Silicon Photonics and Skorpios Technology Platform. Market Watch ECOC Cannes - September 22, 2014 A. Viglienzoni

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1 Silicon Photonics and Skorpios Technology Platform Market Watch ECOC Cannes - September 22, 2014 A. Viglienzoni

2 Agenda Preamble Need for Photonics and Integrated Optics Why Current Models Cannot Deliver on Promises Why CMOS Photonics Why Skorpios Delivers on The Promises of Silicon Photonics Conclusions 2

3 CMOS Industry Advantage Process Maturity Worldwide Annual Processed Wafer (in 1,000 sq. m) Silicon 7,000 Silicon GaAs 7, LiNbO 3 13 InP 0.65 SiO 2 = Sand. Source: SEMI, HHI, isupply, Crystal Technology Inc. 3

4 Silicon Foundry Volume Courtesy of Martin Schell, HHI -- ECOC 2012 Total Output: 13 M Wafers (2011, 8 equ.) Average Revenue: ~1,000 USD/Wafer Smallest Fab: 440k Wafers per Year Source: TSMC business report

5 InP and Si: Comparison Courtesy of Martin Schell, HHI -- ECOC 2012 Telekom Small Datacom / FTTH Large Datacom / FTTH Really large, e.g. chip-to-chip pcs p.a. 50k 500k 5M 50M Si InP Si InP Si InP Si InP R&D ($/pc) CoS ($/pc) Total ($/pc) % Small Fab 0.01% 10% 0.12 % 100% 1.2 % 10x 12 % 100x Small/Large: Cost Side Gives Clear Advantage for Silicon Low Volume on Silicon fab Scale Does not Allow for a Single Modification of Existing Processes martin.schell@hhi.fraunhofer.de Sep 18,

6 Photonics: Major Impact On Our Lives Readout units for fiber sensors Smart Lighting Systems Skin Analysis NG Sensors Fiber Systems: Telecom, Datacom,. Avionics Metrology: Compact Frequency-Comb Generator Optical Coherence Tomography 6

7 Enable NG Consumer Applications 7

8 Silicon Photonics Applications Applications Examples Data rate Telecom Datacom Consumer HPC Commercial - Video Metrology and Sensors Medical Military/Aerospace/ Scientific From Edge Access to Ultra Long Haul Applications; Coherent Metro Enablement Intra Data Centers (2Km+) and Inter Data Centers (100Km); Mega Cloud SMF Duplex 100G/400G Spine-Leaf-Core Switching Connecting Objects e.g. Console, PC, HDTVs. Gaming. Augmented Reality, Peer-to-Peer One High Performance Computer Supercomputer May Consume 40,000 AOCs or 250,000 Mid-Board Modules Digital Signage, Digital Cinemas, Video Recording and Studios; 4Kx2K Displays and Recording Equipment; 100m to 1Km+ Measurements of Time, Temperature, Sound, Frequency, Stress, DNA, Glucose, Molecular and Cellular Analysis, Optical Coherence Tomography Scientific Instruments, Optical Aircraft Networks, Radar, Imaging and Intelligence Applications 10G, 40G, 100G, 400G Systems 40G, 100G, 400G Interconnects; Multi- Terabit Line Cards, Dense Form-Factors Like QSFP28 5G 50G 100G 100G IB, 100 GbE 10G 50G Interconnects HDMI, Display Port, USB 3.0, Thunderbolt Typically Low Data Rates but Using Special Silicon Photonics Based Sensors Typically Low Data Rates but Using Special Silicon Photonics Sensors 10G, 40G, 100G, Capacity Similar to a Small Data Center, with More Difficult Environmental Conditions 8

9 Photonics Connectivity: Application Domains and Challenges Chip Inter-Connects 1mW/Gbps cm Optical Engines 5mW/Gbps m Active Optical Cables 20mW/Gbps m Optical Transceivers Modules 50mW/Gbps 1 W/Gbps 2 40km 100G+ DWDM Intra Chip Inter Chip Back Plane Board to Board Rack to Rack WAN, Access, Front/Back Haul Metro and LH WDM Electrical Consumer Electronics Interconnect Optical Optical Short Reach Interconnects Copper hitting severe physical limitations with increasing bit rates Telecom and Datacom Client Interconnects 40G/100G per Fiber Increasing Processing Capacity & Density of System ASICs DWDM Transport More capacity per single fiber Less $/bit 100G/400G/1T Generalized Need for Footprint and Power Reduction 9

