Photocouplers and Photorelays

Transcription

1 Semiconductor Catalog Mar. 0 Photocouplers and Photorelays SEMICONDUCTOR & STORAGE PRODUCTS SEMICONDUCTOR & STORAGE PRODUCTS

2 Photocouplers are widely used in various electronic devices to isolate highspeed signals from noise-sensitive circuits. Toshibas photocouplers consist of a high-intensity infrared light-emitting diode (LED) optically coupled to a photodetector fabricated using the latest process. The LED-photodetector couple is encapsulated in an electrically insulating resin with high transparency. of Toshiba's photocouplers include certification to many international safety standards, high isolation and low power consumption. They are suitable for applications requiring a high level of safety. Infrared LED Photo detector Photocoupler Package DIP DIP General-purpose packages Lead-forming options for surface mounting DIP DIP SDIP SDIP mm clearance / creepage; 0.mm isolation thickness pin thin SMD package (. mm lead pitch) SO SO mm clearance/creepage; 0. mm isolation thickness pin thin SMD package (. mm lead pitch) SOL SOL mm clearance/creepage; 0. mm isolation thickness SO SO pin SMD package (. mm lead pitch) SOL SOL pin thin SMD package (. mm lead pitch) SO pin SMD package (. mm lead pitch) pin SMD package (. mm lead pitch) SO SO SOP SOP SO SOL SOL mm clearance/creepage; 0. mm isolation thickness pin SMD package (. mm lead pitch) MFSOP MFSOP SMD package (. mm lead pitch).sop.sop SMD package (. mm lead pitch).sop.sop.sop.sop SSOP USOP SSOP USOP Ultra-small SMD package (. mm lead pitch) VSON VSON SMD package (Very Small Outline Non-leaded)

3 Product Lineup Both photocouplers and photorelays consist of a light-emitting element and a light-receiving element in the same package. Their input and output signals are optically coupled with each other to provide electrical isolation. Photocouplers and photorelays are available with many output types to meet various interface needs. Isolation Amplifier IC Output Transistor Output Page Page Page Vcc V CC Analog Output Type Digital Output Type High Speed Communications IGBT/MOSFET Gate Drive IPM Drive DC Input Type ZC Zero Cross Type Triac Output Page Non Zero Cross Type Photocoupler Product Lineup AC Input Type Darlington Transistor Output Type Thyristor Output Photovoltaic Output Photorelays Page 9 Page 0 Page General-purpose With discharge resistor Form-A contact Form-B contact New Product Digest Page Device Degradation Page Package Page Safety Standard Approvals Page Packing Page Cross Reference Page Board Assembly Page Index Page 0

4 New Product Digest Optical Isolation Amplifiers with Industry-Leading (*) Linearity TLP0, TLP90, TLP0, TLP90 In recent years, enhanced accuracy has been required for semiconductor devices for factory equipment applications, including servo amplifiers and AC drives. Its purpose is to provide accurate feedback to microcontrollers by monitoring motor phase current or bus voltage fluctuation. In order to satisfy this requirement, Toshiba s optical isolation amplifiers incorporate a ΔΣ AD ΔΣ converter circuit on the input side that features an industry-leading linearity performance. Optical isolation amplifiers with an analog output exhibit a typical nonlinearity of 0.0% (typ.), and those with a digital output achieve a μ nonlinearity of LSB (typ). In addition, the high common-mode transient immunity of 0 kv/μs (typ.) makes the operation of these products reliable even in motor control applications that generate a lot of voltage noise. These products also feature an isolation voltage of kvrms (min), making them suitable for various factory equipment applications. Two types of packages are available: and SOL. The SOL package has 0% less footprint and 0% less height than, contributing to the reduction of system size. (*) Comparison with optical isolation amplifiers, according to a survey by Toshiba (as of October 0) Industry-leading linearity due to a ΔΣ AD converter circuit: NL00 = 0.0 % (typ.) (analog output products) INL = LSB (typ.) (digital output products) Low input supply current: IDD =. ma (typ.) (analog output products) IDD =. ma (typ.) (digital output products) High common-mode transient immunity (CMTI): 0 kv/μs (typ.) High isolation voltage (BVS): kvrms (min) Small SOL package (0% footprint reduction and 0% height reduction compared to ) ΔΣ μ Applications Industrial equipment such as AC drives, servo amplifiers, robots, machine tools and large-capacity power supplies AC drives and industrial accumulators for wind and photovoltaic power generation applications Office equipment and household appliances (UPSs, power supplies for servers, accumulators for domestic use, and air conditioners) Package Circuit Example Photocoupler Motor phase current sense Factory Network Photocoupler Photocoupler 00/00 VAC Photocoupler M Photocoupler Photocoupler Bus voltage sense Overcurrent sense Network I/O Fan/Panel Photocoupler SOL Fan/ Panel Photocoupler MCU/ASIC/DSP

5 -Mbps High-Speed Photocouplers with Ultra-Low Power Consumption for Communication Applications TLP0, TLP0 The TLP0 and TLP0 have % less power consumption than the conventional product (*). These photocouplers consume a supply current (IDDL/IDDH) of only 0. ma imum over the entire operating temperature range of -0 to C, and operate at a supply voltage as low as. V, contributing to reducing the power consumption of various systems. The input forward current can be less than ma imum, allowing direct drive by a microcontroller. They help reduce system power consumption and cost..-mm-thick () package Clearance and creepage distances of mm (min) (TLP0) Low threshold input current (IFLH): ma () (Approx. % reduction compared to the conventional product (*) ) Low supply current (IDDL/IDDH): 0. ma () (Approx. 90% reduction compared to the conventional product (*) ) Support for./-v system power supplies (VDD):. to. V LED with excellent lifetime characteristics High operating temperature (Topr ()): C Applications -pin SO (TLP0). Anode. N.C.. Cathode.. Vo (Output). AC drivers Servo amplifiers Photovoltaics Factory networks I/O interface boards SOL (TLP0) (*) Conventional product: TLP (-pin SO package) Low-PWD IC-Output Photocouplers for IPM Drive The TLP and TLP are designed for Intelligent Power Module (IPM) drive applications, featuring low pulse width distortion (PWD), high speed, high temperature operation, and low power consumption. The TLP is an noninverting photocoupler (high input high output), and the TLP is an inverting photocoupler (high input low output). Because of a propagation delay time of 0 ns (), the TLP and TLP allow the reduction of inverter dead time, contributing to the improvement of power efficiency. These products are well suited not only to IPM drives but also to communication interfaces (such as RS, RS and RS) including those for industrial applications, and data transmission solutions between circuits with different voltages. TLP, TLP Operating temperature range: -0 to 0 C Data transfer rate: 0 Mbps (typ.) (NRZ) Threshold input current:. ma () Supply current: ma () Common-mode transient immunity: ±0 kv/μs (min) μ Applications SOL. Anode. N.C.. Cathode.. Vo (Output). Factory equipment (for IPM drive) High-speed digital interface for measurement or control devices Programmable logic controllers

6 Product Lineup Isolation Amplifier Selection Table Output Configuration SOL (F type) Analog Output Type TLP0 * TLP90 * TLP90F * Digital Output type TLP0 * TLP90 * TLP90F * *: New product / Selection Guide Analog Output Type Gain Error Rank (Ta=) (%) Non Linearity INL00 (Ta=) (%) typ. Input Offset Voltage (mv) typ. Supply Current Input IDD Output Safety Standards () c TLP0 * TLP90 TLP90F * * SOL Gain =. (typ.) Topr = 0 (). (typ.) 0 Gain =. (typ.) Topr = 0 (). (typ.) *: New product / Digital Output Type TLP0 * TLP90 TLP90F * * SOL bit digital & CLK output Topr = 0 () 0 bit digital & CLK output Topr = 0 () 0 SNDR (Ta=) (db) typ. SNR (Ta=) (db) typ. Output Clock Frequency (MHz) typ. Supply Current Input IDD Output Safety Standards () c Note (): Please refer to page. P. *: New product / SNDR: Signal to Noise and Distortion Ratio SNR: Signal to Noise Ratio

7 IC Output <High Speed Communications> Selection Table Data Rate (Typ.) 0 kbit/s 00 to 00 kbit/s Mbit/s Mbit/s 0 Mbit/s Mbit/s 0 Mbit/s 0 Mbit/s Output Open-collector Open-collector Open-collector IPM drive IPM Totem-pole pin MFSOP TLP09 TLP09 pin SO pin SO SO SDIP SOL ch ch (F type) TLP0 TLP0 * TLP0 TLP0 TLP0 * TLP09 TLP09 TLP0 TLP09 (IGM) TLP0 * TLP09 TLP0 TLP0 ** TLP0 ** TLP0 TLP0 TLP0 * TLP TLP9 TLPF TLP9F AC input AC TLP9 * TLP9 * IPM drive IPM TLP TLP TLP0 TLP0 TLP TLP TLPF TLPF Open-collector TLP Totem-pole TLP9 * IPM drive TLP * TLP ** IPM TLP * TLP ** Open-collector TLPE TLP0 TLP0F TLP Totem-pole TLP * TLP * TLPA TLP * TLP TLPF Open-collector TLP TLP TLP TLP TLP TLPA * TLP TLPF TLPA Totem-pole TLP0 TLP TLP0 TLP TLP0 TLP TLPF Totem-pole TLP TLP ** TLP ** TLP ** Data Rate (Typ.) 00 to 00 kbit/s Mbit/s. Mbit/s Mbit/s 0 Mbit/s Output Open-collector Open-collector IPM drive IPM -state Totem-pole IPM drive IPM Open-collector TLP DIP TLP TLP0 TLP TLP9 TLP TLP0 TLP TLP9 TLP9 (IGM) TLP TLP9 (IGM) TLP00 TLP TLP TLP9 TLP9 TLP TLP TLP0 TLP9 TLPN ch (F type) ch (F type) TLP0F TLPF TLP9F TLPF TLP9F (IGM) TLP9F TLP9F TLP9F TLP0 TLP TLP0 TLP TLP TLPF JEDEC Type JEDEC N N9 N N N : Photocouplers with a imum operating temperature (Topr.) of / () : Photocouplers with low input current. / *: New product / **: Under development /

8 Selection Guide Data Rate: 0 k bps (Typ.) TLP0 TLP0 * pin SO Reinforced insulation Low input drive current Data Rate 0 k bps pin SOL Topr () Reinforced insulation Low input drive current Data Rate 0 k bps Propagation Delay Time () tphl tplh Data Rate: 00 k / 00 k bps (Typ.) TLP0 TLP0 * TLP TLP0 pin SO Reinforced insulation Low input drive current Data Rate 00 k bps SOL Reinforced insulation Low input drive current Data Rate 00 k bps Low input drive current Data Rate 00 k bps SO SO version of the TLP TLP SO Data Rate 00 k bps Data Rate: M bps (Typ.) TLP09 TLP TLP0 pin SO Reinforced insulation Data Rate M bps DIP DIP package version of the TLP0 TLP0 Data Rate M bps High CMR CMR Data Rate M bps min (%) Safety Standards () c Propagation Delay Time () tphl tplh min (%) Propagation Delay Time () tphl tplh min (%) CTR CTR 0 (9% min for rank O) *: New product / Safety Standards () c *: New product / Safety Standards () c Note (): Please refer to page. P.

