NPN Silicon SEMICONDUCTOR TECHNICAL DATA MAXIMUM RATINGS THERMAL CHARACTERISTICS(1) ELECTRICAL CHARACTERISTICS (TA = 25 C unless otherwise noted)

Transcription

1 SEMIONDUTOR TEHNIL DT NPN Silicon *Motorola Preferred Device OLLETOR 3 2 BSE 1 EMITTER MXIMUM RTINGS Rating Symbol Value Unit ollector Emitter Voltage VEO 40 Vdc ollector Base Voltage VBO 60 Vdc Emitter Base Voltage VEBO 6.0 Vdc ollector urrent ontinuous I 200 mdc Total Device T = 25 Derate above 25 PD mw mw/ SE 29 04, STYLE 1 TO 92 (TO 226) Total Device T = 25 Derate above 25 PD Watts mw/ Operating and Storage unction Temperature Range THERML HRTERISTIS(1) T, Tstg 55 to +150 haracteristic Symbol Max Unit Thermal Resistance, unction to mbient R 200 /W Thermal Resistance, unction to ase R 83.3 /W ELETRIL HRTERISTIS (T = 25 unless otherwise noted) haracteristic Symbol Min Max Unit OFF HRTERISTIS ollector Emitter Breakdown Voltage (2) V(BR)EO 40 Vdc (I = 1.0 mdc, IB = 0) ollector Base Breakdown Voltage (I = 10 dc, IE = 0) Emitter Base Breakdown Voltage (IE = 10 dc, I = 0) Base utoff urrent (VE = 30 Vdc, VEB = 3.0 Vdc) ollector utoff urrent (VE = 30 Vdc, VEB = 3.0 Vdc) V(BR)BO 60 Vdc V(BR)EBO 6.0 Vdc IBL 50 ndc IEX 50 ndc 1. Indicates Data in addition to EDE Requirements. 2. Pulse Test: Pulse Width 300 s; Duty ycle 2.0%. Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 2 3

2 ELETRIL HRTERISTIS (T = 25 unless otherwise noted) (ontinued) haracteristic Symbol Min Max Unit ON HRTERISTIS D urrent Gain(1) (I = 0.1 mdc, VE = 1.0 Vdc) 2N3903 2N3904 hfe (I = 1.0 mdc, VE = 1.0 Vdc) 2N3903 2N (I = 10 mdc, VE = 1.0 Vdc) 2N3903 2N (I = 50 mdc, VE = 1.0 Vdc) 2N3903 2N (I = 100 mdc, VE = 1.0 Vdc) 2N3903 2N ollector Emitter Saturation Voltage(1) (I = 10 mdc, IB = 1.0 mdc) (I = 50 mdc, IB = 5.0 mdc Base Emitter Saturation Voltage(1) (I = 10 mdc, IB = 1.0 mdc) (I = 50 mdc, IB = 5.0 mdc) SMLL SIGNL HRTERISTIS urrent Gain Bandwidth Product (I = 10 mdc, VE = 20 Vdc, f = 100 MHz) Output apacitance (VB = 5.0 Vdc, IE = 0, f = 1.0 MHz) Input apacitance (VEB = 0.5 Vdc, I = 0, f = 1.0 MHz) Input Impedance (I = 1.0 mdc, VE = 10 Vdc, f = 1.0 khz) Voltage Feedback Ratio (I = 1.0 mdc, VE = 10 Vdc, f = 1.0 khz) Small Signal urrent Gain (I = 1.0 mdc, VE = 10 Vdc, f = 1.0 khz) Output dmittance (I = 1.0 mdc, VE = 10 Vdc, f = 1.0 khz) 2N3903 2N3904 2N3903 2N3904 2N3903 2N3904 2N3903 2N3904 VE(sat) VBE(sat) ft Vdc Vdc MHz obo 4.0 pf ibo 8.0 pf hie hre hfe k Ω X 10 4 hoe mhos Noise Figure (I = 100 dc, VE = 5.0 Vdc, RS = 1.0 k Ω, f = 1.0 khz) SWITHING HRTERISTIS 2N3903 2N3904 Delay Time (V = 3.0 Vdc, VBE = 0.5 Vdc, td 35 ns Rise Time I = 10 mdc, IB1 = 1.0 mdc) tr 35 ns Storage Time (V = 3.0 Vdc, I = 10 mdc, 2N3903 IB1 = IB2 = 1.0 mdc) 2N3904 NF ts Fall Time tf 50 ns 1. Pulse Test: Pulse Width 300 s; Duty ycle 2.0% db ns 2 4

