Robustness Validation / Mission Profile Compared to AEC-Q100 Standard Qualification Flow
|
|
- Mark Terry
- 5 years ago
- Views:
Transcription
1 Robustness Validation / Mission Profile Compared to AEC-Q100 Standard Qualification Flow Jürgen Gruber Zwolle Nördlingen Stuttgart Dresden Bath
2 Outline History of AEC-Q100 qualification procedure Why robustness validation Basis for your decision Limits RoodMicrotec - Jürgen Gruber - AESIN Conference - October
3 RoodMicrotec to be the Leading Independent European Company for Semiconductor Supply and Quality Services. RoodMicrotec - Jürgen Gruber - AESIN Conference - October
4 Services overview extended Supply Chain Management Test & Quality Engineering Production Test and Programming Qualification and Monitoring Burn-In Failure & Technology Analysis Optoelectronics Evaluation & Consultancy Automotive Competence Center RoodMicrotec - Jürgen Gruber - AESIN Conference - October
5 The begin of AEC-Q100 (end of 1970 s) Quality & reliability of ICs became a real concern IC-failure rate at incoming inspection was 0.5%, defined by AQL (Acceptance Quality Level) Burn-in needed at a failure rate of 2-5% Electronics in automotive became a tough challenge However these rates were an improvement compared to mechanical units RoodMicrotec - Jürgen Gruber - AESIN Conference - October
6 The begin of AEC-Q100 Lack of own experience in automotive industry MIL-standards became first basis of AEC-Q100 (SAE) MIL-STD 883 for test methods MIL-STD for test methods and procedures MIL-STD 105 for sampling plans MIL-STD S lot tolerance percent defective RoodMicrotec - Jürgen Gruber - AESIN Conference - October
7 AEC-Q100 flow RoodMicrotec - Jürgen Gruber - AESIN Conference - October
8 AEC-Q100 flow RoodMicrotec - Jürgen Gruber - AESIN Conference - October
9 AEC-Q100 flow Test conditions were in correlation to the 1970 s technology of integrated circuits The acceptance criteria of the qualification tests covered the accepted failure rates of (one) percent This allowed the use of a limited number of test samples (3 x 77) to get a statistical lot acceptance criteria No fails in 231 parts is equivalent to a maximum of 1% failures at a 90% confidence level far away from today s requirement of ppm failure rates RoodMicrotec - Jürgen Gruber - AESIN Conference - October
10 What happened meanwhile? The introduction of electronics, replacing mechanical parts continued with unexpected speed New functions became reality using new semiconductor technologies Safety functions (e.g. airbag, ABS, ESP) are standard ISO is now describing requirements for extremely safe relevant systems RoodMicrotec - Jürgen Gruber - AESIN Conference - October
11 ADAS trend RoodMicrotec - Jürgen Gruber - AESIN Conference - October
12 Transistors per die 3µm 2µm 1µm 0.8 µm 0.35 µm 0.25 µm 170 nm 110 nm 75 nm IC development 100G 10G 1G 100M 10M 1M 100k 10k 1k 1k 4k 16k 64k k 286 1M 386 4M 486 Pentium Navigation Analog/Power M 64M P2 256M P3 1G 2G Pentium 4 Itanium 4G Source: Bosch, IC Insights, Infineon RoodMicrotec - Jürgen Gruber - AESIN Conference - October
13 IC development Mid 1980s 1,0 µm, 10 MHz Early 2000s 0,1 µm, 3 GHz Today 22 nm FinFET Source: Sematech, Ted Dellin IRPS 2004 RoodMicrotec - Jürgen Gruber - AESIN Conference - October
14 What happened between 2004 and 2014 Increasing demand for low-cost but also high performance ICs for the consumer market pushed designs and technologies Consumer market is technology driver Automotive a fast follower Smartphone sales in 2014 was 1.5 billion Euro Automotive and other hi-rel applications market share is less than 10% RoodMicrotec - Jürgen Gruber - AESIN Conference - October
15 What are the consequences New technologies with dramatically reduced structures below 20 nm, together with the need for minimized packages are reducing the reliability margins from earlier "robust" designs The consumer market with short product life cycles accepts shorter lifetime with higher field failure rates of components than needed for automotive or other hi-rel applications RoodMicrotec - Jürgen Gruber - AESIN Conference - October
16 The bathtub curve RoodMicrotec - Jürgen Gruber - AESIN Conference - October
17 What are the consequences The historical AEC-Q100 qualification flow will not cover the tremendous changes in technologies, hi-rel applications and ppm requirements We need a method for a risk assessment to determine the safety margin between the remaining capability of a device to the cumulated / combined stress in the application (mission profile) RoodMicrotec - Jürgen Gruber - AESIN Conference - October