9 (Data Rate: M bps (Typ.) ) TLP TLP9 TLP TLP9 TLP9 F TLP0 TLP0 F TLP TLP F TLP9 TLP9 F TLP09 TLP09 TLP0 TLP Internal base connection Data Rate M bps High CMR version of the TLP0 TLP0 CMR Data Rate M bps High isolation voltage Internal base connection Data Rate M bps SDIP Direct drive of an IPM Data Rate M bps IPM High isolation voltage SEMKO-approved SEMKO Data Rate M bps Internal base connection SEMKO-approved SEMKO Data Rate M bps IEC090 design standard version of the TLP9 SEMKO-approved TLP9 IEC090 SEMKO Data Rate M bps pin SO Reinforced insulation.-v/.0-v power supplies.-v/.0-v Data Rate M bps SO Topr = () SO version of the TLP09 TLP09 SO Data Rate M bps Dual channel version of the N and the TLP0 N, TLP0 Data Rate M bps Dual channel version of the N and the TLP0 N, TLP0 Data Rate M bps Note (): Please refer to page. P. Propagation Delay Time () tphl tplh 0. min (%) CTR 0 (9% min for rank 00 Safety Standards () c (9% min for rank O) (Typ.) 0 (9% min for rank O).0 (Typ.)

10 Data Rate:. M bps (Typ.) TLP00 Low input current Data Rate M bps Propagation Delay Time () tphl tplh Output Form -state output (Buffer logic) IFLH =. Safety Standards () c Data Rate: M bps (Typ.) TLP TLP Low input current Vcc =. to 0 V With enable pin Data Rate M bps Propagation Delay Time () tphl tplh Output Form -state output (Buffer logic) -state output IFLH =. () =. 00 Safety Standards () c TLP TLP F TLP TLP F Vcc Vcc SDIP Direct drive of an IPM IPM Data Rate M bps (Buffer logic) IFLH = () = () 000 TLP09 TLP09 Vcc Vcc pin MFSOP AC input Vcc =.0 to 0 V AC Data Rate M bps (Buffer logic) IFLH =.0 =.0 0 TLP0 TLP0 TLP0 * TLP0 * TLP Vcc Vcc SO Dual channel Data Rate M bps SO Dual channel version of the TLP0 TLP0 Data Rate M bps pin SO Reinforced insulation Ultra low consumption Data Rate M bps pin SO Reinforced insulation Direct drive of an IPM IPM Data Rate M bps (Buffer logic) (Buffer logic) (Buffer logic) (Buffer logic) IFLH =. () =. () IFLH =.0 () IFLH =.0 () IFLH =. () 00 0 Note (): Please refer to page. P. 0 *: New product /

11 (Data Rate: M bps (Typ.) ) TLP TLP9 * TLP9 * TLP0 TLP0 TLP0 * TLP9 TLP9 F TLP9 TLP9 F Vcc Vcc Vcc Vcc pin SO Reinforced insulation Direct drive of an IPM IPM Data Rate M bps pin SO AC input version of the TLP TLP AC Data Rate M bps pin SO AC input version of the TLP TLP AC Data Rate M bps SO Low input current Direct drive of an IPM IPM Data Rate M bps SOL SOL version of the TLP0 TLP0 SOL Data Rate M bps Topr = () Low input current Vcc =.0 0-V Direct drive of an IPM IPM Data Rate M bps Propagation Delay Time () tphl tplh Output Form (Buffer logic) (Buffer logic) (Buffer logic) (Buffer logic) =. () IFLH =. () =. () IFLH =. () =. () IFLH =.0 () IFLH =. () = Safety Standards () c *: New product / Data Rate: 0 M bps (Typ.) TLP TLP TLP * Vcc High-speed Data Rate 0 M bps High-speed High CMR version of the TLP TLP CMR Data Rate 0 M bps pin SO Reinforced insulation High-speed Direct drive of an IPM IPM Data Rate 0 M bps Note (): Please refer to page. P. Propagation Delay Time () tphl tplh Output Form Open-collector output (Buffer logic) =.0 () IFLH =. 00 Safety Standards () c *: New product /

12 (Data Rate: 0 M bps (Typ.) ) TLP * TLP TLP9 * TLP0 TLP0 TLP TLP TLP F TLP * TLP * TLP9 TLP9 F Vcc Vcc Vcc Vcc pin SO Reinforced insulation High-speed Direct drive of an IPM IPM Data Rate 0 M bps pin SO Reinforced insulation Vcc =.-V/.-V Topr () Data Rate 0 M bps pin SO Reinforced insulation Vcc =.-V/-V Topr () Data Rate 0 M bps High-speed High CMR With enable pin CMR Data Rate 0 M bps Dual channel version of the N and the TLP N TLP Data Rate 0 M bps Dual channel version of the TLP TLP Data Rate 0 M bps Vcc =.-V/-V Topr () Dual channel version of the TLP9 TLP9 Data Rate 0 M bps SOL Reinforced insulation High-speed Direct drive of an IPM SOL version of the TLP TLP SOL Data Rate 0 M bps SOL Reinforced insulation High-speed Direct drive of an IPM SOL version of the TLP TLP SOL Data Rate 0 M bps Vcc =.-V/-V Topr () Data Rate 0 M bps Note (): Please refer to page. P. Propagation Delay Time () tphl tplh Output Form Open-collector output Open-collector output (Buffer logic) Open-collector output =. () =.0 () =. () =.0 () IFLH =. () =. () = Safety Standards () c *: New product /

13 (Data Rate: 0 M bps (Typ.) ) TLPN High-speed Data Rate 0 M bps Propagation Delay Time () tphl tplh Output Form Open-collector output =.0 Safety Standards () c Data Rate: M bps (Typ.) TLP0 TLP0 F TLP TLP F TLP TLP E TLP * TLP A TLP * TLP * Vcc Vcc Vcc SDIP Topr () High-speed SDIP version of the TLP TLP SDIP Data Rate M bps SDIP High-speed SDIP version of the TLPA TLPA SDIP Data Rate M bps SO Dual channel version equivalent of the TLPA TLPA Data Rate Propagation Delay Time () tphl tplh Output Form Open-collector output =.0 () =. () M bps SO Dual channel version Open-collector equivalent of the output TLP TLP Data Rate M bps SO Vcc =.-V/-V power supplies Topr () Data Rate M bps SO Vcc =.0-V/.-V Dual channel version equivalent of the TLP TLP Data Rate M bps pin SO Reinforced insulation Vcc =.-V/.-V Topr () Data Rate M bps SOL Reinforced insulation Vcc =.-V/.-V Topr () SOL version of the TLP TLP SOL Data Rate M bps Note (): Please refer to page. P =.0 () =. () =.0 () =. () IFLH = Safety Standards () c *: New product /

14 Data Rate: 0 M bps (Typ.) TLP A TLP TLP0 TLP0 TLP TLP TLP TLP0 * TLP TLP TLP TLP TLP F Vcc Vcc Vcc Vcc Vcc pin SO Reinforced insulation Data Rate 0 M bps pin SO Reinforced insulation Topr () Data Rate 0 M bps pin MFSOP.-V power supply Data Rate 0 M bps SO Dual channel.-v/-v power supplies Topr () Data Rate 0 M bps SO.-V/-V power supplies Topr () Data Rate 0 M bps pin SO Reinforced insulation.-v/-v power supplies Topr () Data Rate 0 M bps pin SO Reinforced insulation Topr () Data Rate 0 M bps pin SO Topr () Reinforced insulation Ultra low consumption Data Rate 0 M bps SO Topr () SO version of the TLP TLP SO Data Rate 0 M bps SO.-V/-V power supplies Topr () Data Rate 0 M bps SO.-V/-V power supplies Topr () Data Rate 0 M bps SDIP.-V/-V power supplies Topr () Data Rate 0 M bps Note (): Please refer to page. P. Propagation Delay Time () tphl (ns) tplh (ns) Output Form Open-collector output Open-collector output Open-collector output (Buffer logic) Open-collector output Open-collector output =.0 () =. () =.0 () =. () =.0 () IFLH =.0 () =.0 () =. () =.0 () = Safety Standards () c *: New product /

15 (Data Rate: 0 M bps (Typ.) ) TLP TLP F TLP A * SDIP.-V/-V power supplies Topr () Data Rate 0 M bps SOL Reinforced insulation Topr () SOL version of the TLP TLP SOL Data Rate 0 M bps Data Rate: 0 M bps (Typ.) TLP TLP ** TLP ** TLP ** JEDEC Type Vcc Vcc Vcc pin MFSOP Ultra-high-speed Data Rate 0 M bps SO.-V/-V power supplies Topr () Data Rate 0 M bps pin SO Reinforced insulation.-v/-v power supplies Topr () Data Rate 0 M bps SOL.-V/-V power supplies Topr () Data Rate 0 M bps Propagation Delay Time () tphl (ns) tplh (ns) Propagation Delay Time () tphl (ns) tplh (ns) 0 0 Output Form Open-collector output Open-collector output Output Form =.0 () =.0 () =.0 Safety Standards () c *: New product / Safety Standards () c ** ** 00 ** ** 0 ** ** 000 Propagation Delay Time () tphl tplh min (%) **: Under development / Safety Standards () c N JEDEC-compliant.. JEDEC N Data Rate M bps JEDEC-compliant High-speed N JEDEC (Typ.) 00 Data Rate 0 M bps N JEDEC-compliant High-CTR JEDEC N9 Data Rate K bps Note (): Please refer to page. P.

