LMUN2211LT1G SERIES. NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network LESHAN RADIO COMPANY, LTD.
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- Bartholomew Boyd
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1 NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network This new series of digital transistors is designed to replace a single device and its external resistor bias network. The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space. The device is housed in the SOT-23 package which is designed for low power surface mount applications. Simplifies Circuit Design Reduces Board Space and Component Count The SOT-23 package can be soldered using wave or reflow. The modified gull-winged leads absorb thermal stress during soldering eliminating the possibility of damage to the die. Available in 8 mm embossed tape and reel. Use the Device Number to order the 7 inch/3 unit reel. Replace T with T3 in the Device Number to order the3 inch/, unit reel. MAXIMUM RATINGS (TA = unless otherwise noted) Rating Symbol Value Unit Collector-Base Voltage V CBO 5 Vdc Collector-Emitter Voltage V CEO 5 Vdc Collector Current I C madc Total Power T A = (Note.) Derate above DEVICE MARKING AND RESISTOR VALUES P D *246.5 mw C/W Device Marking R(K) R2(K) LMUN22LTG A8A LMUN222LTG A8B LMUN223LTG A8C LMUN224LTG A8D 47 LMUN225LTG A8E LMUN226LTG A8F 4.7 LMUN223LTG A8G.. LMUN223LTG A8H LMUN2232LTG A8J LMUN2233LTG A8K LMUN2234LTG A8L LMUN2235LTG A8M LMUN2238LTG A8R 2.2 LMUN224LTG A8U. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. LMUN22LTG SERIES UN22LT Series PIN BASE (INPUT) R 2 R 2 3 SOT23 (TO236AB) PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) Pb Free Package May be Available. The G Suffix Denotes a Pb Free Lead Finish Ordering Information Device Package Shipping LMUN22XXLTG SOT23 3/Tape&Reel LMUN22XXLT3G SOT23 ORDERING INFORMATION Device Package Shipping /Tape&Reel LMUN22LTG SOT23 3/Tape & Reel LMUN222LTG SOT23 3/Tape & Reel LMUN223LTG SOT23 3/Tape & Reel LMUN224LTG SOT23 3/Tape & Reel LMUN225LTG SOT23 3/Tape & Reel LMUN226LTG SOT23 3/Tape & Reel LMUN223LTG SOT23 3/Tape & Reel LMUN223LTG SOT23 3/Tape & Reel LMUN2232LTG SOT23 3/Tape & Reel LMUN2233LTG SOT23 3/Tape & Reel LMUN2234LTG SOT23 3/Tape & Reel LMUN2235LTG SOT23 3/Tape & Reel LMUN2238LTG SOT23 3/Tape & Reel LMUN224LTG SOT23 3/Tape & Reel /
2 LMUN22LTG Series THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance Junction-to-Ambient (Note.) R θja 58 C/W Operating and Storage Temperature Range T J,T stg 55 to +5 C Maximum Temperature for Soldering Purposes, Time in Solder Bath T L 26 C Sec ELECTRICAL CHARACTERISTICS (TA = unless otherwise noted) OFF CHARACTERISTICS Characteristic Symbol Min Typ Max Unit Collector-Base Cutoff Current (V CB = 5 V, I E = ) I CBO nadc Collector-Emitter Cutoff Current (V CE = 5 V, I B = ) I CEO 5 nadc Emitter-Base Cutoff Current LMUN22LTG (V EB = 6. V, I C = ) LMUN222LTG