Optical Integration and DSP in Next Generation Networks. Atul Srivastava CTO, NTT Electronics - America. Market Focus ECOC 2013

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1 Optical Integration and DSP in Next Generation Networks Atul Srivastava CTO, NTT Electronics - America Market Focus ECOC 2013

2 Outline 100G Deployment Rapid Growth in Long Haul Role of Modules 100G Module Standards and their Applications Gen1 5x7 MSA Gen2 4x5 MSA Pluggable Modules (CFP, CFP2 ) Challenges for DSP and Optical Components Lower Power Dissipation Smaller Size Packaging Discussion 2

3 Q-factor (db) 111Ch 1:2 1:2 1:4 1:4 12:1 Fan In 1:12 Fan Out 111Ch 1:4 Current Landmark Hero Result 1.01-Pb/s (456.8Gb/s x 222ch x 12 cores) transmission over 52-km MCF with the aggregate SE of 91.4 b/s/hz (7.6 b/s/hz x 12 cores) Tx1 CPL Pol MUX C+L + C+L + Switch OTF C or L + OTF Rx Tx2 12-core MCF 52 km X-pol. Ch60, Core1,sc-6 Y-pol. 1Tb/s experiment in OFC 1996 In 16 years 1000x increase ~10x capacity increase every 5 years Is it sustainable?? core1 core2 core3 core4 core5 core6 core7 core8 core9 core10 core11 core Wavelength (nm) T. Takara, et al., ECOC2012, Th.3.C.1 (PDP). 3 Courtesy: Dr. Suzuki, NTT

4 Commercial Transmission Systems Current Systems 100Gb/s: Transmission, Cross-connect and IP Router interface rates have coalesced 10Tb/s Capacity Gb/s 50Hz DP-QPSK, 28Gbaud, 4bits/symbol Coherent Detection with ADC/DSP Future Systems Gb/s? Tb/s? Year 1990s past past present future System Capacity Gb/s 1 Tb/s 10 Tb/s 100Tb/s Channel Rate Gb/s 10 Gb/s Gb/s 1 Tb/s! No. of WDM Channels 8, 16, Spectral Efficiency ! 4

5 Long Haul 100G Growth Number of LH Interfaces 125K 84K 60K 10K 25K : >100K LH Interfaces with ~1B NEM sales Ref: A. Schmitt, Infonetics, OIF meeting Jan. 2013

6 Current OIF LH 100G MSA module: Size: 5 in. x 7 in. Power Dissipation: 80 W 6

7 NEL product lineup for 100G linecard DP-QPSK modulator m-itla Driver SFF, same side I/O 105 x 13.5 x 7 mm LD 35 x 20 x 6.4 mm MUX Modulator CFP (100GE) OTN Framer DSP-LSI Receiver Fiber 2nd GEN Low power 2nd GEN High performance LD(LO) Integrated receiver Integration is key to reducing size and power dissipation 7 17 x 30 x 6 mm

8 100G Modules and Line cards: Enabling higher card density Power Consumption 100W Current OIF MSA W 2013 OIF MSA 2.0 5x7 MSA Smaller Size Low Power 4x5 MSA Future (CFP/ CFP2) Smaller Size Low Power Size (Smaller) 8

9 Evolution of 100G modules: LH Applications Gen 1 5 x 7 Gen2 4 x 5 Module Power dissipation dominated by electronic components such as DSP and MUX 4 DSP 5 modulator Receiver Module Size (width, depth, height) determined by optical components such as Tx and Rx LD LD 9

10 Example of Module Layout in the 100G Transmission Line Card a) Transponder Framer b) Muxponder Framer c) Regenerator CFP 100G LH MSA (4 x5,<40w) DC/DC Conv. Area XFP G LH MSA (4 x5,<40w) DC/DC Conv. Area 100G LH MSA (4 x5,<40w) 100G LH MSA (4 x5,<40w) DC/DC Conv. Area Module size required for the line card a) Transponder b) Muxponder c) Regenerator 5 x7 (Gen.1) 4 x5 (Gen.2) The module with the size of 4 x5 can enable three kinds of the line cards Courtesy: Onaka, Fujitsu 10

11 Multi carrier options for 400G and 1T systems Dual carrier 2x200G for 400G switching to DP- 16QAM Additional carriers can be added to make a 4 X 100G, or 10 X 100G, or 5 X 200G superchannel 11

12 Reach and Capacity Tradeoff G. Bosco et al., JLT, vol.29, No.1, p.53,

13 Reach and Capacity Tradeoff GAP filled by 8QAM G. Bosco et al., JLT, vol.29, No.1, p.53,

14 Smaller Integrated Components for smaller size pluggable (CFP) modules itx ASIC 100G CFP2/4 for Routers with high faceplate density 14

15 Pluggable Digital Coherent TRx Line card CFP(optics + DSP inside) CFP2/4(only optics) DSPs CFP2: 8 modules/card CFP4: 16 modules/card Optics part will be separated from DSP CFP2/4 will be no more than single optical component RF connection

16 Breakdown of 100G module power dissipation Gen1 MSA 4 x5 Gen2 MSA CFP target DSP MUX Modulator(TEC) Driver ITLA(Tx&LO) Receiver FE MISC DD-conv Total 79.0 W 40.0 W 24.0 W

17 100G Transceiver Module/DSP Power Dissipation 5 x7 CFP 4 x5 40nm CMOS 18-20nm 28nm 17

18 100G Transceiver Module Landscape 80 Power (W) 100G Coherent Metro for Gen1 5 x G ER4 100G ZR - Regional km - Core km - Access km - Higher volume - Lower cost - High density Gen2 4 x G LR4 Reach (km) >