18 AEC Q-100 qualification conflict Appendix 7: Guidance on Relationship of Robustness Validation to AEC-Q100H / A7.1 Scope The present updated version of AEC Q100 (published in 2014) describes literally, also due to legal reasons, this conflict to the ppm-needs: "No fails in 231 parts (77 parts from 3 lots) are applied as pass criteria for the major environmental stress tests. This represents an LTPD (Lot Tolerance Percent Defective) = 1 meaning a maximum of 1% failures at 90% confidence level. This sample size is NOT sufficient or intended for process control or ppm evaluation. Much larger sample sizes would be needed but are not possible in terms of costs and time to market." 1% 231 (3 x 77) 100 ppm 23,027 1%o 2, ppm 230,260 RoodMicrotec - Jürgen Gruber - AESIN Conference - October
19 What are the consequences We need a new qualification strategy which demonstrates robustness of products against stress conditions during the application for a valid risk assessment and not only Passing a standard with unspecific tests and a 1%- acceptance criteria A standard has no correlation to the different applications with the different specific mission profiles RoodMicrotec - Jürgen Gruber - AESIN Conference - October
20 What are the consequences So AEC means Fit for the %-standard and not Fit for the application RoodMicrotec - Jürgen Gruber - AESIN Conference - October
21 Required information Risk assessments need more information than AEC can provide With no failure you don t know how good the part really is What is the real stress / level / type to failure What is the safety margin between the specification limit and the limit when failures will occur What is the failure physic RoodMicrotec - Jürgen Gruber - AESIN Conference - October
22 Required information Passing AEC-Q100 flow does not deliver needed information as Limits of design Limits of technology Limits of process capability Potential physics of failures relevant to the application in field and how far these limits are away from the application Interaction of different stresses RoodMicrotec - Jürgen Gruber - AESIN Conference - October
23 QFN Solder Joints QFN QFN QFP QFN in the centre of a pcb failed after 2 years in field with electrical short circuit. Similar component at the edge in same package showed no problems RoodMicrotec - Jürgen Gruber - AESIN Conference - October
24 QFN Solder Joints Metallographic cross sectioning QFN in the centre of the pcb, combination of vibration and temperature, destroyed solder joints, cold deformation of solder material shortened two connections RoodMicrotec - Jürgen Gruber - AESIN Conference - October
25 Robustness validation But relevant information and data regarding the against the later capability of a device stress conditions = mission profile are needed as basis for a risk assessment: robustness validation RoodMicrotec - Jürgen Gruber - AESIN Conference - October
26 Parameter B Failure mode a Robustness validation Robustness curve? Robustness margin? App I App II? Spec? Parameter A Source: Helmut Keller, ZVEI RoodMicrotec - Jürgen Gruber - AESIN Conference - October
27 Robustness validation Based on four key elements: Knowledge of the condition of use mission profile Knowledge of the device s capability and limits Knowledge of the relevant failure mechanisms and possible interactions between different failure mechanisms Knowledge of acceleration models for the failure mechanisms (to define accelerated tests) RoodMicrotec - Jürgen Gruber - AESIN Conference - October
28 Remote car key Intermittent open reported X-ray showed cracks in stitch bond area Source: Peter Jacob, ISTFA 2010 RoodMicrotec - Jürgen Gruber - AESIN Conference - October
29 Remote car key force PCB QFN Pushbutton QFN placed at narrowest point of the PCB Pushbutton adjacent to QFN Poor temperature profile during soldering process RoodMicrotec - Jürgen Gruber - AESIN Conference - October
30 Remote car key Delamination at interface leadframe / mold compound Shear off of stitch bond during bending of the PCB Small overlap mold / pin RoodMicrotec - Jürgen Gruber - AESIN Conference - October
31 Summary Statistical sampling plans with zero failure criteria will not cover ppm needs Testing against device specification limits is not sufficient Only the knowledge of the capability of a device compared to the mission profile allows a risk assessment and robustness validation New test strategies must be implemented (e.g. test till end of life) RoodMicrotec - Jürgen Gruber - AESIN Conference - October
32 Summary Bad news For today s ppm failure rate demands, AEC-Q100 test flow is no longer a sufficient qualification standard The easy time pass the standard and feel good is over Good news The global industry, under the roof of SAE and ZVEI published robustness validation guidelines and handbooks for your free download RoodMicrotec - Jürgen Gruber - AESIN Conference - October
33 Summary Systems 2010 Lifetime Measurement 2013 Implementation 2009 E/E-Modules 2008 revised 2013 Semiconductor 2007 revised 2012 MEMS 2008 RoodMicrotec - Jürgen Gruber - AESIN Conference - October
