Reverse Conducting Integrated Gate-Commutated Thyristor 5SHX 19L6020
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1 VDRM = 5500 V ITGQM = 1800 A ITSM = A VT0 = 1.9 V rt = 0.9 m VDC = 3300 V Reverse Conducting Integrated Gate-Commutated Thyristor 5SHX 19L6020 Doc. No. 5SYA Apr. 16 High snubberless turn-off rating Optimized for medium frequency High electromagnetic immunity Simple control interface with status feedback AC or DC supply voltage Option for series connection (contact factory) Blocking Repetitive peak off-state voltage Permanent DC voltage for 100 FIT failure rate of RC-GCT VDRM Gate Unit energized 5500 V VDC Ambient cosmic radiation at sea level in open air. Gate Unit energized 3300 V Repetitive peak off-state IDRM VD = VDRM, Gate Unit energized 50 ma Mechanical data Mounting force FM kn Pole-piece diameter Dp ± 0.1 mm 85 mm Housing thickness H clamped Fm = 44 kn mm Weight m 2.9 kg Surface creepage distance DS Anode to Gate 33 mm Air strike distance Da Anode to Gate 10 mm Length l ± 1.0 mm 439 mm Height h ± 1.0 mm 41 mm Width IGCT w ± 1.0 mm 173 mm 1) Maximum rated values indicate limits beyond which damage to the device may occur
2 GCT Data On-state 5SHX 19L6020 Average on-state IT(AV)M 840 A RMS on-state IT(RMS) Half sine wave, Tc = 85 C 1320 A Peak non-repetitive surge tp = 3 ms, Tv j= 125 C ITSM A sine half wave Limiting load integral I 2 t VD = VR = 0 V, after surge A 2 s Peak non-repetitive surge ITSM tp = 10 ms, Tvj = 125 C A sine half wave Limiting load integral I 2 t VD = VR = 0 V, after surge A 2 s Peak non-repetitive surge tp = 30 ms, Tvj = 125 C ITSM A sine half wave Limiting load integral I 2 t VD = VR = 0 V, after surge A 2 s Critical rate of rise of onstate dit/dt(cr) For higher dit/dt and lower than 100 A an external retrigger puls is required. 100 A/µs On-state voltage VT IT = 1800 A, Tvj = 125 C V Threshold voltage V(T0) 1.9 V IT = 500 A A, Tvj = 125 C Slope resistance rt 0.9 m Doc. No. 5SYA Apr. 16 page 2 of 14
3 Turn-on switching Critical rate of rise of on-state di/dtcrit f = Hz, Tvj = 125 C IT = 1800 A, VD = 3300 V ITM 2160, DCL = 5SDF 08H A/µs Turn-on delay time td(on) Tvj = 125 C 3.5 µs Turn-on delay time status td(on) SF VD = 3300 V, IT = 1800 A 7 µs feedback di/dt = VD / Li, Li = 7.6 µh Rise time tr CCL = 10 µf, LCL = 300 nh 1 µs DCL Turn-on energy per pulse = 5SDF 08H6005 Eon 1 J Turn-off switching Controllable turn-off ITGQM1 ITGQM2 VDM VDRM Tvj = 125 C RS = 0.65 CCL = 10 µf LCL 300 nh DCL = 5SDF 08H6005 VD = 3300 V VD = 3900 V 1800 A 900 A Turn-off delay time td(off) VD = 3300, Tvj = 125 C 7 µs VDM VDRM, Rs = 0.65 Ω Turn-off delay time status td(off) SF ITGQ = 1800 A, Li = 7.6 µh 7 µs feedback CCL = 10 µf, LCL = 300 nh Turn-off energy per pulse Eoff DCL = 5SDF 08H J Doc. No. 5SYA Apr. 16 page 3 of 14
4 Diode Data On-state 5SHX 19L6020 Average on-state IF(AV)M 340 A RMS on-state IF(RMS) Half sine wave, TC = 85 C 530 A Peak non-repetitive surge IFSM tp = 10 ms, Tvj = 125 C A VD = VR = 0 V Limiting load integral I 2 t A 2 s Peak non-repetitive surge IFSM tp = 3 ms, Tvj = 125 C 3 A VD = VR = 0 V Limiting load integral I 2 t A 2 s On-state voltage VF IT = 1800 A, Tvj = 125 C V Threshold voltage V(F0) Tvj = 125 C 2.7 V Slope resistance rf IT = 200 A A 2.23 m Turn-on Peak forward recovery voltage VFRM dif/dt = 510 A/µs, Tvj = 125 C 200 V dif/dt = 3000 A/µs, Tvj = 125 C 450 V Turn-off Decay rate on-state di/dt(cr) IFM = 900 A, Tvj = 125 C VDClink = 3900 V 510 A/µs IFM = 1800 A, Tvj = 125 C VDClink = 3300 V 510 A/µs Reverse recovery IRM Tvj = 125 C IFM = 1800 A, VD = 3300 V 780 A Reverse recovery charge Qrr -dif/dt = 510 A/µs, LCL = 300 nh 2800 µc Turn-off energy Erec CCL = 10 µf, Rs = 0.65 DCL = 5SDF 08H J Doc. No. 5SYA Apr. 16 page 4 of 14
