Reverse Blocking Thyristors

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1 Preferred Device Reverse Blocking Thyristors Glassivated PNPN devices designed for high volume consumer applications such as temperature, light, and speed control; process and remote control, and warning systems where reliability of operation is important. Glassivated Surface for Reliability and Uniformity Power Rated at Economical Prices Practical Level Triggering and Holding Characteristics Flat, Rugged, Thermopad Construction for Low Thermal Resistance, High Heat Dissipation and Durability Sensitive Gate Triggering Device Marking: Device Type, e.g., C6B, Date Code MAXIMUM RATINGS (TJ = 25 C unless otherwise noted) Rating Symbol Value Unit Peak Repetitive Off State Voltage(1) (Sine Wave, Hz, RGK = 1 kω, TC = 40 to 1 C) C6B C6D, C6D1 C6M, C6M1 On-State RMS Current (180 Conduction Angles, TC = 80 C) Average On State Current (180 Conduction Angles, TC = 80 C) Peak Non-Repetitive Surge Current (1/2 Cycle, Sine Wave, 60 Hz, TJ = +1 C) VDRM, VRRM Volts IT(RMS) 4.0 Amps IT(AV) 2.55 Amps ITSM 20 Amps Circuit Fusing Considerations (t = 8.3 ms) I2t 1.65 A2s Forward Peak Gate Power (Pulse Width 1.0 µsec, TC = 80 C) Forward Average Gate Power (Pulse Width 1.0 µsec, TC = 80 C) Forward Peak Gate Current (Pulse Width 1.0 µsec, TC = 80 C) PGM 0.5 Watt PG(AV) 0.1 Watt IGM 0.2 Amp Operating Junction Temperature Range TJ 40 to +1 Storage Temperature Range Tstg 40 to +150 Mounting Torque(2) 6.0 in. lb. (1) VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. (2) Torque rating applies with use of compression washer (B52200F006). Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink thermal resistance. Anode lead and heatsink contact pad are common. C C SCRs 4 AMPERES RMS 200 thru 600 VOLTS ORDERING INFORMATION Device Package Shipping C6B TO225AA 500/Box C6D A TO225AA G TO 225AA (formerly TO 126) CASE 077 STYLE 2 PIN ASSIGNMENT Cathode Anode Gate K 500/Box C6D1 TO225AA 500/Box C6M TO225AA 500/Box C6M1 TO225AA 500/Box Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 2000 May, 2000 Rev. 3 1 Publication Order Number: C6/D

2 THERMAL CHARACTERISTICS (TC = 25 C unless otherwise noted.) Characteristic Symbol Max Unit Thermal Resistance, Junction to Case RθJC 3.0 C/W Thermal Resistance, Junction to Ambient RθJA 75 C/W Maximum Lead Temperature for Soldering Purposes 1/8 from Case for Seconds TL 260 C ELECTRICAL CHARACTERISTICS (TC = 25 C unless otherwise noted.) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current (VAK = Rated VDRM or VRRM, RGK = 00 Ohms) TJ = 25 C TJ = 1 C ON CHARACTERISTICS Peak Forward On State Voltage(1) (IFM = 1 A Peak for C6B, D, & M) (IFM = 4 A Peak for C6D1, & M1) Gate Trigger Current (Continuous dc)(2) (VAK = 6 Vdc, RL = 0 Ohms) TJ = 25 C TJ = 40 C IDRM, IRRM 0 µa µa VTM 2.2 Volts Peak Reverse Gate Voltage (IGR = µa) VGRM 6.0 Volts Gate Trigger Voltage (Continuous dc)(2) (VAK = 6 Vdc, RL = 0 Ohms) TJ = 25 C TJ = 40 C Gate Non Trigger Voltage (Continuous dc)(2) (VAK = 12 V, RL = 0 Ohms, TJ = 1 C) Latching Current (VAK = 12 V, IG = 20 ma) TJ = 25 C TJ = 40 C Holding Current (VD = 12 Vdc) (Initiating Current = 20 ma, Gate Open) TJ = 25 C TJ = 40 C TJ = +1 C DYNAMIC CHARACTERISTICS Critical Rate of Rise of Off State Voltage (VAK = Rated VDRM, Exponential Waveform, RGK = 00 Ohms, TJ = 1 C) (1) Pulse Test: Pulse Width 2.0 ms, Duty Cycle 2%. (2) RGK is not included in measurement. IGT VGT µa Volts VGD 0.2 Volts IL IH ma ma dv/dt 8.0 V/µs 2

