Herzlich willkommen. Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium. Sören Fricke Section Head Large Area & Flexible Systems
|
|
- Annabella Blankenship
- 5 years ago
- Views:
Transcription
1 Herzlich willkommen Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium Sören Fricke Section Head Large Area & Flexible Systems Agroscope Tänikon,
2 Motivation Printed Sensors can be produced on low-cost substrates e.g. PET Printed Sensors can be produced on bio-degradable materials Printed Sensors and flexible hybrid electronics can be produced on large areas (rolls) Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 1
3 Printing Technologies and Materials Non-contact printing technologies e.g. Ink-jet printing Aerosoljet printing Screen-printing Slot-die Coating Contact printing technologies e.g. Semiconductors Organic, Inorganic (PEDOT, P3HT, Si, ) Dielectrics Organic, Inorganic (PS, PMMA, BCB, Oxides ) Gravure printing Flexography printing Nano-imprinting Conductors Metals (Ag, Cu, Au, Pt,..) Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 2
4 Components, devices, realized by printing Electric discrete components: Wirings, bus bars, electrodes Resistors Inductors Antennas Capacitors Active electronic devices: (Photo-)Diodes Transistors OLEDs Solar cells. Memory devices Ferroelectric capacitors Energy storage Batteries Sensors Physical, chemical Flexible Hybrid Systems Printing + SMD Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 3
5 also printed Sensors build on known sensing principles Capacitive Resistive Inductive Pyroelectric Resonant Optical Amperometric Voltametric Impedance Thermoelectric Piezoresistive Piezoelectric Photoelectric Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 4
6 Physical: Printed Temperature Sensors Inkjet printed Ag RTD on PET (PTC) TCR: C -1 Screen-printed Wheatstone Bridge of NTC (ATO) and PTC materials on PEN F. Molina-Lopez et al V/ 48V in Screen-printed Si nanoparticles (NTC) and Ag electrodes printed on e.g. paper (PST Sensors Ltd.) logarithmic temperature coefficient 2000 ± 100K (T: C) A. Aliane et al. D.T. Britton et al. Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 5
7 Physical: Printed Pressure Sensors Capacitive: CNT-doped PDMS electrodes on PDMS, by soft-lithography and blade coating Piezoresistive: Screen-printing of Ag electrodes and Carbon ink as piezoresistive layer on PU. Woo et al. Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 6
8 Physical: Printed Strain Sensors Piezoresistive: Aerosoljet printed PEDOT:PSS on Kapton substrate Gauge factor 0.53 B. Thompson et al. Piezoresistive: Screen-printing of CNT-AgNP paste on silicone Ratio of CNT in the paste tunes strain sensitivity and temperature insensitivity S. Harada et al. Sensitivity 59%/Pa in linear regime Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 7
9 Physical: Printed Photodetectors Photodiodes: Fully inkjet printed Ag, PEDOT:PSS, P3HT:PCBM Passive Matrix Imager: inkjet printed P3HT:PCBM. 128dpi demonstrated, 512dpi under development G. Azzellino et al. Active Matrix Imager: ISORG building manufacturing site in Limoges (France) ISORG Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 8
10 Chemical: Electrochemical Sensors Electrical Read-out:Voltametry, Amperometry or Impedance-Spectrocsopy Principal: Functionalization with Antibodies Sensing: glucose, ph, lactate, cancer biomarkers.. screen-printed sensors with Ag, C, AgCl, Au, electrodes have reached mass-production G.C. Jensen et al. Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 9
11 Chemical: Printed Ion Sensors cont. a) OFET: Semiconductor exposed OFET b) Ion-sensitive OFET (ISOFET): Insulator exposed OFET c) Organic electrochemical transistor (OECT): Insulator dielectric replaced by electrolyte OECT humidity sensor on PE coated paper using PEDOT:PSS as organic semiconductor and Nafion as electrolyte D. Nilson et al. J.T. Mabeck et al. Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 10
12 Chemical: Printed Gas Sensors Au and Pd decorated carbon-nanofibres on Kapton. Inkjet printed Ag electrodes and heater. Ammonia and NO 2 sensor S. Claramunt et al. Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 11
13 Printed Sensors vs. MEMS Sensors BOSCH Automotive Rigid package, silicone glue, rigid die with SiN membrane and glass socket Cross-sensitivities minimized by thermo-mechnical decoupling Mounting SMD Local measurement PU foil bendable, stetchable Cross-sensitive to bending, stretching, Temperature Mounting on surfaces Mapping Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 12
14 Summary Printed Sensors have been demonstrated with many sensing principles Very different levels of maturity, some are commercialized, some are lab prototypes Strong potential in chemical and biological sensors Integrating communication chips can increase the costs Food packaging of precious goods All large area applications can benefit from the integration on foil by printing Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 13