34 Thank you for your attention Jürgen Gruber Manager Failure and Technology Analysis RoodMicrotec - Jürgen Gruber - AESIN Conference - October
New Technology Insertion in Military and Space Standards
New Technology Insertion in Military and Space Standards at SAE SSTC-G12 and JEDEC JC-13 Anduin E. Touw Technical Fellow Boeing Space & Intelligence Systems anduin.e.touw@boeing.com Introduction In order
More informationConsumer Electronics: from chip to system
Consumer Electronics: from chip to system Kees Revenberg Co-founder/MD June 6 th 2018 APC, University of Warwick, UK NMI Techworks 6-6-2018 CONTENT Introduction Consumer Electronics Definition Trends and
More informationStencil Design Considerations to Improve Drop Test Performance
Design Considerations to Improve Drop Test Performance Jeff Schake DEK USA, inc. Rolling Meadows, IL Brian Roggeman Universal Instruments Corp. Conklin, NY Abstract Future handheld electronic products
More informationSNT Package User's Guide
(Small outline Non-leaded Thin package) [Target Packages] SNT-4A SNT-6A SNT-6A (H) SNT-8A SNT Package User s Guide Introduction This manual describes the features, dimensions, mountability, reliability,
More informationBOARD DESIGN, SURFACE MOUNT ASSEMBLY AND BOARD LEVEL RELIABILITY ASPECTS OF FUSIONQUAD TM PACKAGES
BOARD DESIGN, SURFACE MOUNT ASSEMBLY AND BOARD LEVEL RELIABILITY ASPECTS OF FUSIONQUAD TM PACKAGES Ahmer Syed 1, Sundar Sethuraman 2, WonJoon Kang 1, Gary Hamming 1, YeonHo Choi 1 1 Amkor Technology, Inc.
More informationHigh Efficient Heat Dissipation on Printed Circuit Boards. Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH
High Efficient Heat Dissipation on Printed Circuit Boards Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH m.wille@se-pcb.de Introduction 2 Heat Flux: Q x y Q z The substrate (insulation)
More informationAutomotive TFQ. A brief introduction of automotive test for quality Jonathan Ying
Automotive TFQ A brief introduction of automotive test for quality Jonathan Ying 1 Why do we need this? Its quite simple quality in automotive safety applications is critical,automotive OEM require 0 DPPM
More informationIdeal solder joints form reliable, electrically
Using AXI to Ensure Solder Joint Reliability Werner Engelmaier, Tracy Ragland and Colin Charette A test strategy that includes AXI can cost effectively minimize the chance that poor solder joints are shipped.
More informationTypeR(Ribbon)n Curent
PowerFLAT 5x6singleisland TypeR(Ribbon)n Curent WetableFlanks Botom View SideView TopView º º º º Remark:ComparisondonewithrealPackage,curentandWetableFlanks. Itmaybediferentfrom previousdrawing,presentinsomedatasheet.
More informationEmitter Controlled 4 High Power Technology IDC73D120T8H
Diode Emitter Controlled 4 High Power Technology Data Sheet Industrial Power Control Table of Contents Features and Applications... 3 Mechanical Parameters... 3 Maximum Ratings... 4 Static and Electrical
More informationDual Low Drop Voltage Regulator TLE 4476
Dual Low Drop oltage Regulator TLE 4476 Features Output 1: 350 ma; 3.3 ± 4% Output 2: 430 ma; 5.0 ± 4% Enable input for output 2 Low quiescent current in OFF state Wide operation range: up to 42 Reverse
More informationKMA22x; KMA32x handling information
Rev. 2 9 July 2018 Application note Document information Info Keywords Abstract Content KMA220, KMA221, KMA320, KMA321, package, handling, assembly This document describes the limitations to package handling
More informationProcess Change Notice #
User Registration Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, how-to and design documents,
More informationWire Bond Technology The Great Debate: Ball vs. Wedge
Wire Bond Technology The Great Debate: Ball vs. Wedge Donald J. Beck, Applications Manager Alberto C. Perez, Hardware and Applications Engineer Palomar Technologies, Inc. 2728 Loker Avenue West Carlsbad,
More informationPDTB1xxxT series. 500 ma, 50 V PNP resistor-equipped transistors
Rev. 3 May 204 Product data sheet. Product profile. General description PNP Resistor-Equipped Transistor (RET) family in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table. Product
More informationDATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0
DATA SHEET FUSIBLE CHIP RESISTORS series (Pb Free) 5% sizes 0603/1206 2 Chip Resistor Surface Mount SCOPE This specification describes 0603/1206 fusible chip resistors with leadfree terminations made by
More informationHandling, soldering & mounting instructions
Multiple inertial measurement units: Document revision 1.2 Document release date January 2018 Document number BST-MIS-HS000-01 Technical reference code Notes 0 273 141 134 0 273 141 221 0 273 141 365 0
More informationTwo major features of this text