10 Performance (EMC/EMI, Speed,..) Size - Power Dissipation Performance, Miniaturization Power Dissipation Silicon Photonics Value Innovate in Current Markets Optical Component Industry Viability Enable New Markets & Products Very High Volumes and Low Cost Current Markets & Products Volume Right Size and Cost 10

11 Some Non Telecom Markets 250, , , ,000 50,000 - Total M2M Revenues ($M) Other Transportation Vehicles Remote / Green Technology Retail Outlets Building Automation Maintenance Office Metering / utilities Office Security Home Automation Consumer Electronics Smart Metering / Utilities Home Security Basic Healthcare Point & Distributed Fiber Sensor Market, Distributed Fiber Optic Sensor Markets

Revenues $B Silicon Photonics TAM 10 9 8 7 6 5 4 3 2 1 New Applications Non Telco Applications ROADM, Filters Transceivers (All Bit

12 Revenues $B Silicon Photonics TAM New Applications Non Telco Applications ROADM, Filters Transceivers (All Bit Rates, NO 10G, 40G, 100G) 10G, 40G, 100G (incl.nem) Discretes for Transceivers Current SiPh Revenues (AOC, Discretes) 0 Calandar Year

Optical Market Opportunity Sources: Infonetics 2013, Lightcounting 2013 $4B Transceiver Market in 2014 21-Sep 7-Sep 2Q14 1Q14 Market Cap Market Cap Revs GM Net M Market Cap Revs GM Net M A $1,700

13 Optical Market Opportunity Sources: Infonetics 2013, Lightcounting 2013 $4B Transceiver Market in Sep 7-Sep 2Q14 1Q14 Market Cap Market Cap Revs GM Net M Market Cap Revs GM Net M A $1,700 $ % 4.2% $2,636 $ % 7.0% B+C $2,570 $ % 0.0% $3,220 $ % -0.3% D $347 $ % -8.0% $333 $ % -1.4% E $176 $ % -24.0% $342 $ % -23.0% F $131 $ % -7.0% $155 $ % -12.0% G $83 $ % -9.0% $257 $ % -18.5% Sources: SEK Filings and Yahoo Finance The Fundamental Problem: Large Market, No Profits 13

14 Traditional Optical Integration Processed Laser Chip Optical Module Circuit Board III/V Wafer Hermetic Gold Box Optical Package Assembled Optical Module Linecard Multiple Serial Steps Expensive to Manufacture High Excess Optical Loss 14

15 Silicon Photonics 1.0 Integration Hermetic Gold Box Optical Package III/V Wafer Processed Laser Chip Output Fiber SOI Wafer External Laser Sources Processed Silicon Photonics Chip Separate Off-Chip Laser Sources Expensive to Implement WDM Many Serial Alignments and Processes 15

Optics Silicon Modulators Physically Large Large Drive Voltages High Insertion

16 Si-Photonics 1.0 Silicon Photonics 1.0: A Closer Look Where do the Photons Come From? Need to Buy Completed Lasers How do You Get the Heat Out? Margin Stacking Not Wafer Scale Labor Intensive Alignments Non-Hermetic Bulk Optics Silicon Modulators Physically Large Large Drive Voltages High Insertion Loss Source: EE Times January 28, 2013 Is This a Wafer-Scale Process? Is This Si-Photonics or Si Optical Bench? Cross Section Silicon Photonics But Where are the Photons? 16

Other III/V Devices (Detector, Modulator, non-optical High-Speed RF HBTs ) Parallel

17 Skorpios STAB Integration III/V Wafer III/V Population Process Processed Silicon Photonics Chip with Integrated III/V Output Fiber SOI Wafer Integrated Laser Sources & Other III/V Devices (Detector, Modulator, non-optical High-Speed RF HBTs ) Parallel Fabrication - An Inherently WDM Platform Single Alignment Step - Low Optical Loss and Low Power 17