LMUN223LTG LMUN224LTG LMUN225LTG LMUN226LTG LMUN223LTG LMUN223LTG LMUN2232LTG LMUN2233LTG LMUN2234LTG LMUN2235LTG LMUN2238LTG LMUN224LTG I EBO Collector-Base Breakdown Voltage (I C = µa, I E = ) V (BR)CBO 5 Vdc Collector-Emitter Breakdown Voltage (Note 2.), (I C = 2. ma, I B = ) V (BR)CEO 5 Vdc madc ON CHARACTERISTICS (Note 2.) DC Current Gain LMUN22LTG (V CE = V, I C = 5. ma) LMUN222LTG LMUN223LTG LMUN224LTG LMUN225LTG LMUN226LTG LMUN223LTG LMUN223LTG LMUN2232LTG LMUN2233LTG LMUN2234LTG LMUN2235LTG LMUN2238LTG LMUN224LTG Collector-Emitter Saturation Voltage (I C = ma, I B =.3 ma) (I C = ma, I B = 5 ma) LMUN223LTG/LMUN223LTG (I C = ma, I B = ma) LMUN225LTG/LMUN226LTG LMUN2232LTG/LMUN2233LTG/LMUN2234LTG/ LMUN2235LTG/LMUN2238LTG 2. Pulse Test: Pulse Width < 3 µs, Duty Cycle < 2.%. h FE V CE(sat) 5 Vdc 2/
3 LMUN22LTG Series ELECTRICAL CHARACTERISTICS (TA = unless otherwise noted) (Continued) Characteristic Symbol Min Typ Max Unit ON CHARACTERISTICS (Note 3.) Output Voltage (on) (V CC = 5. V, V B = 2.5 V, R L =. k Ω) LMUN22LTG LMUN222LTG LMUN224LTG LMUN225LTG LMUN226LTG LMUN223LTG LMUN223LTG LMUN2232LTG LMUN2233LTG LMUN2234LTG LMUN2235LTG LMUN2238LTG (V CC = 5. V, V B = 3.5 V, R L =. k Ω) LMUN223LTG (V CC = 5. V, V B = 5. V, R L =. k Ω) LMUN224LTG V OL Vdc Output Voltage (off) (V CC = 5. V, V B =.5 V, R L =. k Ω) (V CC = 5. V, V B =.5 V, R L =. k Ω ) LMUN223LTG (V CC = 5. V, V B = 5 V, R L =. k Ω ) LMUN225LTG LMUN226LTG LMUN2233LTG LMUN2238LTG V OH 4.9 Vdc Input Resistor LMUN22LTG LMUN222LTG LMUN223LTG LMUN224LTG LMUN225LTG LMUN226LTG LMUN223LTG LMUN223LTG LMUN2232LTG LMUN2233LTG LMUN2234LTG LMUN2235LTG LMUN2238LTG LMUN224LTG R kω Resistor Ratio LMUN22LT/LMUN222LT/LMUN223LTG LMUN224LTG LMUN225LT/LMUN226LT/LMUN2238LTG LMUN224LTG LMUN223LT/LMUN223LT/LMUN2232LTG LMUN2233LTG LMUN2234LTG LMUN2235LTG R/R Pulse Test: Pulse Width < 3 µs, Duty Cycle < 2.%. 3/
4 TYPICAL ELECTRICAL CHARACTERISTICS LMUN22LTG LMUN22LTG Series PD, POWER DISSIPATION (MILLIWATTS) RθJA= 6/W TA, AMBIENT TEMPERATURE (5 C) Figure. Derating Curve VCE(sat), MAXIMUM COLLECTOR VOLTAGE (VOLTS).. IC/IB = Figure 2. VCE(sat) vs. IC TA = hfe, DC CURRENT GAIN (NORMALIZED) VCE = V TA = Cob, CAPACITANCE (pf) f = MHz le = A TA = VR, REVERSE BIAS VOLTAGE (VOLTS) 5 Figure 3. DC Current Gain Figure 4. Output Capcitance.. TA = VO = V TA = Figure 5. Output Current vs. Input Voltage Figure 6. Input Voltage vs. Output Current 4/
5 TYPICAL ELECTRICAL CHARACTERISTICS LMUN222LTG LMUN22LTG Series VCE(sat), MAXIMUM COLLECTOR VOLTAGE (VOLTS).. IC/IB = TA = hfe, DC CURRENT GAIN (NORMALIZED) VCE = V TA = IC, COLLECTOR CURRENT (ma Figure 7. VCE(sat) vs. IC Figure 8. DC Current Gain Cob, CAPACITANCE (pf) f = MHz le = A TA = VR, REVERSE BIAS VOLTAGE (VOLTS) 5... TA = VO = 5 V Figure 9. Output Capacitance Figure. Output Current vs. Input Voltage VO = V TA = Figure. Input Voltage vs. Output Current 5/
