Photocouplers and Photorelays

Transcription

1 0- PRODUCT GUIDE Photocouplers and Photorelays SEMONDUCTOR

2 Preface As a type of isolator favored by manufacturers, photocouplers now serve as noise protectors in many electronic devices. Toshiba s photocouplers consist of either a GaAs or GaA As infrared LED(s) and a silicon photodetector(s) housed in a mold package. GaA As LEDs are adopted in high-speed photo- types due to their high-speed and high-light output. White overmold (epoxy) Detector Dome (silicon) Infrared LED Lead frame Extensive Line of Products To meet customers various needs, we offer an extensive product portfolio shown below as well as generalpurpose photocouplers.. Photo- couplers: High speed and advanced functions (highly integrated detectors). Zero-crossing phototriac couplers: Phototriac-output devices with zero-crossing detection. Photovoltaic couplers: MOSFET gate drive (high voltage output achieved using a photodiode array). Photorelays (MOSFET-output devices): AC-DC switches (MOSFET output) Mechanical relay replacement Perspective view of the TLP5- Cross section of the TLP5- Safety Standard Approvals UL approval has been obtained under file number E9 for most of our photocouplers. EN0-5--approved photocouplers are also offered with a wide selection of output (transistor, thyristor, triac, output and photorelay). The designs of these devices meet other standards including IEC0VDE00, IEC0950EN0950 and IEC005EN005. Small-Package Products Toshiba offers a wide variety of photocouplers in a small package to meet the space-saving requirement of increasingly smaller and thinner end products. Packaging options include mini-flat packages (MFSOPs) and half-pitch (. mm) mini-flat SOP packages. Overseas Manufactured Photocouplers Part of the general-purpose photocouplers with transistor and triac outputs are manufactured by Toshiba Semiconductor Thailand Co., Ltd. This will help customers procure components locally for overseas assembly of end products. CONTENTS. Product Index.... New Products Photocoupler Product Tree Selection Guide Output and Darlington-- Output Photocouplers Photocouplers for Logic Signal Transmission.... Photocouplers for IGBTMOSFET Gate Drive.... Photorelays (-Form-A and -Form-A) Photorelays (-Form-B, -Form-B and -Form-A-Form-B).... Triac-Output Photocouplers.... Thyristor-Output Photocouplers.... Photovoltaic-Output photocouplers Products Manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. (TST) Part Naming Conventions.... Package Information.... Lead Form Options for DIP Packages.... Package Dimensions.... Rank Marking Packing Information Photocoupler Magazine Packing Specifications Tape-and-Reel Specifications Board Assembly Example Land Patterns Board Assembly Considerations Device Degradation Projected Operating Life Based on LED Light Output Degradation Safety Standard Approvals Photocoupler Application Circuit Examples.... Competitor Cross Reference... 9

3 Product Index Part Number Package Output Page Part Number Package Output TLP0 TLP05 TLP0 TLP09 TLP09 (IGM) TLPA TLP TLP TLP TLP TLP TLP0 TLP TLP TLPG TLP5 TLP5A TLP55E TLP0G TLP0J TLPG TLPJ TLPJ TLP5J TLPJ TLPJ TLP0A TLP0D TLP0G TLP0J TLPA TLPG TLPA TLPG TLPGA TLP5A TLPA TLPD TLPG TLPGA TLP9D TLP0 TLP TLP TLP5 TLP90B TLP9B TLP9A TLP9G TLP9A TLP9D TLP9G TLP9GA TLP99D TLP00D TLP0A TLP0G TLP0 TLP0A TLP0G TLP0GA TLP095 TLP09 TLP09D TLP05 TLP0 TLP TLPE TLP0 TLPA TLP TLP TLP00 TLP0A TLP0D TLP0G TLP0GA TLP0J TLPA SO MFSOP MFSOP SO SO SO MFSOP SO MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP SO SO SO MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP MFSOP.5SOP.5SOP SO.5SOP.5SOP.5SOP.5SOP.5SOP MFSOP MFSOP SO SO MFSOP MFSOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP MFSOP.5SOP.5SOP.5SOP MFSOP MFSOP.5SOP SO SO SO SO SO SO SO SO DIP DIP DIP DIP DIP DIP Darlington transistor Thyristor Triac Triac Triac Triac Triac Triac Triac Triac MOSFET(Photorelay) Photovoltaic Photovoltaic 0,, TLPA TLPA- TLPG TLPG- TLPG TLPG- TLPGA TLPGA- TLP5A TLPA TLPA- TLPG TLPG- TLPGA TLPGA- TLP TLP TLP TLP0 TLP0 TLP05 TLP0 TLP09 TLP09 (IGM) TLP TLP5 TLP5A TLP TLP TLP TLP50 TLP5 TLP0 TLP0J TLPJ TLP0 TLP TLP TLP TLP TLP0 TLP0- TLP TLP- TLP TLP- TLP5 TLP5- TLP90- TLP9- TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP05 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP00 TLP0 TLP TLP TLP TLP5 TLP TLP TLP9 TLP0 TLP TLP TLP TLP5 TLP0 TLP TLP0 TLP0- TLP0 TLP0- DIP DIP DIP DIP DIP DIP DIP DIP SO SO SO SO SO SO SO SO SO SO SO SO SO SO SO MFSOP MFSOP S S S SOP SOP SOP SOP SOP SOP SOP SOP SO SO.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP DIP SSOP MOSFET (Photorelay Triac Triac Triac Triac Triac Triac Triac Triac Triac Triac Triac Page ,9,9,9,9 9 9,0,0,0,0,0,0,0,0,

4 Product Index Part Number TLP TLP TLP TLP5 TLP TLP TLP TLP9 TLP0 TLP0 TLP TLP0 TLP TLP50 TLP5 TLP0 TLP TLP TLP TLP5 TLP50 TLP50H TLP5 TLP5A TLP5H TLP5 TLP5 TLP5 TLP5 TLP55 TLP5 TLP0J TLPJ TLPJ TLP TLP TLP TLP (S) TLP (S) TLP (S) TLP90 TLP90 TLP9 TLP9 TLP00G TLP00G TLP0G TLP0G TLPG TLPG TLP9G TLP9G TLP0G TLP0G TLPG TLPG- TLPG TLPG- TLP59G TLP59G TLP50A TLP5 TLP5 TLP5 TLP5- TLP5- TLP55G TLP55G- TLP55G- TLP5 TLP5 TLP5J TLP59J TLP550 TLP55 TLP55 TLP55 TLP55 Package Output Page Part Number SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP USOP USOP DIP DIP DIP MFSOP SSOP SSOP SSOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP.5SOP DIP DIP DIP DIP Triac Triac Triac Darlington transistor Darlington transistor Darlington transistor Triac Triac Triac Photovoltaic Photovoltaic Photovoltaic Photovoltaic Darlington transistor Darlington transistor Darlington transistor Triac Triac Triac Thyristor Thyristor ,0, TLP555 TLP55 TLP55 TLP559 TLP559 (IGM) TLP50G TLP50J TLP5G TLP5J TLP50 TLP5 TLP5 TLP590B TLP59B TLP59A TLP59G TLP59A TLP59G TLP59GA TLP59AA TLP59GA TLP0 TLP0- TLP0- TLP TLP- TLP- TLP TLP- TLP- TLP TLP- TLP- TLP TLP- TLP- TLP9 TLP9- TLP9- TLP0 TLP TLP TLP5 TLP00 TLP00H TLP0 TLP0A TLP0H TLP05 TLP05A TLP0 TLP TLP5 TLP TLP TLP9 TLP TLP TLP TLP TLPJ TLP50 TLP5 TLP5 TLP59 TLP59 (IGM) TLPJ TLPJ TLP TLP5 TLP9GA TLP9J TLP9GA N5 N N N N9 Package DIP DIP DIP DIP DIP DIP S S S S S S S S S S S S S DIP DIP Output Triac Triac Triac Triac Darlington transistor Darlington transistor Darlington transistor Photovoltaic Photovoltaic MOSFET (Photorelay Darlington transistor Darlington transistor Darlington transistor Thyristor Triac Triac Page ,9 5, ,9,

5 New Products Small Surface-Mount -Output Photocouplers in the SO Package Toshiba is expanding its portfolio of -output photocouplers in the small and thin SO package. To meet customer needs, Toshiba has released photocouplers featuring various data rates, dual-channel configurations and power device drivers. Data rate (typ.) Part Number # of Circuits Output Supply Voltage 0. Mbits Mbits 5 Mbits 5 Mbits to 0 Mbits 50 Mbits TLP0 TLP0 TLP09 TLP05 TLP0 TLP05 TLP0 TLP* TLP0* TLP TLPE TLP* TLP* TLP TLPA TLP* TLP* -ch -ch -ch -ch -ch -ch -ch -ch -ch -ch -ch -ch -ch -ch -ch -ch -ch Darlington Open-collector Totem-pole Totem-pole Open-collector Open-collector Totem-pole Totem-pole Up to V. to 0 V Up to 0 V. to 0 V. V. V. V. V SO Driver Propagation Delay: 0. μs (max) TLP5 -ch ±0.-A peak current 0 V to 0 V SO Driver Propagation Delay: 0.5 μs (max) TLP5A* -ch ±0.-A peak current 0 V to 0 V *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. IGBTMOSFET Gate-Drive -Output Photocouplers with an Extended Operating Temperature Range Printed circuit boards are becoming smaller and denser as a result of product miniaturization. This is driving the need for electronic components with an extended operating temperature range. To meet this need, Toshiba has been expanding its portfolio of -output photocouplers that are guaranteed up to 5 C instead of the conventional 00 C limit. TLP5H Wide packaging options: SO, SO, S, Key specifications are guaranteed over 0 C to 5 C ( 0 C to 0 C for the TLP5) Low current consumption: C = ma (max) TLP0H Peak Output Current Part Number Package Supply Voltage () Supply Current (C) Input Threshold Current Propagation Delay (max) UVLO Functional Schematic (TLP5) TLP5H* TLP0H* S ±0. A TLP5 SO TLP5A* SO 0 V to 0 V TLP5* TLP5A* SO SO ±.0 A TLP00H* S ±.5 A TLP50H* to 0 V ma (max) *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. (max) 00 ns 500 ns 00 ns 500 ns Yes Yes + : N.C. : Anode : Cathode : N.C. (M) (M) VO 5 5: : VO (Output) : N.C. : 5

6 New Products General-Purpose 5-Mbits -Output Photocouplers -output photocouplers with a date rate of 5 Mbitss are beneficial for applications where the user needs a data rate that is not achievable with transistor-output photocouplers. In conjunction with various packaging options, the fast -output photocouplers simplify system design and provide extra performance for future upgrades. Packaging options: MFSOP, S, SO Available in positive and negative polarity versions. Key specifications guaranteed over 0 C to 00 C Low input current:. ma max ( ma for the TLP5 and TLP) Totem-pole output: Eliminates the need for an external load resistor. Wide supply voltage range:. to 0 V Available in dual-channel versions (TLP05TLP0) EN0-5--certified Pin Configuration TLP05 TLP : Anode : Cathode : 5: VO (Output) : : Anode : Cathode : Cathode : Anode 5: : Output : Output : Package Part Number # of Channels Logic Polarity MFSOP S SO TLP05 TLP0 TLP5 TLP TLP05 TLP0 TLP05 TLP0 -ch -ch -ch -ch -ch -ch -ch -ch Positive Negative Positive Negative Positive Negative Positive Negative.... MFSOP S SO Output Photocouplers for IPM Drive Applications Toshiba offers -output photocouplers ideal for IPM drive applications. Compared to the conventional TLPA (IGM), these -output photocouplers provide shorter propagation delay times, a wider operating temperature range and digital output. Thus, they help to simplify system design and improve system performance. The TLP0 and TLP0 in a small surface-mount package are now available in mass-production quantities, while those in the S and packages will shortly be available. Wide packaging options: SO, SO, S, Key specifications are guaranteed over 0 C to 5 C. Low current consumption: (max) Wide supply voltage range:.5 to 0 V Propagation delay times: tphl = 00 ns (max), tplh = 550 ns (max) Propagation delay skew: tphl tplh = 00 ns (max) SO Functional Schematic (TLP0) Part Number Package Feature + VO 5 TLP0 TLP0 TLP* TLP5* SO SO S Small surface-mount package with a.-mm PCB mounted height (max) Standard -pin small surface-mount package Small surface-mount S package Standard package *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. : Anode : Cathode : 5: VO (Output) :

7 Photorelays in the Ultra-Small USOP Package: TLPxx Series There is a strong market need for smaller photorelays. To meet this need, Toshiba has developed photorelays in the ultra-small USOP package, which are suitable for high-density board assembly. These photorelays help to reduce system size and cost. They are ideal for use in small measuring instruments such as semiconductor testers that require numerous relays. The TLP and TLP5 provide well-balanced off-state voltage and on-state current, making them suitable not only for tester applications but also for various applications requiring high-density board assembly such as battery-controlled devices. Part Number TLP TLP5 Off-State Voltage (max) 0 V 50 V On-State Current (max) 0. A 0. A On-State Resistance (max).5 Ω.5 Ω.5..5 Total Capacitance (typ.) 0 pf pf..5 USOP LED Trigger Current (max) ma ma SSOP Pin Configuration USOP. Anode. Cathode. Drain. Drain High-ION Photorelays: TLP5x Series (Under Development) Toshiba is now developing the TLP5x Series in the package targeting applications that deal with relatively large current. Housed in the package, the TLP5x photorelays allow B and C connections, enabling the switching of -A, -A, -A and -A dc current respectively. They are suitable for various applications such as factory equipment, power supplies and security systems. Scheduled for mass production in April Characteristic Symbol Unit Package Peak Off-State Voltage (min) VOFF V Available Under Development TLP5 TLP5 TLP5 TLP55 TLP On-State Current (max) ION A.5.5 On-State Resistance (max) RON mω Isolation Voltage (min) BVS *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.