18 Si-Photonics 2.0 Silicon Photonics 2.0: A Closer Look LASERS Integrated in a Wafer-Scale Process No Need to Buy Completed Lasers No Margin Stacking Wafer Scale No Labor Intensive Alignments Hermetic No Bulk Optics Skorpios STAB-Silicon Modulators Physically Small Low Drive Voltages Low Insertion Loss Skorpios Single Chip Solution Skorpios: Silicon Photonics With the Photons 18

Skorpios: Fabless Model CMOS Process Flow Skorpios Si-Ph CMOS

Definition FEOL Active Element Definition (CMOS) Active

Processes Device Wiring Device Wiring Wafer Test BEOL Wafer Test

Developed on Commercial CMOS Fab Tools No Gold Photolithographic

19 Skorpios: Fabless Model CMOS Process Flow Skorpios Si-Ph CMOS Flow Passive Element Definition Passive Si-Photonic Element Definition FEOL Active Element Definition (CMOS) Active Si-Photonic Element Definition (CMOS) Skorpios Proprietary MOL Processes Device Wiring Device Wiring Wafer Test BEOL Wafer Test All MOL Processes are 100% CMOS Compatible All Processes Developed on Commercial CMOS Fab Tools No Gold Photolithographic Alignments Only Dice and Test Dice and Test Process Innovation in a Fab-Less Business Model 19

5um) Si Platform Polarization Insensitive and Fabrication Tolerant WDM 5) Wafer-Scale Co-Processed III-V and Si Low-Cost CMOS

20 Technology Advantages 1) Combines Benefits of Both III-V and Si Lasers, Modulators, Waveguides, Density 2) Metal Bonding Between III-V and Substrate Excellent Heat Sinking Path 3) Similar Modes Connected by Butt-Joint Low Coupling Loss 4) Thick (1.5um) Si Platform Polarization Insensitive and Fabrication Tolerant WDM 5) Wafer-Scale Co-Processed III-V and Si Low-Cost CMOS Manufacturing 6) Natively Hermetic for III-V Materials No Expensive Gold Box Packaging 7) Similar Substrate to SiGe-on-SOI Monolithic Integration With 25G and 40G SiGe ICs 20

21 Best In Class ITLA Laser Engine Traditional Approach Skorpios Approach Thermistor Gain Chip Back Miror (EO Xtal) Prism Lens 1 & 2 Tunable Filter Assy (2x) Filter Electrical IO Lens Mount Lens 3 Isolator MP D ~ 4mm Fiber Flexure ~ 40mm ~ 4mm Multiple Manual Serial Assembly Steps Low Yield Dedicated Custom Tools Expensive to Manufacture Single Fiber Alignment Parallel Wafer Fabrication Processes Single Chip, Minimal BOM Inexpensive to Manufacture 21

22 QSFP28 Module RX Chip TX Chip 22

23 Qualitative Cost Comparison III-V Based LR4 Skorpios QSFP Sourced Electronics Photonics (TX & RX) Electronics (Populated PCB) Mechanics & Packaging Test Photonics (TX & RX) Electronics (Populated PCB) Mechanics & Packaging Test Skorpios with Own ASICs Photonics (TX & RX) Electronics (Populated PCB) Mechanics & Packaging Test 23

24 Conclusions Near Term Drivers for Silicon Photonics: Toolkits for Transceivers, Active Optical Cables and Backplanes for Both Telecom and Datacom - Optical Component Industry Cannot Keep Up With the Pace of Applications and Price/Cost Trends - ASICs Can Process More Information Than Optical I/O s Can Handle Data Rates Keep Increasing - Electrical Links are Loss-Limited at High Data Rates - Photonic Links Will Progressively Displace Electrical Ones - Optical Links Have Now Entered a New Phase: CMOS Photonics Now Competes Directly with Copper/VCSELs for Short Reach Applications: No Longer Limited to LAN/MAN/WAN Volumes Growth - Telecom: 10k-100k Units/Yr - Datacom/HPC: >1M Units/Yr Silicon is the Best and Only Mature Platform: - New Architectures Can be Enabled by Silicon Photonics - Low Cost - Need a Process Compatible with CMOS Foundries Skorpios Can Deliver All Such Requirements 24

25 Conclusions Future is not what it used to be. - Arthur C. Clarke

26 Thanks! 26

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