Extending The Life Of 200mm Fabs And The Re-use of Second Hand Tools

Transcription

1 Extending The Life Of 200mm Fabs And The Re-use of Second Hand Tools Gareth Bignell, FE Equipment Procurement Director SEMICON Europa 2012

2 Presentation Summary 2 An introduction to STMicroelectronics The importance of Moore s Law technologies Opportunities in Moore than Moore Re-using existing 200mm assets Observations and requirements for sourcing second hand tools Conclusions Presentation Title

3 About ST A global semiconductor leader The largest European semiconductor company 2011 revenues of $9.73B (1) Approx. 53,000 employees worldwide (1) 12,000 people working in R&D 12 manufacturing sites Listed on New York Stock Exchange, Euronext Paris and Borsa Italiana, Milano (1) Including ST-Ericsson, a 50:50 joint venture with Ericsson

4 Q1 12 revenues by product segments 4 Wireless Automotive (APG) 14% 19% Digital 17% 13% 38% Power Discrete (PDP) Analog, MEMS & Microcontrollers (AMM) *See appendix

5 Technology Competitive Advantage «Moore s Law»: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm «More than Moore»: Diversification Analog / RF Passives HV Power SoC Information processing Digital Content System-on-chip SiP Sensors, Actuators Interacting with people & environment Non-digital content System-in-package Biochips Beyond CMOS: Quantum Computing, Molecular Electronics, Spintronics VLSI PLATFORM

6 Leader in Moore s Law Technologies Prototyping start 2011/ / /16 CMOS LOGIC 40nm/28/28FDSOI 20nm/20FDSOI 14nm CMOS Analog Mixed Signal/RF 55/40nm 28nm 20nm CMOS Embedded non-volatile memory* 80/55nm 40nm 28nm * Logic with Embedded Memories

7 And More than Moore Technologies Prototyping start 2011/ / /16 BIPOLAR CMOS DMOS 160nm/110 90nm 65nm MEMS (epi-poli thickness/aspect ratio) 22um/AR 1:25 25um/AR1:30 40um/AR1:35 POWER& DISCRETE -0.4 m -trench gate -thin wafer -laser annealing -thick metal m -ultra-thin wafer -very deep trench -multi-epi -silicon carbide (SiC) -0.2 m -TSV -Gallium Nitride (GaN)

8 Manufacturing France (Crolles, Rousset, Tours) Italy (Agrate, Catania) Morocco Malta China (Shenzhen, Longgang) Malaysia Philippines 12 Manufacturing Sites: 6 Front-end Sites ~130,000 8 equivalent wafers per week >100,000 m 2 cleanroom area worldwide 6 Back-end Sites ~50 Million parts per day Singapore Access this map:

9 Wafer Size and Technology Divergence Moore s law drives relentless CMOS miniaturization and increasing wafer size More than Moore gives extended life to existing fabs Moore s Law 2018(?) 450mm 14nm,10, 7,5nm. 9 - Innovative technologies - Depreciated assets - Established know how -Add selected tools -Capability -Capacity 1980 s <150mm 10µ to 1µ 1990 s 200mm 0.5µ to 90nm 2000 s 300mm 120nm to 10nm More than Moore Trailing edge 150/200 starting 300mm Presentation Title

10 Fab Evolution Towards Derivative Technologies Use existing tool set Many process steps remain essentially similar 10 Modify/upgrade existing tool set Example: Convert an existing wet bench to a new chemistry mix Re-use tools from other ST sites Example: decomissioned front side PVD tools no longer state of the art re-used as backside metalisation Purchase second hand tools Lowest cost option, ST led this trend starting in the 90s with 200mm and 300mm during last few years. Purchase new tools New capabilities for derivative technology where existing tools don t exist Adapt/optimise fab layout and facilities Presentation Title

11 C O S T Used Equipment Sources 11 Source Refurbished 'As New' OEM supplied Turn Key solution Refurbisher/Broker As is Where is Broker with 3rd party Upgrade/modify/install As is Where is Install by Fab engineers Challenges Not low cost Lead times Equipment 'too good' Availability of donor tool Cost close to OEM? Donor tool quality can refurbisher source parts? Internal skill set Tool compatibility Number of failed parts unknown R I S K Presentation Title

12 How To Select Equipment Sources There is no one fits all approach Example 1. DuV scanner for ST Rousset 200mm 90nm fab 12 Parameters to consider Low availability of good donor tools Fab does not have skill set to install/start up/qualify Very high quality requirement Automotive microcontrollers with envm Logical solution - OEM or experienced Turn Key provider Example 2. Oxide measurement tool for ST Catania Smart Power fab Parameters to consider High cost sensitivity for project Installed base exists with skills set internally Higher risk acceptable because tool is adding to multiple tool existing capacity Logical solution As is where is broker tool Presentation Title

13 How To Select Equipment Sources Fab expansions and fab conversions When considering larger projects involving multiple tools. A more global approach is needed. Speed - Industry product cycles are short, windows of opportunity dissapear Quality - Weakest link effect one tool failing can impact whole project Cost - Trailing edge technologies have lower margins/ strong competitors 13 Future for these larger projects is with service providers who can: Have access to high quality donor tools of multiple types Provide turn key solutions including refurbishment, upgrades, installation, qualification Lead times to deliver achieve wafer starts. Must be shorter. Project management from concept to production Options to cover warranty support parts and people Access to software Transport and storage facilities CE marking Speed Quality Cost Presentation Title

14 Continued life for 200mm Fabs Summary Derivatives, Power products and MEMS good fit with lower cost 200mm fabs Mature fabs with efficient manufacturing, quality and cost control embedded in the DNA of highly trained workforce Collaboration with research institutes such as CEA LETI 14 Need supply of high quality/lower cost equipment to compliment installed base Configurations/options adapted to requirements Short delivery leadtimes Fast first time right installations Parts and manpower support programs Key role for creative suppliers Adaption and evolution of tool supply programs OEMs Opportunities for second source suppliers to move beyond As is where is approach Presentation Title

15 Conclusions mm fabs still have a very long future! Trailing adge of Moores Law And derivatives, options, new ideas 300mm fabs will transition from leading edge to trailing edge Even 450mm will become trailing edge at some point! Additional equipment needed to complete tool sets Adding capability Adding capacity Second hand tools will continue to play major role Opportunties for OEMs to add new capabilities and value Opportunities for OEMs and second sources to provide high value, lower cost solutions Presentation Title

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