Communications. Mitchell Fields, Ph. D. Director of Strategic Marketing

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1 Optical Navigation Division Optical Interconnects for Chip-to-Chip Communications Mitchell Fields, Ph. D. Director of Strategic Marketing com Contributors: Avago: Christine Chen, Sharon Hall, Ron Kaneshiro, Larry McCollough, David Meadowcroft, Frederick W. Miller, Dan Rausch, Michael Robinson, Hui Xu US Conec: Joe Graham, Michael Hughes

2 Media Options for Chip-to-Chip p Communications Technology Examples Distance Comments Embedded electronic CPU to CPU CPU to memory < 1m Very low cost Limited reach as rate Board to board within move beyond 10G chassis Edge mounted SFP+ (10 GbE) <7m (Passive copper) Allow pay-as-grow pluggable (electronic and optical) QSFP (4x IB, 40 GbE) CXP (12x IB, 100 GbE) <15 m (active copper) <300 m (850-nm MM) <10 km (1300-nm SM) Limited density Signal integrity and thermal challenges. Embedded optical Proprietary form factors. Used for dense fabric interconnects in multi- chassis switches and routers. <300 m (850-nm MM) <2 km (1300-nm SM) Dense interconnects Excellent signal integrity and thermal management Enable novel architectures Historically cost challenged This presentation focuses on novel components that address the advantages and challenges of dense high-bandwidth interconnects. Page 2

3 High-bandwidth optical communications The following technologies that address the need for dense high-bandwidth optical interconnects are reviewed: MicroPOD ultra-dense parallel optical modules PRIZM LightTurn optical connectors Dense edge connectors Example configurations are presented. Page 3

4 Avago MicroPOD >10-Gbps 12-channel transmitter and receiver modules. Avago 850-nm VCSEL/PIN technology Avago-designed IC s for superior signal integrity and extended feature set Novel top-attach PRIZM optical connector by USConec for cost (vs MTP ), fiber management, and dense tiling. μlga electrical interface for signal integrity and density Full digital diagnostics. Optimized for dense high-bandwidth applications with tight coupling to the host IC. 8.2x7.8 mm Page 4

5 Avago MicroPOD: Tx and Rx performance 10 Gbps TX Optical Output 0 C 30 C 70 C 10 Gbps Rx Performance BE ER 1E05 1.E-05 1.E-06 1.E-07 1.E-08 1.E-09 1.E-10 1.E-11 1.E-12 1.E-13 Unstressed Stressed (2.2 db VECP) LIP OMA (dbm) DJ (ps) Receiver Source DJ LIP OMA (dbm) Page 5

6 MicroPOD Signal Integrity Features Transmitter Equalization Receiver output de-emphasis and amplitude control Data bit De-Emphasis % = (DE/SS)(100%) De-Emphasis (DE) Output Voltage Steady-State (SS) Maximum De-Emphasis: De-Emphasis% = 100% Output Voltage Steady-State (SS) No De-Emphasis De-Emphasis % = 0 Avago-designed IC: signal integrity is critical! Page 6

7 MicroPOD transmitter input equalization Elect. source Block 10 FR4 Tx EQ Out tput EQ Setting = 0 EQ Setting = 4 EQ Setting = 7 Page 7

8 MicroPOD receiver output de-emphasis Optical source Inp put Rx DE Block 10 FR4 DE Setting = 0 DE Setting = 0 DE Setting = 4 DE Setting = 7 Page 8

9 Manufacture of MicroPOD paradigm shift Production requirement 30,000 pairs per month Solution Simple vertical stack design Invest in manufacturing technology for 100% automation Manufacture parallel optics in panel form 100% automated process. Assemble in panel form. Singulate Panel with MicroPOD modules Page 9

10 MicroPOD interfaces PRIZM connector with features for fiber management Avago MicroPOD μlga interface Page 10

11 PRIZM LightTurn Connector 12 fiber, 90 photonic turn interconnect Ferrule combines fiber array alignment and lensing element into a single, lowcost component Perpendicular mating with passive alignment features Designed as detachable connector for board level l parallel l optic module. dl Multiple mates/de-mates. Page 11

12 PRIZM LightTurn Termination 1. Fiber Array Insertion 3. Housing Installation 2. Epoxy Application Light Path 4. Assembly Complete A low-cost no-polish termination 1. Cleave only fiber array inserted into PRIZM ferrule 2. Quick cure epoxy added 3. One piece connector housing installed 4. Assembly complete and ready for testing Page 12

13 High-density edge connector options MTP connector and terminations 12f MT ferrule Blin nd-mate con nnectors BMTP TM 24f MT ferrule HBMT TM 72f MT ferrule per square cm fibers MTP connectors at card edge provide the densest I/O solution MTP 12 MTP 24 MTP 48 MTP mm 3.8mm 5.5mm 7.5mm Optical cable outer diameter much smaller than possible with copper cables. MTP QSFP CXP Page 13

14 Example system configuration ( ) Tx+Rx lanes of 10G I/O MicroPOD positioned mid-board near ASIC for optimal signal integrity and thermal management. [SFP+, QSFP, and CXP shown for size reference] High-density MTP edge connectors (12+12) and (24+24) TX+RX ports Page 14

15 power7.pdf Example: BlueWaters Supercomputer System System target: > 10 PF peak, > 1 PF sustained performance Single Rack: ~3 x6, 100TF, 12 drawers Single Drawer: 8 nodes / 8 hubs Reference: Hub module: ( ) TX+RX (~6,000 Gb/s optical I/O) Page 15

16 power7.pdf MicroPOD: Optical engine for Hub Module Hub module: ~6,000 Gb/s of optical I/O!! Dime 12-channel MicroPOD: 7.8mm x 8.2 mm Significant signal integrity and packaging challenge: - Best-in-class electrical/optical interfaces - Compact modules - Ability for dense tiling Solution: Design the optical module to address system electrical, optical, mechanical, feature, and cost requirements. Comparison to SNAP12 Page 16

17 What s next? Interconnects for next-generation system will impose demanding requirements on cost, bandwidth, power, and density metrics for optical components. Cost $/Gbps Size Gbps/mm 2 Key Metrics Bandwidth Gbps Power mw/gbps Development of new III-V, modulation, detection, IC, packaging, g waveguide and manufacturing technologies are required. Page 17 Avago Technologies Confidential

18 Summary Electronic signaling will continue to dominate on board communications due to cost advantages. As lane rates and density requirements for off board chip-to-chip communications increase, fiber optics can and has displaced copper in many applications. New low-cost components, including optical modules (MicroPOD) and connectors (PRIZM LightTurn), are required for optics to successfully displace copper and drive new applications and architectures that leverage the density advantages of fiber optics. Page 18

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