Technology transfer and business development for innovation projects. From local market to global industry.

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Jewel Caldwell
5 years ago
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1 Technology transfer and business development for innovation projects. From local market to global industry.

2 Well positioned for innovative business development Fab и Lab R&D Multifunctional complex of microelectronics based on MEMS, CMOS Assembly line, 3D-assemly (TSV). Center for Testing and certification. Prototyping and technical expertise. Providing scientific and research development. Design center IC design, SoC, system on package, reverse design. Technology company and start-up funding Business Development. Funding of innovation projects. Attracting of strategy and industrial partners. Integration development, international cooperation. 2

TASKS AND OBJECTIVES NEW TECHNOLOGY SOLUTIONS FOR MODERN ELECTRONICS MEMS sensors based on AMR and GMR effect MEMS gyroscopes and accelerometers Piezoresistive MEMS sensors Data processing VLSI

3 TASKS AND OBJECTIVES NEW TECHNOLOGY SOLUTIONS FOR MODERN ELECTRONICS MEMS sensors based on AMR and GMR effect MEMS gyroscopes and accelerometers Piezoresistive MEMS sensors Data processing VLSI Sensors and multifunctional blocks, multichip assembly INTELLIGENT SENSORS MULTICHIP ASSEMBLY SMART-SYSTEMS ROBOTECHNICS. Development of infrastructure for production of special-purpose Electronic Component Base Development of full dielectric isolation for high temperature and radiation-resistant Electronic Component Base Systems on a chip Speedup times 3D multichip assembly, Component density speedup times 3

4 Technology infrastructure IC, MEMS and NEMS SoC and SiP manufacturing ASSEMBLY LINE (SiP and 3D technology) TESTING LINE FAB-LITE CMOS and MEMS technology KEY TECHNOLOGY LINES IC DESIGN MEMS and NEMS R&D PHOTOMASKS production line (current technology level 180 nm, transition to 90 nm)

5 Infrastructure for development and Production of Electronic Component Base Designing VLSI, MEMS Systems on a chip Production Microchips, MEMS Packaging, 3D assembly Tests, control and measurements Integrated projects, licensed production Design center : Chip production: - Designing of semicustom compound LSI - Development of magnetoresistive sensors - Development of systems control blocks - Reverse engineering - Feature size: - 0,25 μm- 0,18 μm - Capacity: 600 chips pm. - CMOS- and MEMStechnologies - Systems on a chip, multifunctional blocks High-accuracy assembling in ceramic-metal frames. Systems in Package, 3d TSV, Tests of electrical and functional parameters 5 invention patents Developed basic technologies for production of sensors Design and production of analog and compound integrated circuits and multifunctional blocks. High-temperature electronics. 3d assembly. Functional Electronic Component Base products

6 ALREADY DEVELOPED: Center for Design and manufacturing of photomasks COMPETENCIES: Fragment of 50 nm topological structure Electron-beam generator Design and production of binary photomasks for projection contact lithography (up to 180 nm technology node). Direct lithography of IC critical layers by electron beam. TECHNOLOGIES: Development of photomasks for IC production ( nm technology node) (RET technologies) Capacity of Center: 1500 photomasks per year. Calculation and modeling of OPC elements Fragment of topology with OPC elements PROSPECTIVE LINES OF DEVELOPMENT: CUSTOMERS AND PARTNERS: 65 nm technology node EXPECTED RESULTS: Minimum feature on photomask - 80 nm; Overlay accuracy of topological layers 30 nm; Defects 100 nm 7

Chip production (CMOS IC and MEMS) Technology line Photolithography: Projection

available) Chemical treatment Infrastructure for ECB development and production

Sensors, MEMS assembly in ceramicmetal frames. Multichip modules.

Research and analytical center Test complex Qualification and periodic tests.

Moisture content analysis Diffusion/Deposition Thermal atmosphere equipment.

ь Certification and accreditation Government Defense Standard Certificate 15.

films, bosh-process; ion etching, sacrificing layer remove (SiO2).

