Optoelectronics. Products, Packaging & Engineering Services
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1 Optoelectronics Products, Packaging & Engineering Services 1425 Higgs Road, Lewisburg, TN USA teledynemicro.com 1
2 Teledyne Ruggedized Optical Devices International Space Station 125 Mbps, FDDI suite of devices All data-audio-video communications go thru Teledyne devices F Mbps, MM Fiber Very Low Profile (0.140 ) Over 15,000 devices to date 52 Tx & 53 Rx per aircraft F35, Joint Strike Fighter 2.5 Gbps per Channel, MM fiber Miniature footprint (1 x 1 x ) Over 5,000 devices to date 55 Quad Transceivers per aircraft 2
3 Optical Networking Push the envelope in next generation optical networks Optical Routers & Transponders OC768, 16 channels Multiple rates to 44 Gbps Highly integrated single chip modules High frequency and noise isolation Solder bump flip chip High Temperature Co-fired Ceramic (HTCC) BGA substrate Utilizing stripline and microstrip provisions TOSA/ROSA Up to 11 Gbps & 80 Km TDM & DWDM, 1550 nm Sonet/SDH, Ethernet High speed gain chip Planar wave guide 3
4 Application Experience 2 Gbps Quad Channel Transceiver 10 Gbps Receiver 10 Gbps TOSA Wavelength locked light source MEMS mirror array (n x n) optical switch Laser Pump Module for Raman Amplifier Tunable wavelength laser source DWDM Tx/Rx Mach-Zehnder waveguide modulator High power laser sources (up to 10W) MEMS HUD MEMS F-P interferometer based navigation grade accelerometer Fiber Bragg grating array for optical gain control Fiber optic pressure sensors 4
5 Optoelectronics Advanced Design & Packaging Ruggedized Fiber Optics Transmitters, Receivers and Transceivers Custom Design & Packaging Custom Design & Packaging High Reliability Hermetic MIL-PRF Class H 8 Optical Rx & Tx 500 Mbps, 1.5 x1 x 0.15 ea Standard Devices Up to 4.25 Gbps, -40 C to +95 C, soon 105 C High Reliability Industrial Packaging & Components Extended shock and vibration, moisture resistant Standard connector interface: LC/MT/FC and others Single mode, Multimode, Ethernet, Duplex, Multiplex Quad Optical Transceiver 2.5 Gbps per channel, 1 x 1 x 0.2 SFF: 1.9 x 0.5 MINI: 0.8 x 0.5 Micro Form Factor (MFF): x
6 Teledyne Optical Device Roadmap Phase 1: Currently available TX004-SFF: 4.25 Gbps SFF MM Dual Transmitter RX004-SFF: 4.25 Gbps SFF MM Dual Receiver TR004-SFF: 4.25 Gbps SFF MM Transceiver TR004-MINI: 4.25 Gbps MM Transceiver TX004-MFF: 4.25 Gbps MFF MM Transmitter RX004-MFF: 4.25 Gbps MFF MM Receiver TXSM4-MFF: 4.25 Gbps MFF SM Transmitter RXSM4-MFF: 4.25 Gbps MFF SM Receiver Phase 2: 10 Gbps Moisture resistant MINI, MFF Phase 3: 4.25 & 10 Gbps Hermetically sealed MINI, MFF Phase 4: 4.25 & 10 Gbps Arrays 4 to 8 channels per device Phase 5: Space Qualified Transceivers 6
7 Nano/MicroTechnology 7
8 Comprehensive Design Tools 2D Microwave - EEsof, Microwave Office 3D Microwave - Ansoft, HFSS Photonic Design and Simulation Zemax Far Field Optics RSoft Near Field Optics Pro Engineering, Pro Mechanica, COSMOS, SolidWorks 3D Mechanical Design FEA, Stress Analysis, Thermal Analysis, Dynamic Analysis Mentor Graphics MCM Station Schematic Capture Autorouting High Speed/Crosstalk Analysis Idea - Schematic Capture, Digital Simulation Quick Fault - Test Vector Generation OrCad Schematic Capture Autorouting AutoCAD Substrate layout Hybrid packaging design Microelectronic interconnection PSPICE Design, Analysis and Simulation 8
9 Enabling Optoelectronic Technologies Processes Alignment, single and multi-mode fiber Fusion splicing regular and PM fibers Multi-channel fiber (array) Alignment for high power (up to 10 W) Hermetically sealed fiber packaging Single fiber and multi-fiber array In-house fiber metallization V-Groove fabrication (2 Ch 128 Ch) Optical bench fabrication Single and Multi-mode fiber tip lensing Multiple fiber termination technologies Beam profile characterization Optical Design and Analysis Optical Modeling Near field (BeamProp) Free-space (ZEMAX) Fiber Lensing Micro-lens array Fiber tip lens (SM&MM) Free-space collimation and focusing 9
10 Diversified Packaging Technology Portfolio Substrates Ceramics Al2O3, BeO, AlN Multi-layer thick film Standard Photo-etchable High Frequency Single-layer thin film Cofired (LTCC, HTCC) Laminates FR-4 Polyimide Rigid-Flex Insulated Metal Proprietary High Tg Assembly Chip and wire Flip Chip SMT Mixed Technologies Chip Scale Packaging Technical Expertise Multi-disciplinary product engineering Routing and layouts Circuit simulation, design, analysis Established processes, SPC monitored Concurrent Engineering Teams 10
11 Substrate Capabilities Thin Film Ceramic Nickel & Gold Plating Nichrome, TaN, Gold & TiW Sputtering Fine line capability (0.001 lines w/ spacing) Nichrome & TaN resistors Thick Film Fine Line Ceramic FODEL Photo-Etchable Low-K Dielectric 11
12 Enabling Manufacturing Technologies Microelectronic Interconnection: Dispensing Die Attach Wire Bonding Flip Chip SMT: Stenciling/ Screen Printing SMT Pick & Place Solder Reflow Packaging & Testing: Cover Seal Encapsulation Test Systems 12
13 DAR Process Validation & Screening Wire Bond Pull and Shear Tester Sonoscan Pressurizing Helium Chamber Temp Cycling Fine Leak Test Gross Leak Test Real Time X-Ray HAST Centrifuge Vibration Mechanical Shock XRF (X-Ray Fluorescence) Tester 13
14 Fiber Optics Test Stations 14
15 Automatic Alignment Station 6 degrees of freedom alignment station 15
16 DAR Certifications and Qualifications MIL-PRF-38534, General Specification for Hybrid Microcircuits Facility and Manufacturing process certified and qualified by DSCC for Class H and K devices Laboratory Suitability to MIL-STD-883 for 21 test methods ISO 9001:2008, Quality Management System SAE AS/EN/JISQ9100:2009 Revision C D Appendix A, Advanced Quality Systems Facility certification to Boeing D updated in June 2002 to include AS 9100 MIL-STD-790, Product Assurance Program for Electronic and Fiber Optic Parts Specification MIL-PRF-28750, Qualified Products List - Solid State Relay DOD DMEA (Defense Microelectronics Activity) Microelectronics Trusted Source 16
17 Teledyne Solution Defense, Aviation, Space, and Ruggedized Industrial Requires high performance fiber optic devices Increased data rates, small size, EMI immunity, ease of scalability, lightweight Existing Standard Commercial Fiber Optic Suppliers Devices do not meet ruggedized environmental requirements Not willing to provide custom devices Teledyne fills the need HRIP design for ruggedized applications Long history with optical devices in these markets 17
18 18
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