Photocouplers and Photorelays

Transcription

1 00- PRODUCT GUIDE Photocouplers and Photorelays semiconductor

2 Product Index Part Number TLP0 TLP0 TLP TLP TLP TLP TLP (IGM) TLP TLP TLP TLP TLP TLP TLP TLP0 TLP TLP TLPG TLP0G TLP0J TLPG TLPJ TLPJ TLPJ TLPJ TLPJ TLP TLPG TLPG TLPG TLP TLPD TLPG TLPG TLP9D TLP0 TLP TLP90 TLP9 TLP9 TLP9G TLP9 TLP9D TLP9G TLP9G TLP99D TLP00D TLP0 TLP0G TLP0 TLP0G TLP0G TLP09D TLP TLP- TLPG TLPG- TLPG TLPG- TLPG TLPG- TLP TLP TLP- TLPG TLPG- TLPG TLPG- TLP0 TLP0 (INV) Package Output Page Part Number MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP MFSOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP MFSOP MFSOP MFSOP MFSOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP DIP DIP DIP DIP DIP DIP DIP DIP Darlington transistor Thyristor Triac Triac Triac Triac Triac Triac Triac Triac Photovoltaic Photovoltaic TLP TLP0J TLPJ TLP0 TLP0- TLP TLP- TLP TLP0 TLP0- TLP0- TLP0 TLP TLP TLP0 TLP TLP TLP0J TLPJ TLPJ TLP TLP TLP TLP0 TLPG TLP TLP TLP- TLP- TLP- TLP TLP- TLP- TLPG TLPG- TLPG- TLP TLP TLPG TLPG TLPJ TLPJ TLP0 TLP TLP TLP TLP TLP TLP TLP TLP9 TLP9 (IGM) TLP0G TLP0J TLPG TLPJ TLP0 TLP TLP TLP90 TLP9 TLP9 TLP9G TLP9 TLP9G TLP9G TLP9 TLP9G TLPJ TLP0 Package MFSOP MFSOP SOP SOP SOP SOP SOP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP Output Triac Triac Triac Triac Triac Darlington transistor Darlington transistor Darlington transistor Thyristor Darlington transistor Darlington transistor Darlington transistor Triac Triac Triac Thyristor Thyristor Thyristor Thyristor Triac Triac Triac Triac Darlington transistor Darlington transistor Darlington transistor Photovoltaic Photovoltaic Thyristor Page

3 Part Number TLP0- TLP0- TLP TLP- TLP- TLP TLP- TLP- TLP TLP- TLP- TLP TLP- TLP- TLP TLP- TLP- TLP9 TLP9- TLP9- TLP0 TLP TLP TLPG TLPJ TLP TLP00 TLP0 TLP0 TLP0 TLP0 TLP TLP9 TLP TLP TLP TLP TLP TLPG TLPJ TLPG TLPJ TLP0 TLP TLP9 TLP9 (IGM) TLPJ TLPJ TLP TLP9G TLP9J TLP9G TLP0 TLP00 TLP0 TLP TLP0 TLP0 TLP TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) TLP0 (S) Package Output Page Part Number DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP SDIP SDIP SDIP SDIP SDIP SDIP SDIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP MFSOP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP Darlington transistor Darlington transistor Darlington transistor Thyristor Thyristor Diode Thyristor Thyristor Thyristor Thyristor Triac Triac Triac Triac Triac Triac Triac Triac Triac Triac Triac Triac Triac TLP (S) TLP (S) TLP (S) TLP (S) TLP0 TLP TLP TLP TLP TLP TLP TLP9 TLP0 TLP TLP TLP TLP TLP0 TLP TLP TLP TLP TLP TLP TLP TLP0 TLP0 TLP TLP0 TLP TLP0 TLP TLP90 TLP90 TLP9 TLP9 TLP00G TLP00G TLP0G TLP0G TLPG TLPG TLP9G TLP9G TLP0G TLP0G TLPG TLPG- TLPG TLPG- TLP9G TLP9G N N N N N9 CNY- CNY- CNY- TLP0 (T) TLP (T) TLP- (T) TLP- (T) TLP0 (T) TLP0- (T) TLP (T) TLP- (T) TLP (T) TLP- (T) Package DIP DIP DIP DIP MFSOP MFSOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP.SOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP SSOP DIP MFSOP SSOP SSOP SSOP.SOP.SOP.SOP.SOP.SOP.SOP DIP DIP DIP DIP DIP DIP DIP MFSOP MFSOP DIP DIP DIP DIP Output Triac Triac Triac Triac Photovoltaic Photovoltaic Photovoltaic Photovoltaic Page

4 P HOTOCOUPLER ND Preface s a type of isolator favored by manufacturers, photocouplers now serve as noise protectors in many electronic devices. TOSHI's photocouplers incorporate into a white mold package, a combination of either Gas infrared LEDs or Ga s infrared LEDs and silicon photodetectors. Ga s LEDs are adopted in high-speed photo- types for their high speed and high light output. TOSHI's innovative white mold packaging also greatly contributes to high sensitivity, high CTR, and superb reliability. Extensive Line of Products Perspective view of the TLP- Cross section of the TLP- White overmold (epoxy) Detector Dome (silicon) Infrared LED Lead frame To meet the customers various needs, we offer an extensive product portfolio shown below as well as general-purpose photocouplers.. Photo- couplers: High speed and advanced functions (highly-integrated detectors). Zero-crossing phototriac couplers: Phototriac output devices with zero-crossing function. Photovoltaic couplers: MOSFET gate drive (high voltage output achieved using a photodiode array). Photorelays (MOSFET output devices): C-DC switches (MOSFET output) Mechanical relay replacement P HOTORELYS Safety Standard pprovals Small-Package Products Overseas Manufactured Photocouplers UL approval under File No. E9 has been obtained for most of our photocouplers. 0-- approved photocouplers are also supplied along with a wide selection of output (transistor, thyristor, triac, output and photorelay). The designs of these devices meet other standards including IEC0/VDE00, IEC090/090 and IEC00/00. TOSHI offers a wide variety of small packaged photocouplers to meet requirements for size reduction and space savings in smaller and thinner end products. The devices include mini-flat packaged (MFSOP) products and half-pitch (. mm) mini-flat SOP packaged products. Part of the general-purpose photocouplers with transistor and triac outputs are manufactured by Toshiba Semiconductor Thailand Co., Ltd. This will help customers procure components locally for overseas assembly of end products. CONTTS. Product Index... p.. New Products... p.. Photocoupler Product Tree... p.. Recommended Products... p.0. Selection Guide... p.. Package Information... p.. Supplementary Information... p.. Safety Standard pproved Photocoupler... p. 9. Photocoupler pplication Circuit Example... p. 0. Competitor Cross Reference... p.. Discontinued and Final-Phase Products... p.9 Purchase order Specify the part number, rank, tape, quantity and etc. as follows. Example TLP (D-G TP) 00 pcs Quantity ( ) Symbol of tape option CTR rank VDE(0)-approved device Photocoupler part number ( ) Per reel must be a multiple of quantity For details, please refer to each page as follows. Required Specification () Rank of Current Transfer Ratio for Output or Darlington Output Rank of LED Trigger Current for Thyristor Output, Triac Output or Photorelay () Type of Leadforming for DIP Taping for SMD () VDE(0)-approved devices page P. P. P. P.

5 New Products High-Speed Photo- Couplers TLP:, 0 Mbps/TLP0:. V, 0 Mbps/TLP:, 0 Mbps (-in-) Toshiba now offers three new photo- couplers: high-speed TLP, low-voltage TLP0 and -in- TLP. ll these photo- couplers have a totem-pole output which makes bidirectional drive possible for both the sink and source currents. The maximum operating temperature (Topr) is 00 C (except for the TLP which permits a Topr of 0 C); this makes these photo- couplers suitable for a wide range of applications, including plasma displays, measuring instruments, control equipments, factory automation equipments and so on. TLP TLP0 TLP Package Characteristic TLP (New) MFSOP TLP0 (New) MFSOP TLP (Under development) SO Vcc Vcc Propagation delay time (max), tphl/tplh Supply current (max), CL/CH Supply voltage, Operating temperature, Topr 0 ns m/ m. to. 0 to 0 C 0 ns m/ m.0 to. V 0 to 00 C 0 ns 0 m/0 m. to. 0 to 00 C TLP TLP0 GND GND TLP Threshold input current high to low (max), IFHL m m m Common mode transient immunity (min) CML/CMH (Ta = C) Isolation voltage (min), Vs (Ta = C) ±0 kv/ms ± kv/ms ±0 kv/ms. k. k. k High-VDRM Phototriac Couplers TLP0(S)/TLP0(S)/TLP(S)/TLP(S) Low Trigger Current Phototriac Coupler TLP0(S) The new TLP0(S)/TLP0(S)/TLP(S)/TLP(S) feature a forward peak off-state voltage (VDRM) of 00 V and a zero-crossing triac detector. The TLP(S)/TLP(S) offer an impulse withstand voltage (VN) of 00 V typical. The new TLP0(S) features very low trigger current (IFT) of m (Max). In addition to the existing phototriacs in -pin and -pin DIPs, those new phototriac couplers are suitable for a wide range of applications such as office equipment, home appliances, triac drivers, solid-state relays and so on. TLP0(S) TLP(S) Parameter Min. forward peak off-state voltage, VDRM (V) TLP0(S) (NEW) TLP(S) (NEW) 00 TLP(S) (NEW) TLP0(S) (NEW) TLP0(S) (NEW) 00 TLP(S) (NEW) TLP(S) (NEW) Type Zero-crossing detector ZC Max. effective on-state current, rms (IT) 0. Min. isolation voltage, Vs () Typical impulse withstand voltage, VN (V) Max. LED trigger current, IFT (m)

6 New Products Low CR Photorelays for Testers and Measurement Instruments TLPxx Series The new TLPxx Series photorelays exhibit lower output pin capacitance (COFF) and On-resistance (RON) than previous devices. In addition, they feature CR values of. pfω, pfω and 0 pfω, which are approximately equivalent to those of reed relays. These photorelays have been developed in response to requirements for high-speed operation, high reliability and smaller component size. Such characteristics are required for testers and measuring instruments used for testing semiconductor products (which by their nature are evolving at a rapid pace). esides, the TLPxx Series is housed in the industry's smallest package, the -pin SSOP, and can achieve high-density mounting, 0 devices/inch. The new TLP and TLP0 feature high off-state voltages (VOFF) of 0 V (min) and 00 V (min), respectively. Part Number Package Off-State Voltage VOFF (min) On-State Current Ion (max) On-State Resistance Ron (typ.) Off-State Capacitance Coff (typ.) Trigger Current IFT (max) (New)TLP0 00 V 0 m Ω pf (New)TLP 0 V 0 m. Ω pf m TLP 0 V 00 m Ω 0 pf TLP 0 m Ω 0. pf TLP TLP TLP SSOP 0 V 0 m 00 m 0 m Ω Ω 0 Ω pf 0 pf pf m TLP0 TLP 0 m 0 m Ω Ω 0. pf 0. pf m TLP0 TLP 0 V 0 m 0 m Ω 0. Ω pf pf m TLP0 00 m Ω 0. pf m Photorelays for Testers, Measuring Instruments and Power Line Controls TLP/TLP The new TLP and TLP can control high-load current with maximum On-state resistances of 0.0 Ω and 0. Ω respectively. The TLP and TLP are a bi-directional switch, which can replace mechanical relays in many applications. nd its high on-state current maximum rating is suitable to control a power line. Part Number Package Operating Temperature Range Off-State Voltage Voff (min) On-State Current Ion (max) On-State Resistance Ron (typ.) Off-State Capacitance Coff (typ.) (New)TLP 0 to C 0 V.0 0 mω 90 pf (New)TLP.SOP 0 to C 0 V.0 00 mω 00 pf On-State Current, ION () TLP TLP ION-Ta mbient Temperature, Ta ( C)