Two major features of this text Since explanatory materials are systematically made based on subject examination questions, preparation
More informationHandling, soldering & mounting instructions
Handling, soldering & mounting instructions Triaxial acceleration sensors: Document revision 1.3 Document release date 08 July 2013 Document number BST-MAS-HS000-03 Technical reference code(s) Notes 0
More informationBAP Product profile. 2. Pinning information. 3. Ordering information. Silicon PIN diode. 1.1 General description. 1.2 Features and benefits
Rev. 5 28 April 2015 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package. 1.2 Features and benefits
More informationVoid Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate
Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate Viktoria Rawinski Ersa GmbH Wertheim, Germany Abstract Due to the ongoing trend towards miniaturization of power components,
More informationAutomotive Devices: Quad No- Lead (QFN) Technology with Inspectable Solder Connections
Automotive Devices: Quad No- Lead (QFN) Technology with Inspectable Solder Connections FTF-SDS-F0026 Dwight Daniels Package Engineer A P R. 2 0 1 4 TM External Use Agenda Wettable Lead Ends / Definition
More informationWHITE PAPER CIRCUIT LEVEL AGING SIMULATIONS PREDICT THE LONG-TERM BEHAVIOR OF ICS
WHITE PAPER CIRCUIT LEVEL AGING SIMULATIONS PREDICT THE LONG-TERM BEHAVIOR OF ICS HOW TO MINIMIZE DESIGN MARGINS WITH ACCURATE ADVANCED TRANSISTOR DEGRADATION MODELS Reliability is a major criterion for
More informationPDTC143/114/124/144EQA series
PDTC43/4/24/44EQA series s Rev. 30 October 205 Product data sheet. Product profile. General description 00 ma NPN Resistor-Equipped Transistor (RET) family in a leadless ultra small DFN00D-3 (SOT25) Surface-Mounted
More informationReliable Electronics? Precise Current Measurements May Tell You Otherwise. Hans Manhaeve. Ridgetop Europe
Reliable Electronics? Precise Current Measurements May Tell You Otherwise Hans Manhaeve Overview Reliable Electronics Precise current measurements? Accurate - Accuracy Resolution Repeatability Understanding
More informationPDTC143X/123J/143Z/114YQA series
PDTC43X/23J/43Z/4YQA series 50 V, 0 ma NPN resistor-equipped transistors Rev. 30 October 205 Product data sheet. Product profile. General description 0 ma NPN Resistor-Equipped Transistor (RET) family
More informationBenefits. Applications. Pinout. Pin1. SiTime Corporation 990 Almanor Avenue, Suite 200 Sunnyvale, CA (408)
1 to 125 MHz Programmable Oscillator Features ±60 ps Peak-Peak Period Jitter Wide frequency range 1 MHz to 125 MHz Low frequency tolerance ±50 ppm or ±100 ppm Operating voltage 1.8V or 2.5 or 3.3 V 2.25V
More informationReliability Qualification Report
Reliability Qualification Report SZM-3066Z - Matte Sn, RoHS Compliant Products Qualified by Similarity SZM-2066Z SWA-5002Z SZM-2166Z SWA-5004Z SZM-3166Z The information provided herein is believed to be
More informationAnalog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Report Type: Date: Qualification Test Report See Attached
More informationLaminate Based Fan-Out Embedded Die Technologies: The Other Option
Laminate Based Fan-Out Embedded Die Technologies: The Other Option Theodore (Ted) G. Tessier, Tanja Karila*, Tuomas Waris*, Mark Dhaenens and David Clark FlipChip International, LLC 3701 E University Drive
More informationGaN Reliability Through Integration and Application Relevant Stress Testing
GaN Reliability Through Integration and Application Relevant Stress Testing APEC 2018 PSMA Sponsored Industry Session: Reliability and Ruggedness How to Address these Challenges in Wide Bandgap Semiconductor
More informationPH9 Reliability. Application Note # 51 - Rev. A. MWTC MARKETING March 1997
PH9 Reliability Application Note # 51 - Rev. A MWTC MARKETING March 1997 1.0. Introduction This application note provides a summary of reliability and environmental testing performed to date on 0.25 µm
More informationDATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0
DATA SHEET FUSIBLE CHIP RESISTORS series (Pb Free) 5% sizes 0603/1206 Product specification Product specification 2 SCOPE This specification describes 0603/1206 fusible chip resistors with leadfree terminations
More informationPESD5V0S2BT. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
23 August 2018 Product data sheet 1. General description 2. Features and benefits 3. Applications 4. Quick reference data Low capacitance bidirectional double ElectroStatic Discharge (ESD) protection diode
More informationTXC Proprietary Info June 2012
Purpose To introduce TXC s MO (MEMS Oscillator). Objectives What is a MO Different BOM Structure between MO and XO Product Feature Product Advantage Target Application Manufacturing Flow TXC Core Competence
More informationPlanar PIN diode in a SOD523 ultra small plastic SMD package.