7 Chip production (CMOS IC and MEMS) Technology line Photolithography: Projection photolithography: 0,25 μm, Contact photolithography: 0,6 (double-sided is available) Chemical treatment Infrastructure for ECB development and production Packaging, 3D assembly Production operations IC chip assembly in frames. Sensors, MEMS assembly in ceramicmetal frames. Multichip modules. 3D assembly (TSV). Research and analytical center Test complex Qualification and periodic tests. Measurement and of electric and functional parameters. Moisture content analysis Diffusion/Deposition Thermal atmosphere equipment. Vapour deposition equipment LPCVD и PECVD. Atomic layer deposition. ь Certification and accreditation Government Defense Standard Certificate ь Certification and accreditation Government Standard Certificate allows to test domestic and foreign ECB. Plasma-chemical etching: Plasma-chemical etching of dielectric layers, metal films, bosh-process; ion etching, sacrificing layer remove (SiO2). Metal films depositing PVD depositing of multilayer structures with AMR and GMR effect. Magnetron deposition of multilayer metal and dielectric layers Ion implantation Line characteristics Production up to items per month. Analytic investigation Atomic force microscopy. Cell culture research Probe microscopy 8

SPECIALIZED APPLICATION magnetoresistiv e

Twinaxial sensor for navigation systems.

8 ALREADY DEVELOPED: physical magnitude MEMS sensors AUTOMOBILE SENSORS SPECIALIZED APPLICATION magnetoresistiv e sensor speed sensor encoder position sensor COMPETENCE IN ECB DESIGN : Spintronics Vacuum electronics Element base for integrated optics ANALYTIC INVESTIGATION Elemental composition measurement: auger spectrometry, secondary ion mass-spectrometry, X-Ray analysis. Dimensions measurement: Dual Beam, raster electron microscopy, profilometry. Optical behavior measurement: ellipsometry. ADVANCED PROJECTS: Development of magnetic materials for radiation-resistant memory elements. Twinaxial sensor for navigation systems. ECB DEFENSE TECHNOLOGY AND WEAPON: Electrooptical microsystem module for warning of external exposure. Nano-column magnetic heterostructures for the development of microwave nanoscale generators 9

Operating systems for autonomous robotic

9 ALREADY DEVELOPED: Fast-rotating inertial orientation system MEMS accelerometers MEMS dip needles MEMS gyroscopes ITEMS EXAMPLES: MEMS gyroscopes and accelerometers DEVELOPMENT PROSPECTS: Development of domestic inertial navigation system Development of miniature position and orientation systems High-accuracy micromechanical dip needles Precision micromechanical gyroscopes with null drift 1 per hour Precision micromechanical accelerometers, with null drift 10 ug. Operating systems for autonomous robotic platforms CUSTOMERS AND PARTNERS: Multichip inertial navigation module MEMS acceleromete r MEMS gyroscope COMPETENCE IN ELEMENT BASE DESIGN: Inertial sensor units Experimental model of fast-rotating inertial orientation system Inertial sensor unit Stabilization systems Orientation and navigation systems 10

IC Design center DEVELOPMENT: VLSI for primary conversion of signals from

Smart sensors VLSI : o Capacitance sensors of speed-up and moving.

o Magnetic encoders of location and angular displacement o Optical smoke sensor.

and radical use electronics. Development of VLSI for engine control.

electronic instrumentation with the use of CAD of leading global companies.

agreements RESISTANT ECB FOR DEFENSE TECHNOLOGY AND WEAPON: IC for development of

10 IC Design center DEVELOPMENT: VLSI for primary conversion of signals from optical, magnetic, capacitance, resistive sensors. Smart sensors VLSI : o Capacitance sensors of speed-up and moving. o Resistive sensors of pressure and temperature. o Magnetic encoders of location and angular displacement o Optical smoke sensor. o 16-bit microcontrollers DEVELOPMENT PROSPECTS: Development of high temperature and radical use electronics. Development of VLSI for engine control. CUSTOMERS AND PARTNERS: ADDITIONAL FEATURES: Staff training in design of electronic instrumentation with the use of CAD of leading global companies. Ability to share CAD Cadence, Synopsys, Metntor Graphics according to license agreements RESISTANT ECB FOR DEFENSE TECHNOLOGY AND WEAPON: IC for development of small-sized meteorological stations, и pressure/temperature sensors on the basis of resonant detector elements IC for processing and signal transformation from gyroscopes and accelerometers 11

11 IC integration. Way to grouth Logic, didgital-analog 3D SiP / SoC МEМS 12

12 Well positioned for innovative business development Comprehensive facilities Breakthrough projects International partnerships Special economic terms Exceptional team Entrepreneurial spirit

13 Our Services: Infrastructure (office space, meeting room, lab facilities, research and manufacturing equipment). Business services (help with registration, licenses, accounting, strategy advice, market research, partner search, internationalization). Financing (equity investment, credit and guarantees). Participation in international cooperation programs and traineeships. People connectivity (coaching and interaction with fellow entrepreneurs (a microcluster), market linkages. Invest Department provides startups business support, Funding of innovation companies assistance in commercializing results of their R&D in the nanotechnology, microelectronic, biotech and cleantech and other technologies, attracts investors and industrial partners.