3 DUTY YLE = 2% 300 ns V +3 V < t1 < 500 s DUTY YLE = 2% t V +3 V V < 1 ns 10 k S < 4 pf* 0 10 k 1N916 S < 4 pf* 9.1 V < 1 ns * Total shunt capacitance of test jig and connectors Figure 1. Delay and Rise Time Equivalent Test ircuit Figure 2. Storage and Fall Time Equivalent Test ircuit TYPIL TRNSIENT HRTERISTIS T = 25 T = 125 PITNE (pf) ibo obo REVERSE BIS VOLTGE (VOLTS) Figure 3. apacitance Q, HRGE (p) V = 40 V I/IB = 10 QT I, OLLETOR URRENT (m) Figure 4. harge Data Q 2 5

4 f I/IB = V = 40 V I/IB = 10 TIME (ns) V 10 7 VOB = 0 V 2.0 V I, OLLETOR URRENT (m) Figure 5. Turn On Time V = 3.0 V 40 V t, RISE TIME (ns) r I, OLLETOR URRENT (m) Figure 6. Rise Time t, STORGE TIME (ns) s I/IB = 20 I/IB = 10 t s = ts 1/8 tf IB1 = IB2 I/IB = 20 I/IB = 10 t, FLL TIME (ns) I/IB = 10 I/IB = 20 V = 40 V IB1 = IB I, OLLETOR URRENT (m) Figure 7. Storage Time I, OLLETOR URRENT (m) Figure 8. Fall Time TYPIL UDIO SMLL SIGNL HRTERISTIS NOISE FIGURE VRITIONS (VE = 5.0 Vdc, T = 25, Bandwidth = 1.0 Hz) NF, NOISE FIGURE (db) SOURE RESISTNE = 200 I = 1.0 m SOURE RESISTNE = 200 I = 0.5 m SOURE RESISTNE = 1.0 k I = 50 NF, NOISE FIGURE (db) f = 1.0 khz I = 0.5 m I = 1.0 m I = 50 I = SOURE RESISTNE = 500 I = f, FREQUENY (khz) Figure RS, SOURE RESISTNE (k OHMS) Figure

5 h PRMETERS (VE = 10 Vdc, f = 1.0 khz, T = 25 ) h fe, URRENT GIN I, OLLETOR URRENT (m) Figure 11. urrent Gain h oe, OUTPUT DMITTNE ( mhos) I, OLLETOR URRENT (m) Figure 12. Output dmittance h ie, INPUT IMPEDNE (k OHMS) h, VOLTGE FEEDB RTIO (X 10 4 re ) I, OLLETOR URRENT (m) I, OLLETOR URRENT (m) 10 Figure 13. Input Impedance Figure 14. Voltage Feedback Ratio TYPIL STTI HRTERISTIS h FE, D URRENT GIN (NORMLIZED) T = VE = 1.0 V I, OLLETOR URRENT (m) Figure 15. D urrent Gain 2 7

6 V E, OLLETOR EMITTER VOLTGE (VOLTS) I = 1.0 m T = m 30 m 100 m IB, BSE URRENT (m) Figure 16. ollector Saturation Region T = 25 I/IB = TO +125 V, VOLTGE (VOLTS) I/IB =10 VE =1.0 V OEFFIIENT (mv/ ) V FOR VE(sat) VB FOR VBE(sat) 55 TO TO TO I, OLLETOR URRENT (m) I, OLLETOR URRENT (m) 200 Figure 17. ON Voltages Figure 18. Temperature oefficients 2 8