Rev. 10 12 May 2015 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small plastic SMD package. 1.2 Features and benefits High voltage, current controlled
More informationDevice Qualification Report ADM 5929
Device Qualification Report ADM 5929 Table of Contents Page Introduction 4 QFN Package 5 Summaries & Declarations 6 Test Method 7 Electrical Test Setup & Test Fixture 8 Performance Plots High Temperature
More informationWirebond challenges in QFN. Engineering Team - Wire bond section SPEL Semiconductor Limited
Introduction: Wirebond challenges in QFN by Engineering Team - Wire bond section SPEL Semiconductor Limited The market for the portable & handheld consumer electronic goods is growing rapidly and technological
More informationPDTD1xxxU series. 500 ma, 50 V NPN resistor-equipped transistors
PDTDxxxU series Rev. 3 May 24 Product data sheet. Product profile. General description NPN Resistor-Equipped Transistor (RET) family in a very small SOT323 (SC-7) Surface-Mounted Device (SMD) plastic package.
More informationsizes , 4 x 0402, 2 x 0603, 4 x 0603 RoHS compliant
Product specification June 2, 2016 V.4 DATA SHEET ANTI-SULFURATED CHIP RESISTORS 122 (4Pin/2R) / 124 (Pin/4R) / 162 (4Pin/ 2R)/ 164 (Pin/ 4R) 5%, 1% sizes 2 0402, 4 x 0402, 2 x 0603, 4 x 0603 RoHS compliant
More informationImprove SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. gsmith@fctassembly.com This paper and presentation was first presented at the 2017 IPC Apex Expo Technical
More informationTLS202A1. Data Sheet. Automotive Power. Adjustable Linear Voltage Post Regulator TLS202A1MBV. Rev. 1.0,
Adjustable Linear Voltage Post Regulator TLS22A1MBV Data Sheet Rev. 1., 215-6-22 Automotive Power Adjustable Linear Voltage Post Regulator TLS22A1MBV 1 Overview Features Adjustable Output Voltage from
More informationSESUB - Its Leadership In Embedded Die Packaging Technology
SESUB - Its Leadership In Embedded Die Packaging Technology Sip Conference China 2018 TDK Corporation ECBC, PAF, SESUB BU Kofu, Japan October 17, 2018 Contents SESUB Introduction SESUB Process SESUB Quality
More information4 Maintaining Accuracy of External Diode Connections
AN 15.10 Power and Layout Considerations for EMC2102 1 Overview 2 Audience 3 References This application note describes design and layout techniques that can be used to increase the performance and dissipate
More informationEvaluation of Package Properties for RF BJTs
Application Note Evaluation of Package Properties for RF BJTs Overview EDA simulation software streamlines the development of digital and analog circuits from definition of concept and estimation of required
More information16SCT001 1kV DIRECT-COUPLED MOSFET / IGBT GATE DRIVER 16SCT001 - PRELIMINARY SPECIFICATION - REVISION MAY 1, 2017
Maximum Voltage... 1100 V Zero External Components Direct Drive From Low-Voltage Control Signals MOSFET / IGBT Gate-Emitter Overdrive Circuitry Fast IGBT Turn-On & Turn-Off Times Low HV Current Ultra-Low
More informationBCP68; BC868; BC68PA
Rev. 8 8 October 2 Product data sheet. Product profile. General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number [] Package
More informationPEMH11; PUMH11. NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k
NPN/NPN resistor-equipped transistors; R = k, R2 = k Rev. 6 29 November 20 Product data sheet. Product profile. General description NPN/NPN Resistor-Equipped Transistors (RET) in Surface-Mounted Device
More informationBC857XQA series. 45 V, 100 ma PNP general-purpose transistors
45 V, 100 ma PNP general-purpose transistors Rev. 1 26 August 2015 Product data sheet 1. Product profile 1.1 General description PNP general-purpose transistors in a leadless ultra small DFN1010D-3 (SOT1215)
More informationTRENCHSTOP TM IGBT4 Low Power Chip IGC13T120T8L