15 Thank you for your attention!
16 Chemical: Electrochemical Sensors cont. Inkjet printed Au NP electrodes on Kapton cancer biomarker interleukin-6 (IL-6) in serum Gravure-printed Ag NP electrodes on PET G.C. Jensen et al. mercury sulfide (HgS), lead sulfide (PbS), D-proline and sarcosine B.B. Narakathu et al. Copyright 2017 CSEM Gedruckte Sensoren Sören Fricke Page 19
PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES. Simon Perraud, Ph.D. Vice president for European affairs
PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES Simon Perraud, Ph.D. Vice president for European affairs ABOUT LITEN Liten is the research institute of CEA devoted to clean energy
More informationNational Centre for Flexible Electronics
National Centre for Flexible Electronics Tripartite Partnership Government FlexE Centre - A platform for a meaningful interaction between industry and academia. An interdisciplinary team that advances
More informationMEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications
MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications Part I: RF Applications Introductions and Motivations What are RF MEMS? Example Devices RFIC RFIC consists of Active components
More informationLow Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics
Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics Pooran Joshi, Stephen Killough, and Teja Kuruganti Oak Ridge National Laboratory FIIW 2015 Displays and PV
More informationMEMS in ECE at CMU. Gary K. Fedder
MEMS in ECE at CMU Gary K. Fedder Department of Electrical and Computer Engineering and The Robotics Institute Carnegie Mellon University Pittsburgh, PA 15213-3890 fedder@ece.cmu.edu http://www.ece.cmu.edu/~mems
More informationPrinted Electronics - Quo Vadis? What is Printed Electronics et Quo Vadis?
Printed Electronics - Quo Vadis? Emil J.W. List Institute of Solid State Physics Graz University of Technology NanoTecCenter Weiz Forschungsgesellschaft mbh Agenda Introduction Motivation What is Printed
More informationPrinted Electronics: success stories and future commercial applications
Printed Electronics: success stories and future commercial applications Dr Guillaume Chansin @gchansin June 2017 Helping you profit from emerging technologies Advantages of printed electronics Mass production
More informationAerosol Jet technology opportunities
Aerosol Jet technology opportunities Jiří Navrátil 1. Introduction history and formation 2. Aerosol Jet system 2.1 System components 2.2 Inks and substrates 3. Application of Aerosol Jet technology 4.
More informationMID Manufacturing Process.
3D Aerosol Jet Printing An Emerging MID Manufacturing Process. Dr. Martin Hedges Neotech Services MTP, Nuremberg, Germany info@neotechservices.com Aerosol Jet Printing Aerosol Jet Process Overview Current
More informationSensors & Actuators. Transduction principles Sensors & Actuators - H.Sarmento
Sensors & Actuators Transduction principles 2014-2015 Sensors & Actuators - H.Sarmento Outline Resistive transduction. Photoconductive transduction (resistive). Capacitive transduction. Inductive transduction.
More informationIndustrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies
Industrialization of Micro-Electro-Mechanical Systems Werner Weber Infineon Technologies Semiconductor-based MEMS market MEMS Market 2004 (total 22.7 BUS$) Others mostly Digital Light Projection IR Sensors
More informationAn Instrumentation System
Transducer As Input Elements to Instrumentation System An Instrumentation System Input signal (measurand) electrical or non-electrical Input Device Signal Conditioning Circuit Output Device? -amplifier
More informationEU Research project proposals (call for Finnish companies)
EU Research project proposals (call for Finnish companies) 11th EEMELI Workshop 29 th August 2012 Jukka Hast Research Professor VTT Technical Research Centre of Finland 04/10/2012 2 General ICT theme work
More informationSupplementary Figures
Supplementary Figures Supplementary Figure 1 The diameter and length of AgNWs. (a) SEM image and (b) AFM image of AgNWs coated on a SiO2/Si wafer at 500 rpm for 30 sec. The diameter and length of the AgNWs
More informationLaser printing for micro and nanomanufacturing
Laser printing for micro and nanomanufacturing Ph. Delaporte Lasers, Plasmas and Photonics Processes Laboratory, CNRS, Aix-Marseille University Marseille, France Contact: Philippe Delaporte delaporte@lp3.univ-mrs.fr
More informationAnalysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire
Analysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire 2017. 04. 25 Seung-Hyun Lee, PhD Senior Researcher Dept. Printed Electronics Korea Institute
More informationPrinting versus coating technology Which way Printed Electronics with solution coating will go?