7 Photo- Couplers for IGT/MOSFET Gate Drive TLP00, TLP0and TLP0 Fabricated with the i-cmos process, the TLP00, TLP0, TLP0 achieve the best-in-class small power consumption and can directly drive a small- to mid-power IGT or MOSFET. With greatly reduced supply current, these photocouplers generate less heat, allowing them to operate at up to 00 C (max). Housed in a -pin SDIP, the TLP00, TLP0 and TLP0 provide reinforced isolation required by international safety standards and save board space by an approximately 0%, compared to the -pin DIP. SDIP Characteristic (New)TLP00 TLP0 TLP0 Output peak current (max) IOPH/IOPL (Ta = C) ±.0 Supply voltage to 0 V ±0. 0 to 0 V ±0. 0 to 0 V Supply current (max) CH/CL (Ta = 0 to 00 C) m m m Propagation delay time (max) Operating temperature Threshold input current Common mode transient immunity (min) Isolation voltage (min) Package tphl/tplh (Ta = 0 to 00 C) Topr ( C) IFLH (max) (Ta = 0 to 00 C) CMH/CML (Ta = C) Vs (Ta = C) 0. μs 0 to 00 C m 0. μs 0 to 00 C m 0. μs 0 to 00 C m ±0 kv/μs ±0 kv/μs ±0 kv/μs SDIP pin Pin Configuration Photo- Couplers for IPM Gate Drive TLP0, TLP0, TLP0 and TLP0 The new photo- couplers TLP0, TLP0, TLP0 and TLP0 are optimized for use in IPM drivers. The totem-pole output configuration makes bidirectional drive possible for the sink and source. Open-collector output type photo- couplers often require a pull-up resistor; however, employing the totem-pole configuration for the TLP0, TLP0, TLP0 and TLP0 eliminates the need for this resistor. Toshiba provides two logic output types: an inverter logic, the TLP0 and TLP0, and a buffer logic, the TLP0 and TLP0. You can select the photo- couplers best suited to your intelligent power modules. In addition, the shielded detectors enable high common-mode transient immunity, and excellent input and output noise characteristics. Truth Table Part Number TLP0 TLP0 TLP0 TLP0 Logic Inverter Logic uffer Logic Input H L H L Output L H H L Part Number Package Threshold input current Output current (Ta C) Propagation delay time Operating temperature Supply voltage Isolation voltage TLP0/TLP0 MFSOP m (max) ± m (max) 00 ns (max) 0 to C. to 0 V 0 (min) TLP0/TLP0 SDIP m (max) ± m (max) 00 ns (max) 0 to 00 C. to 0 V (min)

8 Photocoupler Product Tree Photocouplers : Vs 00, 000, -pin & multi-channel type Typical devices package output use (TLP-, TLP, TLP) output use (TLP, TLP) Low input (TLP) C input (TLP0) C input (TLP0) Low input (TLP) Darlington output Triac output Diode output High VCEO High IF rating use High VCEO 00-V VDRM use (TLP) (TLP9) (TLP) (TLP) (TLPG) (TLP) Darlington transistor output Thyristor output Triac output use High VCEO 00-V VDRM 00-V VDRM 00-V VDRM Zero cross Non-zero cross (TLP0) (TLP) (TLPG, TLPG) (TLPJ, TLPJ) (TLPG) (TLP0G) Mini-flat package output use Low input (TLP) (TLP) 00 -V VDRM 00 -V VDRM Zero cross Non-zero cross Zero cross (TLPJ, TLPJ, TLP(S)) (TLP0J, TLP0J) (TLP0(S), TLP0(S), TLP(S), TLP(S)) C input (TLP0) output High speed 00 kbit/s (TLP) Darlington output High VCEO (TLP) Mbit/s (TLP0) Triac output Thyristor output Zero cross Non-zero cross 00-V VDRM (TLPJ, TLPJ, TLPJ) (TLPJ, TLP0J) (TLPG) Mbit/s 0 Mbit/s Power device drive (GTR) (TLP) (TLP,TLP) (TLP) output High speed Mbit/s (TLP) (IGT) (TLP0, TLP, TLP0, TLP) 0 Mbit/s 0 Mbit/s 0 Mbit/s (TLP) (TLP) (TLP) Photovoltaic output No shunt resistor Internal shunt resistor (TLP90) (TLP9) Low-voltage (TLP0) Power device drive (IPM) (TLP0, TLP0) Photorelay (MOSFET output) : Vs 00, 00, Photovoltaic output SOP output No shunt resistor use C input Low input (TLP90) (TLP, TLP-) (TLP0, TLP0-) (TLP) -pin & multi-channel type SOP High VCEO use for modems For measuring instruments TLPG, TLPG- TLPG, TLPG- TLPG, TLP0G TLPG, TLP0G TLP-9, TLP0 TLP, TLP0, TLP TLP, TLP9D, TLP09D SDIP High output current (TLP) output High speed Mbit/s (TLP9) package use (TLP9G, TLP9G) Mbit/s (TLP) For measuring instruments (TLP0, TLP) Power device drive (IGT) Power device drive (IPM) (TLP00, TLP0, TLP0) (TLP0, TLP0) SSOP For measuring instruments TLP-, TLP0 TLP0, TLP, TLP0 TLP, TLP0 9

9 Recommended Products Package SSOP SOP SOP.SOP.SOP.SOP MFSOP SDIP DIP DIP DIP ppearance Page for package dimensions p. 0 p. 0 p. 0 p. 0 p. 0 p. 0 p. 9 p. 9 p. p., p. p. 9 TLP0 TLP TLP TLP0- TLP- TLP0 TLP TLP TLP TLP0 TLP TLP TLP0 TLP TLP- TLP0 TLP TLP TLP TLP TLP9 TLP TLP0 TLP TLP TLP TLP TLP0 TLP TLP TLP TLP TLP TLP TLP0- TLP- TLP0- TLP- TLP- TLP- TLP- TLP9- TLP0- TLP- TLP0- TLP- TLP- TLP- TLP- TLP9- Page for product features p. Darlington transistor TLP TLP TLP TLP TLP TLP TLP0 TLP TLP TLP- TLP- TLP- TLP- p., 9 Diode TLP p. 9 Thyristor TLPG TLPG TLPJ TLPG TLPJ TLPG TLPJ TLPG TLPJ TLPG TLPG TLPJ TLPJ p. 0 Triac TLP0G TLP0J TLPG TLPJ TLPJ TLPJ TLPJ TLPJ TLP0J TLPJ TLPG TLP0J TLPJ TLPJ TLP0G TLP0J TLPG TLPJ TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP(S) TLP(S) TLPJ TLPJ TLPG- TLPG- p. Output type TLP TLP TLP TLP TLP TLP TLP TLP TLP0 TLP0 TLP0 TLP00 TLP0 TLP0 TLP0 TLP0 TLP TLP9 TLP TLP TLP0 TLP TLP TLP0 TLP0 TLP TLP TLP TLP TLP TLP TLP TLP9 TLP TLP0 TLP TLP9 TLP00 TLP0 TLP TLP0 TLP0 TLP N N N9 p. Photorelay TLP TLP TLP TLP TLP TLP TLP0 TLP TLP0 TLP TLP0 TLP0 TLP TLP TLPD TLPG TLPG TLP9D TLP TLP TLP TLP TLP TLP9 TLP0 TLP TLP TLP TLP9 TLP9G TLP9 TLP9G TLP99D TLP0 TLP00D TLP0 TLP0G TLP0 TLP0G TLP09D TLP TLP0 TLP TLPG TLPG TLP TLP TLPG TLPG TLP TLPG TLP9G TLP9G TLP9 TLP9G TLP9 TLP9G TLP9G TLP9 TLP9G TLP9G TLP9J TLP9G TLP TLPG- TLPG- TLP- TLPG- TLPG- TLP0 TLP- TLPG- p. 9 Photovoltaic TLP90 TLP9 TLP9 TLP90 TLP9 TLP90 TLP90 TLP9 p. 0

10 Selection Guide Output For Switching Supplies and DC-DC Converters Part Number Pin Configuration Features CTR (%) Rank Min VCE VCEO Vs 0 00 Y 0 0 -pin DIP GR High isolation voltage L 00 TLP () 00 m, UL-approved (double G 00 0 V TLPF () protection) YH 0 GRL GRH 0 00 LL Y 0 0 Mini-flat GR TLP -pin MFSOP L m, 0 G 00 0 V High CTR YH 0 GRL GRH 0 00 LL Y 0 0 -pin SOP GR TLP Lead pitch =. mm L m, 00 G 00 0 V YH 0 GRL GRH 0 00 LL pin SOP TLP Lead pitch =. mm Low input drive current 00 High-speed switching m, V 00 UL Safety Standards () TÜV VDE SI IEC 0 () () 0 () () For Home ppliances (Hs) CTR (%) Part Number Pin Configuration Features Rank Min Max pin DIP Y 0 0 TLP0 () C input GR TLP0F () L G TLP0 () TLP0 () Mini-flat -pin MFSOP C input -pin SOP Lead pitch =. mm C input Y 0 0 GR L 00 G Y 0 0 GR L 00 G 00 VCE ± m, ± m, ± m, Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. Note : The products with the ranks Y and L are limited in production. For details, please contact your nearest Toshiba sales representative. Note : For details of the TLP and TLPF, please contact your nearest Toshiba sales representative. VCEO 0 V 0 V Vs 0 00 UL Safety Standards () TÜV VDE SI IEC 0 0 () () () ()

11 For Programmable Logic Controllers (PLCs) Part Number Pin Configuration Features Rank CTR (%) Min VCE VCEO Vs UL Safety Standards () TÜV VDE SI IEC TLP0- TLP pin SOP -channel version of the TLP0 Lead pitch =. mm C input -pin SOP -channel version of the TLP Lead pitch =. mm 0 G 00 0 G ± m, m, 0 V 00 () () For Telecommunications Part Number Pin Configuration Features Rank CTR (%) Min VCE VCEO Vs UL Safety Standards () TÜV VDE SI IEC -pin DIP TLP9 High input current 00 m, I F = 0 m 0 0 V DC input pin DIP TLP0 High input current ±00 m, C input 0 0 V I F = 0 m pin DIP TLP0 High input current ±00 m, C input 0 0 V I F = 0 m TLP -pin DIP High VCEO VCEO = 0 V 0 G 00 m, 00 0 V Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

12 Selection Guide Low Input Type Part Number Pin Configuration Features Rank CTR (%) Safety Standards VCEO Vs () Min VCE UL TÜV VDE SI IEC TLP Mini-flat -pin MFSOP Low input drive current 00 V 00 Mini-flat -pin MFSOP TLP C input 00 Low input drive current m, 0. ± m, 0. 0 V 0 TLP TLP -pin DIP Low input drive current SI-approved -pin DIP Low input drive current C input SI-approved 00 V V m, 0. ± m, TLP Mini-flat -pin MFSOP Low input drive current Internal base connection 00 V 00 m, 00 0 V 0. 0 TLP TLP -pin DIP Low input drive current Internal base connection -pin DIP Low input drive current No internal base connection 00 V V 00 m, Note : Legend in the Safety Standard coulmn: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