IGBT TRENCHSTOP TM IGBT4 Low Power Chip IGC13T120T8L Data Sheet Industrial Power Control Table of Contents Features and Applications... 3 Mechanical Parameters... 3 Maximum Ratings... 4 Static and Electrical
More informationApplication Specification Ultraminiature Bare Poke-in Contact 26FEB2019 REV:A2
Application Specification 114-137190 Ultraminiature Bare Poke-in Contact 26FEB2019 REV:A2 1. INTRODUCTION This specification covers the requirements for application of ultraminiature bare poke-in contacts
More informationINCREASING PACKAGE ROBUSTNESS WITH PALLADIUM COATED COPPER WIRE
INCREASING PACKAGE ROBUSTNESS WITH PALLADIUM COATED COPPER WIRE Rodan A. Melanio Regine B. Cervantes Sonny E. Dipasupil New Package Development ON Semiconductor Philippines Incorporated Golden Mile Business
More informationPDTC143Z series. NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
PDTC4Z series NPN resistor-equipped transistors; R = 4.7 k, R2 = 47 k Rev. 8 5 December 20 Product data sheet. Product profile. General description NPN Resistor-Equipped Transistor (RET) family in Surface-Mounted
More informationMEMS Sensors: From Automotive. CE Applications. MicroNanoTec Forum Innovations for Industry April 19 th Hannover, Germany
MEMS Sensors: From Automotive to CE Applications MicroNanoTec Forum Innovations for Industry 2010 April 19 th Hannover, Germany Oliver Schatz, CTO 1 Engineering April 2010 GmbH 2009. All rights reserved,
More informationREDUCED 2ND LEVEL SOLDER JOINT LIFE TIME OF LOW-CTE MOLD COMPOUND PACKAGES
REDUCED 2ND LEVEL SOLDER JOINT LIFE TIME OF LOW-CTE MOLD COMPOUND PACKAGES NOORDWIJK, THE NETHERLANDS 20-22 MAY 2014 Bart Vandevelde (1), Riet Labie (1), Lieven Degrendele (2), Maarten Cauwe (2), Johan
More informationX-ray Inspection Systems 2D AXI / 3D AXI / WAXI
X-ray Inspection Systems 2D AXI / 3D AXI / WAXI SMT / Semiconductor Analysis Equipment High-performance X-ray Inspection System X-eye SF160 Series Non-destructive analysis of semiconductor, SMT, and electron/electric
More informationTDDB Time Depending Dielectric Breakdown. NBTI Negative Bias Temperature Instability. Human Body Model / Machine Model
For integrated circuits or discrete semiconductors select Amkor-Kr to ASECL Assembly Transfer with Cu wire bonds ID Type of change No Yes AC TC SD Headings ANY A2 A3 A4 A5 A6 B1 B2 B3 C1 C2 C3 C4 C5 C6
More informationISOCOM LTD COMPONENT ISSUE 1. SPECIFICATION October 2013
PART NUMBER CS3041/3042/3043 COMPONENT ISSUE 1 SPECIFICATION October 2013 Component Specification For Ceramic Hermetically Sealed, Radiation Hard Zero Crossing Triac Optocoupler BS9000 M1077 IECQ 1077/M
More informationISOCOM LTD. SPECIFICATION October Component Specification For Ceramic Hermetically Sealed, Radiation Hard High Speed Transistor Optocoupler
PART NUMBER MC810/811 COMPONENT ISSUE 2 SPECIFICATION October 2014 Component Specification For Ceramic Hermetically Sealed, Radiation Hard High Speed Transistor Optocoupler M1077 IECQ Further copies of
More informationPESD36VS2UT. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
3 July 2018 Product data sheet 1. General description Low capacitance unidirectional double ElectroStatic Discharge (ESD) protection diode in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic
More information100BASE-T1 / OPEN Allicance BroadR-Reach automotive Ethernet Low-Voltage Differential Signaling (LVDS) automotive USB 2.
14 December 217 Product data sheet 1. General description Ultra low capacitance double rail-to-rail ElectroStatic Discharge (ESD) protection diode in a small SOT457 Surface-Mounted Device (SMD) plastic
More informationThe Advantages of Integrated MEMS to Enable the Internet of Moving Things
The Advantages of Integrated MEMS to Enable the Internet of Moving Things January 2018 The availability of contextual information regarding motion is transforming several consumer device applications.