Printing versus coating technology Which way Printed Electronics with solution coating will go? Frank Schäfer, Andrea Glawe, Dr. Daniel Eggerath, KROENERT GmbH& Co KG, Schuetzenstrasse 105, 22761 Hamburg
More informationSensors and actuators at NXP: bringing more than Moore to CMOS
Sensors and actuators at NXP: bringing more than Moore to CMOS Joost van Beek Senior Principal Scientist Corporate R&D, NXP Semiconductors Presented at the International Symposium on Advanced Hybrid Nano
More informationS.Vidhya by, Published 4 Feb 2014
A Wearable And Highly Sensitive Pressure Sensor With Ultrathin Gold Nanowires Shu Gong1,2, Willem Schwalb3, Yongwei Wang1,2, Yi Chen1, Yue Tang1,2, Jye Si1, Bijan Shirinzadeh3 & Wenlong Cheng1,2 1 Department
More informationDesign of an Integrated OLED Driver for a Modular Large-Area Lighting System
Design of an Integrated OLED Driver for a Modular Large-Area Lighting System JAN DOUTRELOIGNE, ANN MONTÉ, JINDRICH WINDELS Center for Microsystems Technology (CMST) Ghent University IMEC Technologiepark
More informationProcesses for Flexible Electronic Systems
Processes for Flexible Electronic Systems Michael Feil Fraunhofer Institut feil@izm-m.fraunhofer.de Outline Introduction Single sheet versus reel-to-reel (R2R) Substrate materials R2R printing processes
More informationelectronics for computer engineering (Sensor) by KrisMT Computer Engineering, ICT, University of Phayao
305222 electronics for computer engineering (Sensor) by KrisMT Computer Engineering, ICT, University of Phayao ห วข อ Sensor =? Each type of sensor Technology Interpolation Sensor =? is a device that measures
More informationGLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS
GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS SMC057C August Margareth Gagliardi Project Analyst ISBN: 1-62296-338-5 BCC Research 49 Walnut Park, Building 2 Wellesley, MA 02481
More informationPrinted Electronics. Applications
Printed Electronics Research Through University-Industry Partnerships Outline Background on Printed Electronics (PE) Corporate Partnerships Raytheon UMass Lowell Research Institute (RURI) Printed Electronics
More informationЗдра вствуйте, това рищи!
Manufacturing of Smart Objects by Printing Technologies Здра вствуйте, това рищи! Moscow / RUS, June 05, 2013 Reinhard R. Baumann Chemnitz University of Technology Chair of Digital Printing Fraunhofer
More information5. Transducers Definition and General Concept of Transducer Classification of Transducers
5.1. Definition and General Concept of Definition The transducer is a device which converts one form of energy into another form. Examples: Mechanical transducer and Electrical transducer Electrical A
More informationObjective Type Questions 1. Why pure semiconductors are insulators at 0 o K? 2. What is effect of temperature on barrier voltage? 3.