8 New Products General-Purpose Photorelays Certified for Reinforced Insulation: TLP0 Series and TLPA (Under Development) Toshiba is now developing the TLP0 Series and the TLP targeting factory equipment applications, and wattmeter and smart meter applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage between input and output, as well as for international safety standards certification. Housed in the DIP package, the new photorelays save board space and provide an isolation voltage of 5 kv. The TLP0 Series is available in versions with 0-V, 00-V, 50-V, 00-V and 00-V peak off-state voltages. The TLPA provides a 0-V peak off-state voltage and a.5-a on-state current. Scheduled for mass production in June to August Package Characteristic Symbol Unit Peak Off-State Voltage (min) VOFF V Existing Photorelay Examples Under Development TLPA TLPG TLP0A TLP0D TLP0G TLP0GA TLP0J TLPA DIP On-State Current (max) ION A On-State Resistance (max) RON Ω Isolation Voltage (min) BVS *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. -Output Photocouplers in the SO Package Certified for Reinforced Insulation Despite the same footprint size as the MFSOP package, the new SO package provides reinforced insulation, offering clearance and creepage distances of 5 mm; an internal isolation thickness of 0. mm; and an isolation voltage of 50. Additionally, the SO features the maximum PCB mounted height of. mm, approximately 0% lower than the MFSOP. This makes the photocouplers in SO ideal for low-profile applications. Clearancecreepage: 5 mm Thin package:. mm Internal Faraday shield: 0. mm Thin package:. mm SO Part Number Data rate (typ.) Output Supply voltage Input Threshold Current (max).55. TLP0 TLP09 TLPA TLP* TLP TLP* TLP* Mbits Open-collector, optimized for IPM drive Mbits Open-collector 0 Mbits 0 Mbits 50 Mbits Totem-pole inverting logic Open-collector inverting logic Totem-pole inverting logic. to 0 V. to 0 V. V. V. V...0 SO *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.

9 Photocoupler Product Tree Photocoupler Product Tree Package DIP General-purpose packages Lead-forming options for surface mounting DIP S -mm clearancecreepage; 0.-mm isolation thickness -pin SMD package (.-mm lead pitch) S SO 5-mm clearancecreepage; 0.-mm isolation thickness 5-pin SMD package (.-mm lead pitch); low-profile SO SO SO -pin SMD package (.-mm lead pitch) -pin SMD package (.-mm lead pitch) SO SOP SO SOP SOP SOP MFSOP -pin SMD package (.-mm lead pitch) -pin SMD package (.-mm lead pitch) SMD package (.-mm lead pitch) MFSOP.5SOP.5SOP.5SOP SMD package (.5-mm lead pitch).5sop.5sop.5sop SSOP SSOP Ultra-small; SMD package (.-mm lead pitch) USOP USOP Ultra-small; SMD package (.-mm lead pitch) -Output -Output -Output Darlington- Output Logic Output Photorelays Photorelays Vcc V CC Output Choices Thyristor- and Triac-Output Photovoltaic-Output Gate Drive Triac Output Thyristor Output Photovoltaic-Output ZC 9

10 Selection Guide -Output and Darlington--Output Photocouplers Package Features SOP SOP SO SO MFSOP DIP Isolation Voltage Channel Single Quad Single Quad Single Single Single Dual Quad TLP TLP- TLP9-* TLP5 TLP50A 500 TLP5 50 TLP5 TLP5- TLP5* TLP TLP General-purpose 000 TLP TLP TLP TLP TLP TLP TLP TLP5 Low IF 50 TLP TLP TLP TLP TLP TLP- TLP- High VCEO TLP TLP- TLP- High IF TLP9 TLP9- TLP9-500 TLP0 TLP0- TLP90-* AC input 50 TLP TLP- TLP* TLP0 TLP0 TLP0 TLP0 TLP0- TLP0- Low IF 50 TLP TLP TLP- TLP- High IF TLP0 TLP0 TLP0- TLP0- Darlington 500 TLP50 TLP5 TLP5 TLP5 TLP5- TLP5-500 TLP High VCEO TLP TLP TLP TLP TLP- TLP- *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. 0

11 New Products with Reinforced Insulation in a Small, Surface-Mount SOP Package ( 5-mm ClearanceCreepage and 0.-mm Internal Isolation Thickness) CTR (%) () Safety Standards () Part Number Pin Configuration Features VCEO BVs Rank Min VCE ULCUL TÜV VDE BSI IEC Y ±, 50 TLP () GR V () TLP- TLP5 () TLP SOP Lead pitch =. mm AC Input TST part recm ed SOP -channel version of the TLP Lead pitch =. mm AC Input SOP Lead pitch =. mm TST part recm ed SOP -channel version of the TLP5 Lead pitch =. mm BL 00 GB GB Y GR BL GB YH 5 50 GRL GRH BLL GB ±,,, 50 0 V () 50 0 V () () 50 0 V () General-Purpose, -Output Photocouplers CTR (%) () Safety Standards () Part Number Pin Configuration Features VCEO BVs Rank Min VCE ULCUL TÜV VDE BSI IEC TLP TLP TLP TLP () TLP () 5 5 Mini-flat MFSOP Low input drive current Mini-flat MFSOP Internal base connection Mini-flat MFSOP Low input drive current Internal base connection Mini-flat MFSOP TST part recm ed SOP Lead pitch =. mm TST part recm ed BV Y GR BL GB BV 00 Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Note : Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note : Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page for detail. Japan product is non-promotional item Y GR BL GB YH 5 50 GRL GRH BLL Y GR BL GB YH 5 50 GRL GRH BLL ma, 0., ma, 0.,, 50 0 V 50 0 V 50 0 V 50 0 V () V () ()

12 Selection Guide General-Purpose, -Output Photocouplers (Continued) CTR (%) () Safety Standards () Part Number Pin Configuration Features VCEO BVs Rank Min VCE ULCUL TÜV VDE BSI IEC TLP SOP -channel version of the TLP Lead pitch =. mm GB 00 00, V () TLP 5 Low input drive current Internal base connection 00 BV ma, 0. 5 TLP 5 Low input drive current 00 BV ma, 0. 5 TLP50A 5 50 GB , TLP5 TLP5 5 5 Internal base connection High EMI immunity Y GR BL GB Y GR BL GB 00 00,, TLP DIP Low input drive current BV ma, 5 TLP- 5 Dual-channel version of the TLP BV ma, 5 TLP channel version of the TLP 00 BV ma, 5 TLP DIP High VCEO 50 GB , 50 V Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Note : Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.

13 General-Purpose, -Output Photocouplers (Continued) CTR (%) () Safety Standards () Part Number Pin Configuration Features VCEO BVs Rank Min VCE ULCUL TÜV VDE BSI IEC TLP- 5 Dual-channel version of the TLP 50 GB , 50 V TLP channel version of the TLP 50 GB , 50 V TLP9 DIP High input current I F = 50 ma ma, V 5 5 TLP9- Dual-channel version 0 of the TLP ma, V 5 TLP channel version of the TLP ma, V 5 5 TLP 5 Internal base connection GB GR 00 00, TLP High EMI immunity GB 00 00, 5 GR TLP 5 Internal base connection GB GR 00 00, TLP GB 00 00, GR TLP TLPF 5 Internal base connection GB GR 00 00, Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Note : Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.

14 Selection Guide General-Purpose, -Output Photocouplers (Continued) CTR (%) () Safety Standards () Part Number Pin Configuration Features VCEO BVs Rank Min VCE ULCUL TÜV VDE BSI IEC TLP, 000 GB TLPF GR TLP () TLPF () TLP5* () TLP5F* () DIP High isolation voltage UL-approved (double protection) AC-Input, -Output Photocouplers Y GR BL GB YH 5 50 GRL GRH BLL Y GR BL GB YH 5 50 GRL GRH BLL CTR (%) () Safety Standards () Part Number Pin Configuration Features VCEO BVs Rank Min VCE ULCUL TÜV VDE BSI IEC Mini-flat TLP MFSOP AC input 00 Low input drive current TLP0 TLP0 () TLP0 () TLP0- DIP High isolation voltage UL-approved (double protection) Mini-flat MFSOP AC input Internal base connection Mini-flat MFSOP AC input TST part recm ed SOP Lead pitch =. mm AC input TST part recm ed SOP -channel version of the TLP0 Lead pitch =. mm AC input 50 GB 00 GB 00 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Note : Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note : Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page for detail. Japan product is non-promotional item. Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative. Note : About the package dimensions and lead form options, see each datasheet Y GR BL GB Y GR BL GB ,, ± ma, 0. ±, ±, ±, ±, 0 V 0 V (5) (5) 0 V V 50 () () 0 V V () () V ()

15 AC-Input, -Output Photocouplers (Continued) CTR (%) () Safety Standards () Part Number Pin Configuration Features VCEO BVs Rank Min VCE ULCUL TÜV VDE BSI IEC TLP0 TLP0- TLP0- TLP0 TLP0 () TLP0F () TLP0- () TLP0F- () DIP High input current AC input I F = 50 ma Dual-channel version of the TLP0 -channel version of the TLP0 High input current AC input I F = 50 ma Internal base connection DIP AC input TST part recm ed Dual-channel version of the TLP0 TST part recm ed ±00 ma, V 0 ±00 ma, 0 5 V ±00 ma, V 0 0 ±00 ma, V Y GR BL GB GB ±, ±, 5 5 TLP channel version of the TLP0 50 GB ±, 5 TLP DIP Low input drive current AC input 00 BV ± ma, 0. 5 TLP- 5 Dual-channel version of the TLP 00 BV 00 ± ma, TLP channel version of the TLP 00 BV 00 ± ma, TLP0 5 AC input High isolation voltage Internal base connection 50 GB ±, 5 Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Note : Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note : Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page for detail. Japan product is non-promotional item. 5

16 Selection Guide Darlington--Output Photocouplers CTR (%) Part Number Pin Configuration Features () VCE (sat) Safety Standards () VCEO BVs VCE IF ULCUL TÜV VDE BSI IEC TLP TLP TLP TLP 5 5 Mini-flat MFSOP High VCEO High VCEO Internal base connection High VCEO High VCEO Long emitter-collector distance ma, 00 ma, V V 0 ma 00 V () ma, 00 ma, 000. V V 0 ma 00 V ma, 00 ma, 000. V V 0 ma 00 V ma, 00 ma, 000. V V 0 ma 00 V TLP5 DIP 500 ma, V V 50 ma, ma 5 TLP5-5 Dual-channel version of the TLP5 500 ma, 50 ma, V V ma TLP5- -channel version of the TLP5 500 ma, 50 ma, V V ma TLP50 High EMI immunity 000 ma, 00 ma, V. V ma TLP5 5 Internal base connection 000 ma, 00 ma, V. V ma 5 TLP5 Built-in RBE ma, 00 ma, 000. V 55V. V 0 ma 500 TLP () TLP- () TLP DIP High VCEO TST part recm ed Dual-channel version of the TLP TST part recm ed -channel version of the TLP 000 ma, V 00 ma,. V 00 V 0 ma Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Note : Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note : Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page for detail. Japan product is non-promotional item. 000 ma, 00 ma, V. V 0 ma 00 V 000 ma, 00 ma, V. V 0 ma 00 V

17 Photocouplers for Logic Signal Transmission Package Features Data Rate (Typ.) 0. Mbits Mbits 5 Mbits 0 Mbits 5 to 0 Mbits 50 Mbits Output Open-collector (Darlington) Open-collector Totem-pole IPM drive Dual polarity input Open-collector Opencollector Totempole Totempole -state. V. V. V. V MFSOP SO SO S ch ch ch ch JEDEC (TLP)* TLP09 TLP0 TLP09 TLP9 TLP5 TLP55 TLP550 TLP50 N N9 N5 (TLPA)* TLP55 TLP5 N (TLPA)* TLP559 TLP5 TLP50 TLP5 TLP59 (TLPA(IGM))* TLP09(IGM) TLP09(IGM) TLP* TLP559(IGM) TLP0 TLP0 TLP59(IGM) TLP5* TLP05 TLP05 TLP05 TLP5 TLP0 TLP0 TLP0 TLP TLP095 TLP09 TLP555 TLP55 TLP00 (TLP)* TLP5 TLP55 TLP0 N (TLP5)* TLP55 TLP (TLP5A)* TLP0 (TLP)* 5 TLP0 TLP TLPA TLP* TLP TLP* TLP* TLP* TLP TLPA TLP* TLP0* TLP TLP TLP* TLP* TLP* TLP TLP* TLP0 TLP* TLP* * : Under development as of January 0. For the latest information, please contact your nearest Toshiba sales representative. * : TLP09 recommended * : TLP09(IGM) recommended * : TLP recommended * 5 : TLPA recommended Photocouplers for Logic Signal Transmission at 0 to 50 Mbits (Typ.) Data Rate IFHL Part Number Pin Configuration Features Output Form BVs (NRZ) (Typ.) TLP TLP* TLP* Vcc Vcc Mini-flat MFSOP Propagation delay time: 0 ns (max) = SO =. or Topr (max) 5 C SO (reinforced insulation) =. or Topr (max) 5 C 50 Mbits 0 Mbits 0 Mbits Totem pole output (Inverter logic) Totem pole output (Inverter logic) Totem pole output (Inverter logic) ULcUL Safety Standards () TÜV VDE BSI IEC () () () () *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

18 Selection Guide Photocouplers for Logic Signal Transmission at 0 to 50 Mbits (Typ.) (Continued) Data Rate IFHL Part Number Pin Configuration Features Output Form BVs (NRZ) (Typ.) ULcUL Safety Standards () TÜV VDE BSI IEC TLP* 5 SO =. or Topr (max) 5 C 0 Mbits Totem pole output (Inverter logic) 50 () TLP* Vcc 5 S (reinforced insulation) =. or Topr (max) 5 C 0 Mbits Totem pole output (Inverter logic) Photocouplers for Logic Signal Transmission at 5 to 0 Mbits (Typ.) Propagation IFHL Part Number Pin Configuration Features Delay Time Output Form BVs TLPA TLP TLP TLPF TLP Vcc Vcc SO (reinforced insulation) High speed: 0 Mbits = SO High speed: 5 Mbits = Dual-channel version S High speed: 5 Mbits = High isolation voltage SO (reinforced insulation) High speed: 0 Mbits = Topr = 5 C (max) 0 ns 5 ns 5 ns 0 ns Totem pole output (Inverter logic) Totem pole output (Inverter logic) Totem pole output (Inverter logic) Open-collector (Inverter logic) ULcUL Safety Standards () TÜV VDE BSI IEC () () () () () TLP* 5 SO High speed: 5 Mbits = Open-collector 50 5 ns (Inverter logic) () TLPE* 5 SO High speed: 5 Mbits = 5 ns Open-collector (Inverter logic) 500 () TLP0* TLP0 Vcc 5 5 S High speed: 5 Mbits = High isolation voltage Mini-flat MFSOP High speed: 0 Mbits =. V 5 ns 0 ns Open-collector (Inverter logic) Totem pole output (Inverter logic) *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. 50 () ()