13 -Channel Type (other than those above) Part Number Pin Configuration Features TLP- TLP TLPF TLP0 () TLP () TLP () TLP0 () TLP () -pin DIP -pin DIP High isolation voltage UL-approved (double protection) Mini-flat -pin MFSOP C input Internal base connection CTR (%) Safety Standards VCEO Vs Rank Min VCE UL TÜV VDE SI IEC 0 00 Y 0 0 GR L m, 00 G 00 YH 0 GRL GRH 0 00 LL Y 0 0 GR L 00 G YH 0 GRL GRH 0 00 LL Y 0 0 GR L 00 G Y 0 0 GR L 00 G Y 0 0 GR L 00 G Y 0 0 GR L 00 G Y 0 0 GR L 00 G Y 0 0 GR L 00 G Y 0 0 GR L 00 G 00 Mini-flat -pin MFSOP TLP () Internal base connection 00 -pin DIP Internal base connection -pin DIP High EMI immunity No internal base connection -pin DIP C input High isolation voltage Internal base connection -pin DIP Internal base connection TLP () -pin DIP High EMI immunity No internal base connection 00 Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. Note : The products with the ranks Y and L are limited in production. For details, please contact your nearest Toshiba sales representative. m, ± m, m, m, ± m, m, 0 V

14 Selection Guide -Channel Type (other than those above) (continued) Part Number Pin Configuration Features TLP () TLP () TLP () TLPF () TLP () TLPF () -pin DIP Internal base connection -pin DIP No internal base connection -pin DIP Internal base connection -pin DIP No internal base connection CTR (%) Safety Standards () VCEO Vs Rank Min VCE UL TÜV VDE SI IEC 0 00 Y 0 0 GR L G 00 m, Y 0 0 GR L 00 G Y 0 0 GR L 00 G Y 0 0 GR L 00 G m, CNY- Direct replacement 0 m, CNY- for CNY Series V CNY Channel Type Part Number Pin Configuration Features Rank CTR (%) Safety Standards () VCEO Vs Min VCE UL TÜV VDE SI IEC 0 -pin DIP m, TLP0 00 G TLP- () TLP- () -pin DIP Dual-channel version of the TLP- -pin DIP Dual-channel version of the TLP 0 00 Y 0 0 GR L 00 G Y 0 0 GR L 00 G m, m, TLP- -pin DIP Dual-channel version of the TLP 00 V 00 m, TLP- -pin DIP Dual-channel version of the TLP 0 G 00 m, 00 0 V TLP9- -pin DIP Dual-channel version 0 of the TLP9 00 m, 0 V Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. Note : The products with the ranks Y and L are limited in production. For details, please contact your nearest Toshiba sales representative.

15 -Channel Type with C Input Part Number Pin Configuration Features Rank CTR (%) Safety Standards () VCEO Vs Min VCE UL TÜV VDE SI IEC TLP0- -pin DIP Dual-channel version of the TLP0 0 G 00 ± m, TLP- -pin DIP Dual-channel version of the TLP 00 V 00 ± m, pin DIP ±00 m, TLP0- Dual-channel version 0 0 of the TLP0 V Channel Type Part Number Pin Configuration Features Rank CTR (%) Safety Standards () VCEO Vs Rank VCE UL TÜV VDE SI IEC pin DIP m, TLP- -channel version of 00 the TLP- G TLP pin DIP -channel version of the TLP 0 G 00 m, TLP pin DIP -channel version of the TLP 00 V m, TLP pin DIP -channel version of the TLP 0 G 00 m, 00 0 V pin DIP 00 m, TLP9- -channel version of 0 0 the TLP9 V Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

16 Selection Guide -Channel Type with C Input Part Number Pin Configuration Features VCEO Vs Rank CTR (%) Safety Standards () Min VCE UL TÜV VDE SI IEC TLP pin DIP -channel version of the TLP0 0 G 00 ± m, TLP pin DIP -channel version of the TLP 00 V 00 ± m, pin DIP ±00 m, TLP0- -channel version of 0 0 V the TLP Darlington Output -Pin Package Type CTR (%) VCE (sat) (V) Safety Standards Part Number Pin Configuration Features VCEO Vs () VCE IF UL TÜV VDE SI IEC Mini-flat TLP -pin MFSOP 000 High VCEO m, V. 00 m, 0 m V () () pin DIP TLP High VCEO 000 m, V 00 m,. 0 m 00 V pin DIP TLP 00 m, V 0 m, 0 m 00 -Pin Package Type CTR (%) VCE (sat) (V) Safety Standards Part Number Pin Configuration Features Vs () VCEO VCE IF UL TÜV VDE SI IEC TLP -pin DIP High VCEO Internal base connection TLP -pin DIP High VCEO No internal base connection m, 000. V 00 m, 0 m 00 V TLP -pin DIP High VCEO Large emitter-collector distance Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

17 -Pin Package Type (Continued) CTR (%) VCE (sat) (V) Safety Standards Part Number Pin Configuration Features Vs () VCEO VCE IF UL TÜV VDE SI IEC TLP0 TLP -pin DIP High EMI immunity -pin DIP Internal base connection m, 00 m, 000. V 0 m 00 TLP -pin DIP uilt-in RE m, V 00 m, 0 m V 00 -Channel Type CTR (%) VCE (sat) (V) Safety Standards Part Number Pin Configuration Features Vs () VCEO VCE IF UL TÜV VDE SI IEC -pin DIP m, TLP- Dual-channel version 00 V of the TLP 0 m, 0 m 00 -pin DIP TLP- Dual-channel version m, 00 m, 000 V. of the TLP 0 m 00 V Channel Type CTR (%) VCE (sat) (V) Safety Standards Part Number Pin Configuration Features Vs () VCEO VCE IF UL TÜV VDE SI IEC 0 9 TLP- -pin DIP -channel version of the TLP 00 m, V.0 0 m, 0 m 00 TLP pin DIP -channel version of the TLP 000 m, V. 00 m, 0 m 00 V Diode Output CTR (%) ILEK (n) Part Number Pin Configuration Pin Configuration VKO Safety Standards () Max UL TÜV VDE SI IEC -pin DIP TLP High-speed response 0. 0 m 0 0 V 0 V Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. 9

18 Selection Guide Thyristor Output C 00 to 0 V Line Type VTM Safety Standards Part Number Pin Configuration Features VDRM Vs () Max UL TÜV VDE SI IEC Mini-flat TLPG -pin MFSOP 0 m. V 00 m 00 V I FT 00 TLPG -pin DIP m. V Low IFT TLPG -pin DIP High isolation voltage 00 m 00 V m. V 00 m 00 V 00 TLPG -pin DIP 0 m. V 00 m 00 V TLPG TLPGF -pin DIP m. V 00 m 00 V TLPG -pin DIP TLPG Large anode-cathode distance (SCR) m. V 00 m 00 V -pin DIP idirectional thyristor pair Low trigger current m. V 00 m 00 V 00 C 00 to 0 V Line Type VTM Safety Standards Part Number Pin Configuration Features VDRM Vs () Max UL TÜV VDE SI IEC TLPJ -pin DIP TLPJ High VDRM 0 m. V 00 m 00 V -pin DIP High VDRM High isolation voltage I FT 0 m. V 00 m 00 V 00 TLPJ -pin DIP 0 m. V 00 m 00 V TLPJ TLPJF -pin DIP m. V 00 m 00 V TLPJ -pin DIP Large anode-cathode distance (SCR) 0 m. V 00 m 00 V 00 -pin DIP TLPJ idirectional thyristor pair 0 m. V 00 m 00 V High isolation voltage Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. 0

19 Triac Output For Solid State Relays (SSRs) I FT VTM Part Number Pin Configuration Features VDRM TLP0G TLPG ZC TLPJ Zero cross IFT m ZC ZC Mini-flat -pin MFSOP Non-zero cross Mini-flat -pin MFSOP Zero cross Mini-flat 0 m TLP0J -pin MFSOP TLPJ Non-zero cross IFT m TLPJ TLPJ TLPJ Mini-flat -pin MFSOP Mini-flat -pin MFSOP Zero cross Low IFT Mini-flat -pin MFSOP Zero cross High impulse noise immunity VN=000 V (typ.) Safety Standards () Rank Max Max UL TÜV VDE SI IEC 0 m IFT m 00 V () () IFT m 0 m IFT m 00 V () () IFT m 0 m m 0 m. V 0 m 00 m 00 V 00 () () () () () () TLP0J TLPJ ZC Mini-flat -pin MFSOP Non-zero cross Mini-flat -pin MFSOP Zero cross 0 m () () 0 m m () () For Office utomation (O) Equipment I FT VTM Part Number Pin Configuration Features VDRM Vs TLP0J TLP0JF -pin DIP Non-zero cross IFT Max 0 m m Safety Standards () Max UL TÜV VDE SI IEC. V 0 m 00 V 0 0 TLPJ TLPJF ZC -pin DIP Zero cross IFT 0 m m. V 0 m 00 V 0 0 TLPJ TLPJF ZC -pin DIP Zero cross High impulse noise immunity VN = 000 V (typ.) 0 m. V 0 m 00 V 0 0 TLPJ -pin DIP ZC Zero cross m V 00 m 00 V Low trigger current 0 0 Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

20 Selection Guide C 00 to 0 V Line Type I FT VTM Safety Standards () Part Number Pin Configuration Features VDRM Vs Rank Max UL TÜV VDE SI IEC TLPG -pin DIP 0 m V 00 m 00 V 00 TLP0G -pin DIP Non-zero cross IFT IFT 0 m m m V 00 m 00 V 00 TLPG ZC -pin DIP Zero cross IFT IFT 0 m m m V 00 m 00 V 00 TLP0(S) TLP0F(S) TLP0(S) TLP0F(S) -pin DIP Direct replacement for XXX00/0/0 -pin DIP Direct replacement for XXX0 0 m m V 00 m 00 V TLP0(S) TLP0F(S) TLP0(S) TLP0F(S) ZC Includes a Z.C. circuit. -pin DIP Direct replacement for XXX00/0/0 -pin DIP Direct replacement for XXX0 0 m m V 00 m 00 V C 00 to 0 V Line Type I FT VTM Safety Standards () Part Number Pin Configuration Features VDRM Vs Rank Max UL TÜV VDE SI IEC TLP0J -pin DIP Non-zero cross IFT 0 m m V 00 m 00 V 00 TLPJ ZC -pin DIP Zero cross IFT 0 m m V 00 m 00 V 00 Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

21 C 00 to 0 V Line Type (Continued) IFT VTM Safety Standards Part Number Pin Configuration Features VDRM Vs () Rank Max UL TÜV VDE SI IEC TLPJ TLPJF TLPJ TLPJF TLP0(S) TLP0F(S) ZC -pin DIP Internal creepage: mm (min) Non-zero cross-on -pin DIP Internal creepage: mm (min) Zero cross -pin DIP Non-zero cross-on 0 m 0 m 0 m V V V 00 m 00 m 00 m 00 V 00 V 00 V TLP0(S) TLP0F(S) -pin DIP Zero cross 0 m TLP0(S) TLP0F(S) -pin DIP Zero cross m TLP0(S) TLP0F(S) -pin DIP Zero cross m 00 V TLP0(S) ZC -pin DIP Low trigger current Zero cross m V 00 m 0 0 TLP(S) TLPF(S) TLP(S) TLPF(S) TLP0(S) TLP0F(S) TLP0(S) TLP0F(S) TLP(S) TLPF(S) TLP(S) TLPF(S) -pin DIP Zero cross High impulse noise immunity VN = 000 V (typ.) -pin DIP Zero cross -pin DIP High impulse noise immunity VN = 00 V (typ.) 0 m m 0 m m 0 m m 00 V Multi-channel Type I FT VTM Safety Standards () Part Number Pin Configuration Features VDRM Vs Rank Max UL TÜV VDE SI IEC TLPG- TLPG pin DIP Dual-channel version of the TLPG -pin DIP -channel version of the TLPG 0 m 0 m V 00 m 00 V 00 Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

