Layout Analysis Floorplan
|
|
- Rudolph Briggs
- 6 years ago
- Views:
Transcription
1 Sample Report Analysis from a Touch Screen Controller For any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:
2 Table of Contents Table of Contents 1 Overview 1.1 Layout Analysis Floor Plan 1.2 List of Figures 1.3 List of Tables 2 Device Overview 2.1 Introduction 2.2 Device Summary 3 Device Identification 3.1 Package 3.2 Die 4 Functional Layout Analysis 4.1 Overview 4.2 Functional Block Measurements 5 Statement of Measurement Uncertainty and Scope Variation About Chipworks
3 Overview Overview 1.1 Layout Analysis Floor Plan This report delivers an overview of an IC s die size, block sizes, and floor plan. A lower level metal die photo is annotated showing the functional blocks on the die at a high level. Clients use this information to compare their own designs and block efficiency and to determine where additional R&D investment is required to leapfrog the competition. Package photographs Package X-ray Depot (bare die) die photograph Die size measurements Annotated metal 1 or poly die photograph showing the major physical blocks on the die Major layout blocks annotated Layout block measurements Table summarizing the L, W, Area, and the percentage die area of each block
4 Overview List of Figures 3 Device Identification Package Top Package Bottom Package X-Ray Die Photograph Die Markings 4 Functional Layout Analysis Annotated Die Photograph Functional Blocks 1.3 List of Tables 2 Device Overview Device Identification Device Summary 4 Functional Layout Analysis Functional Block Measurements
5 Device Overview Device Overview 2.1 Introduction Manufacturer and device profile with key findings summarized. This report contains the following detailed information: Package photographs, package X-ray, die markings, die photograph, and die photographs with annotated functional blocks and memories Measurements of horizontal dimensions of major microstructural features Identification of major functional blocks All of the analyses for this report were performed on two parts, with the following markings: Table Device Identification Device Package markings Die markings Date code Device Identification Table Device Identification
6 Device Overview Device Summary Table Device Summary Manufacturer Foundry Part number Type Date code Package markings Package type Package dimensions Die markings Die size (die edge seal) Device Summary Table Device Summary
7 Device Identification Device Identification 3.1 Package Top and bottom photographs of the package are shown in Figure and Figure 3.1.2, respectively. The 36 pin exposed pad thin plastic quad flatpack (EP-LQFP) package is 5 mm x 5 mm x 0.6 mm thick. The package bottom image shows the exposed pad, which is 3.6 mm long x 3.6 mm wide. The package markings for this device include: Figure 3.1.1Package Top Figure Package Top Figure Package Top
8 Device Identification 3-2 Figure 3.1.2Package Bottom Figure Package Bottom pin 1 Figure Package Bottom
9 Device Identification 3-3 A plan-view X-ray photograph of the package is shown in Figure 3.1.3, with the location of the exposed pad annotated. Bond wires connect the die to the lead frame. Figure 3.1.3Package X-Ray Figure Package X-Ray pin 1 exposed pad Figure Package X-Ray
10 Device Identification Die Figure shows a photograph of the die. The die is 3.15 mm x 3.15 mm as measured from the die seals, or 3.18 mm x 3.18 mm for the whole die. This yields a die area of 9.92 mm 2 within the die seals. Bond pads are arranged around the periphery of the die; there are approximately 58 total bond pads with 38 of the pads bonded. Figure 3.2.1Die Photograph Figure Die Photograph Figure Die Photograph
11 Device Identification 3-5 The die markings are shown in Figure 3.2.2, they include: Figure 3.2.2Die Markings Figure Die Markings Figure Die Markings
12 Functional Layout Analysis Functional Layout Analysis 4.1 Overview Figure shows the major functional blocks annotated on a photograph of the die. The blocks were divided based on the physical layout features visible on the polysilicon die photograph. The functions of the blocks were estimated based on the pinout information gathered from the product line. This is due to the similarity in the layout features of both devices, as well as the common functions shared by both chips. Other sources of information include product summaries, functional block diagram in the product line, microscopic observation, and previous knowledge and experience. No circuit extraction was carried out to confirm these assumptions. (Basic analysis) Figure 4.1.1Annotated Die Photograph Functional Blocks Figure Annotated Die Photograph Functional Blocks I/O 1 general analog comparator analog system analog reference 4 kbyte SRAM 16 kbyte flash module I/O 2 CPU core amplifier/ comparator MEM 3 sense cap control IDAC Figure Annotated Die Photograph Functional Blocks