7 EMBOSSED TPE ND REEL SOT-23, S-59, S-70/SOT-323, S 90/SOT 416, SOT-223 and SO-16 packages are available only in Tape and Reel. Use the appropriate suffix indicated below to order any of the SOT-23, S-59, S-70/SOT-323, SOT-223 and SO-16 packages. (See Section 6 on Packaging for additional information). SOT-23: S-59: S-70/ SOT-323: SOT-223: SO-16: available in 8 mm Tape and Reel Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel. Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel. available in 8 mm Tape and Reel Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel. Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel. available in 8 mm Tape and Reel Use the device title (which already includes the T1 suffix) to order the 7 inch/3000 unit reel. Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/10,000 unit reel. available in 12 mm Tape and Reel Use the device title (which already includes the T1 suffix) to order the 7 inch/1000 unit reel. Replace the T1 suffix in the device title with a T3 suffix to order the 13 inch/4000 unit reel. available in 16 mm Tape and Reel dd an R1 suffix to the device title to order the 7 inch/500 unit reel. dd an R2 suffix to the device title to order the 13 inch/2500 unit reel. RDIL TPE IN FN FOLD BOX OR REEL TO-92 packages are available in both bulk shipments and in Radial Tape in Fan Fold Boxes or Reels. Fan Fold Boxes and Radial Tape Reel are the best methods for capturing devices for automatic insertion in printed circuit boards. TO-92: available in Fan Fold Box dd an RLR suffix and the appropriate Style code* to the device title to order the Fan Fold box. available in 365 mm Radial Tape Reel dd an RLR suffix and the appropriate Style code* to the device title to order the Radial Tape Reel. *Refer to Section 6 on Packaging for Style code characters and additional information on ordering *requirements. DEVIE MRINGS/DTE ODE HRTERS SOT-23, S-59, S-70/SOT-323, and the S 90/SOT 416 packages have a device marking and a date code etched on the device. The generic example below depicts both the device marking and a representation of the date code that appears on the S-70/SOT-323, S-59 and SOT-23 packages. BD The D represents a smaller alpha digit Date ode. The Date ode indicates the actual month in which the part was manufactured. 2 2

8 Tape and Reel Specifications and Packaging Specifications Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure cavity for the product when sealed with the peel back cover tape. Two Reel Sizes vailable (7 and 13 ) Used for utomatic Pick and Place Feed Systems Minimizes Product Handling EI 481, 1, 2 SOD 123, S 59, S 70/SOT 323, S 70ML/SOT 363, SOT 23, TSOP 6, in 8 mm Tape SOT 223 in 12 mm Tape SO 14, SO 16 in 16 mm Tape Use the standard device title and add the required suffix as listed in the option table on the following page. Note that the individual reels have a finite number of devices depending on the type of product contained in the tape. lso note the minimum lot size is one full reel for each line item, and orders are required to be in increments of the single reel quantity. SOD mm S 59, S 70/SOT 323, SOT 23 8 mm S 70ML/SOT 363, TSOP 6 T1 ORIENTTION 8 mm SOT mm SO 14, mm S 70ML/SOT 363 T2 ORIENTTION 8 mm DIRETION OF FEED Package EMBOSSED TPE ND REEL ORDERING INFORMTION Tape Width (mm) Pitch mm (inch) Reel Size mm (inch) Devices Per Reel and Minimum Order Quantity S ± 0.1 (.157 ±.004) 178 (7) 3,000 T1 S 70/SOT ± 0.1 (.157 ±.004) 178 (7) 3,000 T (13) 10,000 T3 SO ± 0.1 (.315 ±.004) 178 (7) 500 R (13) 2,500 R2 SO ± 0.1 (.315 ±.004) 178 (7) 500 R (13) 2,500 R2 SOD ± 0.1 (.157 ±.004) 178 (7) 3,000 T (13) 10,000 T3 SOT ± 0.1 (.157 ±.004) 178 (7) 3,000 T (13) 10,000 T3 SOT ± 0.1 (.315 ±.004) 178 (7) 1,000 T (13) 4,000 T3 S 70ML/SOT ± 0.1 (.157 ±.004) 178 (7) 3,000 T (7) 3,000 T2 TSOP ± 0.1 (.157 ±.004) 178 (7) 3,000 T1 Device Suffix Tape and Reel Specifications 6 2

