Chip-ScalePackageFiberOptic TransceiverIntegrationforHarsh Environments. Chuck Tabbert (505)

Size: px
Start display at page:

Download "Chip-ScalePackageFiberOptic TransceiverIntegrationforHarsh Environments. Chuck Tabbert (505)"

Transcription

1 Chip-ScalePackageFiberOptic TransceiverIntegrationforHarsh Environments Chuck Tabbert (505)

2 CorporateOverview Agenda Motivation BackgroundTechnology ChipScalePackageTechnology Summary 2

3 Ultra Communications Overview Ultra Communications(UltraComm) Founded 2006(spin-out of Peregrine Semiconductor) Annual Revenue: >$3M(restricted by R&D projects) Gov t/commercial Ratio: 78%(Government)/ 22%(Commercial) 16 employees Fiber optic communications for harsh environments Fiber optic component packaging, optical modeling and circuit design Moved from Development into Production- Low rate production(50 units/ month with planned capacity expansion) 12 active research contracts Business Sectors Military: Avionics, Missiles, Ship platforms & Unmanned systems Space Moving towards Embedded computing Data Center& Automotive Presently shipping evaluation boards and engineering units to customers worldwide(adjudicated non-itar by US Dept of State)

4 Motivation

5 Commercial Trend in Embedded Photonic Modules IBM/Avago 1x12Tx/RxMicroPODs 120Gbps ParallelOptic VCSELbased 28Txand28RXunitsmountedonto server ASIC package 6.72 Tbps I/O 420,000 units per computer shipping 10 s of thousands per month IBM Bluewaters PERCS P7-IH 5

6 Addressing High Temperature& High Reliability Markets Military Aerospace Adapted embedded optical modules in 1999 Inflighttoday Attractive features Compact Light weight EMIfree Wide temperature environment:-55 to 100 C High performance computing Increased activity over past 5 years High temperatures near ASIC 100 W+ components Desire to raise the room temperature 2-5% energy savings per degree Celsius Desirelowcost/lowpower $/GBps&pJ/GBps aerospace network card fiber optic transceiver 6

7 BackgroundTechnology

8 X80- QFN 12.5 Gbps/channel Fury Class(50GBPS) 4Transmit+4receiveparalleloptic 10 Mbps to 12.5 Gbps per channel(850 mw) with most advanced Built-In-Test diagnostics in the world with embedded Fiber Fault Detection utilizing OTDR to 1cm Standard ASIC Package(quad flat-pack no-leads(qfn)) Lead-less offers reduce parasitics for high speed Reflow Solderable Sealed Optical Path -40C to 100C guaranteed operation Qualified as hybrid at cable interface Configurations actively designed into space& avionic applications Transceiver(uController implemented within CORE) Transceiver with non-volatile memory(space version) Transceiver with OTDR(uController on customer board) RVCON splitting optics transceiver VCSEL PIN CORE (7 mm x 7 mm) OTDR ASIC CORE (with OTDR option)

9 Ultra Comm Product Roadmap Low Rate Production 10 Gbps / channel Harsh environment Qualification completes Q CORE (optical engine) Prototype Development 2 On-going SBIR programs Status: Prototypes complete Q under SBIR Phase II program SFP+ with integrated OTDR X80 QFN Transceiver CSP Single 10Gbps CSP 25Gbps/ch RVCON Fiber Termini 4 mm Status: Prototypes complete Q under SBIR Phase II program 8 mm Status: Prototypes complete Q under SBIR Phase II program

10 ChipScalePackagingTechnology

11 10Gpbs Chip Scale Packaged(CSP) Fiber Optic Transmitter/ Receiver Createsanewclassoffiberoptictransceiver components that includes: Standard Pick& Place tolerances Solder reflow board assembly Cost parity with electrical connector 12.5 Gbps data rate, with non-volatile memory(self contained cal data) Advanced ASIC Functionality Autonomous Built-In-Diagnostics Fiber Connector for CSP Key technology development- wafer scale integration Lensontop-side Copper-post solder and flip-chip footprints aligned on bottom side Low-cost Optical Chip Scale Package Status: Prototypes complete Q under SBIR Phase II program 4/15/2015

12 Technology Transitions to 25Gbps CSPplatformbeingusedforDeptOfEnergy(DOE) demo for Exascale Program Linktestingat10GBPS 4/15/2015

13 NASA Wide Temperature Experiments Ultra Comm completed wide temperature excursion transceiver testing under SBIR contract Status Tasks Completed Transceiver Design(Phase I) and Fabrication(Ph II) 3 batches were assembled Fiber Cable Assembly- 1,000 Thermal Cycles -55 C to 125 C Completed performance measurements -120 to +180 C(see figure->) 4/15/2015

14 Summary of Module BIT Functions OTDR Measurements Single point measurement at specified delay Full map with specified range and sample spacing Average back-reflected optical power in situ health monitor with data running Sweep frequency for fiber bandwidth measurements Transceiver Status VCSEL bias/mod/pre-emphasis settings DC Measurements RSSI: receiver average optical power RMSI: receiver optical modulation amplitude TSSI: transmitter optical power TMSI: transmitter input amplitude VCSEL operating voltage VCSEL temperature Die temperature Case(MCU) temperature Supply voltages Register tests DACtests

15 Summary Ultra Comm is demonstrating a new packaging concept for high speed fiber optic connectivity Presently 10MBS 12.5GBPS devices operational from-40 to 100C with development of 25Gbps/Channel Demonstrated in high shock environment in free space optics board to board application Leverages developed high-precision flip chip capability and ruggedized connector technology Keytothistechnology Matching CTE materials Expanded Beam Optical Interface Efficient coupling for reduced laser drive currents Consistent coupling over temperature Low delta-t between laser and heatsink

16 Back-Up

17 EmbeddedOTDR

18 OTDR Example: Long Fiber Corse sweep 5.25 seconds Fine sweep 7.35 seconds Biggest impediment to implementation is platform CONOPS