13 Functional Layout Analysis Functional Block Measurements Table shows the physical measurements (length and width) of the major functional blocks analyzed in Figure 4.1.1, as well as the percentage of the total die area they occupy. The die size (die edge seal) measures 3.15 mm x 3.15 mm, for an area of 9.92 mm 2. Some length and width fields are left blank due to irregular block shapes. Table Functional Block Measurements Functional Block Amplifier/ comparator Analog reference Comparator analog system Type Functional Block Measurements Length (mm) Width (mm) Total Area (mm 2 ) % of Die Analog Analog Analog General analog Analog IDAC Analog Sense cap Analog control TruTouch Analog module 4 kbyte SRAM Logic/memory kbyte Flash Logic/memory MEM3 Logic/memory CPU Core Logic Irregular I/O 1 I/O buffers Irregular I/O 2 I/O buffers Irregular Table Functional Block Measurements
14 Statement of Measurement Uncertainty and Scope Variation Statement of Measurement Uncertainty and Scope Variation Measurement Uncertainty Chipworks calibrates length measurements on its scanning electron microscopes (SEM), transmission electron microscope (TEM), and optical microscopes, using measurement standards that are traceable to the International System of Units (SI). Our SEM/TEM cross-calibration standard was calibrated at the National Physical Laboratory (NPL) in the UK (Report Reference LR0304/E /SEM4/190). This standard has a 146 ± 2 nm (± 1.4%) pitch, as certified by NPL. Chipworks regularly verifies that its SEM and TEM are calibrated to within ± 2% of this standard, over the full magnification ranges used. Fluctuations in the tool performance, coupled with variability in sample preparation, and random errors introduced during analyses of the micrographs, yield an expanded uncertainty of approximately ± 5%. The materials analysis reported in Chipworks reports is normally limited to approximate elemental composition, rather than stoichiometry, since calibration of our SEM and TEM-based methods is not feasible. Chipworks will typically abbreviate, using only the elemental symbols, rather than full chemical formulae, usually starting with silicon or the metallic element, then in approximate order of decreasing atomic % (when known). Elemental labels on energy dispersive X-ray spectra (EDS) will be colored red for spurious peaks (elements not originally in sample). Elemental labels in blue correspond to interference from adjacent layers. Secondary ion mass spectrometry (SIMS) data may be calibrated for certain dopant elements, provided suitable standards were available. A stage micrometer, calibrated at the National Research Council of Canada (CNRC) (Report Reference LS ), is used to calibrate Chipworks optical microscopes. This standard has an expanded uncertainty of 0.3 µm for the stage micrometer s 100 µm pitch lines. Random errors, during analyses of optical micrographs, yield an expanded uncertainty of approximately ± 5% to the measurements. Scope Variation Due to the nature of reverse engineering, there is a possibility of minor content variation in Chipworks standard reports. Chipworks has a defined table of contents for each standard reports type. At a minimum, the defined content will be included in the report. However, depending on the nature of the analysis, additional information may be provided in a report, as value-added material for our customers.
15 About Chipworks About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
Basic Functional Analysis. Sample Report Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel:
Basic Functional Analysis Sample Report 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis Sample Report Some of the information in this
More informationAKM AK8973 and AK Axis Electronic Compass
AKM AK8973 and AK8974 Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call
More informationManufacturer Part Number. Module 4: CMOS SRAM Analysis
Manufacturer Part Number description Module 4: CMOS SRAM Analysis Manufacturer Device # 2 Some of the information is this report may be covered by patents, mask and/or copyright protection. This report
More informationModule 2: CMOS FEOL Analysis
Module 2: CMOS FEOL Analysis Manufacturer Device # 2 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems.