3 Voltage Current Characteristic of SCR + Current Anode + Symbol VDRM IDRM VRRM IRRM VTM IH Parameter Peak Repetitive Off State Forward Voltage Peak Forward Blocking Current Peak Repetitive Off State Reverse Voltage Peak Reverse Blocking Current Peak On State Voltage Holding Current IRRM at VRRM on state Reverse Blocking Region (off state) Reverse Avalanche Region VTM IH + Voltage IDRM at VDRM Forward Blocking Region (off state) Anode T C, CASE TEMPERATURE ( C) HALF SINE WAVE RESISTIVE OR INDUCTIVE LOAD. 50 to 400 Hz IT(AV) AVERAGE ON-STATE CURRENT (AMPERES) DC Figure 1. Average Current Derating P (AV), AVERAGE ON-STATE POWER DISSIPATION (WATTS) HALF SINE WAVE RESISTIVE OR INDUCTIVE LOAD 50 TO 400Hz. JUNCTION TEMPERATURE 1 C IT(AV) AVERAGE ON-STATE CURRENT (AMPERES) Figure 2. Maximum On State Power Dissipation DC 3

4 0 00 I GT, GATE TRIGGER CURRENT ( A) I H, HOLDING CURRENT ( A) TJ, JUNCTION TEMPERATURE ( C) TJ, JUNCTION TEMPERATURE ( C) Figure 3. Typical Gate Trigger Current versus Junction Temperature Figure 4. Typical Holding Current versus Junction Temperature , GATE TRIGGER VOLTAGE (V) I L, LATCHING CURRENT ( A) 0 VGT TJ, JUNCTION TEMPERATURE ( C) TJ, JUNCTION TEMPERATURE ( C) 95 1 Figure 5. Typical Gate Trigger Voltage versus Junction Temperature Figure 6. Typical Latching Current versus Junction Temperature 4

5 Package Interchangeability The dimensional diagrams below compare the critical dimensions of the ON Semiconductor C-6 package with competitive devices. It has been demonstrated that the smaller dimensions of the ON Semiconductor package make it compatible in most lead-mount and chassis-mount applications. The user is advised to compare all critical dimensions for mounting compatibility DIA TYP BSC ON Semiconductor C-6 Package Competitive C-6 Package 5

6 PACKAGE DIMENSIONS TO 225AA (formerly TO 126) CASE ISSUE W H Q B U F A K V G S D 2 PL M C J R 0.25 (0.0) M A M B M 0.25 (0.0) M A M B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D F G BSC 2.39 BSC H J K M 5 TYP 5 TYP Q R S U V STYLE 2: PIN 1. CATHODE 2. ANODE 3. GATE 6

7 Notes 7

8 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION NORTH AMERICA Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada ONlit@hibbertco.com Fax Response Line: or Toll Free USA/Canada N. American Technical Support: Toll Free USA/Canada EUROPE: LDC for ON Semiconductor European Support German Phone: (+1) (M F 1:00pm to 5:00pm Munich Time) ONlit german@hibbertco.com French Phone: (+1) (M F 1:00pm to 5:00pm Toulouse Time) ONlit french@hibbertco.com English Phone: (+1) (M F 12:00pm to 5:00pm UK Time) ONlit@hibbertco.com EUROPEAN TOLL FREE ACCESS*: *Available from Germany, France, Italy, England, Ireland CENTRAL/SOUTH AMERICA: Spanish Phone: (Mon Fri 8:00am to 5:00pm MST) ONlit spanish@hibbertco.com ASIA/PACIFIC: LDC for ON Semiconductor Asia Support Phone: (Tue Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong & Singapore: ONlit asia@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center Nishi Gotanda, Shinagawa ku, Tokyo, Japan Phone: r14525@onsemi.com ON Semiconductor Website: For additional information, please contact your local Sales Representative. 8 C6/D

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