19 Photocouplers for Logic Signal Transmission at 5 to 0 Mbits (Typ.) (Continued) Data Rate IFHL Part Number Pin Configuration Features Output Form BVs (NRZ) (Typ.) TLP0* TLP* TLP* TLP* TLP* TLP TLP* TLP* TLPA Vcc Vcc SO =. or Topr = 5 C (max) Dual-channel version SO Propagation delay time: 5 ns =. V Dual-channel version 0 Mbits 0 Mbits 0 Mbits 0 Mbits 0 Mbits 0 Mbits 0 Mbits 5 Mbits Photocouplers for Logic Signal Transmission at 0 Mbits (Typ.) Open-collector (Inverter logic) Totem pole output (Inverter logic)... Propagation IFHL, Part Number Pin Configuration Features Delay Time Output Form IFLH BVs TLP5 TLP55 TLP55 TLP0 SO =. or Topr = 5 C (max) Dual-channel version SO (reinforced insulation) =. or Topr = 5 C (max) SO (reinforced insulation) =. or Topr = 5 C (max) SO =. or Topr = 5 C (max) SO =. or Topr = 5 C (max) S =. or Topr = 5 C (max) S =. or Topr = 5 C (max) -pin package version of the TLP55 = Logic output = High CMR version of the TLP55 = High CMR = 0 Mbits 0 ns (Topr = 5 C) 0 ns (Topr = 5 C) 0 ns (Topr = 5 C) 5 ns (Topr = 5 C) Totem pole output (Inverter logic) Totem pole output (Inverter logic) Open-collector (Inverter logic) Totem pole output (Inverter logic) Open-collector (Inverter logic) Totem pole output (Inverter logic) Open-collector (Inverter logic) Open-collector Open-collector Open-collector Open-collector ma ULcUL () Safety Standards () TÜV 500. () ULcUL TÜV VDE BSI IEC () () () () () Safety Standards () VDE BSI IEC *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. 9

20 Selection Guide Photocouplers for Logic Signal Transmission at 0 Mbits (Typ.) (Continued) Propagation IFHL, Part Number Pin Configuration Features Delay Time Output Form IFLH BVs TLP0 TLP 5 5 Dual-channel version of the N and the TLP55 = High CMR Dual-channel version of the TLP55 = 5 ns (Topr = 5 C) 5 ns (Topr = 5 C) Open-collector Open-collector Safety Standards () ULcUL TÜV VDE BSI IEC Photocouplers for Logic Signal Transmission at 5 Mbits (Typ.) Propagation IFHL, Part Number Pin Configuration Features Delay Time Output Form IFLH BVs TLP05 TLP0 TLP05 TLP0 TLP555 TLP5 TLP5F TLP TLPF Vcc Vcc Vcc 5 5 Vcc Vcc Vcc SO =.5 to 0 V Low input operation IPM drive Low input current =.5 to 0 V S IPM drive High CMR =.5 to 0 V S IPM drive High CMR =.5 to 0 V 50 ns 00 ns (Topr = 5 C) Totem pole output (Inverter logic) Totem pole output (Buffer logic) Totem pole output (Inverter logic) 50. ma () TLP55 Inverting logic version of 00 ns -state 500. ma the TLP555 (Topr = 5 C) (Inverter logic) =.5 to 0 V TLP095 TLP09 Mini-flat MFSOP =.5 to 0 V Low input operation IPM drive Mini-flat MFSOP =.5 to 0 V Low input operation IPM drive SO =.5 to 0 V Low input operation IPM drive Mini-flat MFSOP Dual polarity input version of the TLP05 = to 0 V Mini-flat MFSOP Dual polarity input version of the TLP0 = to 0 V 50 ns 50 ns 50 ns 50 ns 50 ns -state (Buffer logic) VDE BSI IEC Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.. ma ma ma 500 ULcUL Safety Standards () TÜV Totem pole ns output ma () (Buffer logic) 50 ns Totem pole output (Buffer logic) Totem pole output (Inverter logic) Totem pole output (Buffer logic) Totem pole output (Inverter logic) 50. ma () 50. ma () 50. ma () ma 50 () () () 0

21 Photocouplers for Logic Signal Transmission at 5 Mbits (Typ.) (Continued) Part Number Pin Configuration Features Propagation Delay Time Output Form IFHL, IFLH BVs ULcUL Safety Standards () TÜV VDE BSI IEC TLP05 5 SO Dual-channel version for the TLP05 =.5 to 0 V 50 ns Totem pole output (Buffer logic). ma 50 () () TLP0 5 SO Dual-channel version for the TLP0 =.5 to 0 V 50 ns Totem pole output (Inverter logic). ma 50 () () TLP00 5 Low input current =.5 to 0 V 00 ns -state (Buffer logic). ma 500 Photocouplers for Logic Signal Transmission at Mbits (Typ.) Data Rate Part Number Pin Configuration Features CTR BVs (NRZ) 5 ULcUL Safety Standards () TÜV VDE BSI IEC TLP09 SO (reinforced insulation) 50 Mbits 0% (min) ma () TLP09 5 SO Topr = 5 C(max) SO version of the TLP09 50 () Mbits 0% (min) ma TLP5 5 -pin package version of the TLP Mbits 0% (min) ma 5 TLP550 High CMR 0% (min) 500 Mbits ma (9% min for rank 0) 5 TLP55 Internal base connection 0% (min) Mbits ma 500 (9% min for rank 0) TLP0 5 SO Low input current SO version of the TLP55 50 () 00 kbits 00% (min) 0. 5 TLP Low input drive current 00 kbits 00% (min) 0. 5 TLP559 High CMR version 500 Mbits 0% (min) ma of the TLP550 5 TLP5 Internal base connection 0% (min) Mbits ma (9% min for rank 0) 5 TLP9 TLP9F S High CMR Mbits 0% (min) ma Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

22 Selection Guide Photocouplers for Logic Signal Transmission at Mbits (Typ.) (Continued) Data Rate Part Number Pin Configuration Features CTR BVs (NRZ) TLP50 TLP50F TLP5 TLP5F TLP59 TLP59F High CMR Internal base connection IEC0950-compliant version of the TLP559 Mbits 0% (min) (9% min for rank 0) ma Mbits 0% (min) ma TLP50 Dual-channel version of Mbits % (min) the N5 and the TLP550 Mbits 0% (min) ma TLP5 Dual-channel version of Mbits 9% (min) the N and the TLP550 ma ma ULcUL Safety Standards () TÜV VDE BSI IEC IPM-Drive Photocouplers Propagation IFHL, Part Number Pin Configuration Features Delay Time Output FormCTR IFLH BVs 5 SO (reinforced insulation) TLP0 IPM drive 550 ns Open-collector 50 Topr = 5 C (max) TLP0 TLP TLPF TLP5* TLP5F* SO IPM drive Topr = 5 C (max) SO version of the TLP0 S (reinforced insulation) IPM drive Topr = 5 C (max) High isolation voltage IPM drive 550 ns Open-collector (Inverter logic) 550 ns Open-collector (Inverter logic) ULcUL 550 ns Open-collector Safety Standards () TÜV 50 () VDE BSI IEC () 5 TLP09(IGM) SO (reinforced insulation) IPM drive High CMR 00 ns 50 5% (min) 0 ma () TLP09(IGM) 5 SO IPM drive High CMR 00 ns 0% (min) 0 ma 50 () *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

23 IPM-Drive Photocouplers (Continued) Propagation IFHL, Part Number Pin Configuration Features Delay Time Output FormCTR IFLH BVs 5 5 TLP559(IGM) IPM drive 00 ns 5% 500 (min) 0 ma High CMR TLP59(IGM) TLP59F(IGM) IPM drive High CMR 00 ns 5% (min) 0 ma ULcUL Safety Standards () TÜV VDE BSI IEC JEDEC-Compliant Photocouplers Data Rate IFHL, IFLH Part Number Pin Configuration Features CTR BVs (NRZ) (Typ.) 5 ULcUL Safety Standards () TÜV VDE BSI IEC N5 JEDEC-compliant Mbits % (min) ma N JEDEC-compliant 500 Mbits 9% (min) ma 5 N JEDEC-compliant 0 Mbits 00% (Typ.) JEDEC-compliant N High CTR 00 kbits 00% (min). ma N9 JEDEC-compliant High CTR kbits 00% (min) 0. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Photocouplers for IGBTMOSFET Gate Drive Package Output Peak Current ± 0.5 A ± 0.5 A (max) ± 0. A (max) S SO SO TLP55 TLP05 (High speed) TLP0 TLP5 TLP5* TLP5 TLP0A* TLP5A* TLP5A* TLP5A* TLP0H* TLP5E TLP55E TLP05A* TLP5H* TLP00 ±.0 A (max) TLP00H* TLP50 ±.5 A (max) TLP50H* TLP5* *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.

24 Selection Guide Photocouplers for IGBTMOSFET Gate Drive Propagation I FHL Part Number Pin Configuration Features Output BVs Delay Time TLP5* 5 SO (reinforced Insulation) Topr = 0 C (max) Direct drive of a small-power IGBTMOSFET 0. μs Peak output current (max): ±0. A 50 TLP5A* 0.5 μs ULcUL Safety Standards () TÜV VDE BSI IEC () () TLP55E 5 SO (reinforced Insulation) Topr = 00 C (max) Direct drive of a small-power IGBTMOSFET 0. μs Peak output current (max): ±0. A. 50 TLP5 5 SO Topr = 5 C (max) Direct drive of a small-power IGBTMOSFET High CMR 0. μs Peak output current (max): ±0. A 50 TLP5A* 0.5 μs TLP50 TLP50F 5 Direct drive of a medium-power IGBTMOSFET High CMR Low power dissipation 0.5 μs Peak output current (max): ±.5 A 50 TLP50H* TLP50HF* 5 Topr = 5 C (max) Direct drive of a medium-power IGBTMOSFET High CMR 0.5 μs Peak output current (max): ±.5 A 50 TLP5 TLP5F 5 Direct drive of a medium-power IGBTMOSFET Low power dissipation 0. μs Peak output current (max): ±0. A 50 TLP5A* TLP5AF* 5 Direct drive of a small-power IGBTMOSFET Low power dissipation 0. μs Peak output current (max): ±0. A 50 TLP5H* TLP5HF* 5 Topr = 5 C (max) Direct drive of a small-power IGBTMOSFET High CMR 0. μs Peak output current (max): ±.0 A 50 TLP5* TLP5F* 5 Direct drive of a medium-power IGBTMOSFET Low power dissipation Topr = 5 C (max) 0. μs Peak output current (max): ±.5 A 50 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

25 Photocouplers for IGBTMOSFET Gate Drive (Continued) Propagation I FHL Part Number Pin Configuration Features Output BVs Delay Time 5 ULcUL Safety Standards () TÜV VDE BSI IEC TLP55 Direct drive of a power transistor 5 μs Constant current 500 output : 0.5 A TLP00 TLP00F 5 S Direct drive of a medium-power IGBTMOSFET Low power dissipation 0.5 μs Peak output current (max): ±.0 A TLP00H* TLP00HF* TLP0 TLP0F 5 5 S Topr = 5 C (max) Direct drive of a medium-power IGBTMOSFET High CMR S Direct drive of a medium-power IGBTMOSFET Low power dissipation 0.5 μs 0. μs Peak output current (max): ±.0 A Peak output current (max): ±0. A TLP0A* TLP0AF* 5 S Direct drive of a small-power IGBTMOSFET Low power dissipation 0. μs Peak output current (max): ±0. A TLP0H* TLP0HF* 5 S Topr = 5 C (max) Direct drive of a small-power IGBTMOSFET High CMR 0. μs Peak output current (max): ±0. A TLP05 TLP05F 5 S Direct drive of a small-power IGBTMOSFET High speed (50 khz) Low power dissipation 0. μs Peak output current (max): ±0.5 A ma TLP05A* TLP05AF* 5 S Direct drive of a small-power IGBTMOSFET High speed Low power dissipation 0. μs Peak output current (max): ±0. A. *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. 5

26 Selection Guide Photorelays (-Form-A and -Form-A) Features Package Off-State Voltage (max) (V) On-State Resistance (max) (Ω) TLP TLP TLP TLP TLP0 TLP TLP TLP5 On-State Current (max) (A) TLP5 TLP USOP SSOP TLP0 TLP50 SO TLP5A*.5SOP TLP0 TLP TLP TLP TLP TLP5 TLP TLPA TLP0A TLPA TLPA.5SOP TLP00 TLP0 TLP9A TLP9A.5SOP TLP0A TLP0A TLP0A* 0.5 TLPA TLPA.5 0. TLP. 0.5 TLP TLP5A 0. TLP 0. TLP TLPA* 0.0. TLP0 0.0 TLP5* TLP5* TLP59AA TLP59A TLP59A TLP5 TLPA- TLPA- TLP55* TLP TLP 0 0. TLP 0 0. TLP 0. TLP9 TLP TLP TLP0 0.0 TLP TLP05 0. TLP5* TLP9D TLP99D TLP09D TLP0D TLPD TLP9D TLP00D 0.5 TLP0D* TLP0G TLP0G* 5 0. TLPG TLP9G TLP0G 50 TLPG TLP59G TLPG TLPG TLPG TLPG- TLPG TLP9G TLP0G TLPG TLP59G TLPG TLPGA TLP9GA TLP0GA TLPGA TLP59GA TLPGA- TLP0GA* TLP9GA TLP59GA TLP9GA 5 0. TLPGA TLPGA TLPGA- 0. TLP TLP9J TLP0J TLP0J* *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Dual-channel : MFSOP DIP