More informationSTMicroelectronics VL53L0B ToF Proximity Sensor
STMicroelectronics VL53L0B Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 chipworks.com Basic Functional Analysis 2 Some of the information in this
More informationBosch Sensortec BMI160 Low Power IMU
Bosch Sensortec BMI160 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationGoodix GF6648 Touch Fingerprint Sensor. Exploratory Analysis
Goodix GF6648 Exploratory Analysis 2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on
More informationVolterra VT1115MF PWM Controller Chip
Process Review with Supplementary TEM Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales
More informationMarvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch
Marvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationTexas Instruments BRF6350B Bluetooth Link Controller UMC 90 nm RF CMOS
Texas Instruments BRF6350B UMC 90 nm RF CMOS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please
More informationApple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2
Apple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information
More informationSiTime SIT8002AC-13-18E50 One Time Programmable Oscillator
SiTime SIT8002AC-13-18E50 MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales
More informationFreescale MCIMX535DVV1C i.mx535 Mobile Applications Processor
Freescale MCIMX535DVV1C i.mx535 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis Some of the information
More informationTexas Instruments/Apple 343S0538 Touch Screen Controller with F Die Markings
Texas Instruments/Apple 343S0538 Touch Screen Controller with F761530 Die Markings 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationMarvell I1062-B0 Hard Drive Controller SoC
Marvell I1062-B0 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or copyright protection.
More informationFreescale MCIMX357DVM5B 90 nm Multimedia Application Processor
Freescale MCIMX357DVM5B 90 nm Multimedia Application Processor ESD Protection Device Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationSTMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller
STMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller with Costing Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information
More informationOki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process
Oki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process Custom Process Review with TEM Analysis For comments, questions, or more information about this report, or for any
More informationQualcomm QFE1100 Envelope Tracking PA Power Supply
Qualcomm QFE1100 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask and/or copyright protection.
More informationFocalTech FT5206GE1 Capacitive Touch Screen Controller IC
FocalTech FT5206GE1 Functional Analysis with Costing Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Functional Analysis Some of the information in
More informationMemsTech MSM3C-S4045 Integrated Silicon Microphone with Supplementary TEM Analysis
MemsTech MSM3C-S4045 Integrated Silicon Microphone with Supplementary TEM Analysis MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationMediaTek MT3333AV (BT10085B Die) Satellite Receiver SoC
MediaTek MT3333AV (BT10085B Die) 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or
More informationMicrochip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis
March 13, 2006 Microchip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationAnalog Devices ADMP403 MEMS Microphone
Analog Devices ADMP403 Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please
More informationSamsung SDP1301 DTV SERDES Interface
Samsung SDP1301 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationApple/Dialog Semiconductor 343S0622-A1/D2018A WLED Driver
Apple/Dialog Semiconductor 343S0622-A1/D2018A 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents,
More informationFocalTech Systems FT5336GQQ and FT5436iGQQ (FS-123ATPBC Die) Capacitive Touch Screen Controller
FocalTech Systems FT5336GQQ and FT5436iGQQ (FS-123ATPBC Die) 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be
More informationAuthenTec AES1710 Secure Slide Fingerprint Sensor
AuthenTec AES1710 Secure Slide Fingerprint Sensor Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationMEMSIC MMC3120M Tri-Axis Magnetic Sensor
MEMSIC MMC3120M Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales
More informationTexas Instruments Sitara XAM3715CBC Application Processor 45 nm UMC Low Power Process
Texas Instruments Sitara XAM3715CBC Application Processor Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationApple/Cirrus Logic 338S1081/46L01 Multi-Standard Audio Decoder
Apple/Cirrus Logic 338S1081/46L01 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or
More informationSony IMX Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor
Sony IMX046 8.11 Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationAkustica AKU2000 MEMS Microphone. MEMS Process Review
Akustica AKU2000 MEMS Microphone MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationMediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver
MediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be
More informationFocalTech FT5316 Touch Screen Controller
FocalTech FT5316 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or copyright protection.
