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1 3 Quadrants High temperature Triacs General Description High current density due to mesa technology, guaranteed maximum junction temperature C. The DS4CH triac series is suitable for general purpose C switching. They can beused as an ON/OFF function in applications such as static relays, heating regulation, Rectifier-fed DC inductive loads e.g.dc motors and solenoids, motor speed controllers. The heatsink can be reduced,compared to traditional triacs, according to the high performance at given junction temperatures. 2.T2 1.T1 3.Gate 2 Features Repetitive Peak Off-State Voltage: 6V/8V R.M.S On-State Current ( IT(RMS)= 4 ) High Commutation dv/dt High junction temperature operating capability These Devices are Pb-Free and are RoHS Compliant TO-22 bsolute Maximum Ratings Symbol Items Conditions Ratings Unit V DRM DS4CH6 6 V Repetitive Peak Off-State Voltage Tj = 25 C V RRM DS4CH8 8 V I T(RMS) R.M.S On-State Current T C = 133 C 4 I TSM Surge On-State Current tp=2ms(5hz)/tp=16.7ms(6hz) 3/32 I 2 t I 2 t for fusing tp=1ms s di/dt Critical rate of rise of on-state current F = 12 Hz Tj = C I G = 2 x I GT, tr 1 ns 5 /μs I GM Peak Gate Current tp = 2 μs Tj = C 2 P G(V) verage Gate Power Dissipation(Tj= C).5 W P GM Peak Gate Power Dissipation(tp=2us,Tj= C) 5 W T j Operating Junction Temperature - 4 ~ C T STG Storage Temperature - 4 ~ C Scan the QR code to view the latest product information 1 / 6 Feb,213 -Rev.3.2

2 Electrical Characteristics( Tj = 25 C unless otherwise specified ) Symbol Items Conditions Unit S Blank B I DRM I RRM Peak Forward Reverse Blocking V DRM = V RRM, Tj = 25 C 5 u Max. Current V DRM = V RRM, Tj = C 1.75 m V TM Peak On-State Voltage I TM = 5.5, tp = 38 μs Max V V GD Q1-Q2-Q3 Non Trigger Gate V D = V DRM R L = 3.3 kω Voltage Tj = C Min..15 V V GT Q1-Q2-Q3 Gate Trigger Voltage V D = 12V,R L = 33Ω Max. 1.5 V I GT Q1-Q2-Q3 Gate Trigger Current Max m I H Q1-Q2-Q3 Holding Current I T =.1 Max m I L Q1-Q Latching Current I G = 1.2 I GT Max. m Q dv/dt Critical Rate of Rise of Off-State Voltage V D = 2/3V DRM gate open Tj = C Min. 2 1 V/μs (dv/dt)c Critical Rate of Change of Commutating Voltage V D =4V Tj = C (di/dt)c=-1.7/ms Min V/μs R th(j-c) Junction to case (C) Max. 2.6 C/W R th(j-a ) Junction to ambient Max. 6 C/W FIG.1:Triac quadrant are defined and the gate trigger test circuit T2+ Q2(T2+G-) R L R L Q1(T2+G+) V D V D V R G V R G G- R L G+ V D V R G Q3(T2-G-) T2-2 / 6 Feb,213 -Rev.3.2

3 FIG.2: Maximum on-state power dissipation 5 FIG.3: Typical RMS on-state current VS llowable case Temperature tp(ms),conduction Time R.M.S On-State Current () Full Cycle FIG.4: Maximum transient thermal impedance Power Dissipation(W) Tc( C),Case Temperature FIG.5: Rated surge on-state current ( Non-Repetitive) Number Of Cycles FIG.6: Gate trigger current VS Junction temperature f=5hz 36 Full Cycle R.M.S On-state Current() f=6hz Tj=25 C Max I TSM (),Surge On-State Current Tj( C),Junction Temperature R th(j-c) ( C/W),Transient Thermal Impedance I GT (Tj)/I GT (25 C) x 1(%) 3 / 6 Feb,213 -Rev.3.2

4 FIG.7:Holding current and Latching current VS Junction temperature 125 FIG.8: Gate trigger voltage VS Junction temperature 125 Tj( C),Junction Temperature I H,I L (Tj)/I H,I L (25 C) x 1(%) FIG.9: On-state characteristics(max) Tj( C),Junction Temperature V GT (Tj)/V GT (25 C) x 1(%) V TM (V),On-State Voltage (1)Tj=25 C Max (2)Tj=125 C Max (1) 1 (2) I TM (),On-State Current 4 / 6 Feb,213 -Rev.3.2

5 PCKGE MECHNICL DT TO-22 Package Dimension Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max I E φ c2 B C c G c L B D E g L3 L2 L1 c1 G I L L g D K C L L Ф K 2.6TYP.12TYP Making Diagram XXXX DS4CH6B XXXH XX :Logo DS4CH6B:Part number X:Internal control code H:Halogen Free NCED Internal control code Current:4=4 Quadrant:C=3Q High temperature:h= C Sensitivity and type: S=1m Blank=35m B=5m Package explain:blank=to-22 Voltage:6=6V 8=8V Ordering information Part number Package Marking Packing Quantity DS4CH6# TO-22 DS4CH6# Tube 5pcs DS4CH8# TO-22 DS4CH8# Tube 5pcs Note:# = Gate Trigger Current Sensitivity and type 5 / 6 Feb,213 -Rev.3.2

6 Notice 1. ll information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any products listed in this document, please confirm the latest product information with a sales office. lso, please pay regular and careful attention to additional and different information to be disclosed by such as that disclosed through our website. ( ) 2. has used reasonable care in compiling the information included in this document, but assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 3. You should use the products described herein within the range specified by, especially with respectvto the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. shall have no liability for malfunctions or damages arising out of the use of products beyond such specified ranges. 4. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or products. 5. lthough endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. mong others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 6. This document is provided for reference purposes only so that customers may select the appropriate products for their use. neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of or any third party with respect to the information in this document. 7. shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,programs, algorithms, and application circuit examples. 8. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from. 6 / 6 Feb,213 -Rev.3.2

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