27 MOSFET-Output Photorelays, -Form-A in a USOP Package Part Number Pin Configuration Features TLP* USOP COFF: 0 pf (typ.) IFT ION ma Ω 0. A VOFF 0 V BVs 500 ULcUL Safety Standards () TÜV VDE BSI IEC TLP5* USOP COFF: pf (typ.) ma.5 Ω 0. A 50 V 500 MOSFET-Output Photorelays, -Form-A in a SO Package Part Number Pin Configuration Features IFT ION VOFF BVs Safety Standards () ULcUL TÜV VDE BSI IEC SO TLP5A* General-purpose Low trigger current ma 50 Ω ma 0. A 0 V 50 MOSFET-Output Photorelays, -Form-A in a SSOP Package Part Number Pin Configuration Features TLP0 SSOP COFF: 0 pf (typ.) IFT ION VOFF ma 0. Ω 0.9 A 0 V BVs 500 ULcUL Safety Standards () TÜV VDE BSI IEC TLP SSOP COFF: 0 pf (typ.).5 Ω 0. A 0 V 500 TLP SSOP COFF: 0. pf (typ.) ma 5 Ω 0.0 A 0 V 500 TLP SSOP COFF: 5 pf (typ.) ma Ω 0.5 A 0 V 500 TLP5 SSOP COFF: 0 pf (typ.) ma.5 Ω 0. A 0 V 500 TLP SSOP COFF: pf (typ.) ma 5 Ω 0. A 0 V 500 TLP SSOP COFF: 5 pf (typ.) Ω 0 ma 0. A 0 V 500 TLP SSOP COFF:.5 pf (typ.) 5 Ω 0.0 A 0 V 500 TLP9 SSOP COFF:.5 pf (typ.) ma Ω 0. A 0 V 500 TLP0 SSOP COFF: pf (typ.) Ω 0 ma 0.0 A 00 V 500 TLP0 SSOP COFF: pf (typ.) ma Ω 0. A 0 V 500 TLP SSOP COFF: 5 pf (typ.) ma. Ω 0.5 A 0 V 500 TLP0 SSOP COFF: 0.5 pf (typ.) ma Ω 0. A 0 V 500 TLP SSOP COFF: 0. pf (typ.) ma 0 Ω 0. A 0 V 500 TLP50 SSOP COFF: 0. pf (typ.) ma 5 Ω 0. A 0 V 500 TLP5 SSOP COFF: pf (typ.) ma.5 Ω 0. A 50 V 500 IEC *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 IEC EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

28 Selection Guide MOSFET-Output Photorelays, -Form-A in a.5sop Package Part Number Pin Configuration Features TLP0A TLP0D TLP0G TLP0J TLPA TLPG TLPA TLPG TLPGA TLPA TLPD TLPG TLPGA TLP9D TLP0 TLP TLP TLP TLP5 TLP TLP.5SOP Lead pitch:.5 mm Low trigger LED current.5sop Lead pitch:.5 mm Low trigger LED current.5sop Lead pitch:.5 mm Low trigger LED current.5sop Lead pitch:.5 mm Low trigger LED current.5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: 0 pf (typ.) Mini-flat MFSOP Low trigger LED current.5sop Lead pitch:.5 mm Current-limiting function Limit current: 50 to 00 ma.5sop Lead pitch:.5 mm Current-limiting function Limit current: 50 to 00 ma.5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: 00 pf (typ.).5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: 5 pf (typ.).5sop Lead pitch:.5 mm COFF: 00 pf (typ.).5sop Lead pitch:.5 mm COFF: pf (typ.).5sop Lead pitch:.5 mm COFF: 0. pf (typ.).5sop Lead pitch:.5 mm COFF: 5 pf (typ.).5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: pf (typ.).5sop Lead pitch:.5 mm COFF:.5 pf (typ.) IFT RON ma 50 Ω ma 0.0 A ma 5 Ω 0. A ma 5 Ω 0. A ma Ω 0. A ma Ω 0. A ma 5 Ω 0. A ma 5 Ω 0. A ma 50 Ω 0.05 A ma. Ω 0.5 A ma 0 Ω 0. A 0 V 0 V 0 V ma 5 Ω 0.0 A 0 V ma Ω 0.5 A ma.5 Ω 0. A ma 5 Ω 0. A ma 5 Ω 0.0 A 00 V 00 V 0 V 0 V 0 V 0 V 0 V () () Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales ION ma Ω ma 0. A ma Ω ma 0. A ma 50 Ω ma 0. A ma 0 Ω ma 0.09 A ma Ω 0. A VOFF 0 V 00 V 50 V 00 V 0 V ma 5 Ω 0. A 50 V 50 V 00 V 50 V 00 V BVs ULcUL Safety Standards () TÜV VDE BSI IEC ()

29 MOSFET-Output Photorelays, -Form-A in a.5sop Package (Continued) Part Number Pin Configuration Features TLP9 TLP TLP TLP.5SOP Lead pitch:.5 mm COFF:.5 pf (typ.).5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm ION: A (max)@ta: up to 50 C COFF: 90 pf (typ.).5sop Lead pitch:.5 mm ION: A (max)@ta: up to 50 C COFF: 00 pf (typ.) IFT ma ma RON Ω. ION 0. A 0.5 A ma 0. Ω.0 A ma 0. Ω.0 A VOFF 0 V 0 V 0 V 0 V BVs ULcUL Safety Standards () TÜV VDE BSI IEC TLP0.5SOP Lead pitch:.5 mm COFF: pf (typ.) ma Ω 0. A 0 V 500 TLP.5SOP Lead pitch:.5 mm COFF: 5 pf (typ.) ma. Ω 0. A 0 V 500 MOSFET-Output Photorelays, -Form-A in a.5sop or.5sop Package Part Number Pin Configuration Features TLP9A TLP9G TLP9A TLP9D TLP9G TLP9GA TLP99D TLP00 5.5SOP Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: 00 pf (typ.).5sop Lead pitch:.5 mm.5sop Lead pitch:.5 mm COFF: 0 pf (typ.).5sop Lead pitch:.5 mm COFF: 5 pf (typ.).5sop Lead pitch :.5 mm ION:.5 A up to 50 C IFT ma Ω 0. A ma 5 Ω 0. A ma Ω 0. A ma 50 Ω 0.05 A 0 V 50 V 0 V ma Ω 0. A 00 V ma 5 Ω 0. A ma 5 Ω 0. A ma ION 0.05 Ω.5 A VOFF 50 V 00 V 00 V 0 V BVs ULcUL () Safety Standards () TÜV VDE BSI IEC TLP0.5SOP ION (DC) = 5 A (max); C-connection ma 0.0 Ω.5 A 0 V 500 TLP0.5SOP ION (DC) =. A (max); C-connection ma 0.0 Ω. A 0 V 500 TLP05.5SOP ION (DC) =. A (max); C-connection ma 0. Ω. A 00 V 500 TLP0.5SOP Lead pitch :.5 mm ION:.5 A (max) 0.5 Ω.5 A 0 V TLP5.5SOP Lead pitch:.5 mm COFF: 0 pf (typ.) ma Ω 0. A 00 V 500 Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. 9

30 Selection Guide MOSFET-Output Photorelays, -Form-A in a.5sop Package Part Number Pin Configuration Features TLP00D TLP0A TLP0G TLP0A TLP0G TLP0GA TLP09D 5.5SOP Lead pitch:.5 mm Dual-channel version of the TLPD.5SOP Lead pitch:.5 mm Dual-channel version of the TLPA.5SOP Lead pitch:.5 mm Dual-channel version of the TLPG.5SOP Lead pitch:.5 mm Dual-channel version of the TLPA.5SOP Lead pitch:.5 mm Dual-channel version of the TLPG.5SOP Lead pitch:.5 mm Dual-channel version of the TLPGA.5SOP Lead pitch:.5 mm Dual-channel version of the TLP9D IFT ION ma Ω 0. A ma Ω 0. A ma 50 Ω 0. A ma Ω 0. A 00 V 0 V 50 V 0 V () ma 5 Ω 0. A 50 V ma 5 Ω 0. A ma 50 Ω 0.05 A VOFF 00 V 00 V Safety Standards BVs () ULcUL TÜV VDE BSI IEC MOSFET-Output Photorelays, -Form-A in a DIP Package Part Number Pin Configuration Features TLP0A* TLP0D* TLP0G* TLP0GA* TLP0J* TLPA* TLPA DIP General-purpose Reinforced insulation DIP General-purpose Reinforced insulation DIP General-purpose Reinforced insulation DIP General-purpose Reinforced insulation DIP General-purpose Reinforced insulation DIP General-purpose Reinforced insulation DIP COFF: 0 pf (typ.) IFT ION ma Ω ±0.5 A ma Ω ±0.5 A ma 50 Ω ±0. A ma 5 Ω ±0. A ma 0 Ω ±0.09 A ma 0. Ω ±.5 A ma Ω 0.5 A VOFF 0 V 00 V 50 V 00 V 00 V 0 V 0 V BVs 500 ULcUL Safety Standards () TÜV VDE BSI IEC TLPG DIP COFF: 0 pf (typ.) ma 50 Ω 0. A 50 V 500 TLPG TLPGA DIP Current-limiting function Limit current: 50 to 00 ma DIP For modems Current-limiting function Limit current: 50 to 00 ma ma 5 Ω 0. A ma 5 Ω 0. A 50 V 00 V TLPA DIP COFF: 0 pf (typ.) ma Ω 0.5 A 0 V 500 TLPG DIP COFF: 0 pf (typ.) ma 5 Ω 0. A 50 V 500 TLPGA DIP ma 5 Ω 0. A 00 V 500 TLP5A DIP Designed for DC output modules. Ω 0 ma 0.5 A 0 V 500 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. 0

31 MOSFET-Output Photorelays, -Form-A in a Package Part Number Pin Configuration Features TLP59A TLP59G TLP59A TLP59G TLP59AA 500 COFF: 0 pf (typ.) ma Ω 0.5 A 0 V COFF: 0 pf (typ.) COFF: 0 pf (typ.) COFF: 0 pf (typ.) COFF: 0 pf (typ.) IFT RON ma 50 Ω 0. A ma Ω 0.5 A ma 5 Ω 0. A TLP59GA ma 5 Ω 0. A 00 V COFF: 0 pf (typ.) ma Ω 0.5 A 0 ION VOFF 50 V 0 V 50 V BVs ULcUL Safety Standards () TÜV VDE BSI IEC TLP59GA ma Ω 0.5 A 00 V TLP9GA TLP9GAF TLP9J TLP9JF 5 COFF: 0 pf (typ.) COFF: 0 pf (typ.) ma 5 Ω 5 Ω 0 ma 0. A 0. A 00 V 00 V 500 TLP9GA Ω 0.5 A 00 V TLP5 High output current:.5 A (max) COFF: 00 pf (typ.) ma 0. Ω 0 ma.5 A 0 V 500 TLP5* High output current: A (max) ma 0.05 Ω A 0 V 500 TLP5* High output current:.5 A (max) ma 0.0 Ω.5 A 0 V 500 TLP55* High output current: A (max) ma 0.0 Ω A 0 V 500 TLP5* High output current: A (max) ma 0. Ω A 00 V 500 MOSFET-Output Photorelays, -Form-A in a Package Part Number Pin Configuration Features IFT ION VOFF BVs Safety Standards () ULcUL TÜV VDE BSI IEC TLPA- Dual-channel version of the TLPA ma Ω 0.5 A 0 V 500 TLPG- TLPG- 5 Dual-channel version of the TLPG Dual-channel version of the TLPG ma 50 Ω 0. A ma 5 Ω 0. A 50 V 50 V TLPGA- Current-limiting function Limit current: 50 to 00 ma ma 5 Ω 0. A 00 V 500 TLPA- Dual-channel version of the TLPA ma Ω 0.5 A 0 V 500 Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

32 Selection Guide MOSFET-Output Photorelays, -Form-A in a Package (Continued) Part Number Pin Configuration Features TLPG- TLPGA- 5 Dual-channel version of the TLPG Dual-channel version of the TLPGA IFT ION ma 5 Ω 0. A ma 5 Ω 0. A VOFF 50 V 00 V BVs ULcUL Safety Standards () TÜV VDE BSI IEC Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. 5 Photorelays (-Form-B, -Form-B and -Form-A-Form-B) Package Features -Form-B, -Form-B -Form-A -Form-B * Dual-channel Off-State Voltage (max) (V) On-State Resistance (max) (Ω) On-State Current (max) (A) SOP.5SOP.5SOP DIP TLPG TLP9G TLP0G* TLPG TLP59G TLPG-* TLPG TLP9G TLP0G* TLPG TLP59G TLPG-* TLP0G* TLP00G* TLP0G* TLP00G* MOSFET-Output Photorelays, -Form-B Part Number Pin Configuration Features TLPG.5SOP Lead pitch:.5 mm -Form-B IFT ma 50 Ω 0 ma ION 0.09 A VOFF 50 V BVs 500 ULcUL Safety Standards () TÜV VDE BSI IEC TLP9G 5.5SOP Lead pitch:.5 mm -Form-B ma 50 Ω 0 ma 0.09 A 50 V 500 TLPG DIP -Form-B ma 50 Ω 0 ma 0. A 50 V TLP59G -Form-B ma 50 Ω 0 ma 0. A 50 V 500 TLPG.5SOP Lead pitch:.5 mm -Form-B ma 5 Ω 0 ma 0. A 50 V 500 TLP9G 5.5SOP Lead pitch:.5 mm -Form-B ma 5 Ω 0 ma 0. A 50 V 500 Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

33 MOSFET-Output Photorelays, -Form-B (Continued) Part Number Pin Configuration Features IFT ION VOFF BVs ULcUL Safety Standards () TÜV VDE BSI IEC TLPG DIP -Form-B ma 5 Ω 0 ma 0.5 A 50 V 500 TLP59G 5 -Form-B ma 5 Ω 0 ma 0.5 A 50 V 500 MOSFET-Output Photorelays, -Form-B Part Number Pin Configuration Features IFT ION VOFF BVs ULcUL Safety Standards () TÜV VDE BSI IEC TLP0G.5SOP Lead pitch:.5 mm Dual-channel version of the TLPG -Form-B ma 50 Ω 0 ma 0.09 A 50 V 500 TLPG- 5 Dual-channel version of the TLPG -Form-B ma 50 Ω 0 ma 0. A 50 V 500 TLP0G.5SOP Lead pitch:.5 mm Dual-channel version of the TLPG -Form-B ma 5 Ω 0 ma 0. A 50 V 500 TLPG- Dual-channel version of the TLPG -Form-B ma 5 Ω 0 ma 0.5 A 50 V 500 MOSFET-Output Photorelays, -Form-A-Form-B Part Number Pin Configuration Features IFT ION VOFF BVs ULcUL Safety Standards () TÜV VDE BSI IEC TLP0G.5SOP Lead pitch:.5 ab (N.C. + N.O.) ma 50 Ω (Form-A) (Form-B) 0 ma 0.09 A 50 V 500 TLP00G 5 ab (N.C. + N.O.) ma 50 Ω (Form-A) (Form-B) 0 ma 0. A 50 V 500 TLP0G.5SOP Lead pitch:.5 ab (N.C. + N.O.) ma 5 Ω (Form-A) (Form-B) 0 ma 0. A 50 V 500 TLP00G ab (N.C. + N.O.) ma 5 Ω (Form-A) (Form-B) 0 ma 0. A 50 V 500 Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