9 EMBOSSED TPE ND REEL DT FOR DISRETES RRIER TPE SPEIFITIONS t D P0 P2 10 Pitches umulative Tolerance on Tape ± 0.2 mm (± ) Top over Tape 0 E F W B1 0 B0 See Note 1 P Embossment enter Lines of avity D1 For omponents 2.0 mm x 1.2 mm and Larger For Machine Reference Only Including Draft and RDII oncentric round B0 User Direction of Feed 10 Bending Radius Maximum omponent Rotation R Min Tape and omponents Shall Pass round Radius R Without Damage Bar ode Label 100 mm (3.937 ) Embossed arrier 1 mm Max * Top over Tape Thickness (t1) 0.10 mm (.004 ) Max. Embossment Typical omponent avity enter Line Tape Typical omponent enter Line 1 mm (.039 ) Max 250 mm (9.843 ) amber (Top View) llowable amber To Be 1 mm/100 mm Nonaccumulative Over 250 mm DIMENSIONS Tape Size B 1 Max D D 1 E F P 0 P 2 R Min T Max W Max 8mm 4.55 mm (.179 ) 12 mm 8.2 mm (.323 ) 16 mm 12.1 mm (.476 ) 24 mm 20.1 mm (.791 ) mm 0.0 ( ) 1.0 Min (.039 ) 1.5 mm Min (.060 ) 1.75 ± 0.1mm (.069 ±.004 ) 3.5 ± 0.05 mm (.138 ±.002 ) 5.5 ± 0.05 mm (.217 ±.002 ) 7.5 ± 0.10 mm (.295 ±.004 ) 11.5 ± 0.1 mm (.453 ±.004 ) 2.4 mm Max (.094 ) 6.4 mm Max (.252 ) 7.9 mm Max (.311 ) 11.9 mm Max (.468 ) 4.0 ± 0.1mm (.157 ±.004 ) 2.0 ± 0.1mm (.079 ±.002 ) 25 mm (.98 ) 30 mm (1.18 ) 0.6mm (.024 ) 8.3 mm (.327 ) 12 ±.30 mm (.470 ±.012 ) Metric dimensions govern English are in parentheses for reference only. NOTE 1: 0, B 0, and 0 are determined by component size. The clearance between the components and the cavity must be within.05 mm min. to.50 mm max., NOTE 1: the component cannot rotate more than 10 within the determined cavity. NOTE 2: If B 1 exceeds 4.2 mm (.165) for 8 mm embossed tape, the tape may not feed through all tape feeders. NOTE 3: Pitch information is contained in the Embossed Tape and Reel Ordering Information on pg mm (.642 ) 24.3 mm (.957 ) Tape and Reel Specifications 6 3

10 EMBOSSED TPE ND REEL DT FOR DISRETES T Max Outside Dimension Measured at Edge 1.5 mm Min (.06 ) 13.0 mm ± 0.5 mm (.512 ±.002 ) 20.2 mm Min (.795 ) 50 mm Min (1.969 ) Full Radius G Inside Dimension Measured Near Hub Size Max G T Max 8 mm 330 mm ( ) 12 mm 330 mm ( ) 16 mm 360 mm ( ) 24 mm 360 mm ( ) 8.4 mm mm, 0.0 ( , 0.00) 12.4 mm mm, 0.0 ( , 0.00) 16.4 mm mm, 0.0 ( , 0.00) 24.4 mm mm, 0.0 ( , 0.00) 14.4 mm (.56 ) 18.4 mm (.72 ) 22.4 mm (.882 ) 30.4 mm (1.197 ) Reel Dimensions Metric Dimensions Govern English are in parentheses for reference only Tape and Reel Specifications 6 4

11 TO 92 EI, IE, EI Radial Tape in Fan Fold Box or On Reel Radial tape in fan fold box or on reel of the reliable TO 92 package are the best methods of capturing devices for automatic insertion in printed circuit boards. These methods of taping are compatible with various equipment for active and passive component insertion. vailable in Fan Fold Box vailable on 365 mm Reels ccommodates ll Standard Inserters llows Flexible ircuit Board Layout 2.5 mm Pin Spacing for Soldering EI 468, IE 286 2, EI R1008B TO 92 RDIL TPE IN FN FOLD BOX OR ON REEL Ordering Notes: When ordering radial tape in fan fold box or on reel, specify the style per Figures 3 through 8. dd the suffix RLR and Style to the device title, i.e. MPS3904RLR. This will be a standard MPS3904 radial taped and supplied on a reel per Figure 9. Fan Fold Box Information Order in increments of Reel Information Order in increments of US/European Suffix onversions US RLR RLRE RLRM EUROPE RL RL1 ZL1 Packaging Specifications 6 5