Objective Type Questions 1. Why pure semiconductors are insulators at 0 o K? 2. What is effect of temperature on barrier voltage? 3. What is difference between electron and hole? 4. Why electrons have
More informationPrinted Organic Transistors for Ultraflexible and Stretchable Electronics
2011/6/2 20:00-22:00 Lake Buena Vista, Florida USA CPMT Seminar Printed Devices and Large Area Interconnect Technologies for New Electronics Printed Organic Transistors for Ultraflexible and Stretchable
More informationMicro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors
Micro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors Dean P. Neikirk 1 MURI bio-ir sensors kick-off 6/16/98 Where are the targets
More informationChapter 8. Digital and Analog Interfacing Methods
Chapter 8 Digital and Analog Interfacing Methods Lesson 16 MCU Based Instrumentation Outline Resistance and Capacitance based Sensor Interface Inductance based Sensor (LVDT) Interface Current based (Light
More informationFigure 1 - IMSE (courtesy of TaktoTek)
Screen Printing the Third Industrial Revolution Since its infancy hundreds of years ago, until widespread adoption in the mid/late 20 th century, screen printing has been used primarily to create media
More informationSUPPLEMENTARY INFORMATION
A transparent bending-insensitive pressure sensor Sungwon Lee 1,2, Amir Reuveny 1,2, Jonathan Reeder 1#, Sunghoon Lee 1,2, Hanbit Jin 1,2, Qihan Liu 5, Tomoyuki Yokota 1,2, Tsuyoshi Sekitani 1,2,3, Takashi
More informationLAB ASSIGNMENT No. 1 Characteristics of IC Temperature Sensor (LM 335)
LAB ASSIGNMENT No. 1 Characteristics of IC Temperature Sensor (LM 335) Equipment Required: ST2302with power supply cord Multi Meter Connecting cords Connection diagram: Temperature Transducers: The most
More informationHeterogeneous integration of autonomous smart films based on electrochromic transistors
of autonomous smart films NEWSLETTER #5 www.smartwww.smart-ec.eu Objectives SMART-EC has finalized last August 2014; it aimed at the development of self-powered electrochromic (EC) display device with
More informationSystems Engineering. Passive Components. v1.2 March itic.
Systems Engineering Passive Components Pere Palà itic http://itic.cat v1.2 March 2012 Resistors Resistor Types Resistors Ubiquitous Uncritical Surface mount chip Metal film Carbon Wirewound Precision resistors
More informationAdvancing Consumer Packaging Through Printable Electronics
IPST Executive Conference, Atlanta, GA March 9-10, 2011 Advancing Consumer Packaging Through Printable Electronics Bernard Kippelen Professor, School of Electrical and Computer Engineering Director, Center
More informationAccelerating Scale Up of Large Area Electronics
Accelerating Scale Up of Large Area Electronics Duncan Lindsay Business Development Director, CPI 2015 Centre for Process Innovation Limited. All Rights Reserved. Who are CPI? CPI is a UK technology innovation
More informationMICROFLEX Project: MEMS on New Emerging Smart Textiles/Flexibles
MICROFLEX Project: MEMS on New Emerging Smart Textiles/Flexibles S Beeby, M J Tudor, R Torah, K Yang, Y Wei Dr Steve Beeby ESD Research Group Smart Fabrics 2011 5 th April 2011 Overview Introduce the MicroFlex
More informationSensors. Chapter 3. Storey: Electrical & Electronic Systems Pearson Education Limited 2004 OHT 3.1
Sensors Chapter 3 Introduction Describing Sensor Performance Temperature Sensors Light Sensors Force Sensors Displacement Sensors Motion Sensors Sound Sensors Sensor Interfacing Storey: Electrical & Electronic
More informationFinal Project: FEDX X-ray Radiation Detector
Final Project: FEDX X-ray Radiation Detector Keita Todoroki Keita Fukushima December 12, 2011 Introduction The application of radiation detectors has played an important role in physical science, especially
More information1 FUNDAMENTAL CONCEPTS What is Noise Coupling 1
Contents 1 FUNDAMENTAL CONCEPTS 1 1.1 What is Noise Coupling 1 1.2 Resistance 3 1.2.1 Resistivity and Resistance 3 1.2.2 Wire Resistance 4 1.2.3 Sheet Resistance 5 1.2.4 Skin Effect 6 1.2.5 Resistance
More informationGaN Electrochemical Probes and MEMS on Silicon. Ulrich Heinle, Peter Benkart, Ingo Daumiller, Mike Kunze, Ertugrul Sönmez
GaN Electrochemical Probes and MEMS on Silicon Ulrich Heinle, Peter Benkart, Ingo Daumiller, Mike Kunze, Ertugrul Sönmez Outline Introduction Electrochemical sensors GaN-on-Silicon MEMS High temperature
More informationBME 701 Lecture 1. Measurement and Instrumentation
BME 701 Lecture 1 Measurement and Instrumentation 1 Cochlear Implant 2 Advances in Vision (Retinal Stimulation) 3 Mini Gastric Imaging 4 5 Aspects of Measurement General Instrumentation Transducers (Electrodes)
More informationBiomedical Electrodes, Sensors, and Transducers. Definition of Biomedical Electrodes, Sensors, and Transducers. Electrode: Sensor: Transducer:
Biomedical Electrodes, Sensors, and Transducers from: Chaterjee, Biomedical Instrumentation, chapter 6 Key Points Electrodes, Sensors, and Transducers: - types of electrodes - voltaic - electrolytic -
More informationOptimization and Characterization of an Inkjet Process for Printed Electronics. A thesis presented to. the faculty of
Optimization and Characterization of an Inkjet Process for Printed Electronics A thesis presented to the faculty of the Russ College of Engineering and Technology of Ohio University In partial fulfillment
More informationSpecial Lecture Series Biosensors and Instrumentation
!1 Special Lecture Series Biosensors and Instrumentation Lecture 6: Micromechanical Sensors 1 This is the first part of the material on micromechanical sensors which deals with piezoresistive and piezoelectric
More informationInterface Electronic Circuits
Lecture (5) Interface Electronic Circuits Part: 1 Prof. Kasim M. Al-Aubidy Philadelphia University-Jordan AMSS-MSc Prof. Kasim Al-Aubidy 1 Interface Circuits: An interface circuit is a signal conditioning
More informationUsing Ink-Jet Printing and Nanoimprinting for Microsystems
Faculty of Electrical and Computer Engineering Institute of Semiconductor and Microsystems Technology Using Ink-Jet Printing and Nanoimprinting for Microsystems R. Kirchner*, A. Türke, W.-J. Fischer Institute
More informationIMAGING SILICON NANOWIRES
Project report IMAGING SILICON NANOWIRES PHY564 Submitted by: 1 Abstract: Silicon nanowires can be easily integrated with conventional electronics. Silicon nanowires can be prepared with single-crystal
More informationIntroduction to Electronic Circuit for Instrumentation
Introduction to Electronic Circuit for Instrumentation Fundamental quantities Length Mass Time Charge and electric current Heat and temperature Light and luminous intensity Matter (atom, ion and molecule)
More informationBasic MODAMP MMIC Circuit Techniques. Application Note S001
Basic MODAMP MMIC Circuit Techniques Application Note S001 Introduction and MODAMP MMIC Structure Agilent Technologies MSA (Monolithic Silicon Amplifier) series MODAMP silicon bipolar Monolithic Microwave
More informationPrinting Beyond Color. Printed Smart Objects on Advanced Paper Substrates. Reinhard R. Baumann
Printing Beyond Color Printed Smart Objects on Advanced Paper Substrates June 17, 2009 member of Reinhard R. Baumann member of Chemnitz University of Technology Institute for Print and Media Technology
More informationInvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor
InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationAdditive & Inkjet Printing Technologies & Applications
Additive & Inkjet Printing Technologies & Applications Debbie Thorp, Business Development Director Global Inkjet Systems Ltd Silverstone Park - October 2018 GIS Products DFE Atlas User Interface Machine
More informationNovel piezoresistive e-nose sensor array cell
4M2007 Conference on Multi-Material Micro Manufacture 3-5 October 2007 Borovets Bulgaria Novel piezoresistive e-nose sensor array cell V.Stavrov a, P.Vitanov b, E.Tomerov a, E.Goranova b, G.Stavreva a
More informationEnd-of-line Standard Substrates For the Characterization of organic
FRAUNHOFER INSTITUTe FoR Photonic Microsystems IPMS End-of-line Standard Substrates For the Characterization of organic semiconductor Materials Over the last few years, organic electronics have become
More informationDevelopment of Passive Component using Carbon Powder for Electronic Circuit Board
Development of Passive Component using Carbon Powder for Electronic Circuit Board K. W. E. Cheng 1, W.T.Wu 1, Y.W.Wong 2 Department of Electrical Engineering 1, Department of Applied Physics 2, The Hong
More informationThe Department of Advanced Materials Engineering. Materials and Processes in Polymeric Microelectronics
The Department of Advanced Materials Engineering Materials and Processes in Polymeric Microelectronics 1 Outline Materials and Processes in Polymeric Microelectronics Polymeric Microelectronics Process
More informationTechnician Licensing Class T6
Technician Licensing Class T6 Amateur Radio Course Monroe EMS Building Monroe, Utah January 11/18, 2014 January 22, 2014 Testing Session Valid dates: July 1, 2010 June 30, 2014 Amateur Radio Technician
More informationFully Printed Conformal Antenna and Sensors on 3D Plastic, Ceramic, and Metallic Substrates. Mike O Reilly
Fully Printed Conformal Antenna and Sensors on 3D Plastic, Ceramic, and Metallic Substrates Mike O Reilly imaps NE 2016 Antenna and sensor printing via Aerosol Jet Optomec has developed high volume 3D
More informationBasic Electronics. Chapter 2, 3A (test T5, T6) Basic Electrical Principles and the Functions of Components. PHYS 401 Physics of Ham Radio
Basic Electronics Chapter 2, 3A (test T5, T6) Basic Electrical Principles and the Functions of Components Figures in this course book are reproduced with the permission of the American Radio Relay League.
