OP400A. Quad Low-Offset, Low-Power Operational Amplifier FEATURES: DESCRIPTION: Memory. Logic Diagram (One Amplifier)

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1 Quad Low-Offset, Low-Power Operational Amplifier v+ BIAS OUT VOLTAGE LIMITING NETWORK +IN -IN v- Logic Diagram (One Amplifier) FEATURES: RAD-PAK technology-hardened against natural space radiation Total dose hardness: - > 100 krad (Si), depending upon space mission Package: - 16 pin Rad-Pak flat package Low input offset voltage 150µV max Low offset voltage drift µV/ C max (over -55 to +125 C) Low supply current (per amplifier) 725 µa max High open-loop gain 5000V/mV min Input bias current 3 na Max Low noise voltage density 11 nv per HZ at 1 khz Stable with large capacitive loads 10 nf typ DESCRIPTION: DDC's monolithic quad operational amplifier microcircuit features a greater than 100 krad (Si) typical total dose tolerance, depending upon space mission. Using DDC s radiation-hardened RAD-PAK packaging technology, the has an extremely low input offset voltage no less than 150 mv with a drift of under 1.2 mv/ C, guaranteed over the full military temperature range. The features low power consumption, drawing less than 725 µa per amplifier. DDC's patented RAD-PAK packaging technology incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing the required radiation shielding for a lifetime in orbit or space mission. In a GEO orbit, RAD-PA provides greater than 100 krad (Si) radiation dose tolerance. This product is available with screening up to Class S. Memory 1 (631)

2 TABLE 1. PINOUT DESCRIPTION PIN SYMBOL DESCRIPTION 1, 7, 10, 16 OUT A - D Output Signal 2, 6, 11, 15 -IN A - D Negative Input Signal 3, 5, 12, 14 +IN A - D Positive Input Signal 8, 9 NC Not Connected 4 V+ Positive Voltage 13 V- Negative Voltage TABLE 2. ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL MIN MAX UNIT Supply Voltage V CC ±20 V Differential Input Voltage ±30 V Input Voltage Supply Voltage Output Short-Circuit Duration Continuous Storage Temperature Range T S C Operating Temperature Range T A C Memory TABLE 3. DELTA LIMITS PARAMETER VARIATION ICC ±10% of specified value in Table 4 TABLE 4. DC ELECTRICAL CHARACTERISTICS (V S = ±15V, T A = -55 TO 125 C, UNLESS OTHERWISE SPECIFIED) PARAMETER SYMBOL TEST CONDITIONS SUBGROUPS MIN TYP MAX UNITS Input Offset Voltage V OS +25 C µv Long Term Input Voltage Stability -55 to 125 C 2, to 125 C 1, 2, µv/mo Input Offset Current I OS V CM = 0V +25 C na -55 to 125 C 2, Input Bias Current I B V CM = 0V +25 C na -55 to 125 C 2, Input Resistance Differential Mode R IN +25 C M 2

3 TABLE 4. DC ELECTRICAL CHARACTERISTICS (V S = ±15V, T A = -55 TO 125 C, UNLESS OTHERWISE SPECIFIED) PARAMETER SYMBOL TEST CONDITIONS SUBGROUPS MIN TYP MAX UNITS Input Resistance Common Mode 1 R INCM 1, 2, G Large Signal Voltage Gain A VO V O = ±10V +25 C V/mV RL = 10 k -55 to 125 C 5, R L = 2 k +25 C to 125 C 5, Input Voltage Range 1 IVR +25 C 1 ±12 ± V -55 to 125 C 2, 3 ±12 ± Common Mode Rejection CMR V CM = ±12V +25 C db -55 to 125 C 2, Power Supply Rejection Ratio PSRR V S = ±3V to +25 C µv/v ±18V -55 to 125 C 2, Output Voltage Swing V O R L = 10 k -55 to 125 C 4, 5, 6 ±12 ± V R L = 2 k ±11 ± Supply Current Per Amplifier I SV No Load +25 C µa -55 to 125 C 2, Input Capacitance C IN +25 C pf Capacitive Load Stability AV = +1 No Oscillations +25 C nf Memory 1. Guaranteed by CMR test. TABLE 5. AC Electrical Characteristics (VS = ±15V, T A = -55 TO 125 C, UNLESS OTHERWISE SPECIFIED.) PARAMETER SYMBOL Test Conditions SUBGROUPS MIN TYP MAX UNIT Input Noise Voltage e n p-p 0.1 Hz to 10 Hz +25 C µv P-P Input Noise Voltage e n f O = 10 Hz +25 C nv Hz Density f O = 1 KHz +25 C Input Noise Current i n p-p 0.1 Hz to 10 Hz +25 C pa P-P Input Noise Current i n f O = 10 Hz +25 C na Hz Density Slew Rate SR -55 to 125 C 7, 8, V/µs Gain Bandwidth Product GBWP A V = to 125 C 7, 8, khz Channel Separation 1 CS V O = 20 V p-p +25 C db f O = 10 Hz 1 1. Guaranteed by design. 3

4 TYPICAL OPERATING CHARACTERISTICS 4

5 TYPICAL OPERATING CHARACTERISTICS (CONTINUED) 5

6 TYPICAL OPERATING CHARACTERISTICS (CONTINUED) 6

7 16-PIN RAK-PAK FLAT PACKAGE SYMBOL DIMENSION MIN NOM MAX A b c D E E E E e BSC L Q S N 16 Note: All dimensions in inches. 7

8 Important Notice: These data sheets are created using the chip manufacturer s published specifications. DDC verifies functionality by testing key parameters either by 100% testing, sample testing or characterization. The specifications presented within these data sheets represent the latest and most accurate information available to date. However, these specifications are subject to change without notice and DDC assumes no responsibility for the use of this information. DDC's products are not authorized for use as critical components in life support devices or systems without express written approval from DDC. Any claim against DDC must be made within 90 days from the date of shipment from DDC. DDC s liability shall be limited to replacement of defective parts. 8

9 Product Ordering Options Model Number RP F X Feature Option Details Screening Flow Monolithic S = DDC Class S B = DDC Class B I = Industrial -55 C, +25 C, +125 C) E = Engineering +25 C) Package F = Flat Pack Memory Radiation Feature RP = RAD-PAK package Base Product Nomenclature Quad Low-Offset, Low Power Operational Amplifier 9

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