22 Selection Guide Output For Plasma Display Panels and Factory utomations (Fs) Propagation Part Number Pin Configuration Features Output Form Vs Delay Time (Max) (Max) TLP0 TLP TLP TLP For IPM Drivers Vcc Vcc Vcc GND GND GND Mini-flat -pin MFSOP High speed: 0 Md High CMR Low power dissipation UL Safety Standards () TÜV VDE SI IEC Propagation Output Form/ Safety Standards Part Number Pin Configuration Features Vs () Delay Time (Max) UL TÜV VDE SI IEC TLP0 TLP0 TLP0 TLP0F Vcc Vcc Vcc Vcc GND GND GND GND Mini-flat -pin MFSOP.-V power supply High speed: 0 Md Mini-flat -pin MFSOP High speed: 0 Md Low power dissipation -pin SDIP High isolation voltage (min) Mini-flat -pin MFSOP IPM drive High CMR Mini-flat -pin MFSOP IPM drive High CMR -pin SDIP IPM drive High CMR 0 ns 0 ns 0 ns ns 00 ns 00 ns 00 ns Totem pole output (Inverter logic) Totem pole output (Inverter logic) Totem pole output (Inverter logic) Totem pole output (Inverter logic) Totem pole output (Inverter logic) Totem pole output (uffer logic) Totem pole output (Inverter logic) I FHL () 0 m () (Pending) (Pending) () 0 m () (Pending) 0 m (). m IFHL = m (max) IFLH = m (max) IFHL = m (max) () () 0 () 0 () () 0 TLP0 TLP0F Vcc GND -pin SDIP IPM drive High CMR Mini-flat TLP(IGM) -pin MFSOP 0 0. μs % (min) 0 m High CMR () 00 ns Totem pole output (uffer logic) IFLH = m (max) 0 0 () -pin DIP TLP9(IGM) High CMR 0. μs % (min) 0 m 00 TLP9(IGM) TLP9F(IGM) -pin DIP High CMR 0. μs % (min) 0 m Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

23 For IGT/MOSFET/Giant Gate Drive Propagation I FHL Part Number Pin Configuration Features Output Form Vs Delay Time (Max) (Max) UL Safety Standards () TÜV VDE SI IEC TLP -pin DIP Direct drive of a power transistor -pin DIP TLP Direct drive of a Peak output 00 TLPF small-power.0 μs current (max): m IGT/MOSFET ±0. TLP0 TLP0F -pin DIP Direct drive of a TLP medium-power Peak output 0 0. μs m TLPF IGT/MOSFET current (max): Low power dissipation ±0. TLP -pin SDIP Direct drive of a TLP0 medium-power Peak output 0. μs m TLP0F IGT/MOSFET current (max): Low power dissipation ±0. TLP0 TLP0F TLP0(INV) TLP0F(INV) TLP00 -pin SDIP Direct drive of a small-power IGT/MOSFET Low power dissipation -pin DIP Direct drive of a medium-power IGT/MOSFET Low power dissipation UL double protection -pin DIP Direct drive of a medium-power IGT/MOSFET -pin DIP Direct drive of a medium-power IGT/MOSFET For inverters -pin SDIP Direct drive of a medium-power IGT/MOSFET Low power dissipation pin DIP Direct drive of a TLP0 medium-power Peak output 0 0. μs m IGT/MOSFET TLP0F current (max): High CMR ±. Low power dissipation μs 0. μs 0. μs 0. μs 0. μs 0. μs Constant current output: 0. Peak output current (max): ±0. Peak output current (max): ±0. Peak output current (max): ±. Peak output current (max): ±.0 Peak output current (max): ±.0 m m m m m m (Pending) (Pending) (Pending) 0 Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

24 Selection Guide -Channel Type (other than those above) Data Rate Part Number Pin Configuration Features CTR Vs (NRZ) UL Safety Standards () TÜV VDE SI IEC -pin DIP TLP Low input drive current 00 kbit/s 00% (min) 0. m 00 TLP TLP Mini-flat -pin MFSOP High CMR High CTR version of the TLP Mbit/s 0% (min) 0% (min) Mini-flat TLP -pin MFSOP High CMR version 0 () () of the TLP m 00 -pin DIP version TLP Mbit/s 0% (min) m of the TLP0 00 -pin DIP TLP0 No internal base Mbit/s 0% (min) m connection (9% min for rank O) High CMR -pin DIP TLP9 High CMR version Mbit/s 0% (min) m of the TLP0 -pin DIP TLP Internal base connection 0% (min) Mbit/s m High-speed (9% min for rank O) pin DIP 0% (min) TLP High isolation voltage Mbit/s (9% min for rank O) m Internal base connection TLP0 TLP0F TLP TLPF -pin DIP High isolation voltage High CMR -pin DIP High isolation voltage Internal base connection 0% (min) Mbit/s m (9% min for rank O) Mbit/s 0% (min) m TLP9 TLP9F -pin DIP IEC090 design standard version of the TLP9 Mbit/s 0% (min) m TLP9 TLP9F -pin SDIP High CMR Mbit/s 0% (min) m 0 0 Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

25 -Channel Type (other than those above) (continued) Data Rate I FH, IFL Part Number Pin Configuration Features Output Form Vs (NRZ) (Typ.) (Max) UL Safety Standards () TÜV VDE SI IEC -pin DIP -state output TLP Low input current Mbit/s. m (uffer logic) High Vcc operation GND -pin DIP -state output TLP Inverted logic version of Mbit/s. m (Inverter logic) the TLP GND 00 -pin DIP TLP00 Low input current High-speed Mbit/s -state output. m High Vcc operation GND Mini-flat TLP -pin MFSOP High-speed 0 Mbit/s Open-collector 0 m Logic output TLP TLP GND GND Mini-flat -pin MFSOP High CMR version of the TLP Highly Sensitive version of the TLP 0 Mbit/s Open-collector 0 m m 00 -pin DIP TLP -pin package version of 0 Mbit/s Open-collector m the TLP GND -pin DIP TLP High-speed 0 Mbit/s Open-collector m Logic output GND -pin DIP TLP High-speed High CMR version of 0 Mbit/s Open-collector m the TLP GND 00 TLP0 GND -pin DIP High CMR High-speed 0 Mbit/s Open-collector m -Channel Type Data Rate Output Form Safety Standards Part Number Pin Configuration Features Vs () (NRZ) (Typ.) UL TÜV VDE SI IEC Dual-channel version of TLP0 Mbit/s % (min) the N and the TLP0 m Dual-channel version of TLP the N and the TLP0 Mbit/s 9% (min) TLP0 GND Dual-channel version of the N and the TLP0 0 Mbit/s Open-collector IFHL = m (max) 00 TLP GND High CMR Dual-channel version of the TLP0 0 Mbit/s Open-collector IFHL = m (max) Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

26 Selection Guide JEDEC Type Data Rate Part Number Pin Configuration Features CTR Vs (NRZ) UL Safety Standards () TÜV VDE SI IEC N % (min) JEDEC-compliant Mbit/s m N 9% (min) GND JEDEC-compliant N 0 Mbit/s 00% (typ.) m High-speed 00 N N9 JEDEC-compliant High CTR 00 kbit/s 00% (min). m 00% (min) 0. m Photovoltaic Output Short-Circuit Current (μ) Open Voltage (V) Safety Standards () Part Number Pin Configuration Features Vs Rank (m) (m) UL TÜV VDE SI IEC Mini-flat TLP90 -pin MFSOP 0 m 0 m Mini-flat TLP9 -pin MFSOP uilt-in shunt regulator 0 m 0 m -pin DIP TLP90 0 m 0 m C TLP9 -pin DIP uilt-in shunt regulator C0 0 0 m 0 m Mini-flat TLP90 -pin MFSOP 0 m 0 m Low cost TLP90 -pin SSOP 0 m 0 m TLP9 -pin SSOP High short-circuit current 0 0 m 0 m 00 TLP9 -pin SSOP High open voltage 0 m 0 0 m Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

27 Photorelays MOSFET Output, -Form- Part Number Pin Configuration Features IFT RON VOFF Vs UL Safety Standards () TÜV VDE SI IEC TLP0 -pin SOP Lead pitch:. mm COFF: pf(typ.) Ultra low CR: pf x Ω For measuring instruments m Ω m 0. TLP0 TLP0 TLP TLP TLP TLP -pin SSOP COFF: pf(typ.) Ultra low CR: pf x Ω For measuring instruments -pin SSOP COFF: 0. pf (typ.) Ultra low CR:. pf x Ω For measuring instruments -pin SOP Lead pitch:. mm COFF: pf(typ.) Ultra low CR: pf x Ω For measuring instruments -pin SSOP COFF: pf(typ.) Ultra low CR: pf x Ω For measuring instruments -pin SOP Lead pitch:. mm COFF: 0. pf (typ.) Ultra low CR: pf x Ω For measuring instruments -pin SSOP COFF: 0. pf (typ.) Ultra low CR: pf x Ω For measuring instruments m m m m m Ω. Ω. Ω Ω Ω m m m m m 0. m Ω m V 00 TLP TLP TLP0 TLP TLP TLP TLP TLP TLP -pin SOP Lead pitch:. mm COFF: pf(typ.) Ultra low CR:0 pf x Ω For measuring instruments -pin SSOP COFF: pf(typ.) Ultra low CR:0 pf x Ω For measuring instruments -pin SSOP COFF: 0. pf (typ.) Ultra low CR: pf x Ω For measuring instruments -pin SSOP COFF: 0. pf (typ.) Ultra low CR: pf x Ω For measuring instruments -pin SOP Lead pitch:. mm COFF: pf(typ.) Ultra low CR:0 pf x Ω For measuring instruments -pin SSOP COFF: pf(typ.) Ultra low CR:0 pf x Ω For measuring instruments -pin SOP Lead pitch:. mm COFF: 0 pf (typ.) Ultra low CR:0 pfxω For measuring instruments -pin SSOP COFF: 0 pf (typ.) Ultra low CR:0 pfxω For measuring instruments -pin SOP Lead pitch:. mm COFF: 00 pf (typ.) High output current For measuring instruments and power lines m m m m m m m m m Ω Ω Ω 0 Ω Ω Ω. Ω. Ω 0. Ω m m m m m m m m m V 00 TLP -pin DIP Designed for DC output modules m. Ω 0 m TLP0 -pin SOP Lead pitch:. mm COFF: 00 pf (typ.) Low CR For measuring instruments m. Ω m TLP TLP TLP -pin SOP Lead pitch:. mm High output current -pin SOP Lead pitch:. mm High output current -pin SOP Lead pitch:. mm High output current: ION =.0 (max) For measuring instruments and power lines m m m Ω Ω 0. Ω m m m V 00 () () Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. 9

