FLEXIBLE HYBRID ELECTRONICS FOR ADDITIVE MANUFACTURING

Transcription

1 FLEXIBLE HYBRID ELECTRONICS FOR ADDITIVE MANUFACTURING JASON MARSH NEXTFLEX CTO JUNE

2 WHAT IS NEXTFLEX? 6/13/2017 PAGE 1

3 PART OF A NETWORK OF MANUFACTURING INSTITUTES Across the Manufacturing USA institutes, the Federal government has committed over $850 million, which has been matched by more than $1.8 billion in non-federal investment. - White House Fact Sheet, December 21, /13/2017 2

4 ESTABLISHMENT OF THE NNMI Rep Tom Reed R NY-23 Sen Sherrod Brown D Ohio Rep Joe Kennedy D MA-4 Sen Roy Blunt R Missouri Passed House Sept 15, CoSponsors (51D, 49R) Passed Senate w/ 2015 Appropriations Dec 11, CoSponsors (10D, 7R, 1I) 6/13/2017 PAGE 3

5 PUBLIC PRIVATE PARTNERSHIP Established 28 August 2015 Lead Hub Location Proposal Contributors Federal Funding Committed Matching Government Agencies Engaged FlexTech Alliance San Jose, California 145+ in 27 states $75 million over 5 years $96 million 17 DOD & OGAs 6/13/2017 PAGE 4

6 Tier 1 MEMBERSHIP Corporate * Academic / Non-Profit Tier 2 * * Tier 3 * * * * * Founding Member Observer Honorary 6/13/2017 5

7 FHE ECOSYSTEM Equipment Contract Manufacturing Industrial/Aerospace Materials Research Device/Component Manufacturing Medical/Wearable Devices Semiconductor Process Technology Industry Standards Economic Development 6/13/2017 6

8 APPLICATION FOCUS 6/13/2017 7

9 WHAT ARE FLEXIBLE HYBRID ELECTRONICS? 6/13/2017 PAGE 8

10 WHY FHE? Flexible Stretchable Conformable Transparent Biocompatible Lightweight Cost Effective 6/13/2017 PAGE 9

11 CREATING AN INDUSTRY 6/13/

12 FHE INTEGRATION 6/13/

13 WHAT IS SO COMPELLING ABOUT ADDITIVE MANUFACTURING? 6/13/2017 PAGE 12

14 ADDITIVE ADVANTAGES Low Waste Inventory Alternatives Ability to Manufacture Features Impossible with Subtractive Methods Topics Digital Process Flow In Situ Process Metrology and Adjustment Cost Effective for High Mix Low Volume Turner s Cube vs. 6/13/2017 PAGE 13

15 FUNCTIONAL MASS CUSTOMIZATION Additive methods lend themselves to digital process flow This means high mix low volume can be achieved cost effectively

16 3D Printing Functional Systems SIMPLE CO-DEPOSITED ELECTRONICS 6/13/2017 PAGE 15

17 RIGID & PLANAR PCB PRINTERS 6/13/2017 PAGE 16 16

18 FHE APPLICATIONS 6/13/2017 PAGE 17

19 PC 1.0: Die Integration to Stretchable Substrates TEXTILE INTEGRATED ICs 6/13/2017 PAGE 18

20 OXYGEN MANAGEMENT FOR WOUNDS 6/13/2017 PAGE 19

21 ORAL BIOCHEMISTRY Overall Objective(s) & Duration: Deliver flexible mouth guard senor label with wireless charging and readout Develop semi-automated flexhybrid manufacturing method Duration 16 months I normalized (%) PB-H2O2-Buffer PB-BSA-H2O2-Buffer t (min) -Working electrode(s): Prussian Blue (PB)/Carbon (C) -Counter electrode: PB/C -Reference electrode: Ag/AgCl 6/13/2017 PAGE 20

22 WIRELESS ECG Data Measured by GE at 10GHz Sample Type Dk Df Fused Silica Corning XG Glass Upliex 125SSDB Kapton E Kapton H Kapton HN Ultem Ultem Mylar Flex-Only Modules ECG Interface A/D In order to determine nominal RF properties of the base substrate materials GE utilized its 10GHz NIST provided Re- Entrant Cavity (optimized for thin film (1 to 5 mil) testing) Flex-Stretch Zones Pwr Mgmt Batt 6/13/2017 PAGE 21

23 FHE CYLINDRICAL X-BAND Objective Demonstrate FHE x-band array Benefits Flexible and conformal enables manufacture of single array to cover 360 Lower cost thru installation of single array, reduced maintenance costs with no moving parts, and manufacture on flex Improved performance over dish antenna with faster scan rate Approach Leverage team s key technologies: SI2 s printed phased array UML s printed electronics components Raytheon s low-cost T/R modules 6/13/2017 PAGE 22 22

24 SOFT ROBOTICS 6/13/2017 PAGE 23

25 MANUFACTURING FHE 6/13/2017 PAGE 24

26 FHE BUILDING BLOCKS Strain Gage Printed Battery Printed Antenna Die Placement Trace Print CMOS Radio Integrated Si Die Stretch Conductor Integration & Lamination Antenna Print Skin Contact Die on Stretch Die Thinning 6/13/2017 PAGE 25

27 FHE BUILDING BLOCKS Strain Gage Printed Battery Sensor Printed Antenna Processor Die Placement Trace Print Memory CMOS Radio Integrated Si Die Power Stretch Conductor Transceiver Integration & Lamination Antenna Print Application Specific Package Skin Contact Die on Stretch Die Thinning 6/13/2017 PAGE 26