More informationu-blox M8030-KT Concurrent Multi-GNSS Receiver
u-blox M8030-KT Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationMarvell Avastar 88W ac Wi-Fi 2x2 MIMO Combo Chip
Marvell Avastar 88W8897 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this
More informationPeregrine Semiconductor PE4268 SP6T RF UltraCMOS TM Switch Structural Analysis
September 21, 2005 Peregrine Semiconductor PE4268 Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationFreescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor
Freescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in
More informationInvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope
InvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationMicron MT9T Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor
Micron MT9T111 3.1 Megapixel, ¼ Optical Format, 1.75 µm Pixel Size System-on-Chip (SOC) CMOS Image Sensor Imager Process Review with Optional TEM Analysis of SRAM For comments, questions, or more information
More informationRDA Microelectronics RDA8851A GSM/GPRS Baseband SoC
RDA Microelectronics RDA8851A 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered by patents, mask, and/or
More informationLSI Logic LSI53C1030 PCI-X to Dual Channel Ultra320 SCSI Controller 0.18 µm CMOS Process
LSI Logic LSI53C13 PCI-X to Dual Channel Ultra32 SCSI Controller.18 µm CMOS Process Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs
More informationMagnaChip MC511DB 1.3 Megapixel CMOS Image Sensor 0.18 µm Process
MagnaChip MC511DB 1.3 Megapixel CMOS Image Sensor 0.18 µm Process Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationIntel Q3GM ES 32 nm CPU (from Core i5 660)
Intel Q3GM ES Transistor Characterization For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please
More informationIBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram
IBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram Front End Process Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com
More informationQualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor
Qualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor Basic Functional Analysis with Costing 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414
More informationQualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY
Qualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report
More informationQualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver
Qualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver Basic Functional Analysis with Costing 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional
More informationBosch Sensortec BMP180 Pressure Sensor
Bosch Sensortec BMP180 MEMS Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com MEMS Process Review Some of the information in this report may be
More informationFullhan FH8520 Image Signal Processor
Fullhan FH8520 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationPanasonic DMC-GH Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera
Panasonic DMC-GH1 12.1 Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera Imager Process Review For comments, questions, or more
More informationQualcomm MSM8926 Snapdragon 400 Application Processor
Qualcomm MSM8926 Snapdragon 400 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information
More informationSharp NC Megapixel CCD Imager Process Review
Sharp NC9360 2.0 Megapixel CCD Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationSamsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report
October 13, 2006 Samsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report (with Optional TEM Analysis) For comments, questions, or more information about this report,
More informationFLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera
FLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera Infrared Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationRockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process
Rockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process Process Review FEOL Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com
More informationSilicon Storage Technology SST39VF800A 8 Mbit Multi-Purpose Flash Memory Structural Analysis
February 23, 2005 Silicon Storage Technology SST39VF800A 8 Mbit Multi-Purpose Flash Memory Structural Analysis For questions, comments, or more information about this report, or for any additional technical
More informationQualcomm MDM9235M 4G LTE Advanced Modem
Qualcomm MDM9235M Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information in this report
More informationSpansion S29GL512N11TAI Mbit MirrorBit TM Flash Memory Structural Analysis
March 5, 2007 Spansion S29GL512N11TAI02 512 Mbit MirrorBit TM Flash Memory Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationMicrosoft X02046 IBM PowerPC Processor from the XBOX 360 Structural Analysis
February 7, 2006 Microsoft X02046 IBM PowerPC Processor from the XBOX 360 Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationTexas Instruments THS7530PWP Gain Amplifier Structural Analysis
March 1, 2005 Texas Instruments THS7530PWP Gain Amplifier Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationQualcomm APQ8084 Snapdragon 805 Application Processor
Qualcomm APQ8084 Snapdragon 805 Basic Functional Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Basic Functional Analysis 2 Some of the information
More informationElpida Memory Inc. B240ABB (die markings), MC77-LL/A (package markings) 46 nm Mobile / Low Power DDR2 SDRAM
Elpida Memory Inc. B240ABB (die markings), MC77-LL/A (package markings) 46 nm Mobile / Low Power DDR2 SDRAM DRAM Process Report - Preliminary Table of Contents 3 Table of Contents Introduction Major Findings
More informationTexas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver
Texas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver Basic Functional Analysis with Cost Estimate 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414
More informationPowerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M 512 Megabit DDR2 SDRAM Structural Analysis
February 23, 2007 Powerchip Semiconductor Corporation A3R12E3GEF G6E 635BLC4M Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning
More informationSony IMX Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000. Module 5: Substrate Dopant Analysis
Sony IMX071 16.2 Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000 Module 5: Substrate Dopant Analysis Sony IMX071 16.2 Mp, 4.8 µm Pixel Size, APS-C (DX Format) CMOS Image Sensor
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 1: Overview Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 1: Overview Analysis Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of the information
More informationTexas Instruments ISO7220A Capacitor Type Digital Isolator
