Developments, Applications and Challenges for the Industrial Implementation of Nanoimprint Lithography

Transcription

1 Developments, Applications and Challenges for the Industrial Implementation of Nanoimprint Lithography Martin Eibelhuber, Business Development Manager

2 Outline Introduction Imprint Lithography Wafer Level Optics Applications SmartNIL Technology EVG Hercules NIL Summary

3 Introduction Nanoimprint Lithography

4 General Explanation UV-Nano Imprint Lithography Why? Novel device concepts need alternative lithography solutions Complexity of pattern design should not add to manufacturing costs How? Nanoimprint lithography enables simple replication of various kind of structures, shapes and sizes Nanoscale structures can be achieved without sophisticated and expensive optics What? EVG equipment portfolio covers all common imprinting techniques on volume proven systems NILPhotonics TM Compentence Center to link equipment and process know-how for innovative products Biotechnology Nanostructures EVG 620 Photonics Microlenses EVG Hercules NIL

5 Nanoimprint Lithography at a Glance Hot Embossing UV-Nanoimprint Lithography (UV-NIL) Micro Contact Printing (µcp) Soft Lithography Hard Stamp Polymer Soft Stamp Transparent Hard Stamp Polymer Soft Stamp Polymer Soft Stamp UV-NIL Hot Embossing 1) Dispense liquid resin on 1) Spin coat thermoplastic film substrate 2) Parallel alignment 2) Parallel alignment 3) Heat until viscous 3) Imprint at low pressure 4) Emboss at high temperature 4) Expose with UV light through 5) Cool until solid stamp and crosslink 5) Demold stamp 5) Demold stamp 5

6 Nanoimprint Lithography at a Glance Hot Embossing UV-Nanoimprint Lithography (UV-NIL) Micro Contact Printing (µcp)soft Lithography Resolution capabilities from micro- to nanometer. Microfluidic structures (x 100 µm) 12.5 nm dots

7 Nanoimprint Lithography Results Micro- & Nano structuring by NIL is applicable in any field of photonics. 15 µm Honeycomb Texturing for Photovoltaics Gratings for distributed feedback lasers 2.5 µm Nano-patterend Sapphire Substrates for LED growth 5 µm Photonic Crystals for light extraction of LEDs Gratings on topography 250 µm 3D shaped optical elements

8 Wafer Level Optics Micron and Submicron Imprinting

9 Wafer Level Optics High volume manufacturing of precise optical elements Parallel processing of hundreds or thousands lenses High clarity due to turbulence free and precise processing Complete mold fill even for complex structures Enables wafer level packaging of optical modules Smallest form factors 9

10 Wafer-scale miniaturized optical systems Refractive Optics Diffractive Optics Collimators for laser, fibers, sensors Multi aperture Imaging Microlens arrays Customized Microoptics Pattern Projection Holography Fresnel Lenses Diffractive Filters or Polarizers Optics with complex functionality Alternative Microoptics Source: Fraunhofer IOF Optics on CMOS Hybrid refractive/diffractive 10

11 Process Examples for Wafer Level Optics Single lens pin Microlens arrays S&R master stamp Working stamp Diffractive optical elements Lens wafers Wafer-level camera module Functional optical films. Source: Anteryon

12 WLO in (Volume) Manufacturing EVG 770 NIL Stepper Step & Repeat Master Stamp Fabrication EVG IQ Aligner Working stamp fabrication Lens molding & stacking Smart lens fabrication

13 Nanoimprint Lithography Applications

14 NIL Unique Benefits Large Area Nanopatterning Wafer level processing of nanostructures without stitching Scalable technology which not limited by an optical system Resolution << Alignment 3D Pattering Direct Patterning Replication process is insensitive to shape, size & structure Complexity does not add manufacturing costs Enables highest resolution down to 20nm and less No expensive precision alignment optics Imprint materials can be functionalized to needed properties Reduces process steps significantly

15 From Imprinting to Devices

16 Honeycomb Texturing of Multicrystalline Silicon (mc-si) Mastering using three-beam IL (hexagonal pattern, 8 µm period) NIL using PDMS stamps on Rough, brittle and thin (~180 µm) Large area (156 x 156 mm²) mc-si substrates Plasma etching and subsequent wet chemical post-treatment Excellent optical performance even outperforming pyramidal shapes 30 µm x x x x µm 18 5x Reflectance [%] x10 Photon Flux [s m m ] Plane reference (mc-si) Isotropic texture (mc-si) Pyramidal texture (c-si) Honeycomb texture (mc-si) 0 0,3 18 0,4 0,5 0,6 0,7 0,8 0,9 1,0 1,1 0 1,2 Wavelength [µm] H. Hauser, et.al., Development of NIL processes for PV applications; Proceedings of SPIE; 2015; in press. Optical efficiency opt of 87.5 % (electrons out / photons in)