28 Selection Guide MOSFET Output, -Form- (continued) Part Number Pin Configuration Features TLP9 TLP9 TLP TLP TLP TLP9 TLP9 TLP9 TLP -pin SOP Lead pitch:. mm High output current -pin SOP Lead pitch:. mm High output current -pin SSOP COFF: 0 pf (typ.) Low CR: 0 pf Ω For measuring instruments -pin DIP High output current -pin DIP -pin DIP High output current -pin DIP High output current -pin DIP High output current -pin DIP Low On-resistance High output current: ION =. (max) For measuring instruments and power lines IFT Max m m m m m m m m m Ω m 0. Ω m 0.. Ω m 0. Ω m 0. Ω m 0. Ω m 0. Ω m 0. Ω m Ω 0 m. VOFF 0 V Vs UL Safety Standards () TÜV VDE SI IEC TLP -pin SOP Lead pitch:. mm COFF:. pf (typ.) Low CR: 0 pf Ω For measuring instruments m Ω m 0.0 TLP -pin SOP Lead pitch:. mm COFF: pf (typ.) Low CR For measuring instruments m 0 Ω m 0. TLP TLP9 TLP TLP0 -pin SSOP COFF: pf (typ.) Low CR: 0 pf Ω For measuring instruments -pin SOP Lead pitch:. mm COFF: pf (typ.) Low CR: 0 pf Ω For measuring instruments -pin SOP Lead pitch:. mm COFF: 0 pf (typ.) Low CR: 0 pf Ω For measuring instruments -pin SOP Lead pitch:. mm High output current: ION =.0 (max) For measuring instruments and power lines m m m m Ω 0 m 0. Ω m 0.. Ω m Ω m. 0 V 00 TLP0 -pin SSOP VOFF: 00 V For measuring instruments m Ω 0 m V TLP9D TLP99D TLPD -pin SOP Lead pitch:. mm VOFF: 00V Low COFF: pf (typ.) For measuring instruments -pin SOP Lead pitch:. mm VOFF: 00 V Low COFF: pf (typ.) For measuring instruments -pin SOP Lead pitch:. mm Low On-resistance Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. m m m 0 Ω 0 Ω Ω m m m V () () 0

29 MOSFET Output, -Form- (continued) IFT RON Part Number Pin Configuration Features VOFF Vs TLP9D TLPG -pin SOP Lead pitch:. mm Low On-resistance -pin SOP Lead pitch:. mm m m Ω Ω m V m 0. UL Safety Standards () TÜV VDE SI IEC TLP9G -pin SOP Lead pitch:. mm m Ω m 0. TLPG -pin SOP Lead pitch:. mm m Ω m () () TLP9G -pin SOP Lead pitch:. mm m Ω m 0. () () TLPG TLPG -pin SOP Lead pitch:. mm Current-limiting function Limit current: 0 to 00 m -pin DIP m m Ω 0 Ω m m V TLPG -pin DIP m Ω m TLP9G TLP9G TLPG TLPG -pin DIP -pin DIP -pin DIP Current-limiting function Limit current: 0 to 00 m -pin SOP Lead pitch:. mm m m m m 0 Ω Ω Ω Ω m m m m TLPG TLP9G -pin SOP Lead pitch:. mm Current-limiting function Limit current: 0 to 00 m -pin SOP Lead pitch:. mm m m Ω Ω m m TLP TLPG TLPG -pin SOP Lead pitch:. mm VOFF: 00V Low On-resistance For measuring instruments -pin DIP -pin DIP For modems Current-limiting function Limit current: 0 to 00 m m m m Ω Ω Ω m m m V 00 Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

30 Selection Guide MOSFET Output, -Form- (continued) IFT RON Part Number Pin Configuration Features VOFF Vs UL Safety Standards () TÜV VDE SI IEC TLP9G -pin DIP m Ω m TLP9G TLP9G TLP9GF TLP9G TLP9J TLP9JF -pin DIP Low On-resistance -pin DIP Low On-resistance High isolation voltage IEC090-compliant -pin DIP High isolation voltage m m m Ω m 0. Ω Ω m m Ω m V 00 V MOSFET Output, -Form- IFT RON Part Number Pin Configuration Features Max VOFF UL Safety Standards () TÜV VDE SI IEC TLP0 TLP0 TLP- TLP- -pin SOP Lead pitch:. mm Dual-channel version of the TLP -pin SOP Lead pitch:. mm Dual-channel version of the TLP -pin DIP Dual-channel version of the TLP -pin DIP Dual-channel version of the TLP m m m m Ω Ω Ω Ω m m m m V TLP09D TLP00D TLP0G -pin SOP Lead pitch:. mm Dual-channel version of the TLP9D -pin SOP Lead pitch:. mm Dual-channel version of the TLPD -pin SOP Lead pitch:. mm Dual-channel version of the TLPG m m m 0 Ω Ω 0 Ω m m m V 00 -pin SOP Lead pitch:. mm TLP0G m Ω m 0. () Dual-channel version of the TLPG TLPG- TLPG- TLPG- TLP0G TLPG- TLPG- -pin DIP Dual-channel version of the TLPG -pin DIP Dual-channel version of the TLPG -pin DIP Dual-channel version of the TLPG -pin SOP Lead pitch:. mm Dual-channel version of the TLPG -pin DIP Dual-channel version of the TLPG -pin DIP Dual-channel version of the TLPG Current-limiting function Limit current: 0 to 00 m Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. m m m m m m 0 Ω Ω Ω Ω Ω Ω m m m m m m V 00 V ()

31 MOSFET Output, -Form- IFT RON Part Number Pin Configuration Features VOFF Vs UL Safety Standards () TÜV VDE SI IEC TLPG TLP9G -pin SOP Lead pitch:. mm -pin SOP Lead pitch:. mm -Form- -Form- m m 0 Ω 0 Ω 0 m 0 m TLPG TLP9G -pin DIP -pin DIP -Form- -Form- m m 0 Ω 0 Ω 0 m 0 m TLPG TLP9G -pin SOP Lead pitch:. mm -pin SOP Lead pitch:. mm -Form- -Form- m m Ω Ω 0 m 0 m V 00 TLPG TLP9G -pin DIP -pin DIP -Form- -Form- m m Ω Ω 0 m 0 m Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D.

32 Selection Guide MOSFET Output, -Form- IFT RON Part Number Pin Configuration Features Max VOFF UL Safety Standards () TÜV VDE SI IEC TLP0G -pin SOP Lead pitch:. mm Dual-channel version of the TLPG -Form- m 0 Ω 0 m TLPG- TLP0G -pin DIP Dual-channel version of the TLPG -Form- -pin SOP Lead pitch:. mm Dual-channel version of the TLPG -Form- m m 0 Ω Ω 0 m 0 m V TLPG- -pin DIP Dual-channel version of the TLPG -Form- m Ω 0 m MOSFET Output, -Form- + -Form- IFT RON Part Number Pin Configuration Features VOFF Max TLP0G TLP00G TLP0G TLP00G -pin SOP Lead pitch:. ab (N.C. + N.O.) -pin DIP ab (N.C. + N.O.) -pin SOP Lead pitch:. ab (N.C. + N.O.) -pin DIP ab (N.C. + N.O.) 0. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. m m m m 0 Ω 0 Ω Ω Ω (Form-) m (Form-) 0 m (Form-) m (Form-) 0 m (Form-) m (Form-) 0 m (Form-) m (Form-) 0 m V UL Safety Standards () TÜV VDE SI IEC

33 9 Products Manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. Part Number Pin Configuration Pin Configuration VCEO Vs UL Safety Standards () TÜV VDE SI IEC TLP0 (T) Mini-flat -pin MFSOP C input 0 V 0 () () TLP (T) Mini-flat -pin MFSOP output 0 V 0 () () TLP- (T) TLP- (T) -pin DIP output -pin DIP Dual-channel version of the TLP- (T) 00 TLP0 (T) TLP0- (T) -pin DIP output C input -pin DIP Dual-channel version of the TLP0 (T) TLP (T) TLP- (T) -pin DIP output High isolation voltage -pin DIP Dual-channel version of the TLP (T) TLP (T) TLP- (T) -pin DIP Darlington transistor output High VCEO -pin DIP Dual-channel version of the TLP (T) 00 V Note : The 0-- safety standards for compact package is different from that for standard DIP packages. Since mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note : Legend in the Safety Standard column: : pproved : SELV-approved : Design which meets safety standard; approval pending (as of December 00) TÜV and VDE: 0-- approved with option V or D. Note that the products manufactured by Toshiba Semiconductor Thailand Co., Ltd. are not available in Japan. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd.. For detailed information, please contact your nearest Toshiba sales representative.

34 Package Information Package Dimensions * For TLP and TLPF, please refer individual data sheet. DIP DIP (LF) or (TP) Unit: mm. ± 0.. ± 0.. ± ± 0.. ± 0.. ± 0.. ± ± ± 0.. ± 0.. min. to.0. ± 0.. ± 0..0 min 0.0 max DIP (LF) DIP (LF) or (TP). ± 0.. ± 0.. ± ± 0..0 max. ± 0.. ± 0.. ± 0.. ± ± 0.. ± ± ± 0.. ± 0.. min 0. min DIP (LF) or (TP) to 0. ± ± 0. DIP. ± ± ± ± ± 0.. ± ± 0.. ± 0.. ± 0..0 min 0.0 max 0. max 0. ± 0.. ± 0.. ± 0.. min. to.0

35 DIP (LF) or (TP) DIP (LF) Unit: mm. ± 0.. ± 0.. ± 0.. ± ± 0. DIP (LF) or (TP). ± 0..0 min 0.0 max ± ± 0.. ± 0.. ± min 0. min. DIP (LF) or (TP) 0. ± 0.. ± to. ± 0.. ± ± 0.. ± 0.. ± ± ± ± 0..0 max ± 0.. ± 0.. ± ± ± 0..0 min 0.0 max 0. max pin DIP -pin DIP (LF) 0. ± ± 0.. ± 0.. ± ± 0.. ± 0.. ± 0.. min to.0. ± 0.. ± ± 0.. ± 0.. ± min. min 0. ± 0.. ± to

36 Package Information Package Dimensions (continued) -pin DIP (Cut) Unit: mm. ± ± ± ± 0.. ± 0.. ± 0.. min. ± to.0 9. ± 0.. ± ± 0.. ± 0.. ± 0.. min 0. ± ± to.0 (LF) or (TP) (LF). ± 0.. ± ± ± 0..0 min. ± 0.. ± max ± ± 0.. ± 0.. ± 0.. min 0. min ± 0.. ± to (LF) (LF) or (TP). ± 0.. ± ± 0.. ± ± ± ± 0..0 max ± ± 0..0 min. ± 0.. ± max 0. max

37 DIP SDIP Unit: mm 0 9. ± 0.. ± ± ± 0.. ± 0.. ± 0.. min 0. ± ± to.0 0. ± 0.. ± ± 0.. ± 0.. ± ± SDIP (F type) -pin MFSOP. ± 0.. ± ± ± ± ± 0.. ± pin MFSOP -pin MFSOP (No.Cut).... ± ± min.0 ± 0.. ± 0..0 ± 0.. ± 0..0 ± ± min ± min 9

38 Package Information Package Dimensions (continued).sop.sop Unit: mm.9 ± 0.. max.0 ± 0.. ± 0.. ± ± 0.. ± 0.. ± 0.. max.0 ± ± 0.. ± ± ± 0.. ± ± ± ± 0..SOP SOP 9. ± 0.. max.0 ± 0.. ± 0..0 ± 0.. ± ± ± ± 0.. max 0. ± 0.. ± ± ± 0. SOP SSOP 0 9 φ... ± ± ± 0.. ± 0.. max 0. ± ± ± ±