34 Selection Guide Triac-Output Photocouplers Package Features VDRM 00 V Isolation voltage NZC TLP0G TLP0J TLP5J MFSOP SO ZC TLPG TLPJ TLPJ TLPJ NZC TLP50G TLP0(S) TLP0(S) TLP50J ZC TLP5G TLP0(S) TLP0(S) TLP5J NZC TLP55G-- ZC NZC ZC 00 V 00 V TLP0J ZC ZC ZC TLPJ TLPJ TLPJ TLP05(S) TLPJ TLP(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP(S) TLP(S) TLP0J TLPJ TLPJ *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. NZC: Non-zero cross ZC: Zero cross Triac-Output Photocouplers for Solid State Relays (SSRs) I FT VTM Safety Standards () Rank ULc-UL TÜV VDE BSI IEC Part Number Pin Configuration Features VDRM TLP0G TLPG TLP0J TLP5J TLPJ TLPJ TLPJ TLPJ Mini-flat MFSOP Non-zero cross Mini-flat MFSOP Zero cross Mini-flat MFSOP Non-zero cross Mini-flat MFSOP Zero cross Mini-flat MFSOP Zero cross Low trigger current Mini-flat MFSOP Zero cross High impulse noise immunity VN=000 V (typ.) IFT IFT5 IFT IFT5 IFT IFT 0 ma ma. V 0 ma ma 0 ma ma 0 ma ma ma 0 ma Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.. V. V. V. V 0 ma. V 0 ma ma 00 V 0 ma 0 ma 00 V 00 V 00 V 00 V 00 ma 00 V () () () ()

35 Triac-Output Photocouplers for Solid State Relays (SSRs) (Continued) Part Number Pin Configuration Features VDRM TLP0J TLPJ ZC Mini-flat MFSOP Non-zero cross Mini-flat MFSOP Zero cross I FT VTM Safety Standards () Rank ULc-UL TÜV VDE BSI IEC 0 ma 0 ma. V. V 0 ma 0 ma 00 V 00 V () () Triac-Output Photocouplers for Office Equipment Part Number Pin Configuration Features VDRM BVs TLP0J TLP0JF TLPJ TLPJF TLPJ TLPJF ZC ZC DIP Non-zero cross DIP Zero cross DIP Zero cross High impulse noise immunity VN = 000 V (typ.) IFT IFT I FT 0 ma ma 0 ma ma VTM. V 0 ma 00 V ULc-UL. V 0 ma 00 V 0 ma. V 0 ma 00 V Safety Standards () TÜV VDE BSI IEC Triac-Output Photocouplers for AC 00 to 0 V Lines I FT VTM Part Number Pin Configuration Features VDRM BVs ULc-UL Safety Standards () TÜV VDE BSI IEC TLP55G DIP ma V 00 ma 00 V TLP55G- 5 Dual-channel version of the TLP55G 0 ma V 00 ma 00 V TLP55G- -channel version of the TLP55G ma V 00 ma 00 V 5 TLP50G General-purpose Non-zero cross IFT IFT5 0 ma ma V 00 ma 00 V 500 Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. 5

36 Selection Guide Triac-Output Photocouplers for AC 00 to 0 V Lines (Continued) I FT VTM Part Number Pin Configuration Features VDRM BVs 0 ma 500 TLP5G ZC General-purpose IFT ma V 00 ma 00 V Zero cross IFT5 ULc-UL TÜV Safety Standards () VDE BSI IEC TLP0(S) TLP0F(S) Direct replacement for XXX0000 Non-zero cross 0 ma V 00 ma 00 V TLP0(S) TLP0F(S) Direct replacement for XXX0 Non-zero cross V 00 ma 00 V TLP0(S) TLP0F(S) TLP0(S) TLP0F(S) ZC Direct replacement for XXX0000 Zero cross Direct replacement for XXX0 Zero cross 0 ma V V 00 ma 00 V 00 ma 00 V Triac-Output Photocouplers for AC 00 to 0 V Line IFT VTM Safety Standards Part Number Pin Configuration Features VDRM BVs () ULc-UL TÜV VDE BSI IEC TLP50J General-purpose Non-zero cross IFT 0 ma ma V 00 ma 00 V 500 TLP5J ZC General-purpose Zero cross IFT 0 ma ma V 00 ma 00 V 500 TLPJ TLPJF Internal creepage: mm (min) Non-zero cross-on 0 ma V 00 ma 00 V 000 TLPJ TLPJF ZC Internal creepage: mm (min) Zero cross 0 ma V 00 ma 00 V 000 TLP05(S) TLP05F(S) High VDRM Non-zero cross-on 0 ma V 00 ma 00 V Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

37 Triac-Output Photocouplers for AC 00 to 0 V Line (Continued) IFT VTM Safety Standards Part Number Pin Configuration Features VDRM BVs () ULc-UL TÜV VDE BSI IEC TLP0(S) TLP0F(S) TLP0(S) TLP0F(S) TLP0(S) TLP0F(S) High VDRM Zero cross High VDRM Zero cross Low trigger current Zero cross 0 ma ma V 00 ma V 00 ma 00 V V 00 ma 00 V 00 V TLP(S) TLPF(S) ZC Zero cross High impulse noise immunity VN = 000 V (typ.) 0 ma V 00 ma 00 V TLP0(S) TLP0F(S) Zero cross 0 ma V 00 ma 00 V TLP(S) TLPF(S) TLP(S) TLPF(S) High impulse noise immunity VN = 500 V (typ.) Zero cross 0 ma V 00 ma 00 V V 00 ma 00 V Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Thyristor-Output Photocouplers Features VDRM 00 V 00 V Package Isolation voltage MFSOP TLPG TLP5J TLPJ TLP59J Replacement Devices New Device TLPG TLP5J TLP59J TLPJ TLPG TLP5J TLP5G TLPGJ Discontinued Devices TLP55J TLP5J TLPGJ TLPGJ The new and discontinued devices are not exactly identical in terms of electrical characteristics. For device replacement, hardware evaluation must be performed in the real-world environment. I FT VTM Part Number Pin Configuration Features VDRM BVs TLPG 5 Mini-flat MFSOP 0 00 ma 00 V 500 ULcUL Safety Standards () TÜV VDE BSI IEC 5 TLP5J Low trigger current ma. 00 ma 00 V 500 TLP59J 5 Long anode-cathode distance (SCR) ma. 00 ma 00 V TLPJ TLPJF 0 ma. 00 ma 00 V 000 Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative.

38 Selection Guide Photovoltaic-Output photocouplers Features Package Short-Circuit Current 5 μa V μa V 0 μa V μa V μa 0 V *Built-in shunt resistor Open Voltage SSOP MFSOP TLP90 TLP90 TLP90B TLP590B TLP9 TLP9B* TLP59B* TLP9 Short-Circuit Current (Min) Open-Circuit Voltage (Min) Part Number Pin Configuration Features Mini-flat TLP90B μa MFSOP Mini-flat TLP9B MFSOP μa Built-in shunt resistor μa TLP590B 0 ma V 0 ma C0 0 μa TLP59B Built-in shunt resistor μa C0 0 μa 0 ma V 0 ma 0 ma V 0 ma 0 ma V 0 ma Mini-flat TLP90 5 μa 0 ma V 0 ma MFSOP ULcUL Safety Standards () TÜV VDE BSI IEC TLP90 SSOP 5 μa 0 ma V 0 ma 500 TLP9 SSOP 0 μa 0 ma V 0 ma 500 TLP9 SSOP High open-circuit voltage μa 0 ma 0 V 0 ma 500 Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. 9 Products Manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. (TST) -Output and Darlington--Output Photocouplers Part Number Pin Configuration Features Mini-flat TLP0 MFSOP AC input Mini-flat TLP MFSOP output General-purpose VCEO 0 V 0 V Minute UL c-ul Safety Standards () TÜV VDE BSI IEC *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. () () ()

39 -Output and Darlington--Output Photocouplers (Continued) Part Number Pin Configuration Features TLP* TLP5* SO (reinforced insulation) AC input SO (reinforced insulation) VCEO 0 V Minute 50 UL c-ul 50 0 V () () Safety Standards () TÜV VDE BSI IEC () () TLP0 TLP TLP SOP Lead pitch =. mm AC input SOP Lead pitch =. mm General-purpose SOP (reinforced insulation) Lead pitch =. mm Creepageclearance 5 mm Isolation thickness 0. mm AC input 0 V 0 V 0 V () () () () () TLP5 SOP (reinforced insulation) Lead pitch =. mm Creepageclearance 5 mm Isolation thickness 0. mm 0 V 50 () () TLP0 TLP0- TLP TLP- TLP90-* TLP9-* DIP output AC input Dual-channel version of the TLP0 DIP Darlington transistor output High VCEO Dual-channel version of the TLP SO -channel version Lead pitch =. mm AC input SO -channel version Lead pitch =. mm V 00 V 0 V 0 V () () Photocouplers for IGBTMOSFET Gate Drive Propagation I FHL Part Number Pin Configuration Features Delay Time Output BVs TLP55E 5 SO (reinforced Insulation) Topr = 00 C (max) Direct drive of a small-power IGBTMOSFET 0. μs Peak output current (max): ±0. A ULcUL 50. Safety Standards () TÜV VDE BSI IEC *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note : The EN0-5- safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. 9

40 Selection Guide Triac-Output Photocouplers Part Number Pin Configuration Features Tingger LED Current, Peak On-State Off-State Output Safety Standards () IFT Voltage, VTM BVs Minute Rank Max Max UL c-ul TÜV VDE BSI IEC VDRM TLP0J TLP0JF DIP Non-zero cross IFT 0 ma ma.0 V 00 ma 00 V TLPJ TLPJF TLPJ TLPJF TP50G TP50J TP5G TP5J TLP0 (S) TLP0F (S) TLP0 (S) TLP0F (S) TLP05 (S) TLP05F (S) ZC ZC DIP Zero cross DIP Zero cross High impulse noise immunity VN = 000 V (typ.) General-purpose Non-zero cross General-purpose Zero cross Non-zero cross High VDRM Non-zero cross IFT IFT IFT5 IFT IFT IFT5 IFT 0 ma ma 0 ma 0 ma ma 0 ma ma 0 ma ma 0 ma ma 0 ma 0 ma.0 V.0 V.0 V.0 V 00 ma 00 ma 00 ma 00 ma 00 V 00 V 00 V 00 V 00 V 00 V 00 V 500 TLP0 (S) TLP0 (S) Zero cross 0 ma 00 V TLP0 (S) TLP0F (S) TLP0 (S) TLP0F (S) High VDRM Zero cross 0 ma 00 V TLP0 (S) ZC Zero cross ma.0 V 00 ma TLP0 (S) Zero cross 0 ma 00 V TLP (S) TLPF (S) TLP (S) TLPF (S) High impulse noise immunity VN = 500 V (typ.) 0 ma 00 V Note : BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standardapproval pending as of January 0 EN 005- and IEC 005-approved, EN and IEC 0950-approved TÜV and VDE: : Approved : Design which meets safety standardapproval pending as of January 0 EN 0-5--approved with option V or D For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. 0

41 5 Part Naming Conventions. -Output, Darlington--Output and -Output Photocouplers TLP F (,, F) Part number Wide-spaced leads Specify this option, if necessary. Safety standard option Specify either D or V for EN0-5--approved devices. RoHS COMPATIBLE* Revision code The revision code may be added to identify a revision of a device. For details, contact your nearest Toshiba sales representative. Lead form option for DIP packages Select one of the lead form options shown on page 0. Carrier tape option Select one of the carrier tape options shown on pages 5. CTR rank See respective datasheets. Example : TLP(D-GB-TP,F Example : TLPF(GR,F) [D] = EN0-5- option [F] = Wide-spaced leads [GB] = CTR rank [GR] = CTR rank [TP] = LF lead form [,F] = RoHS COMPATIBLE* Tape-and-reel packing [,F] = RoHS COMPATIBLE* The right parenthesis is omitted due to the limit to the number of characters.. Triac-Output and Thyristor-Output Photocouplers TLP Part number VDRM G: 00 V J: 00 V L: 00 V F (,, F) RoHS COMPATIBLE* Revision code Lead form option for DIP packages Carrier tape option Wide-spaced leads Safety standard option IFT rank No character: No IFT rank specified IFTx: For example, IFT5 denotes the 5-mA rank. The available IFT ranks differ from product to product. See datasheets. Example : TLPJ(D-IFT-TP,S,F) TLPJ(DTTPS,F) (Abbreviated due to the limit to the number of characters.) [J] = VDRM: 00 V [D] = EN0-5- option [IFT] = [T] = IFT = ma [TP] = LF lead form Tape-and-reel packing [,S] = [S] = Revision code: S [,F] = RoHS COMPATIBLE*. Photorelays TLP F (,, F) Part number VOFF A: 0 V D: 00 V G: 50 V GA: 00 V J: 00 V Some photorelays do not have avoff code in their names. See respective datasheets. Wide-spaced leads Safety standard option RoHS COMPATIBLE* Revision code Lead form option for DIP packages Carrier tape option Example : TLPA(TP,F) Example 5: TLP0(TP,F) [A] = VOFF: 0 V [TP] = Tape-and-reel packing [TP] = LF lead form [,F] = RoHS COMPATIBLE* Tape-and-reel packing [,F] = RoHS COMPATIBLE* *: F identifies the indication of product Labels with [[G]]RoHS COMPATIBLE. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 0095EC of the European Parliament and of the Council of January 00 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Note: The length of part names is limited to characters. Longer names are abbreviated by omitting the - character andor using shorthand symbols. However, be sure to give full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative.