16 IC Output <IGBT / MOSFET Gate Drive> Selection Table Output Peak Current () () (A) 0. pin SO SO SOL SOL SDIP (F type) (F type) TLP 0. TLPA TLP TLPE TLPA TLP0 TLP0 TLP0A TLP0H TLP0A TLP0F TLP0AF TLP0HF TLP0AF TLP TLPA TLPH TLPF TLPAF TLPHF.0 TLP * TLP * TLP9 **.0 TLP00 TLP00F. TLP TLP0 TLP * TLP * TLP00A TLP00H TLP00AF TLP00HF TLP0H TLP0H TLP TLP9 ** TLP0HF TLP0HF TLPF.0 TLP * TLP * TLP * TLP9 **.0 TLP TLPH TLPF TLPH : Photocouplers with a imum operating temperature (Topr.) of / () *: New product / **: Under development / Selection Guide IGBT/MOSFET Gate Drive TLP A TLP TLP TLP E TLP0 H TLP0 HF TLP0 H TLP0 HF pin SO Reinforced insulation Topr () 0 Direct drive of a smallpower IGBT/MOSFET 0 IGBT pin SO Reinforced insulation Topr () 00 Direct drive of a mediumpower IGBT/MOSFET 00 IGBT pin SO Reinforced insulation Topr () 00 Direct drive of a smallpower IGBT/MOSFET 00 IGBT Topr () Direct drive of a mediumpower IGBT/MOSFET IGBT Topr () Direct drive of a mediumpower IGBT/MOSFET IGBT Note (): Please refer to page. P. Propagation Delay Time () tphl tplh Peak Output Current () IOP (A) Threshold input current () IFLH Safety Standards () c

17 (IGBT/MOSFET Gate Drive ) TLP TLP F TLP A TLP AF Direct drive of a smallpower IGBT/MOSFET IGBT Propagation Delay Time () tphl tplh Peak Output Current () IOP (A) Threshold input current () Safety Standards () c TLP H TLP HF TLP TLP F Topr () Direct drive of a smallpower IGBT/MOSFET IGBT Topr () Direct drive of a mediumpower IGBT/MOSFET IGBT TLP TLP F Direct drive of a mediumpower IGBT/MOSFET IGBT TLPH TLPH F Topr () Direct drive of a mediumpower IGBT/MOSFET IGBT TLP TLP00 TLP00 F TLP00 A TLP00 AF TLP00 H TLP00 HF TLP0 TLP0 F TLP0 A TLP0 AF Direct drive of a power transistor SDIP Direct drive of a mediumpower IGBT/MOSFET SDIP version of the TLP0 IGBT TLP0 SDIP SDIP Direct drive of a mediumpower IGBT/MOSFET SDIP version of the TLP IGBT TLP SDIP SDIP Topr () Direct drive of a mediumpower IGBT/MOSFET SDIP version of the TLP0H IGBT TLP0H SDIP SDIP Direct drive of a smallpower IGBT/MOSFET SDIP version of the TLP IGBT TLP SDIP SDIP Direct drive of a smallpower IGBT/MOSFET SDIP version of the TLPA IGBT TLPA SDIP Note (): Please refer to page. P

18 (IGBT/MOSFET Gate Drive ) TLP0 H TLP0 HF TLP0 A TLP0 AF TLP A TLP * TLP0 TLP0 TLP * SDIP Topr () Direct drive of a smallpower IGBT/MOSFET SDIP version of the TLPH IGBT TLPH SDIP SDIP High-speed Direct drive of a smallpower IGBT/MOSFET IGBT SO Topr () Direct drive of a smallpower IGBT/MOSFET SO version of the TLPA IGBT TLPA SO SOL Topr () 0 Smart gate drive photocoupler Overcurrent protection Soft shutdown Active miller clamp Direct drive of a mediumpower IGBT/MOSFET Rail to Rail output IGBT SOL Topr () 0 Direct drive of a mediumpower IGBT/MOSFET SOL version of the TLPA 0 IGBT TLPA SOL SOL Topr () 0 Direct drive of a mediumpower IGBT/MOSFET SOL version of the TLP 0 IGBT TLP SOL SOL Topr () 0 Direct drive of a mediumpower IGBT/MOSFET Rail to Rail output 0 IGBT SOL Direct drive of a mediumpower IGBT/MOSFET Topr () 0 Rail to Rail output IGBT 0 Direct drive of a mediumpower IGBT/MOSFET Topr () Rail to Rail output IGBT Propagation Delay Time () tphl tplh Peak Output Current () IOP (A) Threshold input current () Safety Standards () c TLP *. TLP * TLP *.0 TLP *.0 TLP *.0 TLP9 ** VS FAT VS CATHODE ANODE ANODE CATHODE VE VLED DESAT VEE VOUT VCLAMP 0 VEE 9 TLP9 **..0 TLP9 **.0 Note (): Please refer to page. P. *: New product / **: Under development /

19 IC Output <IPM-Drive> Selection Table Data Rate (Typ.) Mbit/s Mbit/s 0 Mbit/s Output Open-collector Totem-pole Open-collector pin SO SO SOL TLP0 TLP09 (IGM) TLP TLP TLP TLP TLP0 TLP0 * TLP0 TLP0 TLP TLP9 TLP TLP SDIP TLPF TLP9F TLPF TLPF (F type) (F type) TLP9 (IGM) TLP TLP9 (IGM) TLP9 TLP9 TLPF TLP9F (IGM) TLP9F TLP9F TLP ** TLP ** : Photocouplers with a imum operating temperature (Topr.) of / () : Photocouplers with low input current. / *: New product / **: Under development / Selection Guide IPM Drive TLP0 TLP0 * TLP09 (IGM) TLP9 (IGM) TLP TLP F TLP TLP F TLP TLP F TLP TLP F Vcc Vcc pin SO Reinforced insulation Topr () Data Rate M bps SOL Reinforced insulation Topr () SOL version of the TLP0 TLP0 SOL pin SO Reinforced insulation Data Rate M bps High CMR version of the TLP0 TLP0 CMR SDIP SDIP version of the TLP0 TLP0 SDIP Data Rate M bps version of the TLP0 TLP0 Data Rate M bps SDIP High CMR Direct drive of an IPM CMR IPM Data Rate M bps Note (): Please refer to page. P. Propagation Delay Time () tphl tplh CTR / Output form / min Open-collector output =.0 () % Open-collector output (Buffer logic) =.0 () IFLH = () = Safety Standards () c *: New product / 9

20 (IPM Drive ) TLP9 TLP9 F TLP9 (IGM) TLP9 F(IGM) SDIP Direct drive of an IPM Data Rate M bps IPM Data Rate M bps Propagation Delay Time () tphl tplh CTR / Output form / Safety Standards () c % TLP TLP Vcc Vcc pin SO Reinforced insulation High-speed Direct drive of an IPM IPM Data Rate 0 M bps (Buffer logic) IFLH =. () =. () TLP TLP TLP0 Vcc Vcc pin SO Reinforced insulation Vcc =.0 0-V Direct drive of an IPM IPM Data Rate M bps SO Topr () SO version of the TLP0 TLP0 SO Data Rate M bps (Buffer logic) Open-collector output IFLH =. () =. () =.0 () 0 TLP0 TLP0 TLP * TLP * Vcc Vcc SO Low input current Direct drive of an IPM IPM Data Rate M bps SOL Reinforced insulation High-speed Direct drive of an IPM SOL version of the TLP TLP SOL Data Rate 0 M bps SOL Reinforced insulation High-speed Direct drive of an IPM SOL version of the TLP TLP SOL Data Rate 0 M bps Note (): Please refer to page. P (Buffer logic) (Buffer logic) IFLH =. () =. () IFLH =. () =. () 000 *: New product / 0

21 (IPM Drive ) Propagation Delay Time () tphl tplh CTR / Output form / Safety Standards () c TLP9 TLP9 F TLP9 TLP9 F Topr () Low input current Direct drive of an IPM IPM Data Rate M bps (Buffer logic) IFLH =. () =. () 000 Transistor Output Selection Table DC Input Type Isolation Voltage SO pin SO pin SOL SO channel / DIP F type DIP 00 Vrms TLP9- General-Purpose 0 Vrms TLP9 (SE * TLP (SE * 000 Vrms TLP TLP 000 Vrms TLP * TLP TLPF Low IF 0 Vrms TLP9 * 000 Vrms TLP * TLP0 TLP * TLP0 * TLP9- * High VCEO 0 Vrms TLP * 000 Vrms TLP * Darlington High VCEO 0 Vrms TLP 000 Vrms TLP * TLP *: New product / AC Input Type Isolation Voltage SO pin SO SO channel / : Reinforced insulation. (Creepage distances and Clearance mm) : Reinforced insulation. (Creepage distances and Clearance mm) : Photocouplers with a imum operating temperature of : Built-in RBE : Photocouplers with low input current. General- Purpose Low IF 00 Vrms TLP90-0 Vrms TLP90(SE * TLP(SE * TLP9- * 0 Vrms TLP9 * TLP * *: New product / : mm : mm : () : RBE :