19 100G Coherent Metro Networks Long-Haul Long-Haul >1500, 6-8 ROADMs Metro Regional Metro-Regional km; 16 ROADMs Metro Core Metro-Core km; 24 ROADMs Metro Access Metro-Access km Typical Optical Specs: 16dB OSNR, 15,000ps/nm dispersion, 12ps PMD Cost, Power and Size of module are key metrics for 100G Metro 19

20 Applications for each 100G coherent transceiver module Datacom Telecom Distance <100km <600km <600km >2000km Application name ER, ZR Metro-access Regional, or metro-regional Long haul Optical topology Point-to-point (pt-p) p-t-p ROADMs (drop & continue)* Number of TLAs Chromatic dispersion compensation (ps/nm) Type of FEC 2,000 12,000 12,000 >40,000 HD-FEC (G.709) (External) HD-FEC (ex. G.975.1) (External) SD-FEC (Internal) Power consumption (W) TBD 40 Module form-factor CFP CFP (tbd) 4 x 5 (tbd) 4 x 5 Name of TRx module Coherent pluggable NG-Coherent LH ROADMs (drop & continue)*, p- t-p SD-FEC (Internal) Note*) For ROADM applications, the drop & continue function is required, where a single wavelength is used for broadcasting. In a transceiver module, NTT Electronics transmitter Corp. wavelength 2013 is proprietary not necessarily & confidential the same as that of local 20

21 Interoperability on 100G 1. Expansion of 100G coherent technology The digital coherent technology is expanding from long-haul (LH) to shortreach (ZR) / metro-access (MA) applications. (Applications are shown in next page.) In ZR/MA application, pluggable optical modules will be used. Where, interoperability is mandatory because of replaceability. We would like to propose strong joint promotion of interoperability on 100G ZR/MA applications. 2. Modulation format and FEC We think that the modulation format for 100G ZR/MA is QPSK. QPSK is only one standard and it is mature. GFEC will be used ZR and MA application. GFEC is already standardized, but eventually EFEC may be needed in MA. For such a case, a table of EFEC candidates could be the solution as in ITU-T G (listing several EFECs). EFEC single standard would be difficult because of vendors differentiator, as in the past.

22 Latest News 100G interoperability NTT Electronics and Acacia Communications Announce Interoperability Mode of Operation in Next-Generation Coherent ASICs London, UK, September 23, ECOC2013 : NTT Electronics (NEL), the leading supplier of 100G coherent Digital Signal Processing (DSP) ASSP's to a variety of system/module manufacturers worldwide, and Acacia Communications, the leader in delivering intelligent transceiver modules for ultra-high speed fiber optic transmission to the telecommunications infrastructure industry, announced today that they have completed verification of an interoperability mode of operation between their next-generation Coherent Digital Signal Processing ASIC's. [Some network operators comments are quoted in the press release] "100G coherent application is to be extended from purely long-haul to metro to even short-reach applications, where the pluggable optical transceiver is attracting solution for those new applications," said a representative of Deutsche Telekom AG (DTAG). "Optical technology solutions like 100G are helping us continue to evolve and scale our network to support the next generation of high bandwidth services in an efficient and cost effective way," said Shamim Akhtar, Distinguished Architect at Comcast. "From the viewpoint of a network operator using 100G as well as a technology provider of 100G coherent solution, we, NTT, are happy to see this interoperability milestone," said Masahito Tomizawa, an executive manager of NTT Network Innovation Labs.

23 CFP Components configuration CFP foot print can be achievable by using m-itla (already standardized) and Gen 2 ICR (newly proposed as close to Gen1 modification) Accordingly, MSA components have broader market, and can be cost-effectively procured. 90mm The same Rx as used for LH (2 nd gen Rx) Modulator Receiver Driver 14x8mm Semiconductor / Polymer type DSP 30x30mm 1 LD for Tx and LO uitla 55mm CPL 23

24 Compact Optical Tx and Rx DSP Assist Tx Chirp Vpi Extinction ratio LD Coupling loss PBC PBS DAC LD ADC DSP Rx Phase error Loss imbalance Performance enhancement by DSP

25 Very Low Voltage MZ Modulator Y. Ueda et al., We1.B.2, ECOC

26 Modulation Characteristics Y. Ueda et al., We1.B.2, ECOC

27 Optical Integration is key to size and cost reduction 27

28 H. Tanobe et al., We2.B.3, ECOC 2013

29 H. Tanobe et al., We2.B.3, ECOC 2013

30 H. Tanobe et al., We2.B.3, ECOC 2013

31 Roadmap of Digital Coherent Products TRx (OIF) DSP 1 slot/40g 2 slots/100g OIF-MSA-1.1 1st GEN: 5 x 7, ~ 80 W 1st GEN Low power 37.5 x 37.5 mm ~ 45 W Japan Project 1 slot/100g OIF-MSA nd GEN: 4 x 5, ~ 45 W 2nd GEN Low power 30 x 30 mm ~ 25 W 2nd GEN High performance 400G support 2 slots/400g Pluggable (CFP2?) IRM 1st GEN 27 x 48 x 7 mm 1.2 W (typ.) 2nd GEN 19 x 33 x 6.5 mm Filter-less VOA-less 3rd GEN 10 x 40 x 6 mm Modulator Silica-LiNbO3 hybrid integration 118 x 13.5 x 7 mm SFF, same side I/O 105 x 13.5 x 7 mm Dual-carrier mod. Tunable transmitter 12 x 55 x 9 mm T-LD Narrow linewidth TLA mm ITLA 6.5 W 30.5 x 74 x 10.5 mm m-itla mm ~2.5 W OTN-LSI 100G-OTN-LSI Connection w/dsp 31

32 Thank You!! Questions?

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