More informationBCP56H series. 80 V, 1 A NPN medium power transistors
SOT223 8 V, A NPN medium power transistors Rev. 23 November 26 Product data sheet. Product profile. General description NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device
More informationDATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1218 (Pb Free) 5%; 1% Product specification Oct 13, 2004 V.1
DATA SHEET GENERAL PURPOSE CHIP RESISTORS 5%; 1% 2 SCOPE This specification describes 1218 series chip resistors with lead-free terminations made by thick film process. ORDERING INFORMATION Part number
More informationDATA SHEET ANTI-SULFURATED CHIP RESISTORS AF series 5%, 1%, 0.5%
Product specification June 07, 2017 V.5 DATA SHEET ANTI-SULFURATED CHIP RESISTORS AF series 5%, 1%, 0.5% sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512 RoHS compliant & Halogen free Product specification
More informationProduct Qualification Report
Product Qualification Report Skyworks Part Number: SKY12145-315 Product Type: HIP3 Variable Attenuator for UMTS Base Stations Report No: Approved by: Product/Package Reliability: Tom Wood Prepared by Skyworks
More information3M IDC Ribbon Cable Socket. Series 891
78-51-- Rev A 1 of 8 M IDC Ribbon Cable Socket Series 891 Product Specification 78-51-- Released: 9-7-11 Austin, TX 7876-9 78-51-- Rev A of 8 Table of Contents Section Page 1. Scope........ M Customer
More informationTwo elements in series configuration in a small SMD plastic package Low diode capacitance Low diode forward resistance AEC-Q101 qualified
Rev. 2 25 October 2016 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in series configuration in a SOT323 small SMD plastic package. 1.2 Features and benefits Two elements
More information80 V, 1 A NPN medium power transistors. Type number Package PNP complement Nexperia JEITA JEDEC BCP56T SOT223 SC-73 - BCP53T
8 V, A NPN medium power transistors Rev. 5 July 26 Product data sheet. Product profile. General description NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic
More informationTechnical Session Abstracts
Automotive Electronics Council Component Technical Committee Technical Session Abstracts (Agenda subject to change) 2018 - Twentieth Annual Automotive Electronics Reliability Workshop April 24, 25, & 26
More informationThermal Cycling and Fatigue
Thermal Cycling and Fatigue Gil Sharon Introduction The majority of electronic failures are thermo-mechanically related by thermally induced stresses and strains. The excessive difference in coefficients
More informationThe Future of Packaging and Cu Wire Bonding Advances. Ivy Qin
The Future of Packaging and Cu Wire Bonding Advances Ivy Qin Introduction Semiconductors have been around for over 70 years Packaging is playing a more and more important role, providing low cost high
More informationPESD5V0F1BSF. 1. Product profile. 2. Pinning information. Extremely low capacitance bidirectional ESD protection diode. 1.1 General description
Rev. 1 10 December 2012 Product data sheet 1. Product profile 1.1 General description Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a DSN0603-2 (SOD962) leadless
More informationBC847 series. 1 Product profile. 45 V, 100 ma NPN general-purpose transistors. 1.1 General description. 1.2 Features and benefits. 1.
Rev. 1 2 March 217 Product data sheet 1 Product profile 1.1 General description NPN general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table 1. Product
More information450mm silicon wafers specification challenges. Mike Goldstein Intel Corp.
450mm silicon wafers specification challenges Mike Goldstein Intel Corp. Outline Background 450mm transition program 450mm silicon evolution Mechanical grade wafers (spec case study) Developmental (test)
More informationPowerBond TM Technology for High-Current Automotive Power MOSFETs
PowerBond TM Technology for High-Current Automotive Power MOSFETs by Jean-Philippe Boeschlin, Dr. Dušan Graovac, Marco Pürschel Automotive Power N e v e r s t o p t h i n k i n g. Table of Content 1 Abstract...3
More information14SCT001 OPTO-COUPLER or SSR LED DRIVER
Metal Shield to prevent LED interaction. Nominal Current 14mA Resistor programmable current -55C to +125C operation Small die size at 1050um X 815um Breakdown voltage > 50V OFF leakage < +/-100uA DIE (TOP
More informationHandling, soldering & mounting instructions
Triaxial, digital gyroscopic sensors: Document revision 1.0 Document release date 13 July 2012 Document number Technical reference code(s) Notes BST-MGS-HS000-01 0 273 142 007 Data in this document are
More information+Vin. Input Return. +Vin. Input Return
PD-97874A SF461 SERIES EMI FILTER HYBRID-HIGH RELIABILITY Description SF461 Series is part of the International Rectifier HiRel family of products. The SF461 Series EMI filter is designed to provide full
More informationBC817K series. 1 Product profile. 45 V, 500 ma NPN general-purpose transistors. 1.1 General description. 1.2 Features and benefits. 1.