12 TO 92 EI RDIL TPE IN FN FOLD BOX OR ON REEL H2 H2 H2B H2B H W2 H4 H5 L L1 H1 W1 W T1 T F1 F2 T2 P2 P2 D P1 P Figure 1. Device Positioning on Tape Specification Inches Millimeter Symbol Item Min Max Min Max D Tape Feedhole Diameter D2 omponent Lead Thickness Dimension F1, F2 omponent Lead Pitch H Bottom of omponent to Seating Plane H1 Feedhole Location H2 Deflection Left or Right H2B Deflection Front or Rear H4 Feedhole to Bottom of omponent H5 Feedhole to Seating Plane L Defective Unit lipped Dimension L1 Lead Wire Enclosure P Feedhole Pitch P1 Feedhole enter to enter Lead P2 First Lead Spacing Dimension T dhesive Tape Thickness T1 Overall Taped Package Thickness T2 arrier Strip Thickness W arrier Strip Width W1 dhesive Tape Width W2 dhesive Tape Position Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. omponent lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and Maximum non cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes. Packaging Specifications 6 6

13 TO 92 EI RDIL TPE IN FN FOLD BOX OR ON REEL FN FOLD BOX STYLES DHESIVE TPE ON TOP SIDE FLT SIDE ÇÇ Ç ÇÇ RRIER STRIP DHESIVE TPE ON TOP SIDE ROUNDED SIDE RRIER STRIP 330 mm 13 MX 252 mm 9.92 MX FLT SIDE OF TRNSISTOR ND DHESIVE TPE VISIBLE. Style M fan fold box is equivalent to styles E and F of reel pack dependent on feed orientation from box. ROUNDED SIDE OF TRNSISTOR ND DHESIVE TPE VISIBLE. Style P fan fold box is equivalent to styles and B of reel pack dependent on feed orientation from box. 58 mm 2.28 MX Figure 2. Style M Figure 3. Style P Figure 4. Fan Fold Box Dimensions DHESION PULL TESTS 500 GRM PULL FORE 100 GRM PULL FORE 70 GRM PULL FORE 16 mm 16 mm HOLDING FIXTURE The component shall not pull free with a 300 gram load applied to the leads for 3 ± 1 second. HOLDING FIXTURE The component shall not pull free with a 70 gram load applied to the leads for 3 ± 1 second. HOLDING FIXTURE There shall be no deviation in the leads and no component leads shall be pulled free of the tape with a 500 gram load applied to the component body for 3 ± 1 second. Figure 5. Test #1 Figure 6. Test #2 Figure 7. Test #3 Packaging Specifications 6 7

14 TO 92 EI RDIL TPE IN FN FOLD BOX OR ON REEL REEL STYLES RBOR HOLE DI. 30.5mm ± 0.25mm ORE DI. 82mm ± 1mm MRING NOTE HUB REESS 76.2mm ± 1mm REESS DEPTH 9.5mm MIN 365mm + 3, 0mm 48 mm MX 38.1mm ± 1mm Material used must not cause deterioration of components or degrade lead solderability Figure 8. Reel Specifications DHESIVE TPE ON REVERSE SIDE RRIER STRIP DHESIVE TPE ROUNDED SIDE RRIER STRIP FLT SIDE FEED FEED Rounded side of transistor and adhesive tape visible. Figure 9. Style Flat side of transistor and carrier strip visible (adhesive tape on reverse side). Figure 10. Style B DHESIVE TPE ON REVERSE SIDE RRIER STRIP DHESIVE TPE FLT SIDE RRIER STRIP ROUNDED SIDE FEED FEED Flat side of transistor and adhesive tape visible. Figure 11. Style E Rounded side of transistor and carrier strip visible (adhesive tape on reverse side). Figure 12. Style F Packaging Specifications 6 8

15 INFORMTION FOR USING SURFE MOUNT PGES REOMMENDED FOOTPRINTS FOR SURFE MOUNTED PPLITIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. POWER DISSIPTION FOR SURFE MOUNT DEVIE The power dissipation for a surface mount device is a function of the drain/collector pad size. These can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T(max), the maximum rated junction temperature of the die, Rθ, the thermal resistance from the device junction to ambient, and the operating temperature, T. Using the values provided on the data sheet, PD can be calculated as follows: PD = T(max) T Rθ The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature T of 25, one can calculate the power dissipation of the device. For example, for a SOT 223 device, PD is calculated as follows. PD = /W = 800 milliwatts The 156 /W for the SOT 223 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 800 milliwatts. There are other alternatives to achieving higher power dissipation from the surface mount packages. One is to increase the area of the drain/collector pad. By increasing the area of the drain/collector pad, the power dissipation can be increased. lthough the power dissipation can almost be doubled with this method, area is taken up on the printed circuit board which can defeat the purpose of using surface mount technology. For example, a graph of Rθ versus drain pad area is shown in Figure 1. nother alternative would be to use a ceramic substrate or an aluminum core board such as Thermal lad. Using a board material such as Thermal lad, an aluminum core board, the power dissipation can be doubled using the same footprint. R θ, THERML RESISTNE, UNTION TO MBIENT ( /W) Board Material = G 10/FR 4, 2 oz opper 0.8 Watts T = Watts* 1.5 Watts *Mounted on the DP footprint , RE (SQURE INHES) Figure 1. Thermal Resistance versus Drain Pad rea for the SOT 223 Package (Typical) SOLDER STENIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically inches thick and may be made of brass or stainless steel. For packages such as the SOT 23, S 59, S 70/SOT 323, S 90/SOT 416, SOD 123, SOT 223, SOT 363, SO 14, SO 16, and TSOP 6 packages, the stencil opening should be the same as the pad size or a 1:1 registration. Surface Mount Information 7 10

