Flexible Hybrid Electronics The Tipping Point To Drive Printed Electronics Market Growth

Transcription

1 Flexible Hybrid Electronics The Tipping Point To Drive Printed Electronics Market Growth November 7, 2016 Jason Marsh Director of Technology America s Flexible Hybrid Electronics Manufacturing Institute

2 What is NextFlex? AU G U S T 2 8, Established 28 August 2015 Lead Hub Location Proposal Contributors Federal Funding Committed Matching Government Agencies Engaged FlexTech Alliance San Jose, California 145+ in 27 states $75 million $96 million 17 DOD & OGAs

3 Flex. Hybrid Elec. San Jose, CA Smart Mfg. for Energy Efficiency Proj. Award TBD National Network of Institutes Network Status ESTABLISHED INSTITUTES Nearly $500M Federal funding catalyzed over $1.2B cost share from consortia Institutes have attracted hundreds of companies and universities as active partners from across the country Digital Mfg & Design. Chicago, IL Adv. Composites Knoxville, TN Light/Modern Metals Detroit, MI Additive Mfg. Youngstown, OH Albany & Rochester, NY Electronics Raleigh, NC Revolutionary Fibers & Textiles Boston, MA Next Up

4 MEMBERS (*Founding) Corporate Tier 1 * Tier 2 * * Tier 3 Academic / Non-Profit Tier 1 Tier 2 Tier 3 * * * * Honorary

5 NextFlex FHE Vision

6 Why FHE? Flexible Stretchable Conformable Transparent Biocompatible Lightweight Cost Effective Photo Source: Phillips Photo Source: Phillips

7 FHE as a Market Flexible Hybrid Electronics Integrated System Semiconductor Integrated System Application/ Attribute Defined Component Process/Mat erial Defined Display Component Function Defined

8 The Challenge with Pure PE Unimpressive Mobility at Operating Temp VT Shift It works in Display? 2x10-9 Duty Cycle Amorphous Silicon/Metal Oxides Polymer Carbon Nanotubes/Graphene Photo Source: imec HRG

9 EMS Industry Fixed Assets in USD $BN $3.50 $3.00 $2.50 $2.00 $1.50 $1.00 $0.50 $ Flex Jabil

10 PC-Laptop-Tablet-Smartphone

11 F 2017F Annual Growth (%) Semiconductor Revenue ($US Billion) Why Is The Market Ready for FHE? Semiconductor is estimated to contract in 2016 Display is moving to flex or seeing margin erosion Thin Film PV market was impacted by China and falling Silicon prices in 2009 $400 $350 $300 $250 $200 $150 $100 $50 $0 8% 39% 32% 29% 8% 10% 4% 42% 4% 19% -9% -8% 37% 1% -32% 18% Semiconductor Revenue 28% 9% 7% 3% 32% -3% -9% 10% 5% 2% 0% -3% 0% -2% 50% 40% 30% 20% 10% 0% -10% -20% -30% -40% Source: IHS

12 FHE has been hiding in plain sight

13 FHE Building Blocks Strain Gage CMOS Radio Printed Battery Printed Antenna Sensor Die Placement Processor Memory Stretch Power Conductor Integrated Si Die Transceiver Application Specific Package Integration & Lamination Trace Print Antenna Print Skin Contact Die on Stretch Die Thinning

14 Intelligent Devices Perishable Decision Window

15 Why? Our Time Domain World When we have gone from manual operation in many process to automation we have relied too heavily on the time domain

16 Time Domain vs Need Domain We rely far too heavily on the time domain for automation Significant waste can be eliminated by operating in a need domain

17 IOT is about Efficiency Significant waste can be eliminated by operating in a need domain Photo Source: Intratab

18 FHE Device Requirements Robust ROI (the money is already being spent) Product Lifecycle Considerations Unobtrusive Form Factor

19 Die Bonding to Textile Systems Test Die #1 Bump Tin-Lead Bump height 130 μm Bump diameter 120 μm Pitch 254 μm (10 mils) Die size 5 x 5 mm No. of bumps 64 Wafer size 5 Test Die #2 Bump Nickel-Gold Bump height 20 +/-3 μm Bump dia. 90 μm Pitch 400 μm (16 mils) Die size 10 x 10 mm Wafer size 6 No of dies ~ 132

20 Accelerate Wound Healing Source: Purdue University

21 Source: PARC Additive Applications

22 Frequency Tunable Materials S 11 (db) Measured:e r =1 Measured:e r =6 Simulated:e r =1 Simulated:e r = Frequency (GHz) Printed two sided Frequency selective surface on BST-COC-LDPE substrate; Front side (a) and Back side (b). The resonance frequency is tuned 1) by changing BST loading or 2) by applying bias voltage Measured Tunability using CRC method

23 Integrated Lines Print, Die Placement, Ablation, Etch, Bonding, Plasma, Encapsulation

24 Mass Customization

25 Soft Robotics Applications

26 Printed Circuit Elements for Basic Structures Resistor Diode Transistor Capacitor Source: Stratasys Source: Heraeus Source: Wiley Source: PolyIC Printed and organic electronics

27 Design Rule Check for Printed Active and Passive Circuits

28 Layout and Schematic Capture

29 DRC for Printed Components

30 DRC for CNT Transistor

31 Strategic Road-mapping Framework TPD1 Human Monitoring TPD2 Asset Monitoring TPD3 Integrate array antenna systems TPD4 Soft robotics Demos 1 Key Features TIME Demos 1 Key Features 1. What we do 2. Led by Tech council Strong end-user participation Demos describe What the institute is doing in manufacturing Revised annually MT1. Device Integration and Packaging MT2. Materials MT3. Printed Flexible Components& Microfluidics MT4. Modeling & Design MT5. Standards, Test & Reliability How we do it Industry Led at WG level Clear boundaries, detailed roadmaps and deliverables feeding into TPDs Develop How gap analysis Drive Project Calls Revised semi-annually In March we had 660 attendees at FLEX2016 from Industry, academia, government (FTA run) Technical Working Groups: 140 participants focused on the Roadmapping

32 Test and Measurement Lab (c las s 10,000 C lean Room) Lobby Conf Conf Conf NextFlex HQ Lunch Room Board Room Conf Seminar, Training and Workforce Development Screen Exp Materials Design Lab Printing and Additive Processing Area (class 10,000 Clean Room) Cubicles Wearables Lab Product Display Materials Registry Library Die Integration and Assembly Area (c las s 10,000 C lean R oom) Conf Break Room

33 Conclusions Market conditions are driving interest in alternative approaches like FHE FHE is well positioned to combine advanced packaging and printed electronics approaches for IoT, wearables and other key growth markets You need not sit on the side lines get involved and help make this market what we want it to be...

34 More Information Contact: Jason Marsh, Director of Technology