New Technology Insertion in Military and Space Standards

Transcription

1 New Technology Insertion in Military and Space Standards at SAE SSTC-G12 and JEDEC JC-13 Anduin E. Touw Technical Fellow Boeing Space & Intelligence Systems

2 Introduction In order for military and industry standards to remain relevant, they must adapt and change. In particular, we must evaluate new technologies and determine when they are mature enough to be accepted by the industry. Technologies may not be new to the commercial sector, but may be new to military and space systems Focus on understanding reliability and environmental suitability Physics of failure and FMEA ensure all failure mechanisms are identified and understood Technology characterized to understand limitations Detailed qualification plans developed with screens and test programs that evaluate the potential of any failure mechanism

3 General Approach What new technologies can be considered for insertion into military and space industry standards? Needs extensive use and data from other, preferably related, applications Automotive, medical, etc. Consumer electronics may be considered for maturity but add l work needed to consider longer lifetimes and harsher environments Needs to lend itself to extensive qualification and testing Mil / Space not prepared to trust SPC and volume to weed out quality problems Technology being evaluated should be at the highest level which is independent of the product-specific implementation. The evaluation must consider, however, the context of the intended application (including complexity, throughput and environment). Author, 10/1/2014, Filename.ppt 3

4 Technology Insertion Requirements in Higher Level Standards Requirements for new technology insertion programs are increasing in high level standards. For example, TOR-2006(8583)-5236 states A new technology insertion program shall be established for the identification, management, and tracking of new technology. The program shall include a plan that defines the new technology criteria and methodology for characterization and qualification of new technology. Author, 10/1/2014, Filename.ppt 4

5 Technology Insertion Requirements in Mil Standards MIL-PRF has a section on new technologies as well New technologies for space may depend on results from other levels of applications has language that says the following data will help with the insertion: Historic product shipment summary Field returns summary Reliability summary data Historic i qualification data Examples of process monitors and data showing performance & trends from recent lots. Examples of wafer lot acceptance reports. A new concept included is the Package integrity demonstration test plan (PIDTP) for non-traditional assembly / package technologies (such as non-hermetics, flip chips, etc) These are basically qual plans that address what is special about the packaging Author, 10/1/2014, Filename.ppt 5

6 What Drives Technology Insertion at the Industry Level? Subcontractors getting g different or conflicting requirements from different primary suppliers Customers realizing that many of their suppliers are using the same new technology ogy but with different e requirements e e Users wanting to reduce costs yet still maintain customer acceptance of the new technology Suppliers wanting to avoid multiple data requests and special qualification requests from different customers Certain technologies becoming so prevalent in the marketplace that t they are difficult to avoid Touw, 10/1/2014, New Technology Insertion.ppt 6

7 Pb-free Why insert Pb-free into military and space systems? Legislation in EU and Asia led to many commercial parts and units converting to Pb-free solders and finishes While most have exempted or excluded military, avionics, and space products, many suppliers are converting their lines to Pb-free due to dual use Challenges The most common Pb-free finish is tin (Sn) which can form whisker Creates shorts, debris, and possibly plasma events (in space) Pb-free solders for attach do not have the history and reliability data of SnPb Qualification for SnPb attach may not be applicable for Pb-free because the acceleration models are different Author, 10/1/2014, Filename.ppt 7

8 Pb-free Progress and Accomplishments Created two sister industry working groups to address use of Pb-free technology in military, avionics, and space: PERM (sponsored by IEC) G-24 (sponsored by SAE) These groups have published standards and guidance documents, including GEIA-STD GEIA-STD GEIA-STD GEIA-STD-0006 Current work includes Identifying funding sources for additional needed research Coordinating industry research on conformal coat inspection, use of SnPb solder attach to self mitigate whiskers, etc. Keeping existing standards d and handbooks current Working with IPC on BGA reballing standardization Author, 10/1/2014, Filename.ppt 8

9 Class Y Non-Hermetic ICs for Space Why insert Non-Hermetic ICs into space systems? Advancements in packaging technology, increasing functional density, and increasing operating frequency have resulted in single die SoCs with non-hermetic flip-chip construction, in high-pin-count ceramic column grid array packages There was a desire for the performance and without industry coordination, each OEM would be attempting to qualify the devices on their own and having to convince their customers the qual was adequate Challenges Deciding which non-hermetic technologies to focus on Focusing on technology issues specific to non-hermetic and not technologies that happen to be used in a non-hermetic device under consideration (such as flip chip, BGA, or new underfills) But still starting other activities to address these technologies Author, 10/1/2014, Filename.ppt 9