More informationThe Future for Printed Electronics
The Future for Printed Electronics Jon Helliwell National Centre for Printable Electronics 24 October, 2013 Copyright CPI 2013. All rights reserved What is Printed Electronics? Organic and printed electronics
More informationChapter 15 Summary and Future Trends
Chapter 15 Summary and Future Trends Hong Xiao, Ph. D. hxiao89@hotmail.com www2.austin.cc.tx.us/hongxiao/book.htm Hong Xiao, Ph. D. www2.austin.cc.tx.us/hongxiao/book.htm 1 The 1960s First IC product Bipolar
More informationPart Derating Parameters
Part Derating Parameters Capacitors Fixed Aluminum (Electrolytic) Fixed Ceramic Fixed Mica/Glass Fixed Paper/Plastic Fixed Tantalum (Non- Solid) Reverse Voltage Fixed Tantalum (Solid) Reverse Voltage Variable
More informationSignal Integrity Modeling and Measurement of TSV in 3D IC
Signal Integrity Modeling and Measurement of TSV in 3D IC Joungho Kim KAIST joungho@ee.kaist.ac.kr 1 Contents 1) Introduction 2) 2.5D/3D Architectures with TSV and Interposer 3) Signal integrity, Channel
More informationLarge area cost-efficient electronics integration. Flexible Substrate Polytronische Systeme
Large area cost-efficient electronics integration. Flexible Substrate Polytronische Systeme Institut Zuverlässigkeit und Mikrointegration Institutsteil München Karlheinz Bock for Hansastr. 27d, D-80686
More informationHeinrich-Hertz-Institut Berlin
NOVEMBER 24-26, ECOLE POLYTECHNIQUE, PALAISEAU OPTICAL COUPLING OF SOI WAVEGUIDES AND III-V PHOTODETECTORS Ludwig Moerl Heinrich-Hertz-Institut Berlin Photonic Components Dept. Institute for Telecommunications,,
More informationElectronic Systems - B1 23/04/ /04/ SisElnB DDC. Chapter 2
Politecnico di Torino - ICT school Goup B - goals ELECTRONIC SYSTEMS B INFORMATION PROCESSING B.1 Systems, sensors, and actuators» System block diagram» Analog and digital signals» Examples of sensors»
More informationELECTRONIC SYSTEMS. Introduction. B1 - Sensors and actuators. Introduction
Politecnico di Torino - ICT school Goup B - goals ELECTRONIC SYSTEMS B INFORMATION PROCESSING B.1 Systems, sensors, and actuators» System block diagram» Analog and digital signals» Examples of sensors»
More informationDEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING QUESTION BANK SUBJECT NAME & CODE: EC2403 & RF AND MICROWAVE ENGINEERING UNIT I
FATIMA MICHAEL COLLEGE OF ENGINEERING & TECHNOLOGY Senkottai Village, Madurai Sivagangai Main Road, Madurai -625 020 An ISO 9001:2008 Certified Institution DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING
More informationTENDER shedule. Sealed tenders in the prescribed format are invited for the purchase of equipments for various labs for Electronics Departments.