17 npss Fabricated by SmartNIL TM 6 imprint SEM images of 400nm pillars for npss Structures 395 nm 35 nm 360 nm 200 nm 17

18 Solutions for Microfluidics R&D Pilot Line HVM Process Services EVG s Core Competences Bonding Lithography sealing/ packaging microchannel fabricaiton (UV-) Nanoimprinting nanopatterns in the channels Hot Embossing

19 intensity Saphely Project Self amplfied photonic biosensing platform for micro RNAbased early diagnosis of deseases Photonic Bandgap Sensor analytes microrna Gratings manufactured with SmartNIL! wafelength

20 SmartNIL TM for Bio-functionalization BSA-Cy5-Biotin solution Stamp Dry out BSA-Cy5 grid FITC-antibody Coated glass slide Incubation with antibodies Bio-functionalization of µ-arrays AFM measurement of antibodies Schwarzenbacher et al., Nature Methods. Weghuber et al., Methods in Enzymology. Lanzerstorfer et al., Basic Methods in Protein Purification and Analysis.

21 SmartNIL TM Technology

22 SmartNIL TM Large Area Imprint Basic elements of the technique: Flexible UV-transparent molds Proprietary imprint tooling SmartNIL TM Allows large area conformal imprints

23 Soft UV-NIL Improves Cost of Ownership (CoO) Master stamp Multi replicated working stamps Spin coat imprint resist Multi imprints per working stamp Master Spin coat working stamp material on master Bring working stamp in contact with substrate Made by e-beamlithography, curing UV exposure Release working stamp from master Seperation of working stamp and wafer 23

24 SmartNIL TM Pattern Fidelity Mean Critical Dimension Superior mean critical dimension variation of < 10 3δ over all 50 imprinted substrates using the same polymer stamp. Height Height variation of only < 20 3δ over all 50 imprinted substrates using the same polymer stamp Side Wall Angle Side wall angle variation of only < 3δ over all 50 imprinted substrates using the same polymer stamp. 24

25 EVG Hercules NIL Fully-integrated UV-Nanoimprint Lithography System

26 HERCULES NIL UV Clean Module Coat Module Bake Module Imprint Module Preprocessing modules The SmartNIL TM module is the heart of the HERCULES NIL

27 Nanoimprint Module SmartNIL tooling Volume-proven imprinting technology with superior replication fidelity Uniform large area imprint with high process flexibility UV Fully-automated imprinting and controlled low-force detachment for maximum working stamp reusability Cleaning Module Excellent cleaning results for critical particle sizes Coating Module High uniformity spin coat module with precise thickness control for minimum residual layer thickness Optimized bowl design and flow dynamics for low resist consumption

28 Additional Features Advanced bake / chill modules with topside heating and high solvent exhaust Internal chemical cabinet & external chemical cabinet for high coating uniformity due to equal temperature of resist and wafer Optional mini-environment and climate control for minimum particle contamination as well as best process stability and yield for sensitive processes or chemicals

29 Summary

30 NILPhotonics TM Competence Center Metrology Infrastructure SEM, AFM, Interferometry Wide network of metrology providers Materials Know-How Based on its extensive process related know-how, EVG offers optimization of soft-stamp and imprint resin interaction to meet: Applications requirements Layout requirements Productivity and low Cost of Ownership (CoO) Master Templates SU-8 Mastering Wide Network of stamp suppliers S&R Mastering Competence NILPhotonics TM Center Pilot Line Production For seamless transition from R&D to production, EVG offers pilot line production services as well as process transfer to customer designated volume manufacturing sites Process Development Definition and development of customized processes UV-NIL Hot Embossing Micro-contact Printing Sample Processing EVG offers: Manufacturability Demonstrations Small production run imprint services Scale-up to pilot line production

31 Thank You! Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond, CoverSpin TM, EZB, EZ Bond, EZD, EZ Debond, EZR, EZ Release, GEMINI, HERCULES, HyperIntegration, IQ Aligner, LowTemp TM, NanoAlign, NanoFill TM, NanoSpray TM, NIL-COM, NILPhotonics TM, OmniSpray, SmartEdge, SmartView, The Triple "i" Company Invent- Innovate-Implement, Triple i. Other product and company names may be registered trademarks of their respective owners.