45 V, 5 ma NPN general-purpose transistors Rev. 2 6 March 28 Product data sheet Product profile. General description NPN general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD)
More informationPEMB18; PUMB18. PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k Rev. 5 21 December 2011 1. Product profile 1.1 General description PNP/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device
More informationPESD5V0S2BQA. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
Protection against high surge currents in ultra small DFN1010D-3 package 1 June 2016 Product data sheet 1. General description Two bidirectional ElectroStatic Discharge (ESD) protection diodes designed
More informationSymbol Parameter Conditions Min Typ Max Unit V DD supply voltage
Rev. 01 5 February 2008 Product data sheet 1. General description 2. Features 3. Applications 4. Quick reference data The is a CMOS quartz oscillator optimized for low power consumption. The 32 khz output
More informationA New Type of Very High Reliability Torsion IDC Which Can Accept A Large Range of Wire Gauges
A New Type of Very High Reliability Torsion IDC Which Can Accept A Large Range of Wire Gauges Janos Legrady Zierick Manufacturing Corporation Radio Circle, Mount Kisco, New York 10549 ABSTRACT This paper
More informationPOSSUM TM Die Design as a Low Cost 3D Packaging Alternative
POSSUM TM Die Design as a Low Cost 3D Packaging Alternative The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration
More informationAnalog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com HMC461* Product Page Quick Links Last Content Update: 8/3/216 Comparable
More informationDATA SHEET CURRENT SENSOR - LOW TCR PA0603 series 5%, 1% sizes 0603
Product specification February 14, 2018 V.0 DATA SHEET CURRENT SENSOR - LOW TCR PA0603 series 5%, 1% sizes 0603 RoHS compliant & Halogen free Product specification 2 SCOPE This specification describes
More informationNPN 5 GHz wideband transistor. The transistor is encapsulated in a 3-pin plastic SOT23 envelope.
SOT3 BFTA Rev. September Product data sheet. Product profile. General description The BFTA is a silicon NPN transistor, primarily intended for use in RF low power amplifiers, such as pocket telephones
More informationBCP55; BCX55; BC55PA
Rev. 8 24 October 2 Product data sheet. Product profile. General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number []
More informationBC817-25QA; BC817-40QA
Rev. 1 3 September 2013 Product data sheet 1. Product profile 1.1 General description 500 ma NPN general-purpose transistors in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD)
More informationAPPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS
Keywords: OLGA, SMT, PCB design APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS Abstract: This application note discusses Maxim Integrated s OLGA and provides the PCB design and
More informationSurface Mounted Power Resistor Thick Film Technology
Surface Mounted Power Resistor Thick Film Technology DIMENSIONS in millimeters FEATURES AEC-Q200 qualified 25 W at 25 C case temperature Surface mounted resistor - TO-252 (DPAK) style package Wide resistance
More informationBCP53; BCX53; BC53PA
Rev. 9 9 October 2 Product data sheet. Product profile. General description PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number [] Package
More informationHigh Voltage Thick Film Chip Resistors Product Specification
Page No 1/10 1 Scope: 11 This specification is applicable to lead and halogen free for RTV series thick film chip resistors 12 Lead free products mean lead free termination meets RoHS requirement Pb contained
More informationHOW DOES PRINTED SOLDER PASTE VOLUME AFFECT SOLDER JOINT RELIABILITY?
HOW DOES PRINTED SOLDER PASTE VOLUME AFFECT SOLDER JOINT RELIABILITY? ABSTRACT Printing of solder paste and stencil technology has been well studied and many papers have been presented on the topic. Very
More informationPBHV9560Z. 1. General description. 2. Features and benefits. 3. Applications. Quick reference data
2 August 204 Product data sheet. General description PNP high-voltage low V CEsat Breakthrough In Small Signal (BISS) transistor in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.
More informationJanuary 2009 TLE4906K / TLE4906L. High Precision Hall Effect Switch. Data Sheet V 2.0. Sensors
January 2009 TLE4906K / High Precision Hall Effect Switch Data Sheet V 2.0 Sensors Edition 2009-01 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved.
More informationApplication Specification Releasable Poke-in Connector 08JUL 2015 REV:A
Application Specification 114-137055 Releasable Poke-in Connector 08JUL 2015 REV:A 1. INTRODUCTION This specification covers the requirements for application of Releasable Poke-in connector for use on
More informationGaAs MMIC Non-Linear Transmission Line. Packag e. Refer to our website for a list of definitions for terminology presented in this table.
GaAs MMIC Non-Linear Transmission Line NLTL-6273SM 1. Device Overview 1.1 General Description NLTL-6273SM is a MMIC non-linear transmission line (NLTL) based comb generator. This NLTL offers excellent
More informationApplication Specification Slim WtoB Poke-in Connector
Application Specification 114-137049 Slim WtoB Poke-in Connector 18APR 2016 REV:B 1. INTRODUCTION This specification covers the requirements for application of Slim WtoB Poke in connector for use on lighting
More information