MODEL ENGINEERING COLLEGE THRIKKAKA,COCHIN-2 PH:2577379,2575370 Ref no.a2/273/7/mec dtd 29..207 Tender No.6/207-8/MEC TENDER shedule Sealed tenders in the prescribed format are invited for the purchase
More informationINTERACTIVE. data book. thick film power resistors. vishay sfernice. vse-db
VISHAY INTERTECHNOLOGY, INC. INTERACTIVE data book thick film power resistors vishay sfernice vse-db0019-0302 Notes: 1. To navigate: a) Click on the Vishay logo on any datasheet to go to the Contents page
More informationElectronics II. Calibration and Curve Fitting
Objective Find components on Digikey Electronics II Calibration and Curve Fitting Determine the parameters for a sensor from the data sheets Predict the voltage vs. temperature relationship for a thermistor
More informationMEMS and Nanotechnology-Based Sensors and Devices for Communications, Medical and Aerospace Applications
MEMS and Nanotechnology-Based Sensors and Devices for Communications, Medical and Aerospace Applications A.R. Jha, Ph.D. C) CRC Press J Taylor & Francis Group Boca Raton London New York CRC Press is an
More informationM.D. Singh J.G. Joshi MECHATRONICS
M.D. Singh J.G. Joshi MECHATRONICS MECHATRONICS MECHATRONICS M.D. SINGH Formerly Principal Sagar Institute of Technology and Research Bhopal J.G. JOSHI Lecturer Department of Electronics and Telecommunication
More informationElectronic Components (Elements)
Lecture_3 Electronic Components (Elements) Instructor: IBRAHIM ABU-ISBEIH 25 July 2011 Reverse Engineering 1 Objectives: After completing this class, you will be able to identify the most commonly used
More informationSi Nano-Photonics Innovate Next Generation Network Systems and LSI Technologies
Si Nano-Photonics Innovate Next Generation Network Systems and LSI Technologies NISHI Kenichi, URINO Yutaka, OHASHI Keishi Abstract Si nanophotonics controls light by employing a nano-scale structural
More informationGeorgia Tech. Greetings from. 3D Modeling and Process Design Kits for Flexible Hybrid Electronics (FHE) Challenges and Opportunities
Greetings from Georgia Tech 3D Modeling and Process Design Kits for Flexible Hybrid Electronics (FHE) Challenges and Opportunities Madhavan Swaminathan* and Sebastian Mueller John Pippin Chair in Electromagnetics
More informationPrinted Electronics Product Types & Markets. Vince Cahill, VCE Solutions
Printed Electronics Product Types & Markets Vince Cahill, VCE Solutions Printed Electronic Product Types Printed circuits boards Printed logic / memory Printed batteries Membrane switches Photovoltaics
More informationDTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production
DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU Danchip National Center for Micro- and Nanofabrication DTU Danchip DTU Danchip is Denmark
More information2007-Novel structures of a MEMS-based pressure sensor
C-(No.16 font) put by office 2007-Novel structures of a MEMS-based pressure sensor Chang-Sin Park(*1), Young-Soo Choi(*1), Dong-Weon Lee (*2) and Bo-Seon Kang(*2) (1*) Department of Mechanical Engineering,
More informationSensors and Actuators Introduction to sensors
Sensors and Actuators Introduction to sensors Sander Stuijk (s.stuijk@tue.nl) Department of Electrical Engineering Electronic Systems INDUCTIVE SENSORS (Chapter 3.4, 7.3) 3 Inductive sensors 4 Inductive
More informationLarge Area, Flexible Electronics TWG. Chair: Dan Gamota, Jabil
Large Area, Flexible Electronics TWG Chair: Dan Gamota, Jabil Large Area Flexible Electronics Roadmap History 09/2005 inemi Stakeholders identify Flexible Electronics as Future Growth Market and authorize
More informationCHEMICAL ENGINEERING 2I03
Student Name: Student ID: CHEMICAL ENGINEERING 2I03 DAY CLASS Duration 2 hours McMaster University Practice Exam Dr. M. Thompson The final test includes 60 questions on 12 pages. This test paper must be
More informationshaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS
shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS WHO ARE WE? XTPL S.A. is a company operating in the nanotechnology segment. The interdisciplinary team of XTPL develops on a global scale
More informationContext Development Details Anticipated Effects