39 TLP0 Unit: mm. ± 0.. ± ± 0.. ± ± 0.. min 0. ± ± to.0

40 Package Information Optional Lead Formed Products * For TLP and TLPF, please refer individual data sheet.. Surface-Mount Lead Form Options (LF), (LF), (LF) LF LF LF Package Outline -pin DIP -pin DIP Dimensions Unit: mm Version (LF) (LF) (LF) -pin DIP -pin DIP 9 Dimension Min Max Min Max Min Max (0. typ.) (0. typ.) 0. C. ll other package dimensions are the same as for each standard package specification..0. C Note: For more details about package dimensions, refer to. Package Dimensions. Features Surface-mountable: Photocoupler leads with (LF), (LF) or (LF) part number suffixes are available for all DIP packages except SDIP packages. These devices are suitable for hybrid circuits. pplications: H modules, telephone exchanges, solid state relays, switching power supplies, inverter base amplifiers This lead form option is available for all -, -, -, - and -pin DIP packages. Ordering information To order any standard photocoupler with a surface-mount lead form, add (LF), (LF) or (LF) to the standard part number, depending on the lead form desired. When tape and reel packaging is desired, add (TP), (TP) or (TP) instead of (LF), (LF) or (LF). Refer to. Tape and Reel Specifications for more details. Example Standard part number TLP (GR) Surface-mount type part numbers TLP (GR-LF) TLP (GR-LF) TLP (GR-LF) Part number when tape and reel packaging is desired TLP (GR-TP) TLP (GR-TP) TLP (GR-TP) Safety Standards pproval Use Toshiba standard part numbers for safety standards approved applications. Example Part number TLP (GR-LF) pproved part number TLP

41 . Wide-Spaced Lead Form Option (LF) LF Package Dimensions -pin DIP -pin DIP Unit: mm -pin DIP -pin DIP to ll other package dimensions are the same as for each standard package specification. Note: For more details about package dimensions, refer to. Package Dimensions. Features Wide-spaced surface-mountable: Leads of the DIP packaged photocouplers with (LF) part number suffixes are bend to satisfy -mm PC board spacing requirements. pplications: Office equipment, home appliances, solid state relays, switching power supplies The lead form option is available for all -, -, -, - and -pin DIP packages with electrical characteristics unchanged. Ordering information To order any standard photocoupler with a wide-spaced lead form, add (LF) to the standard part number. Example: Standard part number: TLP (GR) Wide-spaced part number: TLP (GR-LF) Safety Standards pproval Use Toshiba standard part numbers for safety standards approved applications. Example Part number TLP (GR-LF) pproved part number TLP

42 Package Information Photocoupler Magazine Packing Specifications Standard DIP DIP LF, LF, LF and LF Lead Forming Unit: mm.. Unit: mm Dimensions of Magazine Length = Thickness = 0. Length = Thickness = 0. Quantities of Devices per Magazine Number of Pins Quantity (pcs) Unit: mm Unit: mm Y Y X X Packing Dimensions C C Quantity of Magazines Dimensions ( x x C) Label Position Quantity of Magazines Dimensions ( x x C) Label Position 0 x x Y 0 x x Y 0 x x 9 Y 0 x x X 0 x x X

43 Mini-Flat Coupler (MFP) SOP Photocoupler Unit: mm Unit: mm 0..9 (0.). Dimensions of Magazine Length = Thickness = 0. Length = Thickness = 0. Quantities of Devices per Magazine Number of Pins Quantity (pcs) (MFSOP) 0 Number of Pins Quantity (pcs) Number of Pins Quantity (pcs) (SOP) (SOP) 0 0 (.SOP) (.SOP) (.SOP) 00 0 Unit: mm Y Quantity of Magazines Dimensions ( x x C) Label Position Packing Dimensions X C 9 x x Y x x Y 0 x x X Photocoupler Package Type Typical Devices MFC TLP, TLP0J, TLP0, TLP90 : MFSOP TLP0, TLP : SOP C TLP0-, TLP-, TLP0D, TLP0G C: SOP SOP D E TLPG, TLP TLP9G D:.SOP E:.SOP F TLP0G, TLP0 F:.SOP

44 Package Information Tape and Reel Specifications * The tape specifications differ for photocouplers manufactured in Thailand. ** For TLP and TLPF, please refer individual data sheet.. Embossed Tape Packaging Specifications for Surface-Mount Lead Form Options Photocoupler Package Types MFSOP SOP SOP.SOP.SOP.SOP DIP (LF, LF) DIP (LF) Tape Option Symbol (TPL) or (TPR) (TP) (TP) (TP) (TP) (TP) (TP) or (TP) (TP) Typical Devices TLP, TLPJ, TLP, TLP90 TLP0, TLP TLP0-, TLP- TLPG, TLP, TLPD TLP9G TLP00D,TLP0,TLP0G SSOP (TP) TLP to, TLP0 to TLP0 SDIP (TP) TLP0, TLP0, TLP9 TLP0, TLP0G, TLP TLP, TLP0G, TLP. Tape Dimensions t J F.0 ± 0. G D E Unit: mm C KO K Photocoupler Package Type MFSOP Tape Option (TPL), (TPR) SOP (TP) SOP (TP).SOP (TP).SOP (TP).SOP (TP) SSOP (TP) SDIP (TP) SDIP F type (TP) DIP (LF, LF) (TP), (TP) Unit: mm DIP (LF) (TP). ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± ± 0.. ± ± 0.. ± 0.. ± 0.. ± ± 0.. ± 0.. ± ± 0.. ± 0.. ± 0. Symbol (See Figure above) C D E F G J K Dimensions.0 ± 0.. ± 0..0 ± 0.. ± 0.. ± 0..0 ± 0..0 ± 0.. ± 0.. ± 0..0 ± 0..0 ± 0.. ± 0.. ± 0.. ± 0..0 ± 0.. ± 0.. ± 0..0 ± ± 0.. ± 0.. ± 0.. ± 0..0 ± 0.. ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± 0..0 ± 0.. ± 0..0 ± 0. K0. ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± 0.. ± 0. t 0. ± ± 0.0 : Typical devices DIP DIP (short package) TLP0, TLP, TLP TLP, TLP, TLPG TLP0, TLP, TLP0. ± 0.. ± ± 0. (TP) is not available.

45 E. Reel Dimensions W W C U C E W W ø0 mm ø0 mm ø0 mm Unit: mm Photocoupler Package Type MFSOP SOP SOP.SOP.SOP.SOP SSOP SDIP SDIP F type DIP (LF, LF) DIP (LF) Tape Option (TPL), (TPR) (TP) (TP) (TP) (TP) (TP) (TP) (TP), (TP) (TP) Symbol (See Figure above) C E U W W Dimensions ø0 ±. ± 0.. ±.0 ø0 ± ø0 ± ø ± 0..0 ± 0..0 ± 0.. ± 0.. ± 0.. ±.0. ±.0. ± 0.. ± ø0 ø ± 0..0 ± 0. ± 0.. ±.0 ø0 ± ø0 ± ø ± 0..0 ± 0..0 ± 0.. ± 0.. ±.0 Photocouplers Manufactured in Thailand Photocoupler Package Type MFSOP DIP (LF,LF,LF) DIP (LF,LF,LF) (LF,LF) Tape Option (TPL), (TPR) (TP), (TP), (TP) (TP), (TP), (TP) (TP), (TP) Symbol (See Figure above) C E U W W Dimensions. ± 0.. ±.0 ø0 ± ø0 ± ø ± 0..0 ± 0..0 ± 0.. ± 0.. ±.0 ø0 ±

46 Package Information. Other Packing Information (a) Device orientation on tape The orientations of photocouplers in cavity are shown below. ) Photocoupler Package Type MFSOP Tape Option TPR User direction of feed ) Photocoupler Package Type Tape Option ) MFSOP SOP,.SOP SSOP TPL TP TP ) Photocoupler Package Type Tape Option SOP TP C ).SOP/ SDIP TP TP C) DIP(LF, LF) TP, TP DIP(LF) TP (b) Tape Specifications Quantities per Reel Photocoupler Package Type MFSOP SOP SOP.SOP// SSOP SDIP DIP(LF, LF) DIP(LF) Quantities (pcs) Photocouplers Manufactured in Thailand Photocoupler Package Type MFSOP DIP(LF,LF,LF) DIP(LF,LF,LF) (LF,LF) Quantities (pcs) Empty Cavities Item Specification Note Consecutive empty cavities Zero ny 0 mm portion of tape except leader and trailer. Nonconsecutive empty cavities 0.% max/reel Except leader and trailer. : pcs max/reel for DIP and SDIP types (c) Packing boxes One or five reels per box or reels per box for photocouplers manufactured in Thailand (d) Label The reel label includes the following information.. Part number. Tape type. Quantity. Lot number (e) Purchase order Specify the part number, tape and quantity as follows. Example TLP (G TPR) 000 pcs Quantity ( ) Symbol of tape option CTR rank Photocoupler part number ( ) Per reel must be a multiple of quantity

47 PC oard Mounting for Mini-Flat Coupler, SOP Coupler and Lead Formed Coupler. Recommended Footprint Dimensions elow are the recommended footprint (mount pad) dimensions for surface-mount packages. Mini-flat coupler and SOP couplers Unit: mm. Example: -pin DIP package. Example: -pin SDIP package 0... (LF)&(LF) [ TLP(LF)etc.] SDIP [ TLP9 etc.] SSOP [ TLP etc.] MFSOP ( Pin) [TLP etc.].sop [ TLP9G etc.]. MFSOP ( Pin) [ TLP etc.]. SOP [ TLP0 etc.] Surface-Mount Lead-Formed Photocouplers Unit: mm Unit: mm.. (LF) [ TLP (LF)etc.].. SDIP (F type) [ TLP9F etc.] 9

48 Package Information. Soldering. Flux Cleaning When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions..) Using a soldering iron Complete soldering within ten seconds for a lead temperature of up to 0 C..) Using medium infrared ray/hot air reflow a.complete the infrared ray/hot air reflow process within 0 seconds at a package surface temperature of between 0 C and 0 C. b. Example of temperature profile of lead (Pb) solder Package surface temperature ( C) Example of temperature profile of lead (Pb) solder The profile below shows only the typical temperature profile and conditions, which might not apply to all Toshiba photocouplers. Temperature profiles and conditions may differ from product to product. Refer to the relevant technical datasheets and databooks when mounting a device. ( C) Example of temperature profile of lead (Pb)-free solder d. Precautions for heating 0 90 seconds 0 seconds or less Time (s) c. Example of temperature profile of lead (Pb)-free solder Package surface temperature 0 90 seconds 0 seconds or less Time (s) Keeping packages at high temperature for a long period of time can degrade the quality and reliability of devices. Soldering time has to be kept as short as possible to avoid rise in package temperature. When using a halogen lamp or infrared heater, avoid direct irradiation of packages, as this may cause a rise in package temperature. When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases, which can degrade device performance. Washing devices with water will not cause any problems. However, make sure that no reactive ions such as sodium and chlorine are left as residue. lso, be sure to dry devices sufficiently after washing. Do not rub device markings with a brush or with your hand during cleaning or while the devices are still wet from the cleaning agent. Doing so can rub off the markings. Dip cleaning, shower cleaning and steam cleaning processes all involve the chemical action of a solvent. Use only recommended solvents for these cleaning methods. When immersing devices in a solvent or steam bath, make sure that the temperature of the liquid is 0 C or below, and that the circuit board is removed from the bath within one minute. If a device package allows ultrasonic cleaning, keep the duration of ultrasonic cleaning as short as possible, since long hours of ultrasonic cleaning degrade the adhesion between the mold resin and the frame material. The following ultrasonic cleaning conditions are recommended. Frequency : khz to 9 khz Ultrasonic output power : 00 W or less (0. W/cm or less) Cleaning time : 0 seconds or less Suspend the circuit board in the solvent bath during ultrasonic cleaning in such a way that the ultrasonic vibrator does not come into direct contact with the circuit board or the device. Conventional cleaning solvents that contain freon are not recommended due to the danger that they pose to the earth s ozone layer. lternative products not containing freon are available on the market. Some of these alternative cleaning agents are listed in the Table below. Contact Toshiba or a Toshiba distributor regarding cleaning conditions and other relevant information for each product type. Example of lternative Cleaning gents Technocare sahi Clean Clean Through Pine lpha FRW-, FRW-, FRV-00 K-ES 0H ST-00S, ST-00SX GE Toshiba Silicon sahi Glass Co., Ltd Kao Co., Ltd. rakawa Chemical Co., Ltd..) Dip soldering (flow soldering) The thermal shock of dip soldering increases thermal stress on devices. To avoid stress, the use of a soldering iron or medium infrared ray/hot air reflow is recommended. If you intended to use dip soldering, contact your nearest Toshiba sales representative. 0