42 Package Information Lead Form Options for DIP Packages The DIP,, and packages offer three surface-mount lead form options and a wide-spaced lead form option. The electrical characteristics are identical, regardless of these options. Lead Form Surface-Mount Wide-Spaced Appearance Lead Form Code Carrier Tape Code (LF) (LF) (LF5) (LF) (TP) (TP) (TP5) Not available* -pin DIP -pin DIP 5 A 0. -pin DIP 5 -pin DIP 9 B C 0 to Package Outlines Dimensions Version (LF) (LF) (LF5) Dimension Min Max Min Max Min Max A B (0.5 typ.) (0.5 typ.) 0. C..0. Example : Standard part: TLP0(F) All other package dimensions are the same as for each standard package specification. Surface-mount option: TLP0(LF,F): Packed in stick magazines (see page 9). Surface-mount and tape-and-reel options: TLP0(TP,F): Packed in tape-and-reel (see page 5). * Tape-and-reel packing is not available with (LF). Standard part names should be used when applying for safety standard approval. The package dimensions and lead form options of the TLP, TLP5 differ from those shown above. See the TLP, TLP5 datasheet.

43 Package Dimensions (-Pin DIP) Standard DIP DIP (LF) (TP). ± 0.5. ± ± ± ± 0.5. ± 0.5. ± ± ± 0..5 ± min.5 to.0. ± ± min 0.0 max DIP (LF) DIP (LF) (TP). ± 0.5. ± ± ± 0.5. ± ± 0.5. ± ± ± 0..5 ± min.5 min to 0.5 ± ± ± ± max DIP (LF5) (TP5). ± ± ± ± 0..5 ± 0.5. ± min 0.0 max 0. max

44 Package Information Package Dimensions (-Pin DIP) Standard (LF) (TP) 5 5. ± 0.5. ± 0.5. ± 0.5. ± ± ± 0.5. ± min 0.0 max 5 5. ± 0.5. ± 0.5. ± ± 0.. ± ± min 0.5 min.5 0. ± 0.5. ± to 0.5 ± 0..5 ± 0.5. ± ± ± ± max ± ± ± 0.. ± ± ± min to.0 (LF) (LF) (TP) (LF5) (TP5) 0.5 ± 0..5 ± 0.5. ± ± ± min 0.0 max 0. max

45 Package Dimensions (-Pin DIP) Standard (LF) (TP) 5 5. ± ± 0.5. ± ± 0..5 ± min 0. ± ± to.0 9. ± ± 0.5. ± 0.5. ± min.5 ± 0.5. ± max (LF) (LF) (TP) 5. ± ± ± 0..5 ± 0.5. ± min 0.5 min ± 0.5. ± to 9. ± ± ± ± ± max (LF5) (TP5) 5. ± ± ± min.5 ± 0.5. ± max 0. max 5

46 Package Information Package Dimensions (Other DIP Packages) 5-pin 5-pin (LF). ± ± 0.. ± ± ± ± min. ± to.0. ± 0.5. ± ± 0.. ± ± min.5 min 0. ± 0.5. ± to 5-pin DIP (with Pin 5 Cut) ± ± ± ± 0.. ± ± min. ± to ± ± 0.. ± ± min 0. ± ± 0.5. ± to.0 Package Dimensions (Surface Mount) SO SO ± min.0 ± ± 0.. ± ± 0..5 ± ± min.0 ± 0.

47 Package Dimensions (Surface Mount) (Continued) S S (F type).5 ± ± ± ± 0.. ± 0..5 ± 0.. ± 0.5. ± 0.. ± ± ± ± 0.. ± ± 0.5. ± 0. -pin MFSOP 5-pin MFSOP 5. ± 0.5. ± 0.5. ± 0..0 ± 0.. ± 0..0 ± ± ± 0..5 ± min 0. ± ± 0.. ± 0..5 ± min -pin MFSOP (with Pin 5 Cut) SOP. ± 0.5. ± 0..0 ± 0.. ± ± ± ± ± 0..5 ± min. max 0. ± 0.. ± ± ± 0.

48 Package Information Package Dimensions (Surface Mount) (Continued).5SOP.5SOP 5.0 ± ± ± ± 0.5. max.0 ± 0.. ± 0.5. max 0. ± 0..5 ± ± ± ± ± ± ± 0..5 ± ± 0..5SOP SOP 9. ± 0.5. max.0 ± ± ± 0..5 ± ± ± ± 0.. max. ± ± ± ± 0. SSOP USOP φ...5 φ ± Unless Otherwise Specified, Tolerance ±0. mm Unless Otherwise Specified, Tolerance ±0. mm

49 Rank Marking -output photocouplers are ranked according to their CTR ranges, whereas thyristor-output and triac-output photocouplers are ranked according to their maximum IFT value. The following gives the rank classifications and rank marks printed on packages. Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets.. CTR Rank Name and Rank Marking Available CTR Rank Selection ( : Available, : Contact Toshiba) Part Number TLP0 TLP TLP0 TLP0- TLP TLP- TLP55 TLP0 TLP0- TLP0- TLP0 TLP TLP TLPFF Rank Name None GB Y GR BL YH GRL GRH BLL Rank Marking Group Part Marking when No CTR Rank Is Specified Rank Name CTR CTR Rank Other than TLP TLP Part Number None Rank Marking Group Part Number None Rank Marking Group None Y GR 50 to 00% 50 to 50% 00 to 00% See the right-side tables YE GR Blank,Y,Y+,YE, G,G+,GR,B,B+, BL,GB YE GR TLP0 TLP0 TLP55 TLP0 Blank, YE, GR, BL, GB TLP0- TLP- TLP0- TLP0- Blank, GB GB BL GRL GRH 00 to 00% 00 to 00% 00 to 00% 50 to 00% GB BL G G GB BL G G+ TLP TLP TLP5 TLP TLP TLP Blank, Y, Y, YE, G, G, GR, TLP TLP TLPF B, B, BL, GB TLPF 9

50 Package Information. LED Trigger Current (IFT) Ranking and Marking Rank Name None IFT IFT5 IFT IFT IFT max ma max max ma max IFT Rank Marking Blank, T, T5 T, T5 T5 T (only for photorelays). Marking Examples (a) -pin mini-flat -channel type or P Lot No. Part number minus "TL" CTR or IFT rank marking Pin No. Example: TLP: P TLP0: P0 TLP: P P0 TLP0 (b) TLP, TLPF Pin No. PF Lot No. (Monthly code) Part number (P or PF) Lot No. CTR rank marking (c) TLP0, TLP Pin No. CTR rank marking P0 Part number (P0 or P) Lot No. (d) Others or TLP Lot No. Part number CTR or IFT rank marking Examples: TLP0: TLP0 TLPGF: TLPGF TLP0 TLP0 Pin No. Note: When ordering a standard photocoupler, add a CTR or IFT rank in parentheses to the standard part number. Examples: TLP(GB) TLP5(GR) Use the standard part number when applying for safety standard approval. Example Part number TLP(GB) Use this part number TLP 50

51 Packing Information Photocoupler Magazine Packing Specifications Standard DIP DIPs with LF, LF, LF and LF5 Lead Forming.. Magazine Dimensions Length = 55 Thickness = 0.5 Length = 55 Thickness = 0.5 Device Quantities per Magazine Package Pin Count Quantity (pcs) Y Y B X B X Packing Dimensions C C A A Number of Magazines Dimensions (A x B x C) Label Position Number of Magazines Dimensions (A x B x C) Label Position 50 x x 5 Y 0 x x 5 Y 0 x 5 x 559 Y 0 5 x 5 x 5 X 0 x x 5 X 5

52 Packing Information Mini-Flat Coupler (MFP) SOP Photocoupler SO MFSOP SO (0.). Magazine Dimensions Length = 555 Thickness = 0.5 Length = 555 Thickness = 0.5 Length = 555 Thickness = 0.5 Length = 555 Thickness = 0.5 Package Pin Count (SOP) (SOP) Device Quantities per Magazine Package Pin Count Quantity (pcs) 5 (SO) 5 Package Pin Count Quantity (pcs) (MFSOP) 50 Package Pin Count Quantity (pcs) (SO) 00 Quantity (pcs) Package Pin Count Quantity (pcs) (.5SOP) (.5SOP) (.5SOP) Y Y B X C B X C A A Packing Dimensions Package Number of Magazines Dimensions (A x B x C) Label Position Number of Magazines Dimensions (A x B x C) Label Position SO 0 0 x 55 x 55 X 9 x x 5 Y 9 x x 5 Y x x 5 Y MFSOP x x 5 Y 0 x 55 x 5 X 0 x 55 x 5 X SO 5 x 9 x 59 X Photocoupler Package Type MFSOP SO SO SOP SOP.5SOP.5SOP.5SOP Typical Devices TLP0J, TLP0, TLP90B TLP0, TLP09, TLPA TLP05, TLP0, TLP, TLPE, TLP05, TLP0 TLP0, TLP TLP0-, TLP-, TLP0D, TLP0G TLPG, TLPA TLP9G TLP0G, TLP0A 5

53 Tape-and-Reel Specifications The tape specifications differ for photocouplers manufactured in Thailand.. Embossed Tape Specifications for Surface-Mount Lead Form Options Photocoupler Package Types MFSOP, SO SO Tape Option Symbol (TPL) or (TPR) (TP) Typical Devices TLP5J, TLP, TLP90B TLP05, TLP0, TLP05, TLP0 SOP (TP) TLP0, TLP SOP.5SOP.5SOP.5SOP SSOP (TP) (TP) (TP) (TP) (TP5) TLP0-, TLP- TLPG, TLPA, TLPD TLP9G TLP00D,TLP0A,TLP0G TLP to, TLP0 to TLP50 S (TP) TLP0, TLP05, TLP9 DIP(LF, LF5) DIP(LF) (TP) or (TP5) (TP) TLP550, TLP50G TLP50G. Tape Dimensions t J F.0 ± 0. G D E B C KO K A Photocoupler Package Type Tape Option MFSOP (TPL), (TPR) SO (TPL), (TPR) SO (TP) SOP (TP) SOP (TP).5SOP (TP).5SOP.5SOP (TP) (TP) SSOP (TP5) S (TP) S F type (TP) DIP(LF, LF5) (TP), (TP5) DIP(LF) (TP) A. ± 0..0 ± 0..5 ± 0.. ± 0..5 ± 0.. ± 0..5 ± 0..5 ± ± 0.. ± ± 0.. ± 0. B. ± ± 0..5 ± ± 0..5 ± 0.. ± ± 0..5 ± ± 0. Symbol (See figure above) C D E F G J K Dimensions.5 ± 0..0 ± ± 0..0 ± 0..9 ± 0.. ± 0..5 ± 0..0 ± 0..0 ± 0..5 ± ± 0..0 ± 0..0 ± 0.. ± 0.. ± 0..0 ± 0..0 ± 0..0 ± 0..5 ± ± 0..5 ± 0..5 ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± ± 0.. ± 0.. ± ± 0..0 ± 0. K0. ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± 0. t : Typical devices DIP (short package) 0. ± 0.05 TLP0 TLP, TLP, TLPG TLP555, TLP0 0. ± ± 0.. ± ± 0. (TP) is not available 5

54 AE Packing Information. Reel Dimensions W W C B U C B A E W W ø0 mm ø0 mm ø0 mm Photocoupler Package Type MFSOP, SO SO SOP SOP.5SOP.5SOP.5SOP SSOP S S F type DIP(LF, LF5) DIP(LF) Tape Option (TPL), (TPR) (TP) (TP) (TP) (TP) (TP5) (TP) (TP) (TP), (TP5) (TP) Symbol (See figure above) A B C E U W W Dimensions ø0 ±.5 ± ±.0 ø0 ± ø0 ± ø ± ± ± ± ±.0.5 ± ±.0.5 ± ± ø0 ø ± ± 0.5 ± ±.0 ø0 ± ø0 ± ø ± ± ± ± ±.0 Photocouplers Manufactured in Thailand Photocoupler Package Type MFSOP (LF,LF5,LF) DIP(LF,LF5,LF) (LF,LF5) Tape Option (TPL), (TPR) (TP), (TP5), (TP) (TP), (TP5), (TP) (TP), (TP5) Symbol (See figure above) A B C E U W W Dimensions ø0 ±.5 ± ±.0 ø0 ± ø ± ± ± ± ±.0 ø0 ± 5

55 . Other Packing Information a) Device orientation on tape Photocouplers are oriented in cavity, as shown below. A) Photocoupler Package Type MFSOP, SO Tape Option TPR User direction of feed A) Photocoupler Package Type Tape Option B) MFSOP, SO SOP,.5SOP SSOP TPL TP TP5 B) Photocoupler Package Type Tape Option SOP, SO TP C).5SOP S TP TP C) DIP(LF, LF5) DIP(LF) TP, TP5 TP b) Tape Specifications Quantities Per Reel Photocoupler Package Type MFSOP, SO SOP, SO SOP.5SOP SSOP S S F type DIP(LF, LF5) DIP(LF) Quantity (pcs) Photocouplers Manufactured in Thailand Photocoupler Package Type MFSOP (LF,LF5) (LF) (LF,LF5) Quantity (pcs) Empty Cavities Item Consecutive empty cavities Specification Zero Note Any 0-mm portion of tape except leader and trailer. Non-consecutive empty cavities 0.% maxreel Except leader and trailer. : pcs maxreel for DIP and SDIP packages c) Packing boxes One or five reels per box Two or five reels per box for photocouplers manufactured in Thailand d) Label The reel label includes the following information:. Part number. Tape type. Quantity. Lot number e) Purchase order Specify the part number, tape and quantity as follows. Example TLP(GB-TPR, F ) 000 units Quantity * RoHS COMPATIBLF * Tape option CTR rank Photocoupler part number * : Must be a multiple of the quantity per-reel. * : F identifies the indication of product Labels with [[G]]RoHS COMPATIBLE. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 0095EC of the European Parliament and of the Council of January 00 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 55