Nano- and microelectronics Our specialisation R&D and small scale manufacturing of VLSI and

accelerometers for aviation. Electronic and component base for special purpose.

14 Nano- and microelectronics Our specialisation R&D and small scale manufacturing of VLSI and SoC. Systems of control, process of information with the usage of MEMS- and NEMS-sensors for automobiles. Navigation systems and Intellectual systems control based on MEMS-gyroscopes and accelerometers for aviation. Electronic and component base for special purpose. New materials and structures Systems on the base of matrix micro-mirrors. 3D-technologies, manufacturing of micro- and nanoelectronics. Magnetoresistive memory For additional information go to

Development of modules of liquids cleaning.

Technologies and equipment for sequenation

15 Key projects Green Tech Power saving solutions. Nonvolatile systems on the base of piezoelectric generator. Development of modules of liquids cleaning. BioTech Electronics for medicine. Technologies and equipment for sequenation of DNA/RNA. Biotechnologies for medicine and vaccinology. Research of cell structures. For additional information go to

16 START-UP SPECIALIZATIONS Total investments in start-ups 80,0+ million rubles 17

17 3D printer Designer PICASO «SPE IIS» company was established in 2011 by students of MIET with assistance and funding and of the Zelenograd nanotechnology center. Product: a device for rapid 3-D prototyping (3-D printer), which makes possible to develop samples of different models. Description and advantages: Accuracy of printing - 50 nm Printing speed - 30 cub cm Custom Price Well organized distribution system It is planned to organize a plastic wire production with the usage of special nanotube additions for Unattached device for rapid prototyping.

Nanoelectronic systems «Nanoelectronic systems» company was established by

MIET with the participation of Zelenograd nanotechnology center.

Product: Non-volatile sensors are «listening» to the sound of forthcoming train and

18 Nanoelectronic systems «Nanoelectronic systems» company was established by development team of chair «MPSE» (materials and proceses of solid-state electronics) MIET with the participation of Zelenograd nanotechnology center. Project: Non-volatile system for railways control. Product: Non-volatile sensors are «listening» to the sound of forthcoming train and alerting real-time about rail breaks. Sensors are recharging from piezoelectric generators, which work from mechanical pressure of the forthcoming train.

Nanocrystal «Nanocrystal» company was established by development team of chair «MPC»

Zelenograd nanotechnology center in 2010 according to the 217 Federal Law.

Product: Photovoltaic transducer: - Thin-film component (thickness 1 mkn) - Flexible

convenience in installation and environment-friendly nanostructured materials.

19 Nanocrystal «Nanocrystal» company was established by development team of chair «MPC» (material engineering and physical chemistry) MIET with the participation of Zelenograd nanotechnology center in 2010 according to the 217 Federal Law. Project: Flexible solar cells on the base of nanostructured materials. Product: Photovoltaic transducer: - Thin-film component (thickness 1 mkn) - Flexible (non-silicon based) structure - Efficiency 8% Value proposition: economy of energy, convenience in installation and environment-friendly nanostructured materials. Fields of application: portable electronic devices, portable rechargers on the base of solar cells, special electronic equipment.

20 WHAT WE SEEK 1. Joint commercial R&D projects 3. Industrial cooperation 2. Technology partnership 4. Funding for startups

+7 (499) 720-69-44 Fax +7 (499) 720-69-69

21 Ready for cooperation Anatoly A. Kovalev CEO Cell +7 (916) Phone. +7 (499) Fax +7 (499) «Zelenograd nanotechnology center» Moscow, Zelenograd, passage 4806, h.5, bld.23 We are ready to collaborate!

Des MEMS aux NEMS : évolution des technologies et des concepts aux travers des développements menés au LETI

Des MEMS aux NEMS : évolution des technologies et des concepts aux travers des développements menés au LETI Ph. Robert 1 Content LETI at a glance From MEMS to NEMS: 30 years of technological evolution