6 TYPICAL ELECTRICAL CHARACTERISTICS LMUN223LTG LMUN22LTG Series VCE(sat), MAXIMUM COLLECTOR VOLTAGE (VOLTS). IC/IB = TA = hfe, DC CURRENT GAIN (NORMALIZED) VCE = V TA = Figure 2. VCE(sat) vs. IC Figure 3. DC Current Gain Cob, CAPACITANCE (pf) f = MHz le = A TA = VR, REVERSE BIAS VOLTAGE (VOLTS) 5.. TA = VO = 5 V Figure 4. Output Capacitance Figure 5. Output Current vs. Input Voltage VO = V TA = Figure 6. Input Voltage vs. Output Current 6/
7 VCE(sat), MAXIMUM COLLECTOR VOLTAGE (VOLTS).. IC/IB = TYPICAL ELECTRICAL CHARACTERISTICS LMUN224LTG TA = hfe, DC CURRENT GAIN (NORMALIZED) LMUN22LTG Series TA = Figure 7. VCE(sat) vs. IC Figure 8. DC Current Gain 4 Cob, CAPACITANCE (pf) f = MHz le = A TA = TA = VO = 5 V VR, REVERSE BIAS VOLTAGE (VOLTS) Figure 9. Output Capacitance Figure 2. Output Current vs. Input Voltage VO = V TA = Figure 2. Input Voltage vs. Output Current 7/
8 TYPICAL ELECTRICAL CHARACTERISTICS LMUN2232LTG LMUN22LTG Series VCE(sat), MAXIMUM COLLECTOR VOLTAGE (VOLTS).. IC/IB = TA = Figure 22. VCE(sat) vs. IC hfe, DC CURRENT GAIN VCE = V TA = Figure 23. DC Current Gain Cob, CAPACITANCE (pf) f = MHz IE = A TA =. TA = VO = 5 V VR, REVERSE BIAS VOLTAGE (VOLTS) Figure 24. Output Capacitance Figure 25. Output Current vs. Input Voltage VO = V TA =. 2 3 Figure 26. Output Voltage vs. Input Current 8/
9 TYPICAL ELECTRICAL CHARACTERISTICS LMUN2233LTG LMUN22LTG Series VCE(sat), MAXIMUM COLLECTOR VOLTAGE (VOLTS).. IC/IB = TA = Figure 27. VCE(sat) vs. IC hfe, DC CURRENT GAIN TA = VCE = V Figure 28. DC Current Gain Cob, CAPACITANCE (pf) f = MHz IE = A TA = VR, REVERSE BIAS VOLTAGE (VOLTS).. TA = VO = 5 V Figure 29. Output Capacitance Figure 3. Output Current vs. Input Voltage VO = V TA = Figure 3. Input Voltage vs. Output Current 9/
10 TYPICAL APPLICATIONS FOR NPN BRTs LMUN22LTG Series µ Figure 32. Level Shifter: Connects 2 or 24 Volt Circuits to Logic Figure 33. Open Collector Inverter: Inverts the Input Signal Figure 34. Inexpensive, Unregulated Current Source /
11 LMUN22LTG Series SOT-23 V D A L 3 2 G H B C S K J NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: INCH. DIM INCHES MILLIMETERS MIN MAX MIN MAX A B C D G H J K L S V inches mm /
12 Tape & Reel and Packaging Specifications for Small-Signal Transistors, FETs and Diodes Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure cavity for the product when sealed with the peelback cover tape. Two Reel Sizes Available (7"and 3",) SOT23, SC7/SOT323, Used for Automatic Pick and Place Feed Systems SC89, SC88/SOT363, SC88A/SOT353, Minimizes Product Handling SOD323, SOD-523 in 8 mm Tape EIA 48,, 2 Use the standard device title and add the required suffix as listed in the option table below (Table ). Note that the individual reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is one full reel for each line item, and orders are required to be in increments of the single reel quantity. SOD mm SC-59, SC-7, SC-75,SOT-23 8 mm SC-88, SOT-363 T Orientation 8 mm SC-88A, SOT-353 T Orientation 8 mm Direction of Feed Typical Reel Orientations Table. EMBOSSED TAPE AND REEL ORDERING INFORMATION Package SOT23 SC7/SOT323 SC89 SC88/SOT-363 SC88A/SOT-353 SOD-323 Tape Width Pitch Reel Size Devices Per Reel Device (mm) mm mm(inch) and Minimum Suffix Order Quantity (7) 3, T 8 33 (3), T (7) 3, T 8 33 (3), T (7) 3, T 8 33 (3), T (7) 3, T 8 33 (3), T (7) 3, T 8 33 (3), T (7) 3, T 8 33 (3), T3 SOD (7) 3, T 8 33 (3), T3