22 Selection Guide DC Input Type TLP TLP (SE TLP TLP9 - TLP9 (SE TLP9 TLP pin SO Reinforced insulation Low input drive current Topr = () pin SO Reinforced insulation General-purpose pin SO Reinforced insulation High VCEO SO -channel version equivalent of the TLP9 Lead pitch:. mm TLP9 :. mm SO Reinforced insulation Lead pitch:. mm :. mm SO Reinforced insulation Low input drive current Topr = () SO Reinforced insulation -channel version equivalent of the TLP9 Lead pitch:. mm Low input drive current Topr = () TLP9 :. mm Note (): Please refer to page. P. CTR Rank min (%) (%) 0 00 Y 0 0 YH 0 GR GRL GRH 0 00 GB BL BLL Y 0 0 YH 0 GR GRL GRH 0 00 GB BL BLL GB 00 0 GB Y 0 0 YH 0 GR GRL GRH 0 00 GB BL BLL Y 0 0 YH 0 GR GRL GRH 0 00 GB BL BLL LA 0 LGB VCE Safety Standards () c

23 (DC Input Type ) TLP * TLP * TLP * pin SOL Guarantees a creepage and clearance distance of mm (min) Low input drive current Topr = () mm pin SOL Guarantees a creepage and clearance distance of mm (min) mm Pin SOL Guarantees a creepage and clearance distance of mm (min) High VCEO: 0 V () mm : 0 V CTR Rank min (%) (%) 0 00 Y 0 0 YH 0 GR GRL GRH 0 00 GB BL BLL Y 0 0 YH 0 GR GRL GRH 0 00 GB BL BLL GB 00 VCE Safety Standards () c TLP TLP TLP TLP F TLP0 () () TLP0 * DIP Internal base connection DIP No internal base connection DIP High isolation voltage pin SO Reinforced insulation Low input drive current Built-in RBE Topr = () Equivalent to the TLP0 with the IC output. RBE IC TLP0 Pin SOL Guarantees a creepage and clearance distance of mm (min) Low input drive current Built-in RBE Topr = () Equivalent to the TLP0 with the IC output mm RBE IC TLP0 Note ()(): Please refer to page. P GR GB GR GB Y 0 0 YH 0 GR GRL GRH 0 00 GB BL BLL GB GB *: New product /

24 AC Input Type TLP TLP (SE TLP90 - TLP90 (SE TLP9 TLP9 - * pin SO Reinforced insulation Low input drive current Topr = () pin SO Reinforced insulation SO -channel version equivalent of the TLP90 Lead pitch:. mm TLP90 :. mm SO Reinforced insulation Lead pitch:. mm :. mm SO Reinforced insulation Low input drive current Topr = () SO Reinforced insulation -channel version equivalent of the TLP9 Low input drive current Lead pitch:. mm Topr = () TLP9 :. mm Rank min (%) CTR (%) 0 00 Y 0 0 GR GB BL Y 0 0 GR GB BL GB Y 0 0 GR GB BL Y 0 0 GR GB BL LA 0 LGB 00 VCE 0 0 Safety Standards () c *: New product / Darlington Transistor Output Type TLP pin SO Reinforced insulation High VCEO min (%) VCE Safety Standards () c TLP * Pin SOL Reinforced insulation High VCEO TLP DIP High VCEO Note (): Please refer to page. P. *: New product /

25 Triac Output Selection Table VDRM Isolation Voltage NZC / ZC pin SO pin MFSOP (No cut) DIP pin DIP pin DIP (cut) F type F type F type NZC TLPG TLP0G 00 Vrms ZC TLPG 00 V 000 Vrms NZC ZC TLP0(S) TLP0(S) TLPG(S) TLP0(S) TLP0(S) TLPG(S) TLP0F(S) TLP0F(S) TLPGF(S) TLP0F(S) TLP0F(S) TLPGF(S) NZC TLP0J 00 Vrms ZC TLPJ TLPJ 0 Vrms NZC ZC TLPJ * TLPJ * TLPJ * TLPJ * 00 V NZC TLPJ TLPJF 000 Vrms ZC TLPJ TLPJF NZC TLP0J TLP0JF TLP0A * TLPJ(S) TLPJF(S) 000 Vrms ZC TLPJ TLPJ TLPJF TLPJF TLP0A * TLP0(S) TLP0(S) TLP0(S) TLPJ(S) TLPJ(S) TLPJ(S) TLP0F(S) TLP0F(S) TLP0F(S) TLPJF(S) TLPJF(S) TLPJF(S) NZC TLP0 * TLPL 00 V 000 Vrms ZC TLP(S) TLP(S) TLP0 * TLPF(S) TLPF(S) TLP9L(S) TLP0(S) TLPL(S) TLP9LF(S) TLP0F(S) TLPLF(S) : Reinforced Insulation / *: New product /

26 Selection Guide VDRM = 00 V Trigger LED Current LED Rank IFT Peak Voltage ITM Off-state Output Voltage VDRM Safety Standards () c TLP G DIP Non-zero cross TLP0 G TLP G ZC pin DIP (cut) General-purpose Non-zero cross pin DIP (cut) General-purpose Zero cross 0 IFT IFT 0 IFT IFT TLP0 (S) TLP0 F(S) pin DIP (cut) Non-zero cross 0 TLP0 (S) TLP0 F(S) pin DIP (cut) Non-zero cross TLP0 (S) TLP0 F(S) pin DIP (cut) Zero cross 0 ZC TLP0 (S) TLP0 F(S) pin DIP (cut) Zero cross VDRM = 00 V TLP J ZC pin MFSOP (cut) Zero cross High impulse noise immunity VN = 000 V (typ.) Trigger LED Current LED Rank IFT Peak Voltage ITM Off-state Output Voltage VDRM Safety Standards () c VN = 000 V (typ.) TLP J pin SO Reinforced insulation Non-zero cross 0 TLP J ZC pin SO Reinforced insulation Zero cross IFT IFT TLP J pin SO Reinforced insulation Non-zero cross Low trigger LED current LED IFT Note (): Please refer to page. P.

27 (VDRM = 00 V) TLP J ZC pin SO Reinforced insulation Zero cross Low trigger LED current Trigger LED Current LED Rank IFT Peak Voltage ITM Off-state Output Voltage VDRM Safety Standards () c LED IFT TLP0 J TLP0 JF DIP Non-zero cross 0 IFT TLP J TLP JF ZC DIP Zero cross 0 IFT TLP J TLP JF ZC DIP Zero cross High impulse noise immunity VN = 000 V (typ.) VN = 000 V (typ.) 0 TLP0 J TLP J ZC pin DIP (cut) General-purpose Non-zero cross pin DIP (cut) General-purpose Zero cross 0 IFT 0 IFT TLP J TLP JF pin DIP Non-zero cross 0 TLP J TLP JF ZC pin DIP Zero cross TLP0 A * pin DIP Non-zero cross 0 TLP0 (S) TLP0 F(S) pin DIP (cut) High VDRM Zero cross 0 TLP0 A * pin DIP Zero cross ZC TLP0 (S) TLP0 F(S) pin DIP (cut) High VDRM Zero cross TLP0 (S) TLP0 F(S) pin DIP (cut) Zero cross Note (): Please refer to page. P. *: New product /

28 VDRM = 00 V Trigger LED Current LED Rank IFT Peak Voltage ITM Off-state Output Voltage VDRM Safety Standards () c TLP0 * pin DIP Non-zero cross TLP0 (S) TLP0 F(S) TLP0 * TLP (S) TLPF(S) TLP (S) TLP F(S) ZC pin DIP (cut) Zero cross pin DIP Zero cross pin DIP Zero cross High impulse noise immunity VN = 00 V (typ.) VN = 00 V (typ.) *: New product / Product for Japan TLP J(S) TLP JF(S) TLP G(S) TLP GF(S) ZC pin DIP (cut) Zero cross High impulse noise immunity VN = 000 V (typ.) VN = 000 V (typ.) pin DIP (cut) Non-zero cross Trigger LED Current LED Rank IFT Peak Voltage ITM Off-state Output Voltage VDRM Safety Standards () c IFT 00 TLP J(S) TLP JF(S) pin DIP (cut) High VDRM Non-zero cross 0 IFT TLP L () pin DIP (cut) Non-zero cross 0 IFT 00 TLP G(S) TLP GF(S) pin DIP (cut) Zero cross 0 IFT 00 TLP J(S) TLP JF(S) TLP L(S) TLP LF(S) TLP J(S) TLP JF(S) TLP9 L(S) TLP9 LF(S) pin DIP (cut) High VDRM Zero cross pin DIP (cut) Zero cross pin DIP (cut) Zero cross pin DIP (cut) Zero cross High impulse noise immunity VN = 00 V (typ.) VN = 00 V (typ.) Note ()(): Please refer to page. P. ZC 0 00 IFT IFT

29 Thyristor Output Selection Table VDRM Isolation Voltage pin MFSOP DIP F type pin 00 V 00 Vrms TLPG 00 V 00 Vrms TLPJ TLP9J 000 Vrms TLPJ TLPJF Selection Guide Trigger LED Current LED IFT Peak Voltage ITM Off-state Output Terminal Voltage Safety Standards () c TLP G pin MFSOP General-purpose TLP J DIP General-Purpose Low trigger current TLP9 J pin Long anodecathode distance (SCR) SCR - TLP J TLP JF DIP Note (): Please refer to page. P. 9

30 Photovoltaic Output Selection Table OpenVoltage (Min) V Isolation Voltage 00 Vrms 00 Vrms 0 Vrms μa Short-Circuit current (Min) SSOP pin SO pin MFSOP pin DIP (cut) μa TLP90 0 μa TLP9 μa TLP90 μa TLP90B TLP90B μa TLP9B TLP9B TLP90 TLP90 0 V 00 Vrms μa TLP9 : Photocouplers with a imum operating temperature (Topr.) of / () Selection Guide Short-Circuit Current Rank ISC min (μa) Open Voltage min Safety Standards () c TLP90 B TLP9 B pin MFSOP pin MFSOP Built-in shunt resistor 0 0 C TLP90 B TLP9 B pin DIP (cut) General-purpose pin DIP (cut) Built-in shunt resistor 0 0 C TLP90 pin MFSOP General-purpose TLP90 TLP90 TLP90 TLP9 TLP9 SSOP General-purpose pin SO General-purpose Topr = () pin SO Built-in discharging circuit Topr = () SSOP High output SSOP High open-circuit voltage Note (): Please refer to page. P. 0 Discharging Circuit C C