19 WideTemperatureExperiments

20 VCSEL Reliability at Elevated Temperature VCSEL Acceleration Factor: Case study: Want:20yearlife, T CASE =105 C -> T SUBST =110 C 5Gb/sRequired 10Gb/sDesired VCSELmanufacturerlifetestingresults: 14Gb/s50yearlife,6mA@70 C 6mA@110 C, projectedlifetime<6years NOTACCEPTABLE De-rate operating current 4 ma@ 110 C, projected lifetime > 20 years MEETS REQUIREMENT But lower operating current means lower bandwidth and output power Doesitfunction?... 20

21 VCSEL Performance at Elevated Temperature Measurement results T CASE =105 C (T SUBST =110 C) 4 ma average current 5Gb/s & 10Gb/s Outputpower:-1.5dBmcoupledintofiberviaRVCON TM 5 Gb/s 10 Gb/s (No filter) 21

Chip-Scale Package Fiber Optic Transceiver Integration for Harsh Environments. Chuck Tabbert

Chip-Scale Package Fiber Optic Transceiver Integration for Harsh Environments. Chuck Tabbert Chip-Scale Package Fiber Optic Transceiver Integration for Harsh Environments Chuck Tabbert ctabbert@ultracomm-inc.com (505) 823-1293 Agenda Corporate Overview Motivation Background Technology Wide Temperature

More information

Fiber Optics for Harsh Environments ICSO Chuck Tabbert

Fiber Optics for Harsh Environments ICSO Chuck Tabbert Fiber Optics for Harsh Environments ICSO 2016 Chuck Tabbert VP Sales & Marketing Ultra Communications (505) 823-1293 ctabbert@ultracomm-inc.com www.ultracomm-inc.com If anyone would like copy of briefing

More information

Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments

Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments Chuck Tabbert and Charlie Kuznia Ultra Communications, Inc. 990 Park Center Drive, Suite H Vista, CA, USA, 92081 ctabbert@

More information

Non Hermetic Fiber Optic Transceivers for Space Applications. Chuck Tabbert VP of Sales & Marketing inc.

Non Hermetic Fiber Optic Transceivers for Space Applications. Chuck Tabbert VP of Sales & Marketing inc. Non Hermetic Fiber Optic Transceivers for Space Applications Chuck Tabbert VP of Sales & Marketing ctabbert@ultracomm inc.com (505) 823 1293 1 Agenda Motivation X80 QM Space Product Overview Space Qualification

More information

Fiber-optic transceivers for multi-gigabit interconnects in space systems

Fiber-optic transceivers for multi-gigabit interconnects in space systems VTT TECHNICAL RESEARCH CENTRE OF FINLAND LTD Photo: ESA Fiber-optic transceivers for multi-gigabit interconnects in space systems at EPIC Tech Watch of Micro Photonics Expo, Berlin, 11 Oct 2016 Mikko Karppinen(mikko.karppinen@vtt.fi)

More information

Trends in Optical Transceivers:

Trends in Optical Transceivers: Trends in Optical Transceivers: Light sources for premises networks Peter Ronco Corning Optical Fiber Asst. Product Line Manager Premises Fibers January 24, 2006 Outline: Introduction: Transceivers and

More information

Fiber-Optic Transceivers for High-speed Digital Interconnects in Satellites

Fiber-Optic Transceivers for High-speed Digital Interconnects in Satellites Photo: ESA Fiber-Optic Transceivers for High-speed Digital Interconnects in Satellites ICSO conference, 9 Oct 2014 Mikko Karppinen (mikko.karppinen@vtt.fi), V. Heikkinen, K. Kautio, J. Ollila, A. Tanskanen

More information

Integrated Photonics using the POET Optical InterposerTM Platform

Integrated Photonics using the POET Optical InterposerTM Platform Integrated Photonics using the POET Optical InterposerTM Platform Dr. Suresh Venkatesan CIOE Conference Shenzhen, China Sept. 5, 2018 POET Technologies Inc. TSXV: PUBLIC POET PTK.V Technologies Inc. PUBLIC

More information

Multi-gigabit photonic transceivers for SpaceFibre data networks

Multi-gigabit photonic transceivers for SpaceFibre data networks 7 TH EUROPEAN CONFERENCE FOR AERONAUTICS AND SPACE SCIENCES (EUCASS) Multi-gigabit photonic transceivers for SpaceFibre data networks Ronald T. Logan Jr.* and Davinder Basuita** *Glenair Inc. 1211 Air

More information

Communications. Mitchell Fields, Ph. D. Director of Strategic Marketing

Communications. Mitchell Fields, Ph. D. Director of Strategic Marketing Optical Navigation Division Optical Interconnects for Chip-to-Chip Communications Mitchell Fields, Ph. D. Director of Strategic Marketing mitch.h.fields@avagotech.comh com Contributors: Avago: Christine

More information

Si Photonics Technology Platform for High Speed Optical Interconnect. Peter De Dobbelaere 9/17/2012

Si Photonics Technology Platform for High Speed Optical Interconnect. Peter De Dobbelaere 9/17/2012 Si Photonics Technology Platform for High Speed Optical Interconnect Peter De Dobbelaere 9/17/2012 ECOC 2012 - Luxtera Proprietary www.luxtera.com Overview Luxtera: Introduction Silicon Photonics: Introduction

More information

SECTION 10 TABLE OF CONTENTS

SECTION 10 TABLE OF CONTENTS Contents Introduction Markets and Applications... 10-2 Internal Standard Documents Compliance... 10-2 Features and Benefits... 10-2 Product Range Overview... 10-2 S-Light Features... 10-3 Key Parameters...