5 Gate Unit Data Power supply Gate Unit voltage (Connector X1) Min. needed to power up the Gate Unit VGin RMS IGin Min AC square wave amplitude (15 khz khz) or DC voltage. No galvanic isolation to power circuit. Rectified average see application note 5SYA V 2 A Gate Unit power consumption PGin Max 130 W Internal limitation IGin Max Rectified average limited by the Gate Unit 8 A Optical control input/output CS On-time ton 40 µs CS: Command signal CS Off-time toff 40 µs Optical input power Pon CS dbm CS: Command signal Optical noise power Poff CS SF: Status feedback -45 dbm Optical output power Valid for 1mm plastic optical fiber Pon SF dbm (POF) Optical noise power Poff SF -50 dbm Pulse width threshold tglitch Max. pulse width without response 400 ns External retrigger pulse width tretrig ns Connectors 2) Parameter Symbol Description Gate Unit power connector X1 AMP: MTA-156, Part Number ) LWL receiver for command signal LWL transmitter for status feedback CS Avago, Type HFBR-2521Z 4) SF Avago, Type HFBR-1528Z 4) 2) Do not disconnect or connect fiber optic cables while light is on. 3) AMP, 4) Avago Technologies, Visual feedback Parameter Symbol Description Color Gate OFF LED1 "Light" when GCT is off (green) Gate ON LED2 "Light" when gate- is flowing (yellow) Fault LED3 "Light" when not ready / Failure (red) Power supply voltage OK LED4 "Light" when power supply is within specified range (green) Doc. No. 5SYA Apr. 16 page 5 of 14
6 Thermal Junction operating temperature Tvj C Storage temperature range Tstg 0 60 C Ambient operational temperature Ta 0 50 C Thermal resistance junction-tocase of GCT Thermal resistance case-toheatsink of GCT Thermal resistance junction-tocase of Diode Thermal resistance case-toheatsink of Diode Rth(j-c) 12.6 K/kW Rth(c-h) Double side cooled, 4.2 K/kW no heat flow between GCT and Rth(j-c) Diode part 26 K/kW Rth(c-h) 10.4 K/kW GCT Analytical function for transient thermal impedance: Z thjc (t) = n i1 R i(1- e -t/ i i Ri(K/kW) i(s) Diode i (K/kW) i(s) ) Fig. 1 Transient thermal impedance (junction-to-case) vs. time (max. values) Max. Turn-off for Lifetime operation calculated lifetime of on-board capacitors 20 years with slightly forced air cooling (air velocity > 0.5 m/s) strong air cooling allows for increased ambient temperature Fig. 2 Max. turn-off vs. frequency for lifetime operation Doc. No. 5SYA Apr. 16 page 6 of 14
7 GCT Part VT25 Max. on-state characteristic model: A B I C ln( I 1) D Tvj Tvj T Tvj T Valid for IT = A Tvj I T VT125 5SHX 19L6020 Max. on-state characteristic model: A B I C ln( I 1) D Tvj Tvj T Tvj T Valid for IT = A Tvj I T A 25 B 25 C 25 D 25 A 125 B 125 C 125 D Fig. 3 GCT on-state voltage characteristics Fig. 4 GCT on-state voltage characteristics Fig. 5 GCT surge on-state vs. pulse length, half-sine wave, no reapplied voltage Fig. 6 GCT surge on-state vs. number of pulses, half-sine wave, 10ms, 50Hz, no reapplied voltage Doc. No. 5SYA Apr. 16 page 7 of 14
8 Fig. 7 GCT turn-off energy per pulse vs. turn-off Fig. 8 Safe Operating Area Doc. No. 5SYA Apr. 16 page 8 of 14
