Characteristic Symbol Value (2) Unit R JC 92.0 C/W

Transcription

1 Freescale Semiconductor Technical Data Heterojunction Bipolar Transistor Technology (InGaP HBT) Broadband High Linearity Amplifier The is a general purpose amplifier that is internally input and output matched. It is designed for a broad range of Class A, small-- signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 4 to 36 MHz, such as cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small--signal RF. Features Frequency: MHz P1dB: MHz Small--Signal Gain: 2 9 MHz Third Order Output Intercept Point: 32 9 MHz Single Voltage Supply Internally Matched to 5 Ohms Cost--effective SOT--89 Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1, Units, 12 mm Tape Width, 7--inch Reel. Table 1. Typical Performance (1) Characteristic Small--Signal Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Power Compression Third Order Output Intercept Point Symbol 9 MHz 214 MHz 35 MHz Unit G p db IRL db ORL db P1dB dbm OIP dbm 1.,T A =25 C, 5 ohm system. Table 3. Thermal Characteristics Thermal Resistance, Junction to Case Case Temperature 123 C, 5.6 Vdc, 58 ma, no RF applied Table 2. Maximum Ratings Document Number: Rev. 9, 1/ MHz, 2 db 18.5 dbm InGaP HBT GPA SOT -89 Rating Symbol Value Unit Supply Voltage V CC 7 V Supply Current I CC 3 ma RF Input Power P in 1 dbm Storage Temperature Range T stg --65 to +15 C Junction Temperature T J 15 C Characteristic Symbol Value (2) Unit R JC 92. C/W 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to Select Documentation/Application Notes -- AN1955., , 212, 214. All rights reserved. 1

2 Table 4. Electrical Characteristics (V CC = 5.6 Vdc, 9 MHz, T A =25 C, 5 ohm system, in Freescale Application Circuit) Characteristic Symbol Min Typ Max Unit Small--Signal Gain (S21) G p 18 2 db Input Return Loss (S11) IRL db Output Return Loss (S22) ORL db Power 1dB Compression P1dB 18.5 dbm Third Order Output Intercept Point OIP3 32 dbm Noise Figure NF 4.1 db Supply Current I CC ma Supply Voltage V CC 5.6 V Table 5. Functional Pin Description Pin Number 1 RF in 2 Ground Pin Function 3 RF out /DC Supply Table 6. ESD Protection Characteristics Test Conditions/Test Methodology Human Body Model (per JESD 22--A114) Machine Model (per EIA/JESD 22--A115) Charge Device Model (per JESD 22--C11) Table 7. Moisture Sensitivity Level Class Test Methodology Rating Package Peak Temperature Unit Per JESD 22--A113, IPC/JEDEC J--STD C 1 2 Figure 1. Functional Diagram 2 A IV 3 2

3 5 OHM TYPICAL CHARACTERISTICS 25 I CC, COLLECTOR CURRENT (ma) G p, SMALL--SIGNAL GAIN (db) G p, SMALL--SIGNAL GAIN (db) T C =85 C -- 4 C 25 C f, FREQUENCY (GHz) Figure 2. Small -Signal Gain (S21) versus Frequency P out, OUTPUT POWER (dbm) Figure 4. Small -Signal Gain versus Output Power MHz 196 MHz 35 MHz 214 MHz 26 MHz 2 S11, S22 (db) P1dB, 1 db COMPRESSION POINT (dbm) S22 S f, FREQUENCY (GHz) Figure 3. Input/Output Return Loss versus Frequency f, FREQUENCY (GHz) 2.5 Figure 5. P1dB versus Frequency 21 1 khz Tone Spacing V CC, COLLECTOR VOLTAGE (V) f, FREQUENCY (GHz) Figure 6. Collector Current versus Collector Voltage OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) Figure 7. Third Order Output Intercept Point versus Frequency

4 5 OHM TYPICAL CHARACTERISTICS OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) IMD, THIRD ORDER INTERMODULATION DISTORTION (dbc) NF, NOISE FIGURE (db) f = 9 MHz 1 khz Tone Spacing V CC, COLLECTOR VOLTAGE (V) Figure 8. Third Order Output Intercept Point versus Collector Voltage OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) MTTF (YEARS) T, TEMPERATURE (_C) Figure 9. Third Order Output Intercept Point versus Case Temperature --7 f = 9 MHz 1 khz Tone Spacing P out, OUTPUT POWER (dbm) T J, JUNCTION TEMPERATURE ( C) Figure 1. Third Order Intermodulation Distortion versus Output Power NOTE: The MTTF is calculated with,i CC =58mA Figure 11. MTTF versus Junction Temperature ACPR, ADJACENT CHANNEL POWER RATIO (dbc) f, FREQUENCY (GHz) P out, OUTPUT POWER (dbm) Figure 12. Noise Figure versus Frequency Figure 13. Single -Carrier W -CDMA Adjacent Channel Power Ratio versus Output Power f = 9 MHz 1 khz Tone Spacing 8 Vdc Supply with 43 Ω Dropping Resistor V CC = 5.6 Vdc, f = 214 MHz Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth Input Signal PAR = 8.5 Probability(CCDF) 1 4