10 Class Y Non-Hermetic ICs for Space Accomplishments In December 2013, Class Y was added to MIL-PRF-38535: A microcircuit employing a ceramic non-hermetic package, which meets all applicable requirements of this specification including qualification, screening and TCI/QCI requirements, and all applicable requirements of Appendix B herein. Author, 10/1/2014, Filename.ppt 10

11 Class Y Approach Author, 10/1/2014, Filename.ppt 11

12 PEMS Why address PEMS in military and space systems? Use of PEMs leverages the commercial industrial base for both parts and assembly to achieve cost, quality, and reliability benefits, and provides smaller packaging volumes. No one comprehensive flow exists that t OEMs. For Space, NASA has PEM-INST-001 which comes closest a standard. There are many other flows that various OEMs use and significantly differ from PEM-INST-001 Mil / Space products require greater standardization to enable greater part type availability, cost control, and enhanced quality and reliability assurance. Cost and schedule is a concern by users. Upscreening and additional qualification is costly Some of the existing tests used for screening and qualification that are not clear: CSAM some use it extensively and others not at all Burn-in when is dynamic vs. static required? Outgassing and other construction analysis techniques are not consistently addressed Should life test samples be pre-conditioned? Author, 10/1/2014, Filename.ppt 12

13 PEMS Challenges and Goals Challenges Commercial applications have shorter lifetimes and more benign environments Wide variety of quality available in the commercial sector and no good way of determining i which h have the baseline quality needed d by Mil / Space OCMs have a tough time supporting low volumes; varied requirements Risks and OCM s assertion that they have made great advancements in Quality and Reliability are not clearly understood Goals: Develop standard optimum test protocols for A&D applications with product assurance approaches acceptable to the microcircuit industrial base. Improve availability of reliable PEMs for A&D applications. Author, 10/1/2014, Filename.ppt 13

14 PEMS Approach Comparison of known Industry PEMs flow and Major Subs/OEM PEM-INST- 001 EEE-INST- 002 Major Contractors Major OEMs Review phases I: Baseline review for screening and comparison II: Baseline review for qualification and comparison III: Review for any enhancement or changes IV: Critical process control review V: Final recommendations Screening/ Qualification Review NASA PEM-INST-001 vs Other existing Flow MSFC-STD Common PEM Flow Class N Product Assurance Review NASA s Product Assurance System vs Others Commonality and consensus was to use Marshall MSFC-STD-3012 as baseline Changes or Enhancement Review industry practice and determine benefit for insertion into the Flow Final Recommendation Come up with an agreed Final Recommendation that will either provide enhancement or revision to the existing NASA PEM Flow. Author, 10/1/2014, Filename.ppt 14

15 BME and Other Thin Film Capacitors Why insert BMEs into military and space systems? Some are already being used sometimes difficult for users to easily identify BME vs. PME in catalogs Business model for PME is on the wane Higher functionality is only available in BME The native reliability of properly rated BME is on par with PME Challenges of BME Proven problems with BMEs in the 1990s led to an industry aversion New BME may be different, but convincing i the community is challenging BME built using material systems and design rules unfamiliar to military and space users Current approaches to capacitor qualification may not be applicable Goals Provide detailed guidance on the Selection, Qualification and Screening of BME capacitors for military and space applications Use this guidance to generate a military or industry spec or standard that is practical and sustainable Author, 10/1/2014, Filename.ppt 15

16 BME and Other Thin Film Capacitors Xfer to DLA Land and Maritime Draft test tables Optimize application of risk mitigators Legend Completed In Process Not Started Identify risk mitigators Identify qualification and reliability risks Author, 10/1/2014, Filename.ppt 16

17 Next Steps SAE SSTC-G12 and JEDEC JC-13 are partnering in a new JEDEC subcommitte: JC-13.7 Charter: Evaluation & Method development for new and/or emerging electronic device technologies for potential future insertion in Military, Aerospace, Space, and other special use applications. Committee already trying to identify the next new technologies that may be ready for military and space insertion SiC MOSFETS Copper wire bonds FinFet transistors 2.5D and 3D die stacking Looking for more suggestions from the military and space communities! Author, 10/1/2014, Filename.ppt 17

18 Acknowledgements Special thanks to the following people: p David Sunderland, The Boeing Company Linda Woody, Lockheed Martin Shri Agarwal, NASA-JPL Sultan Lilani, Integra Rod DeLeon, The Boeing Company David Locker, US Army Adam Sens, The Boeing Company Steven Masters, The Boeing Company Craig Taylor, Xilinx Author, 10/1/2014, Filename.ppt 18