31 Photorelays Selection Table -Form-A / VOFF ()V 0 RON ()Ω ION ()A VSON USOP SSOP pin SO.SOP.SOP.SOP 0. TLP0 TLP0 TLP0 0. TLP0 * TLP0 TLP0. 0. TLP. 0. TLP ** TLP TLP0 TLP0 0. TLP0 * TLP 0.0. TLP00 DIP F type TLP TLP0 * TLP * TLP 0. TLP TLP 0. TLP0 * TLP0 TLP TLP * TLP TLP TLP TLP. 0. TLP TLP TLP DIP F type 0..0 TLPA * TLPAF * TLP 0..0 TLP 0.0. TLP TLP TLP * TLP TLP TLPA 0. TLP * TLP TLP * TLP TLP TLP0A TLPA TLPA TLPA TLP9A TLP9A TLP0A TLP0A TLPA TLPA TLP0A *. 0. TLPA 0..0 TLP 0..0 TLP 0.. TLP * TLP0AF * TLP9A TLP9A TLP9AA 0.. TLP 0.0. TLP TLP 0.0. TLP TLP ** 0. TLP TLP TLP * TLP TLP 0. TLP9 * TLP9 TLP9. 0. : Reinforced Insulation / *: New product / **: Under development /

32 -Form-A (Continued) / VOFF ()V RON ()Ω ION ()A VSON USOP SSOP pin SO.SOP.SOP.SOP TLP TLP0 0. TLP0 * TLP TLP 0.. TLP0 DIP F type 0..0 TLP TLP09 * TLP0D 0. TLPD TLP9D TLP00D TLPD 0. TLP0D * TLP0DF * 0. TLPD DIP F type 0 0. TLP0G TLP0G * TLP0GF * TLPG TLP9G TLP0G 0 0. TLPG 0. TLPG 0. TLPGA TLP9G TLP0G TLPG TLPG TLPG TLPG TLP9G TLP9G TLPGA TLPGA 0. TLPGA TLP9GA TLP0GA TLPGA TLP0GAF * TLP9GA TLP9GA TLP9GAF TLP0GA * TLP9GA 0. TLP9GA 0. TLP ** 0. TLP TLPJ TLP0J TLP0J * TLP0JF * 0. TLP9J TLP9JF 0. TLP9 ** : Reinforced Insulation / *: New product / **: Under development / -Form-A / -Form-B / VOFF ()V RON ()Ω ION ()A 0 0. TLPA- TLPA TLPG- TLPG TLPG- TLPG TLPGA- TLPGA- VOFF ()V RON ()Ω 0 ION ()A.SOP DIP DIP 0. TLPG TLP9G 0. TLPG TLP9G -Form-B / -Form-A, -Form-B / VOFF ()V RON ()Ω 0 ION ()A TLP0G.SOP TLPG- VOFF ()V RON ()Ω ION ()A.SOP 0 0. TLP00G TLP0G

33 Selection Guide -Form-A: VSON package TLP0 * VSON Low RON High ION Trigger LED Current LED IFT Resistance (Ω) 0. RON Current ION (A) Off-state Voltage VOFF Safety Standards () c TLP * TLP * VSON Low RON 0-V VOFF VSON Low CR COFF: pf (Typ.) TLP9 * VSON COFF:. pf (Typ.) 0. TLP0 * VSON 00-V VOFF TLP * VSON Low RON TLP0 * VSON Ultra-low CR: pfω COFF: 0. pf (Typ.) CR: pf TLP * VSON TLP * VSON COFF: 0. pf (Typ.) 0 0. TLP0 * VSON Ultra-low CR:. pfω 0. 0 TLP * VSON 0. 0 TLP * VSON COFF: pf (Typ.) Form-A: USOP package TLP0 TLP0 USOP Ultra-low On-resistance R: 0.Ω (Typ.) High output current ION: 0.9 A () USOP -V VOFF Trigger LED Current LED IFT Resistance (Ω) 0. RON Current ION (A) Off-state Voltage VOFF *: New product / Safety Standards () c TLP USOP Low RON 0-V VOFF Note (): Please refer to page. P.

34 (-Form-A: USOP package ) TLP TLP TLP9 USOP Ultra-low CR: 0 pfω RON: Ω (Typ.) CR: 0 pf USOP Low CR COFF: pf (Typ.) CR: pf USOP COFF:. pf (Typ.) CR:. pf Trigger LED Current LED IFT Resistance (Ω). RON Current ION (A) 0. Off-state Voltage VOFF Safety Standards () c TLP0 USOP 00-V VOFF TLP0 USOP Ultra-low CR: pfω COFF: pf (Typ.) 0. 0 TLP0 CR: pf USOP Ultra-low CR: pfω COFF: 0. pf (Typ.) TLP CR: pf USOP Ultra-low CR: pfω COFF: 0. pf (Typ.) TLP TLP0 CR: pf USOP Ultra-low COFF: 0. pf (Typ.) COFF: 0. pf (Typ.) USOP Ultra-low CR:. pfω COFF: 0. pf (Typ.) TLP CR:. pf USOP Ultra-low COFF: 0. pf (Typ.) COFF: 0. pf (Typ.) 0. 0 TLP USOP COFF: pf (Typ.) Form-A: SSOP package SSOP Ultra-low On-resistance R: 0.Ω (Typ.) TLP0 High output current ION: 0.9 A () SSOP TLP Low CR: 0 pfω COFF: 0 pf (Typ.) CR: 0 pf SSOP TLP Ultra-low CR: 0 pfω COFF: pf (Typ.) CR: 0 pf Note (): Please refer to page. P. Trigger LED Current LED IFT Resistance (Ω) 0. RON Current ION (A) Off-state Voltage VOFF Safety Standards () c

35 (-Form-A: SSOP package ) TLP TLP TLP TLP0 SSOP Ultra-low CR: 0 pfω COFF: 0 pf (Typ.) CR: 0 pf SSOP Ultra-low CR: 0 pfω COFF: pf (Typ.) CR: 0 pf SSOP Low CR COFF: 0 pf (Typ.) CR SSOP 00-V VOFF Trigger LED Current LED IFT Resistance (Ω). RON Current ION (A) 0. Off-state Voltage VOFF Safety Standards () c TLP0 SSOP Ultra-low CR: pfω COFF: pf (Typ.) 0. TLP CR: pf SSOP Ultra-low CR: pfω COFF: pf (Typ.) TLP0 CR: pf SSOP Ultra-low CR: pfω COFF: 0. pf (Typ.) 0. TLP CR: pf SSOP Ultra-low CR: pfω COFF: 0. pf (Typ.) TLP0 CR: pf SSOP Ultra-low CR:. pfω COFF: 0. pf (Typ.) 0. 0 CR: pf TLP SSOP COFF: pf (Typ.) Form-A: pin SO package TLP A pin SO General-purpose Low trigger current Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage Safety Standards () c Form-A:.SOP package Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage Safety Standards () c TLP0 A 0. 0 TLP0 D.SOP Low trigger current General-purpose 00 TLP0 G TLP0 J Note (): Please refer to page. P.

36 (-Form-A:.SOP package ) Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage Safety Standards () c TLP A 0. 0 TLP D SOP Ultra-low trigger current TLP GA TLP J TLP A TLP G.SOP High output current General-purpose.SOP General-purpose TLP G.SOP Current-limiting function Limit current 0 to 00 ma TLP GA 0 00 ma TLP A.SOP High output current TLP D.SOP Low On-resistance TLP G.SOP General-purpose 0. 0 TLP GA TLP TLP TLP TLP TLP9 TLP.SOP Ultra-low CR: 0 pfω COFF pf (Typ.) CR: 0 pf.sop Ultra-low CR: 0 pfω COFF 0 pf (Typ.) CR: 0 pf.sop Ultra-low CR: 0 pfω COFF pf (Typ.) CR: 0 pf.sop Low CR: 0 pfω COFF. pf (Typ.),. pf () CR: 0 pf.sop Low CR: 0 pfω COFF. pf (Typ.), pf () CR: 0 pf.sop High output current ION: A up to 0 Note (): Please refer to page. P

37 (-Form-A:.SOP package ) TLP TLP * TLP0 TLP.SOP High output current ION: A up to 0.SOP High output current ION:. A up to 0.SOP Ultra-low CR: pfω COFF pf (Typ.) CR: pf.sop Ultra-low CR: pfω COFF pf (Typ.) CR: pf Trigger LED Current LED IFT -Form-A:.SOP package TLP9 A.SOP High output current Trigger LED Current LED IFT Resistance (Ω) 0. RON Current ION (A) Off-state Voltage VOFF Resistance (Ω) RON Current ION (A) Off-state Voltage VOFF 0. Safety Standards () c *: New product / Safety Standards () c TLP9 G.SOP TLP9 A TLP9 D.SOP High output current.sop Low On-resistance TLP9 G.SOP 0. 0 TLP9 GA.SOP TLP00 TLP0 TLP0.SOP Low On-resistance High output current ION:. A up to 0.SOP High output current ION:. A up to 0 C-connection: ION (DC) =.0 A () C : ION (DC) =.0 A ().SOP High output current ION:. A up to 0 C-connection: ION (DC) =. A () C : ION (DC) =. A () Note (): Please refer to page. P