9 Diode Part Max. on-state characteristic model: VF25 A B I C ln( I 1) D Tvj Tvj T Tvj T Valid for IF = A Tvj I T VF125 5SHX 19L6020 Max. on-state characteristic model: A B I C ln( I 1) D Tvj Tvj T Tvj T Valid for IF = A Tvj I T A 25 B 25 C 25 D 25 A 125 B 125 C 125 D Fig. 9 Diode on-state voltage characteristics Fig.10 Diode on-state voltage characteristics Fig. 11 Diode surge on-state vs. pulse length, half-sine wave, no reapplied voltage Fig. 12 Diode surge on-state vs. number of pulses, half-sine wave, 10ms, 50Hz, no reapplied voltage Doc. No. 5SYA Apr. 16 page 9 of 14
10 Fig. 13 Upper scatter range of Turn-off energy per pulse vs. turn-off Fig. 14 Upper scatter range of Turn-off energy per pulse vs. reverse rise rate Fig. 15 Upper scatter range of reverse recovery charge vs reverse rise rate Fig. 16 Upper scatter range of reverse recovery charge vs reverse rise rate Doc. No. 5SYA Apr. 16 page 10 of 14
11 Fig. 17 Diode Safe Operating Area Fig. 18 Max. Gate Unit input power in chopper mode Fig. 19 Burst capability of Gate Unit Doc. No. 5SYA Apr. 16 page 11 of 14
12 SHX 19L ± ±0.3 H 41 Max M4 (2x) M4 (2x) Detail A M4 (2x) ±0.5 X1 50±0.3 50± ±0.3 50± ± ±0.1x (2x) SF CS 439 Fig. 20 Outline drawing; all dimensions are in millimeters and represent nominal values unless stated otherwise X1 1) VGin (AC or DC+) 2) VGin (AC or DC+) 3) Cathode 4) VGin (AC or DC-) 5) VGin (AC or DC-) Fig. 21 Detail A: pin out of supply connector X1 RC-IGCT Gate Unit RC-GCT X1 Supply (V GIN ) Internal Supply (No galvanic isolation to power circuit) Anode LED1 LED2 LED3 LED4 Turn- On Circuit Gate CS SF Command Signal (Light) Status Feedback (Light) Tx Rx Logic Monitoring Turn- Off Circuit Cathode Fig. 22 Block diagram Doc. No. 5SYA Apr. 16 page 12 of 14
13 Turn-on di T/dt I TM External Retrigger pulse Turn-off V DSP V DM V D V D I T 0.9 V D I T 0.4 I TGQ 0.1 V D V D CS CS CS SF SF SF t d(on) SF t retrig t d(off) SF t d(on) t d(off) t r t on t off Fig. 23 General and voltage waveforms with IGCT-specific symbols V F (t), I F (t) V FR di F /dt I F (t) -di F /dt I F (t) V F (t) V F (t) Q rr t fr tfr (typ) 10 µs I RM V R (t) t Fig. 24 General and voltage waveforms with Diode-specific symbols Doc. No. 5SYA Apr. 16 page 13 of 14
14 L i L CL R s D CL DUT GCT - part V DC C CL DUT Diode - part L Load Fig. 25 Test circuit Related documents: 5SYA SYA SYA SYA SYA SYA SZK SZK SZK 9110 Applying IGCT Gate Units Applying IGCTs Recommendations regarding mechanical clamping of Press Pack High Power Semiconductors Failure rates of IGCTs due to cosmic rays Field measurements on High Power Press Pack Semiconductors Voltage ratings of high power semiconductors Specification of enviromental class for pressure contact IGCTs, OPERATION available on request, please contact factory Specification of environmental class for pressure contact IGCTs, STORAGE available on request, please contact factory Specification of environmental class for pressure contact IGCTs, TRANSPORTATION available on request, please contact factory Please refer to for version of documents. ABB Switzerland Ltd Doc. No. 5SYA Apr. 16 Semiconductors Fabrikstrasse 3 CH-5600 Lenzburg, Switzerland Telephone +41 (0) Fax +41 (0) abbsem@ch.abb.com Internet
Ambient cosmic radiation at sea level in open air. Gate Unit energized
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