Dec 27, 2017 Tanaka Precious Metals/Tanaka Holdings Co., Ltd Japan Science and Technology Agency (JST). A Bendable Touch Panel Achieved with Silver Nano Ink Printing Technology (A Result of NexTEP: Joint
More informationPaper-Based Piezoresistive MEMS Sensors
Supplementary Information Paper-Based Piezoresistive MEMS Sensors Xinyu Liu 1, Martin Mwangi 1, XiuJun Li 1, Michael O Brien 1, and George M. Whitesides 1,2* 1 Department of Chemistry and Chemical Biology,
More informationUnit 2 Semiconductor Devices. Lecture_2.5 Opto-Electronic Devices
Unit 2 Semiconductor Devices Lecture_2.5 Opto-Electronic Devices Opto-electronics Opto-electronics is the study and application of electronic devices that interact with light. Electronics (electrons) Optics
More informationLecture 8 Optical Sensing. ECE 5900/6900 Fundamentals of Sensor Design
ECE 5900/6900: Fundamentals of Sensor Design Lecture 8 Optical Sensing 1 Optical Sensing Q: What are we measuring? A: Electromagnetic radiation labeled as Ultraviolet (UV), visible, or near,mid-, far-infrared
More informationIn the name of God, the most merciful Electromagnetic Radiation Measurement
In the name of God, the most merciful Electromagnetic Radiation Measurement In these slides, many figures have been taken from the Internet during my search in Google. Due to the lack of space and diversity
More informationElectronic Components
Engineering Project (1) Lecture_2 Electronic Components (Elements) Instructor: Eng. IBRAHIM ABU-ISBEIH 6 March 2012 Eng. Ibrahim Abu-Isbeih 1 Objectives: After completing this class, you will be able to
More informationCurriculum. Technology Education ELECTRONICS
Curriculum Technology Education ELECTRONICS Supports Academic Learning Expectation # 3 Students and graduates of Ledyard High School will employ problem-solving skills effectively Approved by Instructional
More informationAll-Printable Real-time Airframe Monitoring System (ARAMS)
All-Printable Real-time Airframe Monitoring System (ARAMS) S. Joshi 1, S. Bland 1, R. DeMott 1, N. Anderson 2, G. Jursich 2, Y. Zhang 3, D. Gamota 4 1 NextGen Aeronautics, Inc., 2 University of Illinois
More informationNewer process technology (since 1999) includes :
Newer process technology (since 1999) includes : copper metalization hi-k dielectrics for gate insulators si on insulator strained silicon lo-k dielectrics for interconnects Immersion lithography for masks
More informationCoating of Si Nanowire Array by Flexible Polymer
, pp.422-426 http://dx.doi.org/10.14257/astl.2016.139.84 Coating of Si Nanowire Array by Flexible Polymer Hee- Jo An 1, Seung-jin Lee 2, Taek-soo Ji 3* 1,2.3 Department of Electronics and Computer Engineering,
More informationPressure Sensors for Printed Blast Dosimeters
Pressure Sensors for Printed Blast Dosimeters Jurgen Daniel +, Tse Nga Ng, Sean Garner and Ana Claudia Arias Palo Alto Research Center (PARC) Palo Alto, CA 94304, USA + Daniel@parc.com John Coleman, Jianzhong
More informationLow-power carbon nanotube-based integrated circuits that can be transferred to biological surfaces
SUPPLEMENTARY INFORMATION Articles https://doi.org/10.1038/s41928-018-0056-6 In the format provided by the authors and unedited. Low-power carbon nanotube-based integrated circuits that can be transferred
More informationMEAS Silicon MEMS Piezoresistive Accelerometer and its Benefits
MEAS Silicon MEMS Piezoresistive Accelerometer and its Benefits Piezoresistive Accelerometers 1. Bonded Strain Gage type (Gages bonded to metal seismic mass using epoxy) Undamped circa 1950 s Fluid (oil)
More informationUBEC/ULEC 60 + GHz Ultra Broadband Embedding silicon Capacitor Wire Bondable
UBEC/ULEC 60 + GHz Ultra Broadband Embedding silicon Capacitor Wire Bondable Rev 1.5 Key Features Ultra broadband performance > 60 + GHz Resonance free Phase stability Ultra high stability of capacitance
More informationT6A4. Electrical components; fixed and variable resistors, capacitors, and inductors; fuses, switches, batteries
Amateur Radio Technician Class Element Course Presentation ti ELEMENT SUB-ELEMENTS Technician Licensing Class Supplement T Electrical/Electronic Components Exam Questions, Groups T - FCC Rules, descriptions
More information