More information

Multi-gigabit intra-satellite interconnects employing multi-core fibers and optical engines

Multi-gigabit intra-satellite interconnects employing multi-core fibers and optical engines VTT TECHNICAL RESEARCH CENTRE OF FINLAND LTD at ICSO conference 19 Oct 2016 Multi-gigabit intra-satellite interconnects employing multi-core fibers and optical engines Mikko Karppinen et al. VTT P. Westbergh,

More information

Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap

Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap Peter De Dobbelaere Luxtera Inc. 09/19/2016 Luxtera Proprietary www.luxtera.com Luxtera Company Introduction $100B+ Shift

More information

Opportunities and challenges of silicon photonics based System-In-Package

Opportunities and challenges of silicon photonics based System-In-Package Opportunities and challenges of silicon photonics based System-In-Package ECTC 2014 Panel session : Emerging Technologies and Market Trends of Silicon Photonics Speaker : Stéphane Bernabé (Leti Photonics

More information

Ruggedized Photonics / Opto-Electronics

Ruggedized Photonics / Opto-Electronics Ruggedized Photonics / Opto-Electronics Fiber Optic Benefits Reduced weight Increased distance Reduced EMI headaches Increased Security Massive data carrying capacity Typical Applications for Ruggedized

More information

NEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL

NEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL NEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL OUTLINE Introduction Platform Overview Device Library Overview What s Next? Conclusion OUTLINE Introduction Platform Overview

More information

10 Gb/s Radiation-Hard VCSEL Array Driver

10 Gb/s Radiation-Hard VCSEL Array Driver 10 Gb/s Radiation-Hard VCSEL Array Driver K.K. Gan 1, H.P. Kagan, R.D. Kass, J.R. Moore, D.S. Smith Department of Physics The Ohio State University Columbus, OH 43210, USA E-mail: gan@mps.ohio-state.edu

More information

Light source approach for silicon photonics transceivers September Fiber to the Chip

Light source approach for silicon photonics transceivers September Fiber to the Chip Light source approach for silicon photonics transceivers September 2014 Fiber to the Chip Silicon Photonics Silicon Photonics Technology: Silicon material system & processing techniques to manufacture

More information

Silicon Photonics for Mid-Board Optical Modules Marc Epitaux

Silicon Photonics for Mid-Board Optical Modules Marc Epitaux Silicon Photonics for Mid-Board Optical Modules Marc Epitaux Chief Architect at Samtec, Inc Outline Interconnect Solutions Mid-Board Optical Modules Silicon Photonics o Benefits o Challenges DragonFly

More information

A 24-Channel 300 Gb/s 8.2 pj/bit Full-Duplex Fiber-Coupled Optical Transceiver Module Based on a Single Holey CMOS IC

A 24-Channel 300 Gb/s 8.2 pj/bit Full-Duplex Fiber-Coupled Optical Transceiver Module Based on a Single Holey CMOS IC A 24-Channel 300 Gb/s 8.2 pj/bit Full-Duplex Fiber-Coupled Optical Transceiver Module Based on a Single Holey CMOS IC A. Rylyakov, C. Schow, F. Doany, B. Lee, C. Jahnes, Y. Kwark, C.Baks, D. Kuchta, J.

More information

High-Speed/Radiation-Hard Optical Links

High-Speed/Radiation-Hard Optical Links High-Speed/Radiation-Hard Optical Links K.K. Gan, H. Kagan, R. Kass, J. Moore, D.S. Smith The Ohio State University P. Buchholz, S. Heidbrink, M. Vogt, M. Ziolkowski Universität Siegen September 8, 2016

More information

Specifications subject to change Packaging

Specifications subject to change Packaging VCSEL Standard Product Packaging Options All standard products are represented in the table below. The Part Number for a standard product is determined by replacing the x in the column Generic Part Number

More information

Wavelength Division Multiplexing (WDM) Technology for Naval Air Applications

Wavelength Division Multiplexing (WDM) Technology for Naval Air Applications Wavelength Division Multiplexing (WDM) Technology for Naval Air Applications Drew Glista Naval Air Systems Command Patuxent River, MD glistaas@navair.navy.mil 301-342-2046 1 Report Documentation Page Form

More information

POSSUM TM Die Design as a Low Cost 3D Packaging Alternative

POSSUM TM Die Design as a Low Cost 3D Packaging Alternative POSSUM TM Die Design as a Low Cost 3D Packaging Alternative The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration

More information

Development of Optical Interconnect PCBs for High-Speed Electronic Systems Fabricator s View

Development of Optical Interconnect PCBs for High-Speed Electronic Systems Fabricator s View Development of Optical Interconnect PCBs for High-Speed Electronic Systems Fabricator s View 2011 IBM Printed Circuit Board Symposium Raleigh, NC, USA November 16 th 2011, Time: 10:00-10:30am Speaker:

More information

R&D Requirements from the 2004 inemi Roadmap. April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi

R&D Requirements from the 2004 inemi Roadmap. April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi R&D Requirements from the 2004 inemi Roadmap April 7, 2005 Dr. Robert C. Pfahl, Jr. VP of Operations, inemi Topics Covered Overview of inemi and the 2004 Roadmap Situation Analysis Highlights from the

More information

ARINC 804 Proposed Update. ARINC 804 today Concerns Compliance Next Steps

ARINC 804 Proposed Update. ARINC 804 today Concerns Compliance Next Steps ARINC 804 Proposed Update ARINC 804 today Concerns Compliance Next Steps Presented By: Slide 1 A804: Taking A Step Back ARINC optical specs define geometry, spring force, materials used, why not apply

More information

SpaceFibre Fibre-optic Link

SpaceFibre Fibre-optic Link SpaceFibre Fibre-optic Link 1 Jaakko Toivonen,, Patria Aviation Oy The SpaceFibre Development ESA study Optical Links for the SpaceWire Intra- Satellite Network Standard, i.e. SpaceFibre in 2004-2006 SpaceFibre