49 Supplementary Information Current Transfer Ratio (CTR), LED Trigger Current (IFT) Ranking and Marking Standard rank classifications are applied for the CTR of transistor output devices and for the I FT of MOSFET, SCR and triac outputs. Indicative product markings corresponding to rank names are as shown below. Note also that the applied rank classifications depend on product types. For details, refer to relevant technical datasheets.. CTR Rank Name and Rank Marking vailable CTR Rank Selection ( : vailable, : Call Toshiba) Part Number TLP0 TLP TLP0 TLP0- TLP TLP- TLP TLP- TLP- TLP/F TLP- TLP- TLP- TLP/ TLP0 TLP0- TLP0- TLP TLP- TLP- TLP0 TLP/ TLP TLP/ TLPF/F Rank Name None G Y GR L YH GRL GRH LL lank list by part number Rank Marking Group TLP Rank Name None Y GR G L GRL GRH CTR 0 to 00% 0 to 0% 00 to 00% 00 to 00% 00 to 00% 00 to 00% 0 to 00% Other than TLP Refer to lank list by part number. YE GR G L G G CTR Rank TLP lank,y,y+,ye, G,G+,GR,,+, L,G YE GR G L G G+ Part Number TLP0 TLP0 TLP- TLP- TLP/ TLP0 TLP- TLP0 TLP TLP TLP TLP- TLP TLP TLP TLP TLP TLP TLP TLPF TLPF lank lank, YE, GR, L, G lank, Y, Y, YE, G, G, GR,,, L, G Rank Marking Group Part Number TLP0- TLP- TLP- TLP- TLP0- TLP0- TLP- lank lank, G Rank Marking Group

50 Supplementary Information LED Trigger Current (IFT) Ranking and Marking. IFT Rank Name and Rank Marking Rank Name None IFT IFT IFT IFT IFT max m max m max m max IFT Rank Marking lank, T, T T, T T T (only for photorelays). Marking Example (a) -pin mini-flat -channel type or P Lot No. Part number without "TL" CTR or IFT rank marking Pin No. Example: TLP : P TLP- : P TLP : P P TLP- (b) TLP, TLPF Pin No. PF Lot No. Part number (P or PF) Lot No. CTR rank marking (c) TLP0, TLP Pin No. Pin No. Lot No. CTR rank marking P0 CTR rank marking P0 Part number (P0 or P) Part number (P0 or P) Lot No. (d) Others or TLP Lot No. Part number CTR or IFT rank marking Example: TLP- : TLP- TLPGF : TLPGF TLP- TLP- Pin No. Note: To order any standard photocoupler, add rank marking in parenthesis to the standard part number. Example TLP- (GR), TLP (GR) Use Toshiba standard part number for safety standards approved application. Example Part number TLP (GR) pproved part number TLP

51 Projected Operating Life ased on LED Light Output Degradation Toshiba photocouplers use one of three types of LEDs and a projection of the operating life is expected for each LED. The table on page shows types of LED used in photocouplers and the figures on pages to show projections of long-term light output performance and operating life. Note that these operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Projected Operating Life Ta = 0 C, IF = 0 m, failure criteria: degradation rate Δ PO < 0% Photocouplers F0% operating life F0.% operating life Gas LED,00,000 h 0,000 h Mainly for phototransistor output devices and phototriac output devices Ga s(sh) LED 0,000 h 00,000 h Mainly for photo- couplers Ga s(dh) LED,000,000 h 00,000 h Mainly for photorelays (MOSFET output), photovoltaic couplers and photo- couplers F0% (cumulative failure rate 0%) operating life: Time period until the projected long-term light output degradation curve of the average light output change (X) shown on pages to reaches the failure criteria. F0.% (cumulative failure rate 0.%) operating life: Time period until the projected long-term light output degradation curve of X - σ shown on pages to reaches the failure criteria. The relationship between LED light output degradation and optical coupling characteristics is shown below. () The relationship between LED light output degradation and current transfer ratio (CTR)/short circuit current (ISC) is :. CTR (t) = CTR (o) Po(t) Po (o) () The relationship between a reciprocal value of LED light output degradation and IFT/I FLH/I FHL/I FH change is :. I FT (t) Po(t) = ( ) - IFT (o) Po (o) How to estimate an operating life from the graph Example: Estimate an operating life from Gas LED projected operating life data (failure criteria Δ PO < 0%) on page. t ambient temperature of C. Calculate absolute temperature. C + = 9 (K). Calculate the reciprocal value of the calculated value. /9 =. x 0 -. Read data from the graph. Projected operating life at Ta = C, IF = 0 m (failure criteria: light output degradation Δ PO < 0%) F0% (cumulative failure rate 0%) operating life: pproximately 00,000 h (reference value) F0.% (cumulative failure rate 0.%) operating life: pproximately 0,000 h (reference value)

52 Supplementary Information LED used in Photocouplers LED: Gas LED Ga s (SH) LED Ga s (DH) LED Photocouplers LED Photocouplers LED Photocouplers LED Photocouplers LED Photocouplers LED N (SHORT) TLPG TLP0 Series TLP9 Series TLP9G N (SHORT) TLP0 Series TLP Series TLP9 Series TLP0 N (SHORT) TLP Series TLP Series TLP9 Series TLP00 N (SHORT) TLP TLP TLP9 Series TLP0 N (SHORT) TLPJ TLP TLP99 Series TLP N9 (SHORT) TLPJ TLP TLPJ TLP0 N9 (SHORT) TLPJ TLP Series TLP0 Series TLP0J N0 (SHORT) TLP Series TLP0 TLP Series TLP0 N (SHORT) TLPG TLPG TLP Series TLP N (SHORT) TLP Series TLP TLP Series TLP0(S) Series N (SHORT) TLP0 TLP TLP Series TLP0(S) Series N (SHORT) TLP TLP- TLP Series TLP0(S) Series N (SHORT) TLP90 TLP- TLP9 Series TLPxx Series N (SHORT) TLP9 TLP- TLP0 TLPxx Series N (SHORT) TLP9 Series TLP Series TLP TLP0 N (SHORT) TLP9 Series TLPG Series TLP TLP N (SHORT) TLP00D TLP TLP Series TLP0 N TLP0 Series TLP TLP TLP N TLP0 Series TLPG TLP00 TLP0 N TLP Series TLPG TLP0 TLP0 N TLPG Series TLPJ TLP0 TLP(S) Series N9 TLP TLPJ TLP0 TLP90 TLP0 TLP Series TLP0 TLP0 TLP9 TLP0 TLP0 Series TLP TLP TLP9 TLP TLP Series TLP TLP9 TLPxxx Series TLP TLP0J TLP TLP TLP TLP0 Series TLP TLP TLP TLP0 Series TLP TLP TLP TLP Series TLP TLP Series TLP TLP Series TLP TLP Series TLP TLP9G TLP9 TLP Series TLP TLP0 Series TLP0 Series TLP Series TLP TLP0 TLP Series TLP0 Series TLP TLP TLP0 TLP Series TLP TLP TLP TLP9 Series TLP0 TLP0 TLP TLPJ Series TLP TLP TLP90 TLPJ Series TLP TLP TLP9 TLP9 Series

53 Gas LED Projected Light Output Degradation Data Test conditions: IF = 0 m, Ta = 0 C Test conditions: IF = 0 m, Ta = 0 C Light output (PO) relative change (%) X X-σ Light output (PO) relative change (%) X X-σ Test time (h) Test time (h) Test conditions: IF = 0 m, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) Gas LED Projected Operating Life Data Projected operating life (h) Failure criteria light output degradation Δ PO < 0% IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m Projected F0% operating life Projected F0.% operating life / K (x0 - ) mbient Temperature ( C) Projected operating life (h) Failure criteria light output degradation Δ PO < 0% IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m Projected F0% 000 operating life Projected F0.% operating life / K (x0 - ) mbient Temperature ( C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.

54 Supplementary Information Ga s (SH) LED Projected Light Output Degradation Data Test conditions: IF = 0 m, Ta = 0 C Test conditions: IF = 0 m, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) Light output (PO) relative change (%) X X-σ Test time (h) Test conditions: IF = 0 m, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) Ga s (SH) LED Projected Operating Life Data Failure criteria light output degradation Δ PO < 0% Failure criteria light output degradation Δ PO < 0% IF = 0 m Projected operating life (h) IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m Projected F0% operating life Projected F0.% operating life / K (x0 - ) Projected operating life (h) IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m 000 Projected F0% operating life Projected F0.% operating life / K (x0 - ) mbient Temperature ( C) mbient Temperature ( C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.

55 Ga s (DH) LED Projected Light Output Degradation Data Test conditions: IF = 0 m, Ta = 0 C Test conditions: IF = 0 m, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) Light output (PO) relative change (%) X X-σ Test time (h) Test conditions: IF = 0 m, Ta = 0 C Light output (PO) relative change (%) X X-σ Test time (h) Ga s (DH) LED Projected Operating Life Data Projected operating life (h) Failure criteria light output degradation Δ PO < 0% IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m Projected F0% operating life Projected F0.% operating life / K (x0 - ) mbient Temperature ( C) Projected operating life (h) Failure criteria light output degradation Δ PO < 0% IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m IF = 0 m 000 Projected F0% operating life Projected F0.% operating life / K (x0 - ) mbient Temperature ( C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.

