MURS120T3G Series, SURS8120T3G Series. Surface Mount Ultrafast Power Rectifiers

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1 MURS12T3G Series, SURS812T3G Series Surface Mount Ultrafast Power Rectifiers MURS5T3G, MURS1T3G, MURS115T3G, MURS12T3G, MURS14T3G, MURS16T3G, SURS85T3G, SURS81T3G, SURS8115T3G, SURS812T3G, SURS814T3G, SURS816T3G Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features Small Compact Surface Mountable Package with J Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (.71 to 1.5 V 1. A, T J = 15 C) AEC Q1 Qualified and PPAP Capable SURS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These are Pb Free Packages Mechanical Characteristics: Case: Epoxy, Molded Weight: 95 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 26 C Max. for Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Rating: Human Body Model = 3B (> 8 kv) Machine Model = C (> 4 V) ULTRAFAST RECTIFIERS 1. AMPERE, 5 6 VOLTS CASE 43A MARKING DIAGRAM AYWW U1x A = Assembly Location* Y = Year WW = Work Week U1 = Device Code x = A, B, C, D, G, or J =Pb Free Package (Note: Microdot may be in either location) * The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank. ORDERING INFORMATION See detailed ordering and shipping information in the table on page 2 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking table on page 2 of this data sheet. Semiconductor Components Industries, LLC, 213 May, 213 Rev Publication Order Number: MURS12T3/D

2 MURS12T3G Series, SURS812T3G Series MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage Blocking Voltage Symbol V RRM V RWM V R MURS/SURS8 5T3 1T3 115T3 12T3 14T3 16T3 Unit V Average Rectified Forward Current I F(AV) T L = 155 T L = 145 C T L = 15 T L = 1 C A Non Repetitive Peak Surge Current, (Surge applied at rated load conditions halfwave, single phase, 6 Hz) I FSM 4 35 A Operating Junction Temperature T J 65 to +175 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS MURS/SURS8 Rating Thermal Resistance Junction to Lead (T L = C) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 1) (i F = 1. A, T J = C) (i F = 1. A, T J = 15 C) Maximum Instantaneous Reverse Current (Note 1) (Rated Voltage, T J = C) (Rated Voltage, T J = 15 C) Maximum Reverse Recovery Time (i F = 1. A, di/dt = 5 A/ s) (i F =.5 A, i R = 1. A, I R to. A) Maximum Forward Recovery Time (i F = 1. A, di/dt = A/ s, Rec. to 1. V) Symbol 5T3 1T3 115T3 12T3 14T3 16T3 R JL 13 v F i R 5 t rr t fr 5 Unit C/W V A ns ns Typical Peak Reverse Recovery Current (I F = 1. A, di/dt = 5 A/ s) I RM A 1. Pulse Test: Pulse Width = 3 s, Duty Cycle %. DEVICE MARKING AND ORDERING INFORMATION MURS5T3G, SURS85T3G Device Marking Package Shipping U1A 2,5 Units / Tape & Reel MURS1T3G, SURS81T3G U1B 2,5 Units / Tape & Reel MURS115T3G, SURS8115T3G U1C 2,5 Units / Tape & Reel MURS12T3G, SURS812T3G U1D 2,5 Units / Tape & Reel MURS14T3G, SURS814T3G U1G 2,5 Units / Tape & Reel MURS16T3G, SURS816T3G U1J 2,5 Units / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D. 2

3 , INSTANTANEOUS FORWARD CURRENT (AMPS) i F MURS12T3G Series, SURS812T3G Series MURS5T3G, MURS1T3G, MURS115T3G, MURS12T3G, SURS85T3G, SURS81T3G, SURS8115T3G, SURS812T3G 175 C C T C = C v F, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage, REVERSE CURRENT ( A) I R C, CAPACITANCE (pf) T J = C T J = C Figure 2. Typical Reverse Current* *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied V R is sufficiently below rated V R. NOTE: TYPICAL CAPACITANCE AT V = 45 pf Figure 3. Typical Capacitance, AVERAGE FORWARD CURRENT (AMPS) I F(AV) T C, CASE TEMPERATURE ( C) RATED VOLTAGE APPLIED R JC = 13 C/W Figure 4. Current Derating, Case, AVERAGE POWER DISSIPATION (WATTS) P F(AV) I (CAPACITANCE LOAD) PK 2 I AV I F(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 5. Power Dissipation 3

4 MURS12T3G Series, SURS812T3G Series MURS14T3G, MURS16T3G, SURS814T3G, SURS816T3G i, INSTANTANEOUS FORWARD CURRENT (AMPS) F C T C = C C, REVERSE CURRENT ( A) I R T J = C T J = C Figure 7. Typical Reverse Current* *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied V R is sufficiently below rated V R C, CAPACITANCE (pf) 2 15 NOTE: TYPICAL CAPACITANCE AT V = 24 pf v F, INSTANTANEOUS VOLTAGE (VOLTS) Figure 6. Typical Forward Voltage Figure 8. Typical Capacitance, AVERAGE FORWARD CURRENT (AMPS) I F(AV) T C, CASE TEMPERATURE ( C) RATED VOLTAGE APPLIED R JC = 13 C/W Figure 9. Current Derating, Case, AVERAGE POWER DISSIPATION (WATTS) P F(AV) (CAPACITANCE LOAD) I PK I AV I F(AV), AVERAGE FORWARD CURRENT (AMPS) Figure. Power Dissipation 4

5 MURS12T3G Series, SURS812T3G Series PACKAGE DIMENSIONS CASE 43A 3 ISSUE J H E E b POLARITY INDICATOR OPTIONAL AS NEEDED D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A A b c D E H E L L1.51 REF.2 REF A L L1 c A1 SOLDERING FOOTPRINT* SCALE 8:1 mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 8217 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MURS12T3/D

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