38 (-Form-A:.SOP package ) TLP0 TLP0 * TLP0 * TLP09 * TLP0.SOP High output current ION:. A up to 0 C-connection: ION (DC) =. A () C : ION (DC) =. A ().SOP General-purpose High output current ION =.0 A () C-connection: ION (DC) =.0 A ().SOP High output current ION:. A up to 0 C-connection: ION (DC) =. A () C : ION (DC) =. A ().SOP General-purpose High output current ION =.0 A () C-connection: ION (DC) =.0 A ().SOP High output current ION:. A () Trigger LED Current LED IFT -Form-A:.SOP package TLP00 D TLP0 A TLP0 G TLP0 A TLP0 G TLP0 GA TLP.SOP Dual channel version of the TLPD TLPD.SOP Dual channel version of the TLPA TLPA.SOP Dual channel version of the TLPG TLPG.SOP Dual channel version of the TLPA TLPA.SOP Dual channel version of the TLPG TLPG.SOP Dual channel version of the TLPGA TLPGA.SOP Low On-resistance Note (): Please refer to page. P. Resistance (Ω) 0. RON Current ION (A) Off-state Voltage VOFF. 00 Safety Standards () c Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage VOFF *: New product / Safety Standards () c

39 -Form-A: DIP package TLP A TLP D TLP G TLP G TLP GA DIP High output current General-purpose DIP High output current General-purpose DIP General-purpose DIP Current-limiting function Limit current 0 to 00 ma 0 00 ma DIP Current-limiting function Limit current 0 to 00 ma 0 00 ma Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage VOFF Safety Standards () c TLP A TLP A TLP G TLP GA TLP G TLP0 A TLP0 AF TLP0 D TLP0 DF TLP0 G TLP0 GF TLP0 GA TLP0 GAF TLP0 J TLP0 JF TLP A TLP AF TLP TLP TLP TLP * * * * * * * * * * * * DIP For DC use only DC DIP General-purpose DIP General-purpose DIP General-purpose DIP High EMI immunity General-purpose EMI DIP Reinforced insulation General-purpose DIP High output current ION:.0 A = DIP High output current ION:. A = DIP High output current ION:.0 A = DIP High output current ION:.0 A = Note (): Please refer to page. P *: New product / 9

40 -Form-A: DIP package TLP9 A TLP9 G TLP9 A TLP9 G TLP9 GA TLP9 AA TLP9 GA TLP9 GA TLP9 GAF DIP High output current DIP General-purpose DIP High output current DIP General-purpose DIP General-purpose DIP High output current DIP Low On-resistance DIP High isolation voltage Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage VOFF Safety Standards () c TLP9 J TLP9 JF DIP High isolation voltage TLP9 GA TLP DIP High isolation voltage Low On-resistance pin DIP (cut) Low On-resistance High output current ION:. A = TLP TLP DIP High output current ION:.0 A = DIP High output current ION:. A = TLP DIP High output current ION:.0 A = TLP DIP High output current ION:.0 A = Note (): Please refer to page. P. 0

41 -Form-A: package TLP ** High output current ION = A = Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage VOFF Safety Standards () c TLP ** High output current ION = 0. A = TLP9 ** High output current ION = 0. A = **: Under development / -Form-A TLP A- TLP G- TLP G- TLP GA- TLP A- TLP G- TLP GA- TLP G- Dual channel version of the TLPA TLPA Dual channel version of the TLPG TLPG Dual channel version of the TLPG TLPG Dual channel version of the TLPGA Current-limiting function Limit current: 0 to 00 ma TLPGA : 0 00 ma Dual channel version of the TLPA TLPA Dual channel version of the TLPG TLPG Dual channel version of the TLPGA TLPGA Dual channel version of the TLPG TLPG Note (): Please refer to page. P. Trigger LED Current LED IFT Resistance (Ω) 0 RON Current ION (A) Off-state Voltage VOFF Safety Standards () c

42 -Form-B Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage Safety Standards () c TLP G TLP9 G.SOP General-purpose.SOP General-purpose TLP G DIP General-purpose TLP9 G DIP General-purpose Form-B Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage Safety Standards () c TLP0 G.SOP Dual channel version of the TLPG TLPG TLP G- Dual channel version of the TLPG TLPG -FormA, -Form-B Trigger LED Current LED IFT Resistance (Ω) RON Current ION (A) Off-state Voltage Safety Standards () c TLP00 G TLP0 G -form-b -form-a General-purpose.SOP General-purpose 0 -Form-A: -Form-B: Note (): Please refer to page. P.

43 Reference Note (): Certified to safety standards. For details on certification status, contact your Toshiba sales representative. /c-/: : Approved : Approval pending as of October 0 : : Approved ( 0-- / 00 / 090--certifi ed) : Approval pending as of October 0 Specify -certified devices with option V or D : Underwriters Laboratories () is a safety consulting and certifi cation company. c-: c- Mark is the Mark for Canada. : VERBAND DEUTSCHER ELECTROTECHNISCHER e.v. : China Quality Certification center (): The products with the ranks Y and BL are limited in production. For details, please contact your local Toshiba sales representative. (): For details of the devices, please contact your local Toshiba sales representative. (): This product is for Japan. Note (): /c-/: (0 0 ) ( 0-- / 00 / 090- ) (0 0 ) (D) Underwriters Laboratories c-csa (Canadian Standards Association) VERBAND DEUTSCHER ELECTROTECHNISCHER e.v. : China Quality Certification center (): Y BL (): ():

44 Package Package Dimensions Unit: mm / pin DIP type DIP DIP (standard) DIP (LF) DIP (LF) / DIP (F type) min to min min. min to DIP (LF) DIP (LF) TLP (standard) TLPF (TLP F type) TLP (LF) TLPF (LF) min to to pin DIP type DIP DIP (standard) DIP (LF) DIP (LF) / DIP (F type) min to min min 0. min to * All dimensions are for reference only unless tolerance is given. *

45 Unit: mm / pin DIP type DIP DIP (LF) DIP (LF) min pin DIP type DIP (standard) (LF) (LF) / (F type) min to min min 0. min to (LF) (LF) min Other DIP type / SDIP type DIP / SDIP pin DIP pin DIP (LF) pin DIP (cut) min to min. min to min to.0 SDIP SDIP (F type) * All dimensions are for reference only unless tolerance is given. *

46 Unit: mm / MFC (Mini Flat Coupler) typemfc pin MFSOP pin MFSOP (No.cut) pin MFSOP. 0.. SOP type. SOP. SOP. SOP. SOP SOP/SSOP/USOP/VSON typesop/ssop/usop/vson SOP SSOP USOP VSON SO typeso SO pin SO pin SO A min min min (0.). 0. (0.) BOTTOM VIEW BOTTOM VIEW (0.) (0.) BOTTOM VIEW M A (0.) 0. min.0 0. (0.) (0.) (0.). 0. (0.) 0. min min.0 0. * All dimensions are for reference only unless tolerance is given. *

47 Unit: mm / SO typeso SO SO min A M A (0.) 0. min.0 0. ( 0.). 0. SOL typesol pin SOL SOL SOL. ± 0. A B 0 ± A B ± 0.. ± 0.. ± 0.. ± ± 0. S 0. ± A B S A B S 0. S SOL * All dimensions are for reference only unless tolerance is given. *

48 Lead Form Options for DIP Packages The DIP, DIP and packages offer three surface-mount lead form options and a wide-spaced lead form option. The electrical characteristics are identical, regardless of these options. -pin DIP -pin DIP -pin DIP Lead Form Surface-Mount Wide-Spaced Appearance Lead Form Code Carrier Tape Code (LF) (LF), (LF) () (LF), (LF) () (LF), (F type) (TP) (TP), (TP) () () Not available() (TP), (TP) () A 0. B C 0 to Package Outline Dimensions Dimension Version (LF) (LF) (LF) min min min A B (0. typ.) (0. typ.) 0. C..0. All other package dimensions are the same as for each standard package specification. () Tape-and-reel packing is not available with (LF). () The package dimensions and lead form options of the TLP differ from those shown above. See the TLP datasheet. () Standard part names should be used when applying for safety standard approval.

49 Example Land Patterns Unit: mm / DIP (surface-mount lead form) () SDIP DIP (LF) / (LF) DIP (LF) / (F type) SDIP SDIP (F type) MFC. SOP pin MFSOPpin MFSOP.SOP.SOP.SOP SOP/SSOP/USOP/VSON SOP SOP SSOP USOP VSON SO SO pin SOpin SO SO SO SOL pin SOL SOL SOL SOL * The PCB land Pattern dimensions shown above are for reference only and should be determined empirically. () For the example land patterns for the TLP, see their respective datasheets * 9

50 Rank Marking Transistor-output photocouplers are ranked according to their CTR (Current Transfer Ratio) ranges, whereas thyristor-output and triac-output photocouplers are ranked according to their imum IFT value. The following gives the rank classifications and rank marks printed on packages. Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets. CTR Rank Name and Rank Marking (for Transistor-output) Available CTR Rank Selection ( Available, Contact your nearest Toshiba sales representative) Input Type Rank Name CTR Rank Marking CTR None Blank Y YH GR GRL GRH GB BL BLL LA LGB YE Y+ GR G G+ GB BL B LA (*) LB (*) CTR min TLP TLP(SE TLP TLP9- TLP9(SE TLP9 DC Input DC TLP9- TLP TLP TLP TLP TLP TLP/F TLP0 TLP0 TLP TLP(SE AC Input AC TLP90- TLP90(SE TLP9 TLP9- (*): The LA and LB rank are made CTR rank of the low input current condition. Marking Examples (a) DIP Package (TLP) (b) SO Package (TLP9) Lot No. Pin No. minus TL Lot No. CTR Rank Marking CTR Rank Marking 0 Pin No. minus TL