5 5 OHM APPLICATION CIRCUIT: 4-8 MHz V SUPPLY S21, S11, S22 (db) RF INPUT Z1 C1 Z2 Z1, Z5.347 x.58 Microstrip Z2.575 x.58 Microstrip Z3.172 x.58 Microstrip S21 S11 S22 DUT Figure 15. S21, S11 and S22 versus Frequency V CC f, FREQUENCY (MHz) Z3 Figure Ohm Test Circuit Schematic Table 8. 5 Ohm Test Circuit Component Designations and Values R1 L1 Z4 C1 C3 C2 C4 Z5 RF OUTPUT Z4.43 x.58 Microstrip PCB Getek Grade ML2C,.31, r =4.1 Figure Ohm Test Circuit Component Layout C5 R1 MMG3XX Rev 2 Part Description Part Number Manufacturer C1, C2, C3.1 F Chip Capacitors C63C13J5RAC Kemet C4 1 pf Chip Capacitor C63C12J5RAC Kemet C5 47 pf Chip Capacitor C85C47J5RAC Kemet L1 47 nh Chip Inductor BK2125HM471--T Taiyo Yuden R1 8.2 Ω Chip Resistor RK73B2ATTE8R2J KOA Speer Table 9. Supply Voltage versus R1 Values Supply Voltage V R1 Value Note: To provide V CC = 5.6 Vdc and I CC = 58 ma at the device. L1 C5 C4 C3 C2 5

6 5 OHM APPLICATION CIRCUIT: 8-36 MHz V SUPPLY S21, S11, S22 (db) RF INPUT S22 Z1 S21 S f, FREQUENCY (MHz) Figure 18. S21, S11 and S22 versus Frequency C1 Z2 Z1, Z5.347 x.58 Microstrip Z2.575 x.58 Microstrip Z3.172 x.58 Microstrip Figure Ohm Test Circuit Schematic Table 1. 5 Ohm Test Circuit Component Designations and Values DUT V CC Z3 R1 L1 Z4 C3 C1 C2 C4 Z5 RF OUTPUT Z4.43 x.58 Microstrip PCB Getek Grade ML2C,.31, r =4.1 C5 R1 MMG3XX Rev 2 L1 C5 C4 C3 Figure Ohm Test Circuit Component Layout Part Description Part Number Manufacturer C1, C2 39 pf Chip Capacitors C85C39J5RAC Kemet C3.1 F Chip Capacitor C63C13J5RAC Kemet C4 1 pf Chip Capacitor C63C12J5RAC Kemet C5 47 pf Chip Capacitor C85C47J5RAC Kemet L1 56 nh Chip Inductor HK16856NJ--T Taiyo Yuden R1 8.2 Ω Chip Resistor RK73B2ATTE8R2J KOA Speer C2 6

7 5 OHM TYPICAL CHARACTERISTICS Table 11. Common Emitter S -Parameters (,T A =25 C, 5 Ohm System) f S 11 S 21 S 12 S 22 MHz S 11 S 21 S 12 S (continued) 7

8 5 OHM TYPICAL CHARACTERISTICS Table 11. Common Emitter S -Parameters (,T A =25 C, 5 Ohm System) (continued) f S 11 S 21 S 12 S 22 MHz S 11 S 21 S 12 S

9 Recommended Solder Stencil NOTES: 1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN. 2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN. 3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL AND RF PERFORMANCE. 4. RECOMMENDED VIA PATTERN SHOWN HAS.381 x.762 MM PITCH. Figure 2. Recommended Mounting Configuration 1N ( ) YYWW Figure 21. Product Marking.35 diameter

10 PACKAGE DIMENSIONS 1

11 11

12 12

13 PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN31: General Purpose Amplifier and MMIC Biasing Software.s2p File For Software, do a Part Number search at and select the Part Number link. Go to Software & Tools on the part s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office. The following table summarizes revisions to this document. REVISION HISTORY Revision Date Description 5 Mar. 27 Corrected and updated Part Numbers in Tables 8 and 1, Component Designations and Values, to RoHS compliant part numbers, pp. 6, 7 6 July 27 Replaced Case Outline with , Issue D, pp. 1, Case updated to add missing dimension for Pin 1 and Pin 3. 7 Mar. 28 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis (ACPR) unit of measure to dbc, p. 5 Corrected S--Parameter table frequency column label to read MHz versus GHz and corrected frequency values from GHz to MHz, pp. 8, 9 8 Feb. 212 Corrected temperature at which ThetaJC is measured from 25 C to 123 C and added no RF applied to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 Table 6, ESD Protection Characteristics, removed the word Minimum after the ESD class rating. ESD ratings are characterized during new product development but are not 1% tested during production. ESD ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive devices, p. 3 Removed I CC bias callout from applicable graphs and Table 11, Common Emitter S--Parameters heading as bias is not a controlled value, pp Added.s2p File availability to Product Software, p Oct. 214 Added Fig. 21, Product Marking, p. 9 Added Failure Analysis information, p

14 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customer s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of, Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. E , 212, Document Number: Rev. 9, 1/214