MBR5H100MFST3G NRVB5H100MFST3G. SWITCHMODE Power Rectifiers SCHOTTKY BARRIER RECTIFIERS 5 AMPERES 100 VOLTS
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1 MBRHMFS, NRVBHMFS SWITHMODE Power Rectifiers These state of the art devices have the following features: Features Low Power Loss / High Efficiency New Package Provides apability of Inspection and Probe fter Board Mounting Guardring for Stress Protection Low Forward Voltage Drop 7 Operating Junction Temperature NRVB Prefix for utomotive and Other pplications Requiring Unique Site and ontrol hange Requirements; E Q Qualified and PPP apable These are Pb Free Devices Mechanical : ase: Epoxy, Molded Epoxy Meets Flammability Rating UL in. Lead Finish: % Matte Sn (Tin) Lead and Mounting Surface Temperature for Soldering Purposes: 6 Max. for Seconds Device Meets MSL Requirements MXIMUM RTINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage V RRM V Working Peak Reverse Voltage D Blocking Voltage V RWM V R verage Rectified Forward urrent (Rated V R, T = ) I F(V) Peak Repetitive Forward urrent, (Rated V R,, khz, T = ) I FRM Non Repetitive Peak Surge urrent I FSM (Surge pplied at Rated Load onditions Halfwave, Single Phase, 6 Hz) Storage Temperature Range T stg 6 to +7 Operating Junction Temperature T J to +7 Voltage Rate of hange dv/dt, V/ s (Rated V R ) Unclamped Inductive Switching Energy ( mh Inductor, Non repetitive) ESD Rating (Human Body Model) ESD Rating (Machine Model) E S mj Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating onditions is not implied. Extended exposure to stresses above the Recommended Operating onditions may affect device reliability. B SHOTTKY BRRIER RETIFIERS MPERES VOLTS ORDERING INFORMTION Device Package Shipping MBRHMFSTG,,,6 BH T LED SE 88 STYLE Not Used YWZZ BH = Specific Device ode = ssembly Location Y = Year W = Work Week ZZ = Lot Traceability MBRHMFSTG NRVBHMFSTG NRVBHMFSTG MRKING DIGRM / / / / For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8/D. Semiconductor omponents Industries, LL, May, Rev. Publication Order Number: MBRHMFS/D
2 MBRHMFS, NRVBHMFS THERML HRTERISTIS haracteristic Symbol Typ Max Unit Thermal Resistance, Junction to ase, Steady State (ssumes 6 mm oz. copper bond pad, on a FR board) ELETRIL HRTERISTIS Instantaneous Forward Voltage (Note ) (i F = mps, T J = ) (i F = mps, T J = ) Instantaneous Reverse urrent (Note ) (Rated dc Voltage, T J = ) (Rated dc Voltage, T J = ). Pulse Test: Pulse Width = s, Duty ycle.%. R θj. /W v F.6.6 i R V m
3 MBRHMFS, NRVBHMFS TYPIL HRTERISTIS I F, INSTNTNEOUS FORWRD URRENT () 7 I F, INSTNTNEOUS FORWRD URRENT () I R, INSTNTNEOUS REVERSE URRENT ().E+.E.E.E.E.E.E 6.E 7.E 8.E 9.E V F, INSTNTNEOUS FORWRD VOLTGE (V) Figure. Typical Instantaneous Forward V R, INSTNTNEOUS REVERSE VOLTGE (V) Figure. Typical Reverse urrent I R, INSTNTNEOUS REVERSE URRENT ().E+.E.E.E.E.E.E 6.E 7.E 8 V F, INSTNTNEOUS FORWRD VOLTGE (V) Figure. Maximum Instantaneous Forward V R, INSTNTNEOUS REVERSE VOLTGE (V) Figure. Maximum Reverse urrent J, JUNTION PITNE (pf), MXIMUM FORWRD SURGE URRENT () Single pulse non repetitive square wave ambient Mounted on a minimum pad, FR board, oz. copper pour... V R, REVERSE VOLTGE (V) PULSE DURTION (ms) Figure. Typical Junction apacitance Figure 6. Forward Surge Safe Operating rea
4 MBRHMFS, NRVBHMFS TYPIL HRTERISTIS I F, VERGE RETIFIED FORWRD URRENT () R J = /W D 7 I F, VERGE RETIFIED FORWRD URRENT () 6 D R J = 9 /W T, SE TEMPERTURE ( ) T, MBIENT TEMPERTURE ( ) Figure 7. Forward urrent Derating Over ase Temperature Figure 8. Forward urrent Derating Over mbient Temperature P D, VERGE FORWRD POWER DISSIPTION (W) T J = 7 I F, VERGE RETIFIED FORWRD URRENT () OPPER HET SPREDER RE (mm ) Figure 9. Maximum Forward Power Dissipation D J ( /W) 8 6 oz. opper PB oz. opper PB ssumes mbient Temperature 6 7 Figure. Steady State Junction to mbient Thermal Resistance ssumes ambient and soldered to a 6 mm oz copper pad on PB R(t) ( /W). % Duty ycle % % % % % Single Pulse PULSE TIME (sec) Figure. Transient Thermal Response, Junction to ase
5 MBRHMFS, NRVBHMFS PKGE DIMENSIONS.. 8X b. B. c L X D D TOP VIEW SIDE VIEW e/. B X E E DETIL. c DFN x6,.7p (SO 8FL) SE 88 ISSUE G X e DETIL X SETING PLNE SOLDERING FOOTPRINT* X.7 NOTES:. DIMENSIONING ND TOLERNING PER SME Y.M, 99.. ONTROLLING DIMENSION: MILLIMETER.. DIMENSION D ND E DO NOT INLUDE MOLD FLSH PROTRUSIONS OR GTE BURRS. MILLIMETERS DIM MIN NOM.9.. b.. c..8 D. BS D..9 D. E 6. BS E..8 E. e.7 BS G..6 K.. L..6 L..7 M.. STYLE : PIN. NODE. NODE. NODE. NO ONNET. THODE X.7 X. MX K.96 PIN (EXPOSED PD) G E D L M. X.9. X.9..7 BOTTOM VIEW X..6 *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor omponents Industries, LL (SILL). SILL reserves the right to make changes without further notice to any products herein. SILL makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SILL assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SILL data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SILL does not convey any license under its patent rights nor the rights of others. SILL products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SILL product could create a situation where personal injury or death may occur. Should Buyer purchase or use SILL products for any such unintended or unauthorized application, Buyer shall indemnify and hold SILL and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SILL was negligent regarding the design or manufacture of the part. SILL is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLITION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution enter for ON Semiconductor P.O. Box 6, Denver, olorado 87 US Phone: 67 7 or 8 86 Toll Free US/anada Fax: or Toll Free US/anada orderlit@onsemi.com N. merican Technical Support: Toll Free US/anada Europe, Middle East and frica Technical Support: Phone: 79 9 Japan ustomer Focus enter Phone: 8 87 ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MBRHMFS/D
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