51 LED Trigger Current (IFT) Rank Name and Rank Marking (for Triac-output) Off-state Output Terminal Voltage VDRM Rank Name IFT Rank Marking IFT Trigger LED Current LED IFT None IFT IFT IFT Blank T T T TLP0G 0 00 V TLPG 0 TLPG(S)* / TLPGF(S)* 0 TLPG(S)* / TLPGF(S)* 0 TLPJ 0 TLPJ 0 TLPJ TLPJ 00 V TLP0J / TLP0JF 0 TLPJ / TLPJF 0 00 V TLP0J 0 TLPJ 0 TLPJ(S)* / TLPJF(S)* 0 TLPJ(S)* / TLPJF(S)* 0 TLPL* 0 TLP9L(S)* / TLP9LF(S)* 0 *: Product for Japan / Marking Examples (a) pin SO Package (TLPJ) (b) pin DIP Package (TLPL) Pin No. Lot No. minus TL Lot No. IFT Rank Marking IFT Rank Marking Pin No. Note:. Specify both the part number and a rank in this format when ordering. Examples: TLP (GB), TLP0G (T). For safety standard certification, however, specify the part number alone. Examples: Part number Use this part number TLP (GB) TLP TLPGB TLP

52 Packing Magazine Packing Specification DIP type DIP Standard Lead Forming LF, LF / F type, LF / LF, LF / LF Unit: mm / Magazine Carton Dimensions Pin Count Quantities per Magazine Number of Magazines Carton Dimensions Label Position L = t = 0. pin pin pin pin pin pin 00 pcs 0 pcs 0 pcs 00 pcs 0 pcs 0 pcs A 0 mm mm mm 0 mm mm B mm mm mm mm mm C mm 9 mm mm mm mm Y Y X Y X L = t = 0. Unit: mm / Unit: mm / SDIP type SDIP SDIP MFC type MFC MFSOP Magazine Carton Dimensions Quantities per Magazine Number of Magazines Carton A Dimensions B C Label Position pcs 0 mm mm mm X L = t = 0. Magazine Carton Dimensions Quantities per Magazine Number of Magazines Carton Dimensions Label Position pcs.. 0 A 9 mm mm mm B mm mm mm C mm mm mm Y Y X L = t = 0. Unit: mm / Unit: mm /. SOP type. SOP. SOP SOP type SOP SOP Magazine Carton Dimensions Pin Count Quantities per Magazine Number of Magazines Carton Dimensions Label Position.. (. SOP). 0. (.SOP).. (.SOP) 00 pcs pcs 0 pcs 0 A 9 mm mm mm B mm mm mm C mm mm mm Y Y X L = t = 0. Magazine Carton Dimensions Pin Count Quantities per Magazine Number of Magazines Carton Dimensions Label Position.. (SOP) L = t = 0. (SOP) 0 pcs 0 pcs 0 A 9 mm mm mm B mm mm mm C mm mm mm Y Y X

53 SO type SO SO SO SO SO Unit: mm / Magazine Carton Dimensions Quantities per Magazine Number of Magazines Carton Dimensions Label Position L = t = L = t = 0. L = t = 0. pcs pcs 00 pcs 0 pcs A mm 0 mm mm mm B mm mm 9 mm mm C mm mm 9 mm mm.. X X X X L = t = 0. SOL type SOL SOL Unit: mm /. Magazine Carton Dimensions Pin Count Quantities per Magazine Number of Magazines Carton A Dimensions B C Label Position.. (SOL) L = t = 0. (SOL) pcs 0 pcs 0 0 mm mm mm X.9 * All dimensions are typical values. * Photocouplers are stored in magazines, and packed into cartons. An overview of how devices are packed is shown below.

54 Tape-and-Reel Specification Tape Dimensions t J F.0 0. G D E B C K0 K A Package Taping DIP (LF) (LF) (TP) (TP) DIP (LF) SDIP SDIP F type (TP) (TP) (TP) pin / pin MFSOP.SOP.SOP.SOP SSOP USOP VSON SO pin / pin SO (TPL) (TPR) (TP) (TP) (TP) (TP) (TP) (TP) (TP) (TPL) (TPR) SO (TP) SO (TP) pin SOL (TPL) (TPR) Unit: mm / SOL SOL SOL (TP) (TL) (TP) A B (*) (*) C D Symbol E F G J ø. ø. ø. ø. ø. ø. ø K (.00.) (. 0.) (.0.). 0. (.0.) K t (*): Typical devices DIP. 0. DIP (short package) (TP) is not available. TP Reel Dimensions U C B A E W W Package Taping DIP (LF) (LF) (TP) (TP) DIP (LF) SDIP SDIP F type (TP) (TP) (TP) pin / pin MFSOP.SOP.SOP.SOP SSOP USOP VSON SO (TPL) (TPR) (TP) (TP) (TP) (TP) (TP) (TP) (TP) A 0 ø0 ø0 0 0 ø0 ø0 ø0 B ø0 ø0 ø0 ø0 ø0 ø0 ø0 ø00 pin / pin SO (TPL) (TPR) SO (TP) SO (TP) pin SOL (TPL) (TPR) Unit: mm / SOL SOL SOL (TP) (TL) (TP) Symbol C ø 0. ø 0. ø 0. ø ø 0. ø 0. ø 0. E U W W

55 Device Orientation on Tape Photocouplers are oriented in cavity, as shown below. Package Type Tape Option Packing Quantity (pcs/reel) Device Orientation on Tape User direction of feed VSON TP,000 USOP User direction of feed TP,00 SSOP.SOP TP,00 SO TP, TPL / TPR,00 pin MFSOP pin MFSOP pin SO pin SO pin SOL TPL / TPR,000.SOP,00.SOP TP SOL,00 SO,00 SOL TL,00 SO,000 SOL SDIP TP,00 SDIP (F Type),000 DIP (LF) TP,00 DIP (LF) TP,000 DIP (LF) TP,00 User direction of feed [TP, TPL] [TPR] User direction of feed Empty Device Recesses Item Occurrences of or more successive empty device recesses. Single empty device recesses. Standard 0 devices () per reel Remarks Within any given 0-mm section of tape, not including leader and trailer. 0mm Not including leader and trailer. Packing Boxes Either one reel or ten reels of photocoupler are packed in a shipping carton. Label Format () Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. () Reel: The label provides the part number, the taping name, quantity, lot number, etc. The standard taping specification is presented herein. The taping specification and name for some products may be different. For details, see technical datasheets for individual products.

56 Board Assembly Board Assembly Considerations. Soldering The profile below shows only the typical temperature profile and conditions, which might not apply to all Toshiba photocouplers. Temperature profiles and conditions may differ from product to product. Refer to the relevant technical datasheets when mounting a device. When using a soldering iron or medium infrared ray / hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions..) Using a soldering iron a. Solder once within 0 seconds for a lead temperature of up to 0. b. Solder once within seconds for a lead temperature of up to 0..) Using medium infrared ray/hot air reflow a. Complete the infrared ray/hot air reflow process at once within 0 seconds at a package surface temperature between 0 and 0. b. Example of temperature profile of lead (Pb)-free solder Package surface temperature (C) to 0 seconds Time 0 to 0 seconds Example of temperature profile of lead (Pb)-free solder c. Temperature Profile of JEDEC Pb-Free Solder (For Reference Only) Package surface temperature TC (C) to 0 seconds Time 0 (Max) 0 to 0 seconds Temperature profile of JEDEC Pb-free solder (for reference only) d. Precautions for heating Keeping packages at high temperature for a long period of time can degrade the quality and reliability of devices. Soldering time has to be kept as short as possible to avoid a rise in package temperature. When using a halogen lamp or infrared heater, avoid direct irradiation of packages, since this may cause a rise in package temperature. (s) (s) (C) (C) (Max) 00 (s) (s).) Dip soldering (flow soldering) The thermal shock of dip soldering increases thermal stress on devices. To avoid stress, the use of a soldering iron or medium infrared ray/hot air reflow is recommended. If you want to use dip soldering, contact your nearest Toshiba sales representative.

57 . Flux Cleaning When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as sodium (Na+) or chloride (Cl ) ions remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases, which can degrade device performance. Washing devices with water will not cause any problems. However, make sure that no reactive ions such as sodium (Na+) or chloride (Cl ) ions are left as residue. Also, be sure to dry devices sufficiently after washing. Do not rub device markings with a brush or with your hand during cleaning or while the devices are still wet from the cleaning agent. Doing so can rub off the markings. Dip cleaning, shower cleaning and steam cleaning processes all involve the chemical action of a solvent. Use only recommended solvents for these cleaning methods. When immersing devices in a solvent or steam bath, make sure that the temperature of the liquid is 0 or below and that the circuit board is removed from the bath within one minute. If a device package allows ultrasonic cleaning, keep the duration of ultrasonic cleaning as short as possible, since long hours of ultrasonic cleaning degrade the adhesion between the mold resin and the frame material. The following ultrasonic cleaning conditions are recommended. Frequency: khz to 9 khz Ultrasonic output power: 00 W or less (0. W/cm or less) Cleaning time: 0 seconds or less Suspend the circuit board in the solvent bath during ultrasonic cleaning in such a way that the ultrasonic vibrator does not come into direct contact with the circuit board or the device. Conventional cleaning solvents that contain freon are not recommended due to its adverse effects on the earths ozone layer. Alternative freon-free products are available on the market. Contact Toshiba or a Toshiba distributor regarding cleaning conditions and other relevant information for each product type.

