EV Group Solutions for MEMS

Transcription

1 EV Group Solutions for MEMS

2 EV Group Solutions for MEMS Introduction Micro electro mechanical systems (MEMS), sometimes also referred to as micromachines or as micro systems technology (MST), micro optical electro mechanical systems (MOEMS) and microfluidics (MF) function as an interface between electronics and mechanics, optics, and fluidics. This interface can be used to convert pressure to an electrical signal as in the case of a pressure sensor or an electrical signal into pressure by opening a valve. MOEMS can be used to convert an electrical signal into an image by controlling the reflections from an array of micro-mirrors or to switch an optical signal path based on an electrical input. These devices are commonly called sensors and actuators or more generally transducers. These MEMS, MOEMS, and MF devices are everywhere. A modern car has many MEMS devices - for example: multi axis MEMS accelerometers for control of airbag deployment, MEMS gyroscopes for stability control, MEMS pressure sensors in the engine management system to ensure the proper air to fuel mixture to minimize air pollution and maximize fuel efficiency and MEMS pressure sensors in each wheel as part of the tire pressure management system (TPMS). MEMS accelerometers are used in many handheld devices to determine the orientation of the device and in games as input devices. All of these MEMS, MOEMS, and MF devices are fabricated in processes that heavily leverage processes that were originally developed for the manufacture of integrated circuits (IC). In addition to leveraging the processes it was necessary to develop several unit processes specifically for MEMS fabrication such as double side lithography, aligned wafer bonding, deep etch processes and resist application systems compatible with significant topography. EV Group offers a broad and unique product and process portfolio with solutions for many of the specialized processes needed to manufacture MEMS, MOEMS, and MFs. These solutions include resist application systems, single and double sided alignment and exposure systems, development systems, bond alignment systems and wafer bonders. This development of specialized equipment for MEMS fabrication extends back to the development of the first double sided alignment system in 1985 by EV Group. EV Group has been supplying process equipment and process know-how to the MEMS market since its inception and is a leading equipment supplier to this market. EV Group's Triple i (Invent, Innovate, and Implement) philosophy has ensured its ability to supply leading edge solutions for its MEMS customers. EVG s Process and Equipment Portfolio...etc. RIE, DRIE Bond Alignment Wafer Dicing Wafer & Template Fabrication Wafer Bonding for SOI Substrate Cleaning Plasma Activation EVG Processes Resist Coating Spin/Spray Alignment Verification Proximity Lithography Nano- Imprint Lithography Resist Developing Metallization Wet Etching Resist Lift-Off CVD, LPCVD, PVD,... Thermal Oxide Growing Wafer Bonding Thinning, CMP Temporary Bonding/ Debonding Stress Relief Etching Electroplating Chip-to- Wafer Bonding Wafer Bumping & Redistribution 2

3 Photo Lithography for MEMS Introduction Over 25 years ago EV Group introduced the first double side alignment system with the innovation of adding backside microscopes. Ever since then EV Group has steadily continued to invent, innovate, and implement solutions to meet the photolithography needs of MEMS development and manufacturing. EV Group offers a complete range of hardware and process solutions for pieces to 300 mm wafers. Mask Alignment and Exposure Systems (Full Field Lithography) EV Group offers a full range of solutions for alignment and exposure for MEMS from R&D to HVM (High Volume Manufacturing) for sizes from pieces to 300 mm. These are based on EV Group's over 30 years of experience, its broad equipment portfolio, its process development experience, and the Triple i (invent, innovate, implement) philosophy. These solutions include the capability to process wafer with high topography; wafers mounted on carriers, wafers that are thin, perforated, or bowed; substrates with non-standard shape; wafers with thick resist; and multiple substrates on one carrier. Additionally, these tools can be configured for NIL (nano imprint lithography), micro contact printing, bond alignment, shadow mask alignment, as well initiating the cure of UV-initiated adhesives. Metrology for Lithography The EVG 40NT provides metrology solutions for lithography by measuring front to back alignment, overlay alignment, critical dimensions as well measuring bond alignment. Backside Microscopes Three Spindle Z-Drive Simplified Z-Motion Design with Cover Compound Semiconductor Process Windows GUI 200 mm Aligner External WEC SmartView Bond Aligner EVG620 IQ Aligner 125 Wafer Autonomy Image based Pre-Aligner EVG6200 NanoAlign Temp. Contolled Wafer Chuck Launch of EVG620/6200 NT Series Launch of EVG610 R&D Mask Aligner Launch of Modular Bond Aligner Launch of Special HBL Configuration Load & Go Philosophy Timeline of EV Group's Advances in Lithography EVG 40NT EVG 610 EVG 620 / EVG 6200 IQ Aligner NT 3

4 EV Group Solutions for MEMS Spin Coating EV Group offers a full range of hardware and process solutions for spin coating for MEMS for volumes from R&D to HVM for all common wafer sizes. These highly configurable systems are available with pre and post coating modules such as vapor prime and bake modules. EV Group's decades of experience, wide portfolio of highly configurable equipment and Triple i philosophy (invent, innovate, implement) make EV Group the best choice for coating equipment for MEMS. EVG 101 EVG 120 EVG 150 EVG HERCULES Lithography Track System R&D Pilot line + manufacturing High volume manufacturing Spray Coating Spray coating enables the uniform application of photo resist or other materials over features with significant topography often encountered in MEMS fabrication and it enables drastic reductions in material consumption which is important when expensive materials are being used. EV Group has the experience, the equipment, and process knowledge to provide spray coating solutions. Cumulative Material Cost Savings from Switching to Spray Coating from Spin Coating Photoresist was spray coated over wet etched trenches in silicon, exposed and developed leaving openings at the bottom of the trench. Courtesy of TU Delft, NL $1,600,000 $1,400,000 $1,200,000 $1,000,000 Cumulative Cost Saving for Midrange Resist and 100 wfrs/wk ($) Cumulative Cost Savings for Midrange Resist 1000 wfrs/wk ($) Cumulative Cost Savings - BCB 100 wfrs/wk ($) Cumalative Cost Savings - BCB 1000 wfrs/wk ($) Dollars $800,000 $600,000 $400,000 $200,000 An example of square substrate which was coated using spray coating $ Weeks Chart showing the cumulative cost savings due to the reduction in material consumption for spray coating as compared to