16 The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. lways preheat the device. The delta temperature between the preheat and soldering should be 100 or less.* When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating profile for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 2 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the SOLDERING PREUTIONS TYPIL SOLDER HETING PROFILE The soldering temperature and time should not exceed 260 for more than 10 seconds. When shifting from preheating to soldering, the maximum temperature gradient shall be 5 or less. fter soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used since the use of forced cooling will increase the temperature gradient and will result in latent failure due to mechanical stress. Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. 200 STEP 1 PREHET ZONE 1 RMP STEP 2 VENT SO STEP 3 HETING ZONES 2 & 5 RMP DESIRED URVE FOR HIGH MSS SSEMBLIES STEP 4 HETING ZONES 3 & 6 SO 160 STEP 5 HETING ZONES 4 & 7 SPIE 170 STEP 6 VENT STEP 7 OOLING 205 TO 219 PE T SOLDER OINT SOLDER IS LIQUID FOR 40 TO 80 SEONDS (DEPENDING ON MSS OF SSEMBLY) 50 DESIRED URVE FOR LOW MSS SSEMBLIES TIME (3 TO 7 MINUTES TOTL) TMX Figure 2. Typical Solder Heating Profile Surface Mount Information 7 11

17 Footprints for Soldering inches mm inches mm S 59 SOT inches mm 0.5 min. (3x) 0.5 min. (3x) S 70/SOT 323 SOT 416/S inches mm inches mm SOT 223 SO 14, SO 16 Surface Mount Information 7 12

18 0.5 mm (min) É É É mm inches 0.4 mm (min) 0.65 mm 0.65 mm 1.9 mm SOD 123 SOT 363 (S 70 6 LED) TSOP inches mm Surface Mount Information 7 13

19 Package Outline Dimensions Dimensions are in inches unless otherwise noted. SETING PLNE R X X 1 H V N F G P N L B D SETION X X 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: INH. 3. ONTOUR OF PGE BEYOND DIMENSION R IS UNONTROLLED. 4. DIMENSION F PPLIES BETWEEN P ND L. DIMENSION D ND PPLY BETWEEN L ND MINIMUM. LED DIMENSION IS UNONTROLLED IN P ND BEYOND DIMENSION MINIMUM. INHES MILLIMETERS B D F G H L N P R V STYLE 1: PIN 1. EMITTER 2. BSE 3. OLLETOR STYLE 2: PIN 1. BSE 2. EMITTER 3. OLLETOR STYLE 3: PIN 1. NODE 2. NODE 3. THODE STYLE 4: PIN 1. THODE 2. THODE 3. NODE STYLE 5: PIN 1. DRIN 2. SOURE 3. GTE STYLE 7: PIN 1. SOURE 2. DRIN 3. GTE STYLE 14: PIN 1. EMITTER 2. OLLETOR 3. BSE STYLE 15: PIN 1. NODE 1 2. THODE 3. NODE 2 STYLE 17: PIN 1. OLLETOR 2. BSE 3. EMITTER STYLE 21: PIN 1. OLLETOR 2. EMITTER 3. BSE STYLE 22: PIN 1. SOURE 2. GTE 3. DRIN STYLE 30: PIN 1. DRIN 2. GTE 3. SOURE SE (TO 226) TO 92 PLSTI R F X X H V N G P N L B SETING PLNE D SETION X X 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: INH. 3. ONTOUR OF PGE BEYOND DIMENSION R IS UNONTROLLED. 4. DIMENSION F PPLIES BETWEEN P ND L. DIMENSIONS D ND PPLY BETWEEN L ND MIMIMUM. LED DIMENSION IS UNONTROLLED IN P ND BEYOND DIMENSION MINIMUM. INHES MILLIMETERS B D F G H L N P R V STYLE 1: PIN 1. EMITTER 2. BSE 3. OLLETOR STYLE 14: PIN 1. EMITTER 2. OLLETOR 3. BSE STYLE 22: PIN 1. SOURE 2. GTE 3. DRIN SE (TO 226E) TO 92 1 WTT PLSTI Package Outline Dimensions 8 2