56 Safety Standard pproved Photocouplers Toshiba s extensive line of photocouplers is approved under UL (US), VDE (Germany), SI (England), SEMKO (Sweden). These devices offer a wide selection of output (transistor, thyristor and triac) and are suited to a range of applications including switching power supplies and solid state relays. When requiring VDE(0)-approved devices, be sure to specify option D. Example: Standard part number: TLP(GR) Part number when an 0-- approved type is needed : TLP(D-GR) Safety Standards pproval Use Toshiba standard part numbers for safety standards approved applications. Example Part number TLP(D-GR) pproved part number TLP Safety Standard pprovals for Photocouplers Safety Standard DE V TLP TLP- TLP / TLPG / J TLP0 / TLP0G / G TLPG TLPG- TLP0 TLP TLP9G TLPG TLPG- TLP TLP9G TLPG TLPG- TLPG TLPG- TLP TLP9G TLP0 / - / - TLP / - / - TLP0 / TLP / TLPG / J TLP TLP0J TLPJ TLP0 / - / - TLP / - / - TLP / - / - TLP0 TLP0 TLP9 TLP0 / - / - TLP / - / - TLP / - / - TLP / - / - TLP / - / - TLP0 / TLP0 / - TLP / - TLP / - TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP9G TLP9G TLP9G TLP / TLPG TLPJ TLPJ TLPJ TLP / TLPG TLPJ TLPJ TLP / TLPG TLPJ TLPJ TLPJ TLP / TLPG TLPJ TLPJ TLPJ TLP TLP TLP TLP TLP TLP0 TLP TLP0 TLP TLPJ TLPJ TLP TLP0 TLP TLP0 TLP TLP0 TLP TLP0 TLP TLP0 TLP (s of December 00) TLP TLP0G TLPG TLP90 TLP9G TLPG TLP0G TLP TLPG TLP9G TLP0G TLP TLPG TLP9G TLP0G TLPG TLP9G TLP0G ody Internal Construction (Cross-Section) Window Detector LED TLP TLP0//0/ Film..... Package Dimensions (Unit: mm)

57 Device Type, Construction Mechanical Ratings and Safety Standard pprovals -pin multi-channel photocoupler TLP / TLP0 TLP0/TLP Output TLP Device Type Thyristor Output Triac Output TLPJ/ TLPJ TLPG TLP0J/ TLPJ Output TLP Photorelay TLPG TLP0G Package MFSOP SOP MFSOP.SOP Isolation Creepage Path (mm) Isolation Clearance (mm) Construction Mechanical Ratings (min) Isolation Thickness (mm) Internal Creepage Path (mm) Isolation Voltage (k) Internal Construction (Cross Section) ody Window Detector LED Film UL (File No. E9) Parts Specifications Double Protection DIN 0-- (Note ) Parts Specifications Safety Standard pproved DE V DIN IEC/ VDE 00/0. DIN IEC0/ VDE 00/0. Home ppliances Office Equipment Reinforced insulation (SELV) DIN IEC/ VDE 00/0.9 DIN 0 VDE 00/0. Data processing Equipment Data processing Equipment asic insulation (ELV) DIN 00T/ VDE 000T/. DIN IEC0T/ VDE 00T/0. Home ppliances Medical Equipment S 00: 00 Home ppliances S 090-: 00 Office Equipment SEMKO SS-090 Office Equipment Note : 0-- standards for MFSOP and SOP photocouplers are different from those of standard DIP photocouplers because MFSOP and SOP are compact and small packages. When 0-- approved type is needed, please designate option(d) or option(v). : Only applied to the TLP : Only applied to the TLP 9

58 Safety Standard pproved Photocouplers Device Type, Construction Mechanical Ratings and Safety Standard pprovals Device Type -pin multi-channel photocoupler Output Thyristor Output Triac Output Output Photorelay TLP / TLP TLP0 / TLP TLP / TLP0 / TLP TLP0 / TLP9 TLP / TLP TLPG / TLPJ TLPJ / TLPJ TLP0(S) TLP0(S) TLP0(S) TLP0(S) TLP- TLP Package DIP SDIP DIP DIP DIP DIP Isolation Creepage Path (mm) Isolation Clearance (mm)..0 (Note ).0 (Note ).0 (Note ).0 (Note )..0 (Note ) Construction Mechanical Ratings (min) Isolation Thickness (mm) Internal Creepage Path (mm) Isolation Voltage (k) Internal Construction (Cross Section) ody Window Detector LED Film UL (File No. E9) Parts Specifications Double Protection DIN 0-- (Note ) Parts Specifications Safety Standard pproved Reinforced insulation (SELV) asic insulation (ELV) DE V DIN IEC/ VDE 00/0. DIN IEC0/ VDE 00/0. DIN IEC/ VDE 00/0.9 DIN 0 VDE 00/0. DIN 00T/ VDE 000T/. DIN IEC0T/ VDE 00T/0. S 00: 00 Home ppliances Office Equipment Data processing Equipment Data processing Equipment Home ppliances Medical Equipment Home ppliances (Note ) (Note ) (Note ) S 090-: 00 Office Equipment SEMKO SS-090 Office Equipment (Note ) Note : 0-- standards for MFSOP and SOP photocouplers are different from those of standard DIP photocouplers because MFSOP and SOP are compact and small packages. When 0-- approved type is needed, please designate option(d) or option(v). Note : pplied to (LF) or F type. Note : The TLP, TLP0 and TLP are approved. : Only applied to the TLP 0

59 9 Photocoupler pplication Circuit Example Digital Interface pplications High Speed. m 90 Ω LSTTL TLP, TLP0 0. μf kω LSTTL y using the high-speed TLP0 (the equivalent MFC () version is the TLP), high-speed data transmission is possible up to approximately MHz. f (typ.): Mbit/s (duty cycle /) Low Input Current Drive Use of the high-ctr (current transfer ratio) 0. m. kω kω N9 0 kω. kω 0. μf LSTTL N9 enables operation by low input current (0. m), and direct driving with a CMOS. f (typ.): 0 kbit/s (duty cycle /) CMOS No Pull-up Resistor Required kω. m 0 pf TLP00 LSTTL When the -state-output TLP00 is used, the next-step logic gate can be actuated without using a pull-up resistor. f (typ.): Mbit/s (duty cycle /) LSTTL High Tolerance m. kω TLP RL y using the TLP which accepts a wide range of (up to 0 V), the CMOS logic gates and other components can be operated with high. 0. μf CMOS f (typ.): Mbit/s (duty cycle /) LSTTL = RL = kω = 0 V RL = kω

60 9 Photocoupler pplication Circuit Example Inverter and C-DC Servo pplications [Photo- coupler, high-speed base/gate drive circuit application] TLP / TLP0 TLP / TLP9 TLP9 GTR Direct Drive IGT / Power MOS Direct Drive High-Speed TLP (for medium-power IGTs): TLP0 / TLP0/ TLP00 (for small-power IGTs): TLP/ TLP/ TLP0/ TLP0 TLP / TLP DC Servo (NC, Robot) C Servo Inverter (PWM) M M ase/gate Drive Circuit ase/gate Drive Circuit - Class GTR (Giant ) Module ase Drive m 90 Ω TLP Rex. Ω V The TLP drives a GTR base directly. n external resistor Rex is connected between pins and. This resistor causes the drive base current to become constant and stabilizes the GTR drive. LSTTL μf 00- Class GTR Module ase Drive m 90 Ω TLP Rex. Ω V Ω 0 Ω The TLP photo- coupler and two booster transistors can drive a high-power GTR. LSTTL 00 μf - Class IGT (Insulated Gate ipolar ) Module Gate Drive TLP/ TLP/ TLP0/ TLP0 The TLP/ TLP/ TLP0/ TLP0 m 90 Ω 0. μf high-speed photo- photocoupler can drive a low power IGT directly. VEE LSTTL

61 0- Class IGT Module Gate Drive The TLP0 / TLP0 / TLP00 can drive a TLP0 / TLP0 medium power IGT directly. m 90 Ω 0. μf VEE LSTTL 00- Class IGT Module Gate Drive The TLP/ TLP/ TLP0/ TLP0 m 90 Ω TLP / TLP 0. μf high-speed photo- photocoupler and two booster transistors can drive a high power IGT. VEE LSTTL IGT Module Gate Drive Using IGM Selection TLP (IGM) TLP9 (IGM) TLP9 (IGM) IGM selection is suitable for driving an intelligent power module (IPM). The device has a guaranteed propagation delay difference 0 m 0 kω + l tplh - tphll and provides a high common transient immunity. 0.μF 0 V IGM Selection Part Number Package Vs VO/ CTR tplh tphl CMH CML TLP (IGM) TLP9 (IGM) TLP9 (IGM) MFSOP V / 0 V max % min % = 0 m =. VO = 0. V 0. μs = 0 m RL = 0 kω 0000 V / μs = 0 m RL = 0 kω VCM = 00 Vp-p 0000 V / μs = 0 m RL = 0 kω VCM = 00 Vp-p

62 9 Photocoupler pplication Circuit Example TV and udio pplications "MIDI" Interfaces for Electronic Musical Instruments TLP / TLP MIDI IN. m 0. μf kω URT MIDI THRU Compact Disc Players Compact Disc Pick-up Detector TLP / TLP x Number of Signal Lines Motor Laser Digital Signal Circuit System Control Signal Data Signal it Clock Word Clock L/R Clock Emphasis Muting. m 0. μf 90 Ω D/ Filter Converter Filter L R nalog Signal nalog Signal TV/V Terminal Isolations Video Chroma Processor Video-IF Tuner Video Signal Terminal For VTR, VDP Stabilized Switch-Mode Power Supply External Video Signal Ω 0 μf kω V 9. kω 00 Ω TLP (VIDEO) TLP (VIDEO) kω kω.9 kω V 0 μf 00 Ω TV Set Video Signal TLP TLPF TLPF 0 μf V TLP (UDIO) TLP (UDIO) kω. kω V 0 μf TV Set udio Signal External udio Signal kω 9. kω 00 Ω.9 kω 00 Ω x : circuit for stereo source Part Number Isolation Voltage and Width Voltage Gain TLP (VIDEO) TLP (VIDEO) TLP (UDIO) >. MHz 0. to 0. to. TLP (UDIO) 000 > 00 khz 0. to

63 Home ppliance pplications Oven/Grill Sets Magnetron Thermo-Switch Door-Open Monitor Switch C0 V 0/0 Hz Oven- Cavity Lamp TLP0G Grill Heater H TLP0J M lower Motor Turntable Motor H.V. Transformer Magnetron Tube Door-Detector Circuit TLP0G Weight Sensor Microcontroller Gas Sensor Control Panel lock Diagram for Refrigerators Photocouplers used for control applications Interior Fan TLP0G + main triac Panel Input Interior Lamp TLP0G + main triac Defroster Heater (for Freezer Compartment) TLP0G + main triac Door Switch Microcontroller Damper Motor (Switches between refrigerator and freezer compartment) TLP0G + main triac Defroster Heater (for etween-compartment switching) TLP0G + main triac Temperature Sensor Compressor (TLP0G)

64 9 Photocoupler pplication Circuit Example Home ppliance pplications (continued) utomatic Washing Machines RT PC Th Operating Panel (Key input) TLP0G IF Operation Modes (Manual/automatic) M RT PC Water Flow Speed Spinning Period Th Number of Rinsing Drain Valve RT Th TLP0G PC IF Microcontroller Washing Period Operation Detection TLP0G IF Water Supply Valve TLP0J IF C Input Photocoupler TLP0 (G) Microcontroller Power Supply C 00 V Circuit Configuration Fan Heaters (a) lock Diagram Temperature Limit Switch urner Overheat Prevention Switch TLPG Panel Electric Heater ( kw) C 00 V ZC Main Switch IF TLPJ djustment Switches VT urner Motor (0 W) Display Speaker Room Temperature Sensor Preheat Sensor Microcontroller IF ZC TLPJ ZC TLP VT Drive Circuit IM IM M Fan Motor (0 W) M Electromagnetic Fuel Pump P Earthquake Sensor TLP Ignition IG

65 (b) Waveform Examples. Example of Operating Waveform for urner Motor. Example of Operating Waveform for Fan Motor Trigger Point Top: IF 0 m/div Medium: VT 00 V/div ottom: IM /div Horizontal: time 0 ms/div Trigger Point Top: IF 0 m/div Medium: VT 00 V/div ottom: I M 0. /div Horizontal: time 0 ms/div Inverter ir Conditioners Temperature Fuse C00 V Remote Control Panel Control Panel Microcontroller for Indoor Unit Fan Motor for Room Unit M Room Temperature Sensor Temperature Sensor Indoor Unit TLP TLPG TLP0G Motor for ir-flow Direction Control M Outdoor Unit TLP TLPG Filter Microcontroller for Outdoor Unit ZC TLP0G Fan Motor for Outdoor Unit M Two-way Valve / Four-way Valve IGT Gate Drive Circuit IGT Module Rectifier VO TLP x Compressor Motor