58 Device Degradation Projected Operating Life Based on LED Light Output Degradation Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on page 9 shows the types of LED used in photocouplers and the figures on pages 0 to show projections of longterm light output performance and operating life. Note that these operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Projected Operating Life () () F0% operating life () F0.% operating life () F0% () F0.% () GaAs LED,00,000 h 0,000 h GaAAs (SH) LED 0,000 h 00,000 h GaAAs (DH) LED,000,000 h 00,000 h Photocouplers Mainly for phototransistor output devices and phototriac output devices Mainly for photo-ic couplers IC Mainly for photorelays (MOSFET output), photovoltaic couplers and photo-ic couplers MOSFET IC GaAAs (MQW) LED Ask your local Toshiba sales representative. Mainly for photo-ic couplers IC () Ta = 0, IF = 0 ma, failure criteria: degradation rate ΔPo < -0% () Cumulative failure rate 0%: Time period until the projected long-term light output degradation curve of the average light output change (X) shown on pages to 0 reaches the failure criteria. () Cumulative failure rate 0.%: Time period until the projected longterm light output degradation curve of X - σ shown on pages to 0 reaches the failure criteria. F Δ σ The relationship between LED light output degradation and optical coupling characteristics is shown below. The relationship between LED light output degradation and current transfer ratio (CTR)/short circuit current (ISC) is :. CTR (t) CTR (o) = Po (t) Po (o) CTR (t) CTR (o) = Po (t) Po (o) The relationship between a reciprocal value of LED light output degradation and IFT/IFLH//IFH change is :. IFT (t) IFT (o) Po (t) Po (o) = ( ) - IFT (t) IFT (o) Po (t) Po (o) = ( ) -

59 LEDs Used in Photocouplers LED: GaAs GaAAs (SH) GaAAs (DH) GaAAs (MQW) Photocouplers LED Photocouplers LED Photocouplers LED Photocouplers LED Photorelays N TLP0 TLP TLP0A TLP0 Series N TLP0 TLP TLP0H TLP Series N TLP0 TLPH TLP0A TLP Series N TLP0 TLP0J TLP0 TLPG Series N9 TLP09 TLPJ TLP TLPA TLP0 TLP TLPJ TLP TLP Series TLP09 Series TLPA TLP TLP TLP9D TLPA TLP TLP TLP TLP9 Series TLP TLP TLP TLP9 TLP9 Series TLP TLP0H TLP TLP TLP99D TLPG TLP0 TLP TLP TLP00D TLPA TLP TLP TLPJ TLP0 Series TLP TLP0 TLP90 TLP0 TLP0 Series TLP Series TLP0 TLP90 TLP TLP09D TLPJ TLP TLP90 TLP TLP Series TLP TLPJ TLP90 TLP9 Series TLPG Series TLP TLP TLP9 TLPJ TLPA TLP(SE TLPJ TLP9 TLPJ TLP Series TLP(SE TLPJ TLP TLP0 TLP Series TLP TLPJ TLPG Series TLP0 TLP0 Series TLP TLP0 TLPJ TLP TLPA TLP90B TLP0 TLP9J TLP90 TLP9 Series TLP9B TLP0 TLP0 TLP90 TLP9 Series TLP0 TLP0 TLP TLPN TLP9 Series TLP09 TLP TLP TLP9 Series TLP09 TLP TLP TLP9GA TLP0 TLP TLP TLPxx Series TLP0 TLP TLP TLP0 TLP0 ** TLP ** TLP TLPx Series TLP TLP Series TLP TLP0 TLPE TLP90- TLP9 Series TLP0 TLP0 TLP90(SE TLP0 Series TLP TLP TLP9- TLP Series TLP0 TLPA TLP9(SE TLP0 TLP TLP ** TLP9 Series TLP0 TLP0 TLP TLP9 Series TLP TLP TLP00 TLP9 TLP TLPxx Series TLP0 TLP9 TLP TLPxx Series TLP0 TLP9 TLP90B TLPxx Series TLP09 TLP0(S) TLP9B TLPxxx Series TLP0 ** TLP0(S) TLP9 ** TLP ** TLP0(S) TLP9 ** TLP ** TLP0(S) TLP9 ** TLP TLP0A TLP Series TLP TLP0 Series TLP TLP TLP0(S) TLPJ TLP TLP0(S) TLP Series TLP TLP0 TLP Series TLP ** TLP0(S) TLPJ TLP TLP0 TLP9L TLP0 TLP0H TLP00 TLP9 TLP TLP00A TLP9 TLPA TLP00H TLP9 TLPH TLP0 LED **: Under development / 9

60 GaAs LED Projected Light Output Degradation Data Projected Operating Life Data The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the imum ratings are not guaranteed. 0

61 GaAAs (SH) LED Projected Light Output Degradation Data Projected Operating Life Data / K (x0 - ) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the imum ratings are not guaranteed.

62 GaAAs (DH) LED Projected Light Output Degradation Data Projected Operating Life Data The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the imum ratings are not guaranteed. GaAAs (MQW) LED Projected Light Output Degradation and Operating Life Data Toshiba is now preparing the light output degradation and operating life data for GaAAs (MQW) LEDs. These data are available for individual LEDs. Ask your local Toshiba sales representative.

63 Reading the Projected LED Operating Life Graph For example, lets calculate the operating life of the GaAs LED, based on the data shown on page. Here is an example of how to read an operating life, assuming that the ambient temperature (Ta) is 0 and that the failure criterion is a 0% decrease in light output. Suppose that the initial LED current, IF, is 0 ma. Since the horizontal axis of the failure criteria graph is the reciprocal of absolute temperature, it is necessary to convert the ambient temperature (Ta) to the reciprocal of absolute temperature (T): Δ T = =.9 0 Ta The graph shows the projected lifetimes for F0% and F0.% cumulative failure probabilities in solid and dashed lines respectively. Normally, it is recommended to use F0.% lines. As X =.9, its intersection with the IF = 0 ma line for F0.% is approximately 0,000 hours. (This figure is for reference only.) You can also estimate the projected operating life from the projected light output degradation data. 0%

64 Safety Standard Approvals Safety Standard Approvals for Photocouplers (DIN 0--) Mechanical Construction Transmissive Photocouplers in Single-Molded Packages Transmissive Photocouplers with an Insulating Film in Single-Molded packages Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photorelays certified to (USA), c- (Canada), (Germany), SEMKO (Sweden) and (China). The table above lists photocouplers and photorelays that have already been approved as of October 0. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative. Transmissive Photocouplers in Double-Molded Packages Photo Detector Chip Coupling Medium (Window) Photo Detector Chip Coupling Medium (Window) Photo Detector Chip Coupling Medium (Window) Internal Construction Package (Body) Lead Package (Body) Lead Package (Body) Lead LED Chip LED Chip Film LED Chip Die Coat Construction Mechanical Ratings (min) /TÜV DIN 0-- Package Isolation Creepage Path (mm) Isolation Clearance (mm) Isolation Thickness (mm) Max Working Insulation Voltage (Viorm) Highest Allowable Overvoltage (Viotm) SO (ch).sop // DIP DIP (F type) SO ( ch) SDIP SDIP (F type) DIP DIP (F type) MFSOP SO SO SOL SOL SO DIP..0./ / / / / /.0.0 (0.) (0.) /0. 0./ /0. 0./0. Vpk Vpk 0 Vpk /90 Vpk 000 Vpk 00 Vpk 000 Vpk 000 Vpk 000 Vpk 000 Vpk 000 Vpk 0 Vpk Vpk 90 Vpk 0 Vpk 90 Vpk 0 Vpk Vpk 0 Vpk 0 Vpk 000 Vpk /000 Vpk 000 Vpk /000 Vpk 000 Vpk /000 Vpk 0 Vpk /0 Vpk 0 Vpk Vpk 000 Vpk 000 Vpk 000 Vpk 000 Vpk 000 Vpk 90 Vpk /0 Vpk 000 Vpk /000 Vpk DIP (F type) 90 Vpk /0 Vpk 000 Vpk /000 Vpk IC Output TLP0 TLP0 TLPA TLP TLPE TLP TLP0 TLP TLP TLP9 TLPF TLP0 TLP0 TLP0 TLP0 TLP09 TLP TLPA TLP TLP TLP00 TLP00A TLP00H TLP0 TLP0A TLP0H TLP0A TLP0 TLP TLP TLP TLP TLP9 TLP TLP TLP00F TLP00AF TLP00HF TLP0F TLP0AF TLP0HF TLP0AF TLP0F TLPF TLPF TLPF TLPF TLP9F TLPF TLPF TLP0 TLP TLP9 TLP0H TLPH TLP TLP TLPH TLPN TLP0H TLPA TLP TLP TLP9 TLP9 TLP9 TLP90 TLP90 TLP0F TLPF TLP9F TLP0HF TLPHF TLPF TLPF TLPHF TLP0HF TLPAF TLPF TLPF TLP9F TLP9F TLP9F TLP90F TLP90F TLP TLP0 TLP09 TLP09 TLP09 TLPA TLP0 TLP TLPA TLP TLP TLPE TLP09 TLP0 TLP TLP TLP TLP TLP TLP TLP TLP0 TLP0 TLP0 TLP TLP9 TLP9 TLP9 TLP0 TLP0 TLP0 TLP TLP TLP TLPA TLP0 TLP0 TLP TLP TLP TLP0 TLP0 Transistor Output TLP TLP TLP TLP90(SE TLP9(SE TLP9 TLP9 TLP(SE TLP(SE TLP TLP TLP TLP TLP TLP TLP TLP90- TLP9- TLP9- TLP9- TLP TLPF Certified Devices Triac/Thyristor Output / TLP0G TLP0J TLPG TLPJ TLP0J TLPJ TLPJ TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP(S) TLP(S) TLPJ(S) TLPG(S) TLPJ(S) TLPL TLPG(S) TLPJ(S) TLPL(S) TLPJ(S) TLP9L(S) TLP0JF TLPJF TLPJF TLP0F(S) TLP0F(S) TLP0F(S) TLP0F(S) TLP0F(S) TLP0F(S) TLP0F(S) TLP0F(S) TLPF(S) TLPF(S) TLPJF(S) TLPGF(S) TLPJF(S) TLPGF(S) TLPJF(S) TLPLF(S) TLPJF(S) TLP9LF(S) TLPJ TLPJ TLPJ TLPJ TLPJ TLPJ TLPJ TLPJF TLPJF TLPJF Photorelay/ Photovoltaic / TLP0A TLP0D TLP0G TLP0J TLPA TLPD TLPGA TLPJ TLPA TLPG TLPA TLPD TLPG TLPGA TLP0G TLP0G TLP0GA TLP TLP TLP TLP TLP9 TLP TLP TLP TLPG TLPG- TLP9G TLP9GA TLP9J TLP9GAF TLP9JF TLPA TLP90 TLP90 TLP0A TLP0D TLP0G TLP0GA TLP0J TLPA TLP0AF TLP0DF TLP0GF TLP0GAF TLP0JF TLPAF