20 PGE OUTLINE DIMENSIONS (continued) B D F 1. PGE ONTOUR OPTIONL WITHIN DI B ND LENGTH. HET SLUGS, IF NY, SHLL BE INLUDED WITHIN THIS YLINDER, BUT SHLL NOT BE SUBET TO THE MIN LIMIT OF DI B. 2. LED DI NOT ONTROLLED IN ZONES F, TO LLOW FOR FLSH, LED FINISH BUILDUP, ND MINOR IRREGULRITIES OTHER THN HET SLUGS. F MILLIMETERS INHES B D F ll EDE dimensions and notes apply. SE (DO 204) DO 7 SETING PLNE P R F D X X H 1 2 G V N L B D ÉÉ SETION X X 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: INH. 3. ONTOUR OF PGE BEYOND ZONE R IS UNONTROLLED. 4. DIMENSION F PPLIES BETWEEN P ND L. DIMENSIONS D ND PPLY BETWEEN L ND MINIMUM. LED DIMENSION IS UNONTROLLED IN P ND BEYOND DIM MINIMUM. INHES MILLIMETERS B D F G BS 1.27 BS H BS 3.54 BS L N P R V N STYLE 1: PIN 1. NODE 2. THODE SE (T0 226) TO 92 PLSTI Package Outline Dimensions 8 3

21 PGE OUTLINE DIMENSIONS (continued) L 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: INH. 3. MXIUMUM LED THINESS INLUDES LED FINISH THINESS. MINIMUM LED THINESS IS THE MINIMUM THINESS OF BSE MTERIL. V D G H B S INHES MILLIMETERS B D G H L S V STYLE 6: PIN 1. BSE 2. EMITTER 3. OLLETOR STYLE 8: PIN 1. NODE 2. NO ONNETION 3. THODE STYLE 9: PIN 1. NODE 2. NODE 3. THODE STYLE 10: PIN 1. DRIN 2. SOURE 3. GTE STYLE 11: PIN 1. NODE 2. THODE 3. THODE NODE STYLE 12: PIN 1. THODE 2. THODE 3. NODE STYLE 18: PIN 1. NO ONNETION 2. THODE 3. NODE STYLE 19: PIN 1. THODE 2. NODE 3. THODE NODE STYLE 21: PIN 1. GTE 2. SOURE 3. DRIN SE (TO 236B) SOT 23 PLSTI L 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: MILLIMETER. S 2 3 G 1 D B MILLIMETERS INHES B D G H L S H STYLE 1: PIN 1. EMITTER 2. BSE 3. OLLETOR STYLE 2: PIN 1. N.. 2. NODE 3. THODE STYLE 3: PIN 1. NODE 2. NODE 3. THODE STYLE 4: PIN 1. N.. 2. THODE 3. NODE STYLE 5: PIN 1. THODE 2. THODE 3. NODE SE 318D 04 S 59 Package Outline Dimensions 8 4

22 PGE OUTLINE DIMENSIONS (continued) 0.08 (0003) L S H G F D B M 3. DIMENSIONING ND TOLERNING PER NSI 4. ONTROLLING DIMENSION: INH. INHES MILLIMETERS B D F G H L M S STYLE 1: PIN 1. BSE 2. OLLETOR 3. EMITTER 4. OLLETOR STYLE 2: PIN 1. NODE 2. THODE 3. N 4. THODE STYLE 3: PIN 1. GTE 2. DRIN 3. SOURE 4. DRIN SE 318E 04 SOT 223 S L B 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: MILLIMETER. 3. MXIMUM LED THINESS INLUDES LED FINISH THINESS. MINIMUM LED THINESS IS THE MINIMUM THINESS OF BSE MTERIL (0.002) G H D M MILLIMETERS INHES B D G H L M S STYLE 1: PIN 1. DRIN 2. DRIN 3. GTE 4. SOURE 5. DRIN 6. DRIN SE 318G 02 TSOP 6 PLSTI Package Outline Dimensions 8 5