28 FLEX ARDUINO PROJECT 6/13/2017 PAGE 27

29 ULTRATHIN DIE The semiconductor die must be thinner than 50 μm to be flexible 25µm thick ultra-thin silicon die: 25 μm thick Si die 250 μm thick Si die Probability of survival [%] The thinner the die, the smaller the bend radius is: Min bend radius [mm] Thickness 35μm 25μm 15μm 6 7 however, the flex substrate also matters: 12mm ROC Here is why the FHE dies need to be thin: 6/13/2017 PAGE 28

30 THE IMPORTANCE OF NEUTRAL PLANE Standalone die CoF (Chip on Flex) Adhesive bonding vs. soldering position of neutral plane σσ xxmax = pppp rr mmmmmm pp = tt dddddd 2 pp = tt ssssss bb, where bb = nn ii=1 EE ii tt ii ii jj=1 tt dddddd tt jj tt ii 2 nn ii=1 EE ii tt ii bb is always less than 2, can be negative Bonding methods affect the neutral plane position CiF (Chip in Flex) CMOS at the neutral plane 6/13/2017 PAGE 29

31 IC ASSEMBLY TECHNIQUES: FACE-UP OR FACE-DOWN? Face-up Face-down (adhesive bonding) Wirebonding: thickness, bonding force Anthony Leonardo, HHMI Janelia Farm Research Campus Uniqarta, Inc Isoplanar/direct write: reliability, curing, step American Semiconductor Flat Panel Display Materials - Trends and Forecasts 2009 Edition Adhesive flip-chip bonding is a mature technology 6/13/2017 PAGE 30

32 INTEGRATION OF SILICON ICA Conductive Adhesive Solder ACF/ACP Thermo-Compression TLPS Materials Direct Print 6/13/2017 PAGE 31

33 PRINTING METHODS Aerosol Jet Digital Extrusion Screen Rotogravure 6/13/2017 PAGE 32

34 PRINT METHODS Printing Method Contact Dynamic Dry film Resolution viscosity η thickness range limits DoD Ink jet No 1-20 cp µm 20/50 µm Aerosol jet No cp µm 10/50 µm Digital dispensing No 1-1M cp µm 20/50 µm Screen (PTF inks) Yes 1K-300K cp 5-15 µm 20/75 µm Flexographic (nano) Yes cp µm 5/25 µm Gravure Yes cp µm 20/50 µm Offset Gravure (pad) Yes cp µm 5/30 µm Offset Lithographic Yes 40k - 100k cp µm 10/50 µm Letterpress Yes 50K - 150K cp µm 10/25 µm Viscosity impacts aspect ratio for printed traces 6/13/2017 PAGE 33

35 CONDUCTOR PERFORMANCE (BY CLASS) 6/13/2017 PAGE 34

36 FHE PROCESS TOOLS FOR DEVICE INTEGRATION Conductor Printing & Curing Interconnect and Antenna Printing Component Placement Die Attachment 6/13/

37 DIGITAL PROCESS FLOW 6/13/2017 PAGE 36

38 DESIGN FLOW Product Definition/ Schematic Netlist Design/Layout/ Analysis Layout (Gerber File),BOM Manufacturing/Test Courtesy: American Semiconductor Arduino is registered trademark of Arduino 6/13/2017 PAGE 37

39 DESIGN DATA FILES Illustrator has not z-axis data Gerber has no part data Gerber Parts List/BOM NetList 6/13/2017 PAGE 38

40 PRINTED CIRCUIT ELEMENTS Resistor Diode Transistor Capacitor Source IMEC/HPE Source: Stratasys Source: PolyIC 6/13/ Source: Heraeus Source: Wiley Printed and organicelectronics 6/13/

41 DESIGN RULE CHECK 40 6/13/2017 PAGE 40 40

42 LAYOUT AND SCHEMATIC CAPTURE 6/13/2017 PAGE 41 41

43 DRC FOR PRINTED COMPONENTS 42 6/13/2017 PAGE 42 42

44 RF TEST OF PRINT VS BULK COPPER Element Types on RF Test Frame Microstriplines Grounded coplanar line Filters (BPF)ring resonators Spiral inductors Fabrication: Duplicate Designs 1.Copper plate one version 2.Print Design element overlapping with launches Green =plated, Blue = printed S-parameters of coplanar waveguide printed and copper lines with HFSS simulations. Again, mode conversion is evident at the higher frequencies. 6/13/2017 PAGE 43

45 MRL AND TRL Definitional Material Solution Analysis Technology Development & Commercial Merit Engineering & Manufacturing Development MRL 1 Mfg feasibility assessed MRL 2 Mfg concepts defined MRL 3 Proof of Mfg concept MRL 4 Breadboard & manufacturing processes in a laboratory environment MRL 5 Breadboard & component manufacturing in a relevant environment MRL 6 Prototype, system & subsystem in production relevant environment MRL 7 Prototype, system & subsystem in operations and production environment MRL 8 Pilot line capability demonstrated; Ready to begin lowrate initial production MRL 9 Low-rate production demonstrated; capability in place to begin fullrate production 6/13/2017 PAGE 44

46 NEXTFLEX TECHNOLOGY HUB Lunch Room Conf Conf Conf Board Room Conf Lobby Seminar, Training and Workforce Development Design Lab Screen Exp Printing and Additive Processing Area (class 10,000 Clean Room) Materials Cubicles Product Display Materials Registry Library Test and Measurement Lab (class 10,000 Clean Room) Die Integration and Assembly Area (class 10,000 Clean Room) Textile Wearables Lab Conf Break Room 6/13/2017 PAGE 45

47 THANK YOU JASON MARSH CTO 6/13/2017 PAGE 46