIL-PRF Class L 5

6 Pre-Qual Work Summary Testing of piece parts and sub assembles RVCON cable assembly Passed 1,000 TC, -58 to 128C Passed 1,000 hours of non-biased 85/85 Lensing/cover glass sub-assy Passed 1,000 hrs non biased 85C/85 RH Passed non-biased HAST 96 hrs, 85% RH, 130C Joints on flip-chip components 10/10 units passed 500 Thermal Shock -58 to 128C Environmental testing of X80-J (JSF F-35) Passed Vibration & Shock Levels Passed HTOL (1,000 hr at 125C) Passed 85/85 Testing CORE Space Environmental Completing 1000 Hour on our way to 2000 hour HTOL 6

7 Recent Radiation & Space Environmental Results

8 SEE, Proton TID & Displacement Damage Results 8

9 Environmental Testing 9

10 Advanced Technology Developments UltraComm Embedded 100G Optical Transceiver Project (LITECHIP )

11 X80 CSP & X200-CSP LiteChip TM Emerging need for embedded optical transceivers On the board near the central processor ASIC Difficultly of electrical routing at 28G and beyond UltraComm technology to address this need Chip-scale-packaging and flip-chip assembly Value for the customer Low transceiver cost minimum BOM and wafer level assembly testing Ease of use mass solder assembly onto the customer board (no electrical connector). Minimum PCB footprint Electrical I/O density matched to PCB technology (not defined by bulky connector). Performance advantages Maximal bandwidth (no wire-bonds) Efficient coupling of optical modes into multi-mode fiber Compatibility with immersion cooling 11

12 Scaling Next generation systems are targeting 56 Gbps per channel line rates Finisar and VI Systems have demonstrated 56G VCSEL operation over 50 meter fiber links. Imperative to control the electrical parasitics inside the package Especially at the ASIC-to-OE device interface. ASIC-to-OE interface in the LITECHIP SOS carrier with excellent dielectric properties lithographically defined traces OE devices are flip-chip bonded (no wire-bonds) CSP -> electrical I/O directly to PCB UltraComm dual-metallization process - both flip-chip bumps (for the OE devices) and copper pillars for the electrical I/O. 12

13 Summary Parting Thoughts The near-term qualification of Fiber Optic components for space applications is within our grasp The bandwidth / network security issues are real and affecting numerous space programs Transceivers don t care about system protocols Rapid IO or Space Fiber data needs to be encoded and balanced Ultra Comm is presently completing qualification of fiber optic transceivers for harsh environments Proof of Design testing conducted in both avionic and space applications RH FPGA manufacturers have to keep up. We re on our way to 25G/channel and then 56G/channel because that s what the space community wants! 13