56 Board Assembly Example Land Patterns Below are the example land patterns for surface-mount packages. Mini-flat and SOP couplers MFSOP (-Pin) [e.g., TLP].5SOP [e.g., TLP9G] SO (-Pin) [e.g., TLP5J] MFSOP (5-Pin) [e.g., TLPA] SOP [e.g., TLP0] SO (5-Pin) [e.g., TLP09] SSOP [e.g., TLP] SO [e.g., TLP05].5 Surface-Mount Lead-Formed Photocouplers Example: -pin DIP package Example: -pin SDIP package (LF)&(LF5) [e.g., TLP(LF)] (LF) [e.g., TLP(LF)] S [e.g., TLP9] S (F type) [e.g., TLP9F] For the example land patterns for the TLP, see its datasheet. 5

57 Board Assembly Considerations. Soldering. Flux Cleaning When using a soldering iron or medium infrared rayhot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions..) Using a soldering iron a. Solder once within 0 seconds for a lead temperature of up to 0 C. b. Solder once within seconds for a lead temperature of up to 50 C..) Using medium infrared rayhot air reflow a. Complete the infrared rayhot air reflow process at once within 0 seconds at a package surface temperature between 0 C and 0 C. b. Example of temperature profile of lead (Pb) solder Package surface temperature Package surface temperature ( C) to 90 seconds 0 seconds or less Time Example of temperature profile of lead (Pb) solder c. Example of temperature profile of lead (Pb)-free solder The profile below shows only the typical temperature profile and conditions, which might not apply to all Toshiba photocouplers. Temperature profiles and conditions may differ from product to product. Refer to the relevant technical datasheets and databooks when mounting a device. ( C) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as sodium(na + ) or chloride(cl ) ions remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases, which can degrade device performance. Washing devices with water will not cause any problems. However, make sure that no reactive ions such as sodium(na + ) or chloride(cl ) ions are left as residue. Also, be sure to dry devices sufficiently after washing. Do not rub device markings with a brush or with your hand during cleaning or while the devices are still wet from the cleaning agent. Doing so can rub off the markings. Dip cleaning, shower cleaning and steam cleaning processes all involve the chemical action of a solvent. Use only recommended solvents for these cleaning methods. When immersing devices in a solvent or steam bath, make sure that the temperature of the liquid is 50 C or below and that the circuit board is removed from the bath within one minute. If a device package allows ultrasonic cleaning, keep the duration of ultrasonic cleaning as short as possible, since long hours of ultrasonic cleaning degrade the adhesion between the mold resin and the frame material. The following ultrasonic cleaning conditions are recommended. Frequency: khz to 9 khz Ultrasonic output power: 00 W or less (0.5 Wcm or less) Cleaning time: 0 seconds or less Suspend the circuit board in the solvent bath during ultrasonic cleaning in such a way that the ultrasonic vibrator does not come into direct contact with the circuit board or the device. Conventional cleaning solvents that contain freon are not recommended due to its adverse effection the earth s ozone layer. Alternative freon-free products are available on the market. Some of these alternative cleaning agents are listed in the table below. Contact Toshiba or a Toshiba distributor regarding cleaning conditions and other relevant information for each product type. Examples of Alternative Cleaning Agents Technocare FRW-, FRW-, GE Toshiba Silicon FRV-00 Asahi Clean AK-5AES Asahi Glass Co., Ltd Clean Through 50H Kao Co., Ltd. 0 to 0 seconds 0 to 50 seconds Time Example of temperature profile of lead (Pb)-free solder Pine Alpha ST-00S, ST-00SX Arakawa Chemical Co., Ltd. d. Precautions for heating Keeping packages at high temperature for a long period of time can degrade the quality and reliability of devices. Soldering time has to be kept as short as possible to avoid a rise in package temperature. When using a halogen lamp or infrared heater, avoid direct irradiation of packages, since this may cause a rise in package temperature..) Dip soldering (flow soldering) The thermal shock of dip soldering increases thermal stress on devices. To avoid stress, the use of a soldering iron or medium infrared rayhot air reflow is recommended. If you want to use dip soldering, contact your nearest Toshiba sales representative. 5

58 9 Device Degradation Projected Operating Life Based on LED Light Output Degradation Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on page 5 shows the types of LED used in photocouplers and the figures on pages 5 to 0 show projections of long-term light output performance and operating life. Note that these operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Projected Operating Life Ta = 0 C, IF = 0 ma, failure criteria: degradation rate Δ PO < 50% Photocouplers F50% operating life F0.% operating life GaAs LED,00,000 h 0,000 h Mainly for phototransistor output devices and phototriac output devices GaA As(SH) LED 50,000 h 00,000 h Mainly for photo- couplers GaA As(DH) LED,000,000 h 00,000 h Mainly for photorelays (MOSFET output), photovoltaic couplers and photo- couplers GaA As(MQW) LED Ask your local Toshiba sales representative. Mainly for photo- couplers F50% (cumulative failure rate 50%) operating life: Time period until the projected long-term light output degradation curve of the average light output change (X) shown on pages 5 to 0 reaches the failure criteria. F0.% (cumulative failure rate 0.%) operating life: Time period until the projected long-term light output degradation curve of X - σ shown on pages 5 to 0 reaches the failure criteria. The relationship between LED light output degradation and optical coupling characteristics is shown below. () The relationship between LED light output degradation and current transfer ratio (CTR)short circuit current (ISC) is :. CTR (t) = CTR (o) Po(t) Po (o) () The relationship between a reciprocal value of LED light output degradation and IFTI FLHI FHLI FH change is :. I FT (t) Po(t) = ( ) - IFT (o) Po (o) 5

59 LEDs Used in Photocouplers LED: GaAs LED GaA As (SH) LED GaA As (DH) LED GaA As (MQW) LED Photocouplers LED Photocouplers LED Photocouplers LED Photocouplers LED Photocouplers LED N5 (SHORT) TLP0 Series TLP Series TLP599 Series TLP0 N5A (SHORT) TLP Series TLP TLP0 Series TLP N (SHORT) TLP TLP TLP Series TLP0(S) Series N (SHORT) TLP5J TLP TLP Series TLP0(S) Series N (SHORT) TLPJ TLP Series TLP Series TLP0(S) Series N9 (SHORT) TLPJ TLP50A TLP Series TLPxx Series N9A (SHORT) TLP Series TLP5 TLP Series TLPxx Series N0 (SHORT) TLPG TLP5 TLP9 Series TLP0 N (SHORT) TLP Series TLP5- TLP0 TLP N (SHORT) TLP0 TLP5- TLP TLP0 NA (SHORT) TLP TLP5- TLP TLP N (SHORT) TLP90B TLP5 Series TLP Series TLP50 N5 (SHORT) TLP9B TLP55G Series TLP5 TLP(S) Series N (SHORT) TLP9 Series TLP5 TLP00 TLP90 N (SHORT) TLP9 Series TLP5 TLP0 TLP9 N (SHORT) TLP00D TLP5G TLP0 TLP9 NA (SHORT) TLP0 Series TLP5G TLP05 TLPxxx Series N5 TLP0 Series TLP5J TLP0 TLP0 N TLP Series TLP55J TLP TLP N TLPG Series TLP550 TLP9 TLP5 N TLP5A TLP55 TLP TLP50H N9 TLP Series TLP55 TLP TLP5H TLP0 TLP50 Series TLP55 TLP Series TLP00H TLP0 TLP5 Series TLP55 TLP Series TLP0H TLP TLP0J TLP555 TLP Series TLP0 TLPA TLP0 Series TLP55 TLP Series TLP TLP TLP0 Series TLP55 TLP50 Series TLP5 TLPA TLP Series TLP559 TLP5 Series TLP TLP5 TLP Series TLP50 Series TLP59 Series TLP TLP5A TLP9G TLP5 Series TLPJ Series TLP0 TLP TLP0 Series TLP50 TLPJ Series TLP09 TLP TLP0 TLP5 TLP9 Series TLP TLP TLP TLP5 TLP9GA TLP5 TLP TLP TLP590B TLP0 TLP TLP TLP50 TLP59B TLP00 TLP TLP0 TLP5 TLP59 Series TLP50 TLP TLP5A TLP59 Series TLP5 TLP TLP0 Series TLP59 Series TLP0 TLPG TLP Series TLP59 Series TLP0J 59

60 9 Device Degradation GaAs LED Projected Light Output Degradation Data Test conditions: IF = 50 ma, Ta = 0 C Test conditions: IF = 0 ma, Ta = 0 C Light output (PO) relative change (%) X X-σ Light output (PO) relative change (%) X X-σ Test time (h) Test time (h) Test conditions: IF = 0 ma, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) GaAs LED Projected Operating Life Data Projected operating life (h) Failure criteria light output degradation Δ PO < 50% IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma Projected F50% operating life Projected F0.% operating life K (x0 - ) Ambient Temperature ( C) Projected operating life (h) Failure criteria light output degradation Δ PO < 0% IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma Projected F50% 000 operating life Projected F0.% operating life K (x0 - ) Ambient Temperature ( C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed. 0

61 GaA As (SH) LED Projected Light Output Degradation Data Test conditions: IF = 50 ma, Ta = 0 C Test conditions: IF = 0 ma, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) Light output (PO) relative change (%) X X-σ Test time (h) Test conditions: IF = 0 ma, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) GaA As (SH) LED Projected Operating Life Data Failure criteria light output degradation Δ PO < 50% Failure criteria light output degradation Δ PO < 0% IF = 0 ma Projected operating life (h) IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma Projected F50% operating life Projected F0.% operating life K (x0 - ) Projected operating life (h) IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma 000 Projected F50% operating life Projected F0.% operating life K (x0 - ) Ambient Temperature ( C) Ambient Temperature ( C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.

62 9 Device Degradation GaA As (DH) LED Projected Light Output Degradation Data Test conditions: IF = 50 ma, Ta = 0 C Test conditions: IF = 0 ma, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) Light output (PO) relative change (%) X X-σ Test time (h) Test conditions: IF = 0 ma, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) GaA As (DH) LED Projected Operating Life Data Projected operating life (h) Failure criteria light output degradation Δ PO < 50% IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma Projected F50% operating life Projected F0.% operating life K( 0 ) Ambient Temperature ( C) Projected operating life (h) Failure criteria light output degradation Δ PO < 0% IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 0 ma IF = 50 ma 000 Projected F50% operating life Projected F0.% operating life K( 0 ) Ambient Temperature ( C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.

63 GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data Toshiba is now preparing the light output degradation and operating life data for GaA As LEDs. These data are available for individual LEDs. Ask your local Toshiba sales representative. Note

64 9 Device Degradation Reading the Projected LED Operating Life Graph For example, let's calculate the operating life of the GaAs LED, based on the data shown on page 0. Here is an example of how to read an operating life, assuming that the ambient temperature (Ta) is 0 C and that the failure criterion is a 0% decrease in light output. Suppose that the initial LED current, IF, is 0 ma. Since the horizontal axis of the failure criteria graph is the reciprocal of absolute temperature, it is necessary to convert the ambient temperature (Ta) to the reciprocal of absolute temperature (T): T = = Ta The graph shows the projected lifetimes for F50% and F0.% cumulative failure probabilities in solid and dashed lines respectively. Normally, it is recommended to use F0.% lines. As X =.9, its intersection with the IF = 0 ma line for F0.% is approximately 0,000 hours. (This figure is for reference only.) Failure criteria for light output degradation Δ PO < 0% IF = 0mA Projected operating life (h) IF = 0mA IF = 0mA IF = 0mA IF = 0mA IF = 50mA IF = 0mA IF = 0mA IF = 0mA IF = 50mA Projected F50% operating life Projected F0.% operating life K( 0 ) Ambient Temperature ( C) You can also estimate the projected operating life from the projected light output degradation data. Test conditions: I F = 0 ma, Ta = 0 C Light output (PO) relative change (%) % 0 0 X X-σ Test time (h)

65 0 Safety Standard Approvals Toshiba offers a wide selection of photocouplers with a transistor output, output, thyristor output and triac output, as well as photorelays certified to UL (USA), cul (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden). Safety Standard Approvals for Photocouplers (DIN EN0-5-) Mechanical Construction Reflective Photocouplers in Single-Molded Packages Transmissive Photocouplers in Single-Molded Packages Coupling Medium (Window) Package (Body) Photo Detector Chip Coupling Medium (Window) Internal Construction Package (Body) Lead Lead LED Chip Photo Detector Chip LED Chip Construction Mechanical Ratings (min) VDETÜV DIN EN 0-5- Package Isolation Creepage Path (mm) Isolation Clearance (mm) Isolation Thickness (mm) Internal Creepage Path (mm) Max. Working Insulation Voltage (Viorm) Highest Allowable Overvoltage (Viotm) SO.5SOP SOPSOP MFSOP MFSOP DIP ( ch) (0.) (0.) 5pk 000 Vpk 0 Vpk 000 Vpk 5pk 000 Vpk 5pk 000 Vpk 5pk 000 Vpk 5pk 500 Vpk 0 Vpk 90 Vpk 000 Vpk DIP (F type) 0 Vpk 000 Vpk Output TLP05 TLP0 TLPA TLP TLP TLP50 TLP5 TLP50F TLP5F Certified Devices Output TriacThyrsitor Output TLP0 TLP0- TLP TLP- TLP TLP- TLP5 TLP5- TLP0 TLP TLP0J TLPJ TLP TLP0G TLP0J TLPG TLPJ TLP50G TLP50J TLP5G TLP5J Photorelay TLPA TLPD TLPG TLP9G TLP0G TLPG TLPG- TLP59G The table above lists photocouplers and photorelays that have already been approved as of January 0. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative. 5

66 0 Safety Standard Approvals Safety Standard Approvals for Photocouplers (DIN EN0-5-) (Continued) Mechanical Construction Transmissive Photocouplers with an Insulating Film in Single-Molded Packages Transmissive Photocouplers in Double-Molded Packages Photo Detector Chip Coupling Medium (Window) Photo Detector Chip Coupling Medium (Window) Internal Construction Package (Body) Lead Package (Body) Lead LED Chip Film LED Chip Package SO ( ch) S S (F type) DIP DIP MFSOP DIP (F type) SO DIP (F type) Construction Mechanical Ratings (min) VDETÜV DIN EN 0-5- Isolation Creepage Path (mm) Isolation Clearance (mm) Isolation Thickness (mm) Internal Creepage Path (mm) Max. Working Insulation Voltage (Viorm) Highest Allowable Overvoltage (Viotm) pk 000 Vpk Vpk 000 Vpk 0 Vpk 000 Vpk 90 Vpk 0 Vpk 5pk 0 Vpk 000 Vpk 000 Vpk 000 Vpk 000 Vpk 000 Vpk 000 Vpk 000 Vpk 90 Vpk 0 Vpk 000 Vpk 000 Vpk 90 Vpk 0 Vpk 000 Vpk 000 Vpk Output TLP0 TLP05 TLP0 TLP09 TLP0 TLP05 TLP5 TLP TLP TLP9 TLP0F TLP05F TLP5F TLPF TLPF TLP9F TLP50H TLP5H TLP50 TLP5 TLP59 TLP50HF TLP5HF TLP50F TLP5F TLP59F TLP05 TLP0 TLPA TLP TLP TLP0 TLP09 TLPA TLP0 TLP5 Certified Devices Output TriacThyrsitor Output TLP0 TLP0- TLP0- TLP TLP- TLP- TLP TLP TLP0J TLPJ TLPJ TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP05(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP(S) TLP(S) TLP(S) TLP0F TLP0F- TLPF TLPF- TLP0JF TLPJF TLPJF TLP0F(S) TLP0F(S) TLP0F(S) TLP0F(S) TLP05F(S) TLP0F(S) TLP0F(S) TLP0F(S) TLP0F(S) TLPF(S) TLPF(S) TLPF(S) TLP5J TLPJ TLP5J TLPJ TLP TLP TLP TLPJ TLPJ TLPJ TLPF TLPF TLPF TLPJF TLPJF TLPJF The table above lists photocouplers and photorelays that have already been approved as of January 0. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative.