Texas Instruments ISO7220A Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Review Some of the information in this report may be covered
More informationSony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600. Module 1: Overview Analysis
Sony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600 Module 1: Overview Analysis Sony IMX128AQP 24.3 Mp CIS from Nikon D600 2 Some of the information in this report may be covered
More informationTexas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator
Texas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this
More informationNikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings
Nikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs
More informationAnalog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review
November 1, 2005 Analog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review For comments, questions, or more information about this report, or for any additional technical
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 5: Substrate Dopant Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 5: Substrate Dopant Analysis Nikon NC81369R CMOS Image Sensor from the Nikon D3200 2 Some of the information
More informationNVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process
NVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process Process Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process Analysis
More informationFUJIFILM MS3897A CCD Image Sensor Imager Process Review
September 7, 2006 MS3897A CCD Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationSony IMX018 CMOS Image Sensor Imager Process Review
September 6, 2006 Sony IMX018 CMOS Image Sensor Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology,
More informationNikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 4: Pixel Cross-Sectional Analysis
Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200 Module 4: Pixel Cross-Sectional Analysis Nikon NC81369R (CMOS Image Sensor from the Nikon D3200) 2 Some of
More informationMotorola PRF5P21240 RF Power MOSFET Structural Analysis
September 2, 2004 Motorola PRF5P21240 RF Power MOSFET Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor
More informationCMOSIS CMV Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling
CMOSIS CMV4000 4 Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling Imager Process Review 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada
More informationAltera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process
Altera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process Process Review FEOL Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Process
More informationSamsung K9F2G08U0M-YCB0 2Gbit NAND Flash Device Structural Analysis
April 4, 2006 Samsung K9F2G08U0M-YCB0 2Gbit NAND Flash Device Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationOmniVision OV2640 1/4-Inch 2 Megapixel CMOS Image Sensor (OV253AI Die Markings) TSMC 0.13 µm Process
March 5, 2007 OmniVision OV2640 1/4-Inch 2 Megapixel CMOS Image Sensor (OV253AI Die Markings) TSMC 0.13 µm Process Imager Process Review For comments, questions, or more information about this report,
More informationSamsung K9G8G08U0M-PCB0 8 Gbit MLC NAND Flash Structural Analysis
November 6, 2006 Samsung K9G8G08U0M-PCB0 Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please
More informationBroadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process
Broadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process Structural Analysis 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Structural Analysis
More informationSony IMX Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera
Sony IMX147 20 Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera Module 5: Substrate Dopant Analysis Sony IMX147 Back Illuminated
More informationFreescale SCK20DN51Z K20 USB MHz Microcontroller eflash. Flash Process Review
Freescale SCK20DN51Z K20 USB 2.0 50 MHz Microcontroller eflash Flash Process Review Freescale SCK20DN51Z Microcontroller eflash 2 Some of the information in this report may be covered by patents, mask
More informationNanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis
September 20, 2005 Nanya elixir N2TU51280AF-37B 512 Mbit DDR2 SDRAM Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning
More informationOlympus EVOLT E-410/Matsushita LiveMOS Image Sensor
Olympus EVOLT E-410/Matsushita Imager Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call
More informationSony IMX118CQT 18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera
18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera Imager Process Review 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Imager
More informationInvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor
InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationCanon LC Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i)
Canon LC1270 18.0 Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i) Module 3: Planar Pixel Analysis Canon LC1270 CMOS Image Sensor 2 Some of the
More informationPowerDsine/Freescale
April 25, 2005 PowerDsine/Freescale PD64004 4 Channel Power-Over-Ethernet (POE) Manager Process Review For questions, comments, or more information about this report, or for any additional technical needs
More informationAMD ATI TSMC 28 nm Gate Last HKMG CMOS Process
AMD ATI 7970 215-0821060 TSMC 28 nm Gate Last HKMG CMOS Process Package Analysis 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Package Analysis Some of the
More informationToshiba TH58NVG2S3BTG00 4 Gbit NAND Flash Structural Analysis
July 5, 2005 Toshiba TH58NVG2S3BTG00 4 Gbit NAND Flash Structural Analysis For questions, comments, or more information about this report, or for any additional technical needs concerning semiconductor
More informationIntel Q3GM ES 32 nm CPU (from Core i5 660)
Intel Q3GM ES Partial Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please
More informationSTMicroelectronics LIS3L02AE 3-Axis Accelerometer. MEMS Process Review
3-Axis Accelerometer For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks. 3685 Richmond
More informationSamsung K4H510838C-UCCC 512Mbit DDR SDRAM Structural Analysis
July 26, 2005 Samsung K4H510838C-UCCC 512Mbit DDR SDRAM Structural Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor
More informationIntel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process
Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this report may be covered
More informationOmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 3: Planar Pixel Analysis
OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip Module 3: Planar Pixel Analysis OmniVision OVM7692 VGA CameraCubeChip 2 Some of the information in this report may be covered by patents, mask
More information