13 EMBOSSED TAPE AND REEL DATA FOR DISCRETES CARRIER TAPE SPECIFICATIONS K t D P P 2 Pitches Cumulative Tolerance on Tape ± mm( ±.8 ) Top Cover Tape A E F W B K See Note B P Embossment Center Lines of Cavity D For Components 2.mm x.2mm and Larger For Machine Reference Only Including Draft and RADII Concentric Around B User Direction of Feed o R Min Bar Code Label Tape and Components Shall Pass Around Radius R Bending Radius Embossed Carrier Without Damage mm Maximum Component Rotation (3.937 ) mm Max Typical Component Cavity Center Line Typical Component Center Line mm(.39 ) Max 25 mm (9.843 ) *Top Cover Tape Thickness(t ).mm (.4 )Max. Tape Embossment Camber (Top View) Allowable Camber To Be mm/ mm Nonaccumulative Over 25 mm DIMENSIONS Tape Size B Max D D E F K P P 2 RMin TMax WMax 8mm 2mm 6mm 24mm 4.55mm (.79 ) 8.2mm (.323 ) 2.mm (.476 ) 2.mm (.79 ).5+.mm -. ( ).Min (.39 ).5mm Min (.6 ).75 ±.mm (.69 ±.4) 3.5 ±.5mm (.38±.2 ) 5.5 ±.5mm (.27 ±.2 ) 7.5 ±.mm (.295 ±.4 ).5 ±.mm (.453 ±.4 ) 2.4mm Max (.94 ) 6.4mm Max (.252 ) 7.9mm Max (.3 ).9mm Max (.468 ) 4. ±.mm (.57 ±.4 ) 2. ±.mm (.79 ±.2 ) 25mm (.98 ) 3mm (.8 ).6mm (.24 ) 8.3mm (.327 ) 2 ±.3mm (.47 ±.2 ) 6.3mm (.642 ) 24.3mm (.957 ) Metric dimensions govern - English are in parentheses for reference only. NOTE : A, B, and K are determined by component size. The clearance between the components and the cavity must be within.5 mm min. to.5 mm max., NOTE 2: the component cannot rotate more than o within the determined cavity. NOTE 3: If B exceeds 4.2 mm (.65 ) for 8 mm embossed tape, the tape may not feed through all tape feeders.
14 EMBOSSED TAPE AND REEL DATA FOR DISCRETES.5mm Min (.6 ) 3.mm ±.5mm (.52 ±.2 ) T Max Outside Dimension Measured at Edge A 2mm Min (.795 ) 5mm Min (.969 ) Full Radius G Inside Dimension Measured Near Hub Size A Max G T Max 8 mm 33mm (2.992 ) 8.4mm+.5mm, -. ( , -.) 4.4mm (.56 ) 2mm 33mm (2.992 ) 2.4mm+2.mm, -. ( , -.) 8.4mm (.72 ) 6mm 36mm (4.73 ) 6.4mm+2.mm, -. ( , -.) 22.4mm (.882 ) 24 mm 36mm (4.73 ) 24.4mm+2.mm, -. ( , -.) 3.4mm (.97 ) Reel Dimensions Metric Dimensions Govern English are in parentheses for reference only Storage Conditions Temperature: 5 to 4 Deg.C (2 to 3 Deg. C is preferred) Humidity: 3 to 8 RH (4 to 6 is preferred ) Recommended Period: One year after manufacturing (This recommended period is for the soldering condition only. The characteristics and reliabilities of the products are not restricted to this limitation)
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