67 Photocoupler Application Circuit Examples Digital Interface Applications High Speed. 90 Ω TLP, TLP0 0. μf kω The TLP0 allows high-speed data transmission at up to approximately 5 MHz. Data rate of left-side circuit f (typ.): 5 Mbits (duty cycle ) LSTTL LSTTL Low Input Current Drive 0.. kω 5 kω TLP55 50 kω. kω The high-ctr (current transfer ratio) TLP55 allows operation with low input current (0.) and direct driving with a CMOS signal. Data rate of left-side circuit 0. μf LSTTL f (typ.): 50 kbits (duty cycle ) CMOS No Pull-up Resistor Required kω. ma 0 pf TLP00 LSTTL When the TLP00 with a -state output is used, the next-stage logic gate can be actuated without using a pull-up resistor. Data rate of left-side circuit f (typ.): Mbits (duty cycle ) LSTTL High Tolerance ma. kω LSTTL TLP55 RL 0. μf CMOS By using the TLP55 which tolerates up to 0 V, CMOS logic gates and other components can be driven without design restrictions on. Data rate of left-side circuit f (typ.): Mbits (duty cycle ) = RL = kω = 0 V RL = kω

68 Photocoupler Application Circuit Examples Inverter and AC-DC Servo Applications [Photo- couplers: high-speed basegate drive applications] TLP09 TLP09 TLP550 TLP559 TLP59 GTR Direct Drive IGBT Power MOS Direct Drive High-Speed TLP55 (for medium-power IGBTs): TLP50 TLP5 TLP00 (for small-power IGBTs): TLP5 TLP0 TLP05 TLP TLP55 DC Servo (Numerical control, Robotics) AC Servo Inverter (PWM) M M BaseGate Drive Circuit BaseGate Drive Circuit Driving the Base of a 5-A-Class GTR (Giant ) Module TLP55 The TLP55 drives the base of a GTR directly. ma 90 Ω Rex. Ω V An external resistor, Rex, is connected between pins and. This resistor causes the base current to become constant and stabilizes the GTR drive. LSTTL μf Driving the Base of a 00-A-Class GTR Module TLP55 The TLP55 photo- coupler and two booster ma 90 Ω Rex. Ω V Ω 50 Ω transistors can drive a high-power GTR. LSTTL 00 μf Driving the Gate of a 5-A-Class IGBT (Insulated Gate Bipolar ) Module ma 90 Ω TLP5 TLP5 0. μf The TLP5, TLP5, TLP0, TLP05 and TLP5 high-speed photo- photocouplers can drive a low-power IGBT directly. 5 VEE LSTTL

69 Driving the Gate of a 50-A-Class IGBT Module ma 90 Ω TLP50 0. μf The TLP50 and TLP00 can drive a medium-power IGBT directly. 5 VEE LSTTL Driving the Gate of a 00-A-Class IGBT Module ma 90 Ω TLP5 TLP5 0. μf The TLP5, TLP0, TLP05or TLP5 high-speed photo- photocoupler and two booster transistors can drive a high power IGBT. 5 VEE LSTTL Driving the Gate of an IGBT Module Using an IGM Photocoupler TLP09 (IGM) TLP559 (IGM) TLP59 (IGM) IGM photocouplers are suitable for driving an intelligent power module (IPM). These photocouplers guarantee symmetrical low-to-high 0 ma 0 kω + and high-to-low propagation delays (l tplh - tphll) and provides a high common mode transient immunity. 0.μF 0 V IGM Selection Part Number Package BVs () VO CTR CMH CML tplh tphl TLP09 (IGM) SO 50 TLP559 (IGM) TLP59 (IGM) V 0 V max 5% min 5% = 0 ma =. VO = 0. V 0. μs = 0 ma RL = 0 kω 0000 V μs = 0 ma RL = 0 kω VCM = 500 Vp-p 0000 V μs = 0 ma RL = 0 kω VCM = 500 Vp-p 9

70 Photocoupler Application Circuit Examples Home Appliance Applications Electric OvenGrills Magnetron Thermo-Switch Door-Open Monitor Switch 0 Vac 500 Hz Oven- Cavity Lamp TLP50G Grill Heater H TLP50J M Blower Motor Turntable Motor H.V. Transformer Magnetron Tube Door-Detector Circuit TLP50G Weight Sensor Microcontroller Gas Sensor Control Panel Refrigerator Block Diagram Photocouplers used for control applications Interior Fan TLP50G + main triac Panel Input Interior Lamp TLP50G + main triac Defroster Heater (for Freezer Compartment) TLP50G + main triac Microcontroller Door Switch Damper Motor (for refrigerator freezer compartment) TLP50G + main triac Defroster Heater (for refrigerator freezer compartment) TLP50G + main triac Temperature Sensor Compressor (TLP50G) 0

71 Automatic Washing Machines RT PC Th Operating Panel (Key Input) M Drain Valve RT Th RT Th TLP50G PC TLP50G PC IF IF Microcontroller Operation Modes (Manualautomatic) Water Flow Speed Spinning Period Number of Rinsing Washing Period Operation Detection TLP50G IF Water Supply Valve TLP50J IF AC-Input Photocoupler TLP0 (GB) Microcontroller Power Supply 00 Vac Circuit Configuration Fan Heaters ()Block Diagram Burner Overheat Prevention Switch Temperature Limit Switch TLP5G Panel Electric Heater ( kw) 00 Vac ZC Main Switch IF TLP5J Adjustment Switches VT Burner Motor (0 W) Display Speaker Room Temperature Sensor Preheat Sensor Microcontroller IF ZC TLP5J ZC TLP VT Drive Circuit IM IM M Fan Motor (0 W) M Electromagnetic Fuel Pump P Earthquake Sensor TLP Ignition IG

72 Photocoupler Application Circuit Examples Home Appliance Applications (Continued) ()Waveform Examples. Example of Operating Waveform for Burner Motor. Example of Operating Waveform for Fan Motor waveforms Trigger Point Top: IF 0 madiv Medium: VT 00 Vdiv Bottom: IM Adiv Horizontal: time 50 msdiv waveforms Trigger Point Top: IF 0 madiv Medium: VT 00 Vdiv Bottom: IM 0.5 Adiv Horizontal: time 50 msdiv Inverter Air Conditioners Remote Control Panel Temperature Fuse 00 Vac Control Panel Microcontroller for Indoor Unit Fan Motor for Room Unit M Room Temperature Sensor Temperature Sensor Indoor Unit TLP TLP5J TLP50G Motor for Air-Flow Direction Control M Outdoor Unit TLP TLP5J Filter ZC Fan Motor for Outdoor Unit Microcontroller for Outdoor Unit TLP50G M Two-Way Valve Four-Way Valve IGBT Gate Drive Circuit IGBT Module Rectifier VO TLP5 x Compressor Motor

73 5 Programmable Controller Applications DC Output for Sequencers TLPTLP TLPTLP IF = 0 ma +00 V IF = ma Load +00 V Load TLP5A TLPA IF = 0 ma + V Load AC Input for Sequencers TLP0- O O Limit Switches Thermostats Transducer DC-AC Inputs O Logic Outputs Logic Processor O COMMON 0-0-Vac Output for Sequencers and Solid State Relays (SSRs) TLP0G TLP55G 0 VAC Logic Processor Logic Inputs TLPJ TLP5J 0 VAC AC Outputs Motor Transformer Lamp ZC

74 Photocoupler Application Circuit Examples SSR and Power Control Circuit Applications Zero-Crossing Phototriac Output: TLP5GTLP5J and Mini-Flat TLPGTLPJ TLPG TLP5G TLP0(S) TLPJ TLP5J TLP0(S) TLP0(S) TLP(S) RF AC Load ZC RS CS TNR G: 0 Vac J: 0 Vac RG Lamp Load (-A tungsten lamp) L load (.5-A pure inductive load) Waveforms Top: IF 0 madiv Medium: VT 00 Vdiv Bottom: IT 5 Adiv Recommended conditions I F = 0 ma RG = Ω RS = Ω, CS = 0.0 μf Non-Zero Crossing Phototriac Output: TLP50GTLP50J and Mini-Flat TLP0GTLP0J TLP0G TLP50G TLP0(S) TLP0J TLP50J TLP05(S) RF RT G : 00 Ω J : 00 Ω RS CS TNR AC Load G: 0 Vac J: 0 Vac RG Lamp Load (-A tungsten lamp) L load (.5-A pure inductive load) Waveforms Top: IF 0 madiv Medium: VT 00 Vdiv Bottom: IT 5 Adiv Recommended conditions I F = 0 ma RT = 00 Ω00 Ω RG = Ω RS = Ω, CS = 0.0 μf

75 Switching Power Supply Circuit Application + Filter Regulated Voltage + Switching Control Circuit () Error Amplification Feedback + TLP TLP5 TLP Overvoltage Protection TLPG TLP5J TLP59J TLPJ Output ( : Approved, as of January 00) Safety Standard Approvals CTR ( IF) Rank (%) Part Number Package Type Isolation Voltage UL 5 BSI 00(EN0950) EN0 (Note ) Nordic SEMKO Min Max TLPTLP5 MFSOPSOP 50 (Note ) No Rank 50 (GB) Rank TLP DIP * (Y) Rank (GR) Rank (BL) Rank (GRL) Rank (GRH) Rank TLP50 (high-speed) (O) Rank No Rank 9 0 Thyristor Output ( : Approved, as of January 00) Safety Standard Approvals Part Number Package Type Isolation Voltage UL 5 EN0 (Note ) IFT (ma) VDRM (V) TLPG TLP5J TLPJ MFSOP Note : EN0-approved with option (D) Note : The EN0-5- safety standard for compact packages is different from those for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. *: Double protection 5

76 Photocoupler Application Circuit Examples Push-Button Telephone Application A variety of photocouplers are used to isolate between telephone lines (L and L) and a CPU. Line Detector Ring Detector Dial Pulsing Line Switch TLPG- L L TLP TLP9 TLP0 TLP0 TLP0 +V +V Dial Circuit Line Control Circuit Push-Button Telephone CPU Main Unit Part Number Application Package Type Features DC Input AC Input Ring Detector DIP MFSOP SOP TLP TLP TLP TLP5 TLP0 TLP0 TLP0 General single transistor output in compact packages Good cost performance Dial Pulsing DIP MFSOP DIP TLP TLP TLP High-VCEO (00 V) Darlington transistor output in compact packages Suitable to generate a pulse dial signal High-VCEO (50 V) single transistor output Line Detector DIP TLP9 TLP0 High LED current rating = 50 ma Directly connectable to telephone lines DIP TLPG* TLPG* Line Switch (Dual).5SOP.5SOP TLP59G* TLP59G* TLPG-* TLPG-* TLP0G* TLPD** TLPG* TLP9G* TLP9G* MOSFET-output photorelay with VOFF = 00 V Crosspoint relay replacement (*: VOFF = 50 V, **: VOFF = 00 V).5SOP (Dual) TLP00D** TLP0G* TLP0G*

77 9 Photovoltaic Coupler Applications TLP90B TLP590B RSH This is the simplest power MOSFET drive circuit. The resistor RSH for discharging the gate capacitor reduces turn-off time. RSH is not required for the TLP59B, which has a built-in resistor. (TON, TOFF several ms) TLP9B TLP59B Both AC and DC drivers become possible by connecting power MOSFETs in a common-source configuration. Transformerless AC-DC converter 00 Aac TLP590B x n DC Outputs Photovoltaic couplers in a parallel-serial configuration convert AC power to DC without a transformer. This type of configuration requires tens to hundreds of photovoltaic couplers. 0 Photorelays for Tester Application Power Source TLP0 TLP TLP5 TLP to TLP TLP0 TLP TLP to TLP TLP0 to TLP TLP0 TLP TLP50 TLP TLP5 CPU Timing Generator Waveform Squaring Circuit Pattern Generator Logic Comparator OUT DC Test Unit Photorelay (MOSFET Output) Application L TLPG- TLPG- Switch Signal TLPG- TLPG- + + Switch Signal L F A X Example of Terminal Switching Application

78 Photocoupler Application Circuit Examples NCU Circuit (Fax Modem Card) Application NCU circuit (fax modem card) No need for output snubber circuit No need for reverse-blocking diode in input side L Off-Hook Relay Dial Pulsing Relay Line transformer shorting Line L TLP0 TLP Half-Pitch Mini-Flat Coupler + + TLPG0G G9G D9G SOP Photorelay Modem CPU Controller Ring Detector Competitor Part Number Cross Reference Search The Toshiba Semiconductor webpage at offers a cross reference search tool for photocouplers and photorelays.