Innovations in Photonic Integration Platforms

Transcription

1 Innovations in Photonic Integration Platforms September 20, 20

2 Burgeoning Growth Demand Disruptive Technology Video content is fast becoming a larger percentage of total internet traffic 50% Video services require exponential increase in bandwidth Lowest cost/bit 22% Need Disruptive technology to enable competitive solutions 2

3 Exponential Growth in Computing and Data Centers Interconnect Bandwidth Requirements must scale with System Performance Requires Exponential Increase in Bandwidth at all Levels of the System 3

4 Metrics for Efficient Interconnects Electrical Interconnect Lane Rate 0G 5G G 25G??? Interc connect G G 25M 250M G 622M 3.25G 5G G System Performance Dependent on Interconnect Bandwidth Interconnect Efficiency Metrics: Performance, Cost, power Most efficient interconnect metrics are achieved when electrical lane rate and optical lane rate are matched 4

5 0G Architectures Across the Network Photonic integrated solutions Ultra Long Haul DWDM N x G (RZ/NRZ) N x 40 G (DQPSK ~ 2 x 20G) N x 0 G (DP QPSK ~ 4 x 25G) Long Haul Metro New 40G and 0G links x G 40Km SMF DWDM = N x G DWDM and 40km: SMF 0G = 4 x 25 G 0 GbE 40G = 4 x G IEEE 802.3ba 0m: MMF 0G = x G 40G = 4 x G Intelligent IntegrationTM 5 x G PIC x 40 G 5x0G Access x G CFP module Km SMF x G VCSEL over MMF CXP, Snap2

6 0G Client System Implementation All 0G Client optical interfaces based on parallel architecture xg 4x25G Parallel implementation renews interest in photonic integration Experience with Photonic integration implementations can help determine optimal product roadmap for parallel architectures Santur s EPIC platform combines hybrid AND monolithic integration 6 to speed up availability within deployment constraints km CFP based on xg hybrid PIC implementation Extensions to longer reach, DWDM and CWDM applications

7 Photonic Integrated Platform x.3g CDR CAUI OTU4 OU 0GE Driver TIA DFB Control PD Mux. Demux Km SMF 7

8 Photonic Integrated Platform x.3g CDR CAUI OTU4 OU 0GE Driver TIA DFB Control PD Mux. Demux Km SMF 8

9 Photonic Integrated Platform Hybrid Integration x.3g CDR CAUI OTU4 OU 0GE Driver TIA DFB Control PD Mux. Demux Km SMF Hybrid Integration 9

10 Photonic Integrated Platform Electronics Hybrid Integration x.3g CDR CAUI OTU4 OU 0GE Driver TIA DFB Control PD Mux. Demux Km SMF Electronics Hybrid Integration

11 Photonic Integrated Platform Hybrid Integration Electronics g x.3g CAUI Driver DFB Control Mux. Km CDR OTU4 ASIC/ FPGA xg PD TIA Demux SMF OU 0GE FPGA Hybrid Integration Electronics Integration Electronics

12 Approach to Photonic Integration Monolithic integration using InP for new N x M Gb/s applications Products based on monolithic integration xg monolithic PICs 4xG Monolithic PICs x CDR.3G OTN GE CAUI Driver TIA Laser Control PD Mux. Demux Km SM MF Hybrid integration to combine optimal technologies Deliver high performance at lowest cost Core technologies Parallel Laser s [DFBs, EMLs] Other InP Elements [PDs, MZM] Silicon Photonics [PLC, MEMs] Electronics SFP+ Serdes SFP+ Serdes 4 4x.3G nppi 4 4 I2C Driver TIA Laser Monitors/ diagnostics PD Mux. Demux -Km SMF 2

13 WDM Overview Santur s single and multi element DFBs x G DML Santur s DFB laser technology High efficiency BH design Phase shifted DFB lasers guarantee single mode High power 550 nm DML 2 X CW tunable DFB array 20 µm Relative test yield 20 35mW C/L DFB Narrow Linewidth Laser LR WDM DFB array Yield a.u. 2 mm 0 GbE LR km transmitter single element G DML 2 x CW tunable DFB array x G WDM DFB array 3

14 LR Hybrid PIC Components WDM PIC Architecture Parallel Laser Mux Demux Electronics - Element DFB Centered at 550 8nm spacing Similar to Tunable array with over 300K shipped SMSR > 45dB 0 - Based on Silicon with Echelle Grating Insertion loss 3dB or lower Based on Silicon with Eschelle Grating Less than 20dB Crosstalk Insertion loss 3dB or lower Monolithic TIA Monolithic PD Wavelength, nm Facet power, mw C 75C DFB Driver Current, ma 4

15 Future Hybrid PICs Mux/demux designs mature for such applications New array development:. 40 km transmission using DML + EDC works across C band with linear TIA+ APD receiver 40km 40 km (over C band) using DML array BER.E-03.E-04.E-05 E-06.E E E E E-.E- w/ EDC 0 km.e P_received (dbm) 2. LR DWDM laser array with integrated heaters DWDM a.u. power(db) Spectra from 4 x G DWDM chip 60 LR DWDM DML chip Spectra from x version Wavelength, nm 3. CWDM (4 x G) DML 4 channel tuned together on 0Ghz spacing (+/ 4GHz) xG DML CWDM Powe er (dbm) X DML chip Wavelength (nm)

16 Conclusion Hybrid PICs such as Santur s EPIC platform are suited to meet the parallel roadmap to address high bandwidth applications Monolithic N = laser and detector PICs available today! Hybrid options for optics and mux/demux available Lower fixed cost, while delivering lower $/Gb vs. discrete LR CFP uses photonic integration to reduce $/Gb Monolithic integration of core functions on separate chips Re use existing low cost G electronics and packaging infrastructure Extensions to hybrid PIC platform support roadmap to 400G Next generation packaging to deliver lower $/Gb 6