23 PGE OUTLINE DIMENSIONS (continued) 0.05 (0.002) V S H L G B D R N 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: INH. INHES MILLIMETERS B D G H REF REF L BS BS N REF REF R S V STYLE 2: PIN 1. NODE 2. N.. 3. THODE STYLE 3: PIN 1. BSE 2. EMITTER 3. OLLETOR STYLE 4: PIN 1. THODE 2. THODE 3. NODE STYLE 5: PIN 1. NODE 2. NODE 3. THODE STYLE 7: PIN 1. BSE 2. EMITTER 3. OLLETOR STYLE 9: PIN 1. NODE 2. THODE 3. THODE NODE STYLE 10: PIN 1. THODE 2. NODE 3. NODE THODE SE S 70/SOT 323 G V 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: INH. S B D 6 PL 0.2 (0.008) M B M INHES MILLIMETERS B D G BS 0.65 BS H N REF 0.20 REF S V N STYLE 1: PIN 1. EMITTER 2 2. BSE 2 3. OLLETOR 1 4. EMITTER 1 5. BSE 1 6. OLLETOR 2 H STYLE 6: PIN 1. NODE 2 2. N/ 3. THODE 1 4. NODE 1 5. N/ 6. THODE 2 SE 419B-01 SOT 363 Package Outline Dimensions 8 6

24 PGE OUTLINE DIMENSIONS (continued) 1 ÂÂÂ ÂÂÂ 2 D B H E 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: INH. INHES MILLIMETERS B D E H STYLE 1: PIN 1. THODE 2. NODE SE SOD 123 S D 3 PL 0.20 (0.008) M B G B 0.20 (0.008) 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: MILLIMETER. MILLIMETERS INHES B D G 1.00 BS BS H L S 0.50 BS BS STYLE 1: PIN 1. BSE 2. EMITTER 3. OLLETOR L H STYLE 4: PIN 1. THODE 2. THODE 3. NODE SE SOT 416/S 90 Package Outline Dimensions 8 7

25 PGE OUTLINE DIMENSIONS (continued) F H G D N B SETING PLNE L M 1. LEDS WITHIN 0.13 (0.005) RDIUS OF TRUE POSITION T SETING PLNE T MXIMUM MTERIL ONDITION. 2. DIMENSION L TO ENTER OF LEDS WHEN FORMED PRLLEL. 3. DIMENSION B DOES NOT INLUDE MOLD FLSH. 4. ROUNDED ORNERS OPTIONL. INHES MILLIMETERS B D F G BS 2.54 BS H L BS 7.62 BS M N SE PIN DIP PLSTI H G F 9 D 16 PL B S 0.25 (0.010) M T SETING T PLNE M L M 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: INH. 3. DIMENSION L TO ENTER OF LEDS WHEN FORMED PRLLEL. 4. DIMENSION B DOES NOT INLUDE MOLD FLSH. 5. ROUNDED ORNERS OPTIONL. INHES MILLIMETERS B D F G BS 2.54 BS H BS 1.27 BS L M S SE PIN DIP PLSTI Package Outline Dimensions 8 8

26 PGE OUTLINE DIMENSIONS (continued) B P 7 PL 0.25 (0.010) M B M 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS ND B DO NOT INLUDE MOLD PROTRUSION. 4. MXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INLUDE DMBR PROTRUSION. LLOWBLE DMBR PROTRUSION SHLL BE (0.005) TOTL IN EXESS OF THE D DIMENSION T MXIMUM MTERIL ONDITION. T SETING PLNE G D 14 PL 0.25 (0.010) M T B S S R X 45 M F MILLIMETERS INHES B D F G 1.27 BS BS M P R SE SO 14 PLSTI T SETING PLNE G B D 16 PL 0.25 (0.010) M T B S S P 8 PL 0.25 (0.010) M B S M R X 45 F 1. DIMENSIONING ND TOLERNING PER NSI 2. ONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS ND B DO NOT INLUDE MOLD PROTRUSION. 4. MXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INLUDE DMBR PROTRUSION. LLOWBLE DMBR PROTRUSION SHLL BE (0.005) TOTL IN EXESS OF THE D DIMENSION T MXIMUM MTERIL ONDITION. MILLIMETERS INHES B D F G 1.27 BS BS M P R SE 751B 05 SO 16 PLSTI Package Outline Dimensions 8 9