More information

3D Integration Using Wafer-Level Packaging

3D Integration Using Wafer-Level Packaging 3D Integration Using Wafer-Level Packaging July 21, 2008 Patty Chang-Chien MMIC Array Receivers & Spectrographs Workshop Pasadena, CA Agenda Wafer-Level Packaging Technology Overview IRAD development on

More information

MISSION-CRITICAL SOLUTIONS FOR AEROSPACE AND DEFENSE

MISSION-CRITICAL SOLUTIONS FOR AEROSPACE AND DEFENSE MISSION-CRITICAL SOLUTIONS FOR AEROSPACE AND DEFENSE WHEN IT S CRITICAL CHOOSE MOLEX In the aerospace and defense industries, mission-critical isn t just a catchphrase it s the core quality that drives

More information

Electronic-Photonic ICs for Low Cost and Scalable Datacenter Solutions

Electronic-Photonic ICs for Low Cost and Scalable Datacenter Solutions Electronic-Photonic ICs for Low Cost and Scalable Datacenter Solutions Christoph Theiss, Director Packaging Christoph.Theiss@sicoya.com 1 SEMICON Europe 2016, October 27 2016 Sicoya Overview Spin-off from

More information

TE Connectivity Data Communications Product Guide:

TE Connectivity Data Communications Product Guide: Data Communications Product Guide: Providing technology leadership for your next-generation high-speed architectural platforms Success in today and tomorrow s data communications relies on dependable high-speed

More information

inemi OPTOELECTRONICS ROADMAP FOR 2004 Dr. Laura J. Turbini University of Toronto SMTA International September 26, 2005

inemi OPTOELECTRONICS ROADMAP FOR 2004 Dr. Laura J. Turbini University of Toronto SMTA International September 26, 2005 inemi OPTOELECTRONICS ROADMAP FOR 2004 0 Dr. Laura J. Turbini University of Toronto SMTA International September 26, 2005 Outline Business Overview Traditional vs Jisso Packaging Levels Optoelectronics

More information

NANOSCALE IMPULSE RADAR

NANOSCALE IMPULSE RADAR NANOSCALE IMPULSE RADAR NVA6X00 Impulse Radar Transceiver and Development Kit 2012.4.20 laon@laonuri.com 1 NVA6000 The Novelda NVA6000 is a single-die CMOS chip that delivers high performance, low power,

More information

The Future of Packaging ~ Advanced System Integration

The Future of Packaging ~ Advanced System Integration The Future of Packaging ~ Advanced System Integration Enabling a Microelectronic World R. Huemoeller SVP, Adv. Product / Platform Develop June 2013 Product Segments End Market % Share Summary 2 New Product

More information

Silicon photonics with low loss and small polarization dependency. Timo Aalto VTT Technical Research Centre of Finland

Silicon photonics with low loss and small polarization dependency. Timo Aalto VTT Technical Research Centre of Finland Silicon photonics with low loss and small polarization dependency Timo Aalto VTT Technical Research Centre of Finland EPIC workshop in Tokyo, 9 th November 2017 VTT Technical Research Center of Finland

More information

Silicon Photonics Photo-Detector Announcement. Mario Paniccia Intel Fellow Director, Photonics Technology Lab

Silicon Photonics Photo-Detector Announcement. Mario Paniccia Intel Fellow Director, Photonics Technology Lab Silicon Photonics Photo-Detector Announcement Mario Paniccia Intel Fellow Director, Photonics Technology Lab Agenda Intel s Silicon Photonics Research 40G Modulator Recap 40G Photodetector Announcement

More information

CFORTH-QSFP28-100G-AOCxM Specification Rev. D00A. Applications

CFORTH-QSFP28-100G-AOCxM Specification Rev. D00A. Applications CFORTH-QSFP28-100G-AOCxM Specification Rev. D00A Preliminary DATA SHEET CFORTH-QSFP28-100G-AOCxM 100Gb/s QSFP28 Active Optical Cable Transceiver CFORTH-QSFP28-100G-AOCxM Overview CFORTH-QSFP28-100G-AOCxM

More information

Innovations in Photonic Integration Platforms

Innovations in Photonic Integration Platforms Innovations in Photonic Integration Platforms September 20, 20 Burgeoning Growth Demand Disruptive Technology Video content is fast becoming a larger percentage of total internet traffic 50% Video services

More information

Markets for On-Chip and Chip-to-Chip Optical Interconnects 2015 to 2024 January 2015

Markets for On-Chip and Chip-to-Chip Optical Interconnects 2015 to 2024 January 2015 Markets for On-Chip and Chip-to-Chip Optical Interconnects 2015 to 2024 January 2015 Chapter One: Introduction Page 1 1.1 Background to this Report CIR s last report on the chip-level optical interconnect

More information

407-BBOS-A 407-BBOS-A. Features. Up to 1.25Gb/s bi-directional data links. Hot-pluggable SFP footprint

407-BBOS-A 407-BBOS-A. Features. Up to 1.25Gb/s bi-directional data links. Hot-pluggable SFP footprint 1000BASE, SFP-T Transceiver Features Up to 1.25Gb/s bi-directional data links Hot-pluggable SFP footprint Commercial case temperature range (0 C to +70 C ) Fully metallic enclosure for low EMI Low power

More information

on-chip Design for LAr Front-end Readout

on-chip Design for LAr Front-end Readout Silicon-on on-sapphire (SOS) Technology and the Link-on on-chip Design for LAr Front-end Readout Ping Gui, Jingbo Ye, Ryszard Stroynowski Department of Electrical Engineering Physics Department Southern

More information

!"#$"%&' ()#*+,-+.&/0(

!#$%&' ()#*+,-+.&/0( !"#$"%&' ()#*+,-+.&/0( Multi Chip Modules (MCM) or Multi chip packaging Industry s first MCM from IBM. Generally MCMs are horizontal or two-dimensional modules. Defined as a single unit containing two

More information

Si photonics for the Zettabyte Era. Marco Romagnoli. CNIT & TeCIP - Scuola Superiore Sant Anna

Si photonics for the Zettabyte Era. Marco Romagnoli. CNIT & TeCIP - Scuola Superiore Sant Anna Si photonics for the Zettabyte Era Marco Romagnoli CNIT & TeCIP - Scuola Superiore Sant Anna Semicon 2013 Dresden 8-10 October 2013 Zetabyte era Disaggregation at system level Integration at chip level

More information

GLC-LH-SMD-AO. 1.25Gbps SFP Transceiver

GLC-LH-SMD-AO. 1.25Gbps SFP Transceiver GLC-LH-SMD-AO Cisco 1000Base-LX SFP SMF 1310nm, 10km Reach, LC, DOM www.addonnetworks.com GLC-LH-SMD-AO 1.25Gbps SFP Transceiver Features Up to 1.25Gb/s data links Duplex LC connector Hot-pluggable SFP

More information

Flip-Chip for MM-Wave and Broadband Packaging

Flip-Chip for MM-Wave and Broadband Packaging 1 Flip-Chip for MM-Wave and Broadband Packaging Wolfgang Heinrich Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH) Berlin / Germany with contributions by F. J. Schmückle Motivation Growing markets

More information

Zukunftstechnologie Dünnglasbasierte elektrooptische. Research Center of Microperipheric Technologies

Zukunftstechnologie Dünnglasbasierte elektrooptische. Research Center of Microperipheric Technologies Zukunftstechnologie Dünnglasbasierte elektrooptische Baugruppenträger Dr. Henning Schröder Fraunhofer IZM, Berlin, Germany Today/Overview Motivation: external roadmaps High Bandwidth and Channel Density

More information

Optical Measurements in 100 and 400 Gb/s Networks: Will Coherent Receivers Take Over? Fred Heismann

Optical Measurements in 100 and 400 Gb/s Networks: Will Coherent Receivers Take Over? Fred Heismann Optical Measurements in 100 and 400 Gb/s Networks: Will Coherent Receivers Take Over? Fred Heismann Chief Scientist Fiberoptic Test & Measurement Key Trends in DWDM and Impact on Test & Measurement Complex

More information

13607CP 13 GHz Latched Comparator Data Sheet

13607CP 13 GHz Latched Comparator Data Sheet 13607CP 13 GHz Latched Comparator Data Sheet Applications Broadband test and measurement equipment High speed line receivers and signal regeneration Oscilloscope and logic analyzer front ends Threshold

More information

InterBOARD TM 12 Channel Transmitter and Receiver Evaluation Board User Guide

InterBOARD TM 12 Channel Transmitter and Receiver Evaluation Board User Guide InterBOARD TM 12 Channel Transmitter and Receiver Evaluation Board User Guide SN-E12-X00501 Evaluation Board Features: Single Board compatible with Transmitter and Receiver Designed to operate up to 3.5

More information

As originally published in the IPC APEX EXPO Conference Proceedings.

As originally published in the IPC APEX EXPO Conference Proceedings. Embedded Packaging Technologies: Imbedding Components to Meet Form, Fit, and Function Casey H. Cooper STI Electronics, Inc. Madison, AL USA ccooper@stielectronicsinc.com Abstract As the electronics industry

More information

20 GHz High Power, High Linearity Photodiode Part #ARX zz-DC-C-FL-FC

20 GHz High Power, High Linearity Photodiode Part #ARX zz-DC-C-FL-FC Ver 2a, 4-25-2018 Product Specification 5800 Uplander Way Culver City, CA 90230 Tel: (310) 642-7975 sales@apichip.com www.apichip.com 20 GHz High Power, High Linearity Photodiode Part #ARX-20-50-zz-DC-C-FL-FC

More information

DS485 Low Power RS-485/RS-422 Multipoint Transceiver

DS485 Low Power RS-485/RS-422 Multipoint Transceiver Low Power RS-485/RS-422 Multipoint Transceiver General Description The DS485 is a low-power transceiver for RS-485 and RS- 422 communication. The device contains one driver and one receiver. The drivers

More information

E. A. MENDOZA, J. PROHASKA, C. KEMPEN, S. SUN and Y. ESTERKIN

E. A. MENDOZA, J. PROHASKA, C. KEMPEN, S. SUN and Y. ESTERKIN Fully Integrated Miniature Multi-Point Fiber Bragg Grating Sensor Interrogator (FBG-Transceiver TM ) System for Applications where Size, Weight, and Power are Critical for Operation E. A. MENDOZA, J. PROHASKA,

More information

TE Connectivity Data Communications Product Guide:

TE Connectivity Data Communications Product Guide: TE Connectivity Data Communications Product Guide: Providing technology leadership for your next-generation high-speed architectural platforms Success in today and tomorrow s data communications relies

More information

RXT-1200 Modular Test Platform

RXT-1200 Modular Test Platform CWDM and DWDM Testing RXT-1200 Modular Test Platform Optical Spectrum/Channel Analyzer for CWDM and DWDM Networks Using superior micro-optic design and MEMS tuning technology, the RXT-4500 OSA module measures

More information

New silicon photonics technology delivers faster data traffic in data centers

New silicon photonics technology delivers faster data traffic in data centers Edition May 2017 Silicon Photonics, Photonics New silicon photonics technology delivers faster data traffic in data centers New transceiver with 10x higher bandwidth than current transceivers. Today, the

More information

SO-SFP-16GFC-ER-Dxxxx

SO-SFP-16GFC-ER-Dxxxx SO-SFP-16GFC-ER-Dxxxx SFP+, 16G/8G/4G FC, 10G FC, 10GBASE-ER, DWDM (ITU 921 to 960), SM, DDM, 40km, LC SO-SFP-16GFC-ER-Dxxxx Overview The SO-SFP-16GFC-ER-Dxxxx fiber optical SFP+ (small form pluggable)

More information

Project Overview. Innovative ultra-broadband ubiquitous Wireless communications through terahertz transceivers ibrow

Project Overview. Innovative ultra-broadband ubiquitous Wireless communications through terahertz transceivers ibrow Project Overview Innovative ultra-broadband ubiquitous Wireless communications through terahertz transceivers ibrow Presentation outline Key facts Consortium Motivation Project objective Project description

More information

NG-TRx BOARD MOUNT TRANSCEIVER

NG-TRx BOARD MOUNT TRANSCEIVER NG-TRx BOARD MOUNT TRANSCEIVER PDS-297 Amphenol provides a high performance ruggedized board mount transceiver, that is specifically developed for NAVAIR/ NAVSEA harsh environment applications capable

More information

SO-QSFP28-4xSFP28-AOCxM

SO-QSFP28-4xSFP28-AOCxM SO-QSFP28-4xSFP28-AOCxM QSFP28 to 4xSFP28, 100G, AOC, xm OVERVIEW The SO-QSFP28-4xSFP28-AOCxM is a parallel active optical cable (AOC) which overcomes the bandwidth limitation of traditional copper cables.

More information

1.5-MICRON SOLID-STATE PULSED LASERS DIODE-PUMPED SOLID-STATE (DPSS) 1534-NM PULSED MICRO-LASERS

1.5-MICRON SOLID-STATE PULSED LASERS DIODE-PUMPED SOLID-STATE (DPSS) 1534-NM PULSED MICRO-LASERS DIODE-PUMPED SOLID-STATE (DPSS) 1534-NM PULSED MICRO-LASERS 1.5-MICRON SOLID-STATE PULSED LASERS EAR 99: NOT ITAR CONTROLLED FEATURES Eyesafe: Class-1/1M High Peak Power: to 115 kw Excellent Beam Quality:

More information

Silicon photonics on 3 and 12 μm thick SOI for optical interconnects Timo Aalto VTT Technical Research Centre of Finland

Silicon photonics on 3 and 12 μm thick SOI for optical interconnects Timo Aalto VTT Technical Research Centre of Finland Silicon photonics on 3 and 12 μm thick SOI for optical interconnects Timo Aalto VTT Technical Research Centre of Finland 5th International Symposium for Optical Interconnect in Data Centres in ECOC, Gothenburg,

More information

DATASHEET G Data Center Interconnect (DCI) 100G Embedded DWDM (DWDM transciever in to Ethernet switch with no OEO transponder requirement)

DATASHEET G Data Center Interconnect (DCI) 100G Embedded DWDM (DWDM transciever in to Ethernet switch with no OEO transponder requirement) SO-QSFP28-PAM4-Dxxxx QSFP28, 100GBase, PAM4, DWDM, SM, DDM, 80km*, LC OVERVIEW The SO-QSFP28-PAM4-Dxxxx is a pluggable QSFP28 DWDM transceiver designed for high capacity 100 Gigabit Ethernet (100GbE) Data

More information

MXD6240/6241AU. Autonomous 8-Angle Tip-Over Sensor with High Vibration Immunity

MXD6240/6241AU. Autonomous 8-Angle Tip-Over Sensor with High Vibration Immunity Autonomous 8-Angle Tip-Over Sensor with High Vibration Immunity MXD6240/6241AU FEATURES 8 Pin-programmable angle thresholds Single-wire digital output Fully autonomous- no uc required Built-in self-test

More information

Innovative ultra-broadband ubiquitous Wireless communications through terahertz transceivers ibrow

Innovative ultra-broadband ubiquitous Wireless communications through terahertz transceivers ibrow Project Overview Innovative ultra-broadband ubiquitous Wireless communications through terahertz transceivers ibrow Mar-2017 Presentation outline Project key facts Motivation Project objectives Project

More information

Active Optical. Products

Active Optical. Products Active Optical Products Low Rider Transceivers The Cinch Connectivity Solutions, Stratos Brand Low Rider Optical Transceiver family are designed specifically with the rugged Mil-Aero and Industrial markets

More information

Index. Cambridge University Press Silicon Photonics Design Lukas Chrostowski and Michael Hochberg. Index.

Index. Cambridge University Press Silicon Photonics Design Lukas Chrostowski and Michael Hochberg. Index. absorption, 69 active tuning, 234 alignment, 394 396 apodization, 164 applications, 7 automated optical probe station, 389 397 avalanche detector, 268 back reflection, 164 band structures, 30 bandwidth

More information

Lockheed Martin 2016 LOCKHEED MARTIN CORPORATION. ALL RIGHTS RESERVED

Lockheed Martin 2016 LOCKHEED MARTIN CORPORATION. ALL RIGHTS RESERVED Lockheed Martin 1 Helping the Future Arrive 2 Our People 115,000 Employees 60,000 Scientists & Engineers 500+ U.S. Facilities Operating in 70 Countries 3 Lockheed Martin 100+ Years of Accelerating Tomorrow

More information

Beyond Multimode Duplex FOHEC 2010

Beyond Multimode Duplex FOHEC 2010 Beyond Multimode Duplex FOHEC 2010 V 1d3 www.cotsworks.com Slide 1 Rugged Fiber Optics = Expensive Rugged fiber networks in aircraft and vehicles is often multimode cable based Network costs are high due

More information

High Efficient Heat Dissipation on Printed Circuit Boards. Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH

High Efficient Heat Dissipation on Printed Circuit Boards. Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH High Efficient Heat Dissipation on Printed Circuit Boards Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH m.wille@se-pcb.de Introduction 2 Heat Flux: Q x y Q z The substrate (insulation)

More information

Silicon photonics integration roadmap for applications in computing systems

Silicon photonics integration roadmap for applications in computing systems Silicon photonics integration roadmap for applications in computing systems Bert Jan Offrein Neuromorphic Devices and Systems Group 2016 IBM Corporation Outline Photonics and computing? The interconnect

More information

Specialized Integrated Hybrid Modules, Assemblies, Subsystems and Systems. RF and Microwave Components

Specialized Integrated Hybrid Modules, Assemblies, Subsystems and Systems. RF and Microwave Components Since its founding Renaissance Electronics Corporation (REC) has been dedicated to the advancement of RF, microwave and millimeter wave technologies, innovative component design and development of sophisticated

More information

Continuous Wave SSPAs. Version 1.6

Continuous Wave SSPAs. Version 1.6 Continuous Wave SSPAs Version 1.6 Date: Jun 1, 2015 CONTENT Product Overview... 3 FACTS ON THE TECHNOLOGY... 4 SOLID-STATE POWER AMPLIFIERS... 5 ABOUT NANOWAVE... 8 RF Components and Subsystems NANOWAVE

More information

SY88992L. Features. General Description. Applications. Markets. Typical Application. 3.3V, 4.25Gbps VCSEL Driver

SY88992L. Features. General Description. Applications. Markets. Typical Application. 3.3V, 4.25Gbps VCSEL Driver 3.3V, 4.25Gbps VCSEL Driver General Description The is a single supply 3.3V, low power consumption, small-form factor VCSEL driver ideal for use in datacom applications; Ethernet, GbE (Gigabit Ethernet),

More information

PROLABS QSFP-4x10G-AC7M-C QSFP+ to 4 SFP+ Active Copper Cable Assembly

PROLABS QSFP-4x10G-AC7M-C QSFP+ to 4 SFP+ Active Copper Cable Assembly PROLABS QSFP-4x10G-AC7M-C QSFP+ to 4 SFP+ Active Copper Cable Assembly QSFP-4x10G-AC7M-C Overview PROLABS s QSFP-4x10G-AC7M-C QSFP+ (Quad Small Form-factor Pluggable Plus) to 4 SFP+ Active Copper are suitable

More information

Presentation Overview

Presentation Overview Low-cost WDM Transceiver Technology for 10-Gigabit Ethernet and Beyond Brian E. Lemoff, Lisa A. Buckman, Andrew J. Schmit, and David W. Dolfi Agilent Laboratories Hot Interconnects 2000 Stanford, CA August

More information

Pluggable Transceivers

Pluggable Transceivers DATA SHEET Pluggable Transceivers Industry-Standard Pluggable Transceivers and Direct Attach Cables BENEFITS BUSINESS ALIGNMENT Standards-based technology. Flexible interface options for 100Mbs, 1Gbps,10Gbps,

More information

MAPPER: High throughput Maskless Lithography

MAPPER: High throughput Maskless Lithography MAPPER: High throughput Maskless Lithography Marco Wieland CEA- Leti Alterative Lithography workshop 1 Today s agenda Introduction Applications Qualification of on-tool metrology by in-resist metrology

More information

FIBERQUAD HIGH PERFORMANCE RUGGEDIZED QUADRAX CONTACT

FIBERQUAD HIGH PERFORMANCE RUGGEDIZED QUADRAX CONTACT FIBERQUAD HIGH PERFORMANCE RUGGEDIZED QUADRAX CONTACT DESCRIPTION Amphenol provides a high performance ruggedized Quadrax contact, known as FiberQuad, that embeds a fiber optic transmitter or receiver

More information

Ultrafast Laser Solutions for Microprocessing

Ultrafast Laser Solutions for Microprocessing Ultrafast Laser Solutions for Microprocessing Dr. Kurt Weingarten Lumentum Switzerland Ruetistrasse 12 Schlieren 4-November-2016 Lumentum Switzerland AG Founded in 1995 as Time-Bandwidth Products, a spinoff

More information

Advanced Packaging Equipment Solder Jetting & Laser Bonding

Advanced Packaging Equipment Solder Jetting & Laser Bonding Advanced Packaging Equipment Solder Jetting & Laser Bonding www.pactech.comw.pactech.com PacTech Packaging Technologies Pioneering in laser solder jetting technologies since 1995 Our mission is to reshape

More information

VePAL UX400 Universal Test Platform

VePAL UX400 Universal Test Platform CWDM and DWDM Testing VePAL UX400 Universal Test Platform Optical Spectrum/Channel Analyzer for CWDM and DWDM Networks Using superior micro-optic design and MEMS tuning technology, the UX400 OSA module

More information

A 3.9 ns 8.9 mw 4 4 Silicon Photonic Switch Hybrid-Integrated with CMOS Driver

A 3.9 ns 8.9 mw 4 4 Silicon Photonic Switch Hybrid-Integrated with CMOS Driver A 3.9 ns 8.9 mw 4 4 Silicon Photonic Switch Hybrid-Integrated with CMOS Driver A. Rylyakov, C. Schow, B. Lee, W. Green, J. Van Campenhout, M. Yang, F. Doany, S. Assefa, C. Jahnes, J. Kash, Y. Vlasov IBM

More information

OPERATING MANUAL VOLTAGE CONTROLLED OSCILLATOR MODEL NUMBER: 21XXX-YYY-ZAMVCO DOCUMENT NUMBER: 51A18412A

OPERATING MANUAL VOLTAGE CONTROLLED OSCILLATOR MODEL NUMBER: 21XXX-YYY-ZAMVCO DOCUMENT NUMBER: 51A18412A OPERATING MANUAL VOLTAGE CONTROLLED OSCILLATOR MODEL NUMBER: 21XXX-YYY-ZAMVCO DOCUMENT NUMBER: 51A18412A This Operating Manual is for use with Variable Frequency AOM Drivers with model numbers: XXX = The

More information

Wavelength (nm) (m) ( o C) SPM-2100AWG 10.3 SR / SW 300 / 82 / 33* 850 VCSEL SFP+ with DMI -40 to 85 Yes

Wavelength (nm) (m) ( o C) SPM-2100AWG 10.3 SR / SW 300 / 82 / 33* 850 VCSEL SFP+ with DMI -40 to 85 Yes / SPM-2100BWG / SPM-2100AWG (RoHS Compliant) 3.3V / 850 nm / 10.3 Gb/s Digital Diagnostic SFP+ LC Multi-Mode TRANSCEIVER ********************************************************************************************************************************************************************

More information

Brief Introduction of Sigurd IC package Assembly

Brief Introduction of Sigurd IC package Assembly Brief Introduction of Sigurd IC package Assembly Content Package Development Trend Product Brief Sawing type QFN Representative MEMS Product LGA Light Sensor Proximity Sensor High Yield Capability Low

More information

Amphenol CTF-4G-4TXRX Four Bi-Directional Channel Fiber Optic Media Converter

Amphenol CTF-4G-4TXRX Four Bi-Directional Channel Fiber Optic Media Converter 1 Four Bi-Directional Channel Fiber Optic Media Converter The CTF-4G-4TXRX Media Converter is an integrated, standalone, convection cooled, and rugged fiber to copper and copper to fiber converter for

More information

TELECOMMUNICATIONS. Y-Packet Y-Trunk Y-Split Y-Haul

TELECOMMUNICATIONS. Y-Packet Y-Trunk Y-Split Y-Haul TELECOMMUNICATIONS Y-Packet Y-Trunk Y-Split Y-Haul > 20 000 microwave radios have been produced for last 10 years > 100 international partners > 50 countries all over the world receive Micran's products

More information

gem TECHNICAL DATA SHEET CW 532nm laser Extremely low noise Power from 50mW - 750mW 532nm high spec OEM laser

gem TECHNICAL DATA SHEET CW 532nm laser Extremely low noise Power from 50mW - 750mW 532nm high spec OEM laser gem CW 532nm laser Extremely low noise Power from 50mW - 750mW TECHNICAL DATA SHEET gem The high specification CW 532nm laser Overview The gem is the jewel in the Laser Quantum collection. Its small and

More information

Trusted in High-Reliability Timing and Frequency Control

Trusted in High-Reliability Timing and Frequency Control Frequency and Timing Space Products Trusted in High-Reliability Timing and Frequency Control Strong Space Heritage Superior Reliability and Precision Frequency and Timing Solutions Trusted in High Reliability

More information

1000BASE-T SFP Copper Transceiver Hot Pluggable, Cat-5 UTP Cable, 100m

1000BASE-T SFP Copper Transceiver Hot Pluggable, Cat-5 UTP Cable, 100m Mini-GBIC Module INEO-MD-MSFP-TE 1000BASE-T SFP Copper Transceiver Hot Pluggable, Cat-5 UTP Cable, 100m tactio TM s INEO-MD-MSFP-TE 1000BASE-T copper SFP transceiver is high performance, cost effective

More information

An Example Design using the Analog Photonics Component Library. 3/21/2017 Benjamin Moss

An Example Design using the Analog Photonics Component Library. 3/21/2017 Benjamin Moss An Example Design using the Analog Photonics Component Library 3/21/2017 Benjamin Moss Component Library Elements Passive Library Elements: Component Current specs 1 Edge Couplers (Si)

More information

Laminate Based Fan-Out Embedded Die Technologies: The Other Option

Laminate Based Fan-Out Embedded Die Technologies: The Other Option Laminate Based Fan-Out Embedded Die Technologies: The Other Option Theodore (Ted) G. Tessier, Tanja Karila*, Tuomas Waris*, Mark Dhaenens and David Clark FlipChip International, LLC 3701 E University Drive

More information

CBT-90-UV-405 LEDs. CBT-90-UV-405 CBT-120 Product Datasheet. Features: Table of Contents. Applications

CBT-90-UV-405 LEDs. CBT-90-UV-405 CBT-120 Product Datasheet. Features: Table of Contents. Applications CBT-9-UV-45 CBT-2 Product Datasheet Datasheet CBT-9-UV-45 LEDs Table of Contents Technology Overview...2 Optical & Electrical Characteristics...3 Features: >6.5 W of optical power from 4 nm to 4 nm. High

More information

Company Profile. (MEMS) technology, along with our

Company Profile. (MEMS) technology, along with our Component Solutions for FTTx Company Profile NeoPhotonics is a leading provider of photonic integrated circuitbased modules, components and subsystems for use in optical communications networks. Our products,

More information

MICROELECTRONICS ASSSEMBLY TECHNOLOGIES. The QFN Platform as a Chip Packaging Foundation

MICROELECTRONICS ASSSEMBLY TECHNOLOGIES. The QFN Platform as a Chip Packaging Foundation West Coast Luncheon January 15, 2014. PROMEX PROMEX INDUSTRIES INC. MICROELECTRONICS ASSSEMBLY TECHNOLOGIES The QFN Platform as a Chip Packaging Foundation 3075 Oakmead Village Drive Santa Clara CA Ɩ 95051

More information

CMOS Quad Rail-to-Rail I/O Op Amp DESCRIPTION: FEATURES: Logic Diagram

CMOS Quad Rail-to-Rail I/O Op Amp DESCRIPTION: FEATURES: Logic Diagram 6484 CMOS Quad Rail-to-Rail I/O Op Amp V+ IN+A IN+D IN-A OUT A OUT D IN-D V- IN+B OUT B OUT C IN+C IN-B Logic Diagram IN-C FEATURES: Rad-Pak technology-hardened against natural space radiation Total dose

More information

SANway Optoelectronics technology Corporation Tel: Fax: Website :www.sanoc.com.tw

SANway Optoelectronics technology Corporation Tel: Fax: Website :www.sanoc.com.tw Description General The transceiver from SANOC is small form factor pluggable module for serial optical data Communications applications specify of Gigabit Ethernet IEEE802.3z/D5 and Fiber Channel. This

More information