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1 Description General The transceiver from SANOC is small form factor pluggable module for serial optical data Communications applications specify of Gigabit Ethernet IEEE802.3z/D5 and Fiber Channel. This module is designed for single mode fiber with cost effective and high performance by using 1570 nm transmitter and 1510 nm receiver. It is with the SFP 20-pin connector to allow hot plug capability. Transmitter Section The transmitter consists of a high-performance 1570 nm DFB laser in the bi-directional optical subassembly (BOSA), which is housed within a metal package. In addition, this component is also class 1 laser compliant with according to International Safety Standard IEC-825 Receiver Section The receiver contain of an integrated planar InGaAs PIN photodiode coupled to a high sensitivity transimpedance amplifier (TIA) in an BOSA. This BOSA combination is mated to a post amplifier IC that provides the post amplification and SD (Signal Detect) indication circuit, which provides LVTTL logic low state output when an unusable input optical signal level is detected. Features Single V power Supply Small Form Factor Pluggable MSA Compliant. PECL Differential Inputs and Output TTL Signal Detect Indicator. For Single Mode Applications LC Simplex Connector Class 1 Laser International Safety Standard IEC 825 Compliant Temperature Ranges: 0 to +70 Bi-directional Linking Distance Up to 80 km. RoHS Compliant Applications Bridges/Routers/intelligent hub and concentrators Gigabit Ethernet / Fiber Channel Storage Area Network Performance Specifications Absolute Maximum Ratings Supply Voltage V CC 0-5 V Storage Temperature T S Operating Temperature T OP 0-70 Lead Soldering Limits T SOLD /10 /sec General Specifications s Data Rate B Mbps Supported Link Length on 9/125μm SMF L Km

2 Δ SANOC Bi-directional SFP Transceiver Optical and Electrical Characteristics Transmitter Electrical Characteristics Supply Voltage V CC V Supply Current I CC ma Data Differential Input Voltage V in, pp mv Disable Input Voltage V IL - V CC V Enable Input Voltage V IH - V CC V Transmitter Optical Characteristics Output Optical Power P O dbm Center Wavelength λ C nm Spectral Width (RMS) λ nm Optical Rise Time (10%-90%) t r ns Optical Fall Time (10%-90%) t f ns Extinction Ratio ER db Receiver Electrical Characteristics Supply Voltage V CC V Supply Current I CC ma Data Differential Output Voltage V out, pp mv Data Output Rise Time (10%-90%) t r ns Data Output Fall Time (10%-90%) t f ns Receiver Optical Characteristics Maximum Receiver Power P in dbm Receiver Sensitivity P S dbm Optical Center Wavelength λ C nm Signal Detect-Asserted P A dbm avg. Signal Detect-Deasserted P D dbm avg. Signal Detect-Hysteresis P A -P D db

3 Ordering Information S K A T O O (No Stainless Plate) / I (Interior-Mounting Stainless Plate) / E (Exterior-Mounting Stainless Plate) P (PECL) / T (TTL) A (3.3V) / B (5V) Distance 80:80 km Bandwidth 12:1.25 Gbps Wavelength 57:Tx-1570nm Rx-1510nm K:Bi-directional LC SFP SANOC Function Diagram:

4 SFP to Host Connector Pin Assignment: As the is inserted, first contact is made by the housing ground shield. Discharging any potentially component-damaging static electricity. Ground pins engage next and are followed by Tx and Rx power supplies. Finally, signal lines are connected. Pin functions and sequencing are listed in next Table ENGAGEMENT SEQUENCE V EE T V EE T TX - TX FAULT TX + TX DISABLE V EE T MOD-DEF(2) V CC T MOD-DEF(1) V CC R MOD-DEF(0) RATE SELECT RX + LOS RX - Power Coupling: The L1 and L2 can use Ferrite Bead (BLM11A102S) or inductor (4.7uH)

5 Pin Assignment Pin Description Pin Symbol Function Description 1 T GND Transmit Ground 2 TX_FAULT Transmit Fault 3 TX_DISABLE Transmit Disable 4 MOD_DEF(2) SDA Serial Data Signal 5 MOD_DEF(1) SCL Serial Clock Signal 6 MOD_DEF(0) TTL Low 7 RATE SELECT Open Circuit 8 RX_LOS Receiver Loss of Signal, TTL High, open collector 9 R GND Transmitter Ground 10 R GND Transmitter Ground 11 R GND Receiver Ground 12 RX- Receiver Data Bar, Differential PECL, ac coupled 13 RX+ Receiver Data, Differential PECL, ac coupled 14 R GND Receiver Ground 15 V CCR Receiver Power Supply 16 V CCT Transmitter Power Supply 17 T GND Transmitter Ground 18 TX+ Transmit Data, Differential PCEL, ac coupled 19 TX+ Transmit Data, Differential PCEL, ac coupled 20 T GND Transmitter Ground

6 Package Outline Drawing Dimension (unit:mm) RoHS Reference Material Classify Heavy Metals Brominated Organic Compounds Substance Reference Standard Analysis Equipment Lead (Pb)/ Lead Compounds 2002/95/EC < 1000 ppm US EPA 3050B ICP-AES Cadmium (Cd)/ EN /95/EC < 100 ppm Cadmium Compounds 91/338/EEC ICP-AES Mercury ( Hg ) / Mercury Compounds 2002/95/EC < 1000 ppm US EPA 3052 ICP-AES Hexavalent-Chromium( US EPA 3060A 2002/95/EC < 1000 ppm Cr6+)Compounds & 7196A UV-VIS PolyBrominated US EPA 3540 & 2002/95/EC < 1000 ppm Biphenyls (PBB) 3550 GC/MS PolyBromo Diphenyl US EPA 3540 & 2002/95/EC < 1000 ppm Ethers(PBDE) 3550 GC/MS

7 Qualification Information Heading Test Conditions Sample Size Reference Mechanical Shock 5 times/axis G, 1.0ms Method 2002 Vibration 20G, 20Hz HZ 11 4min/cycle,4cycles/axis Method 2007 Mechanical Thermal Shock Delta T= & Physical Method 2003 Solderability - 11 Method 2007 Fiber Pull 1Kg ; 3times ; 5sec 11 Endurance Special Test Accelerated Aging 85, 5000hrs 25 High Temperature Storage 85, 2000hrs 11 Low Temperature Storage -40, 2000hrs 11 Temperature Cycling 500 cycles. 11 Cyclic Moisture Resistance 10 cycles 11 40, 95% Damp Heat RH, 1344hrs 11 Internal Moisture <5000ppm water vapor 11 Flammability - - ESD Threshold - 6 Section 5.18 Section 5.20 Section 5.23 MIL-STD-202 Method 103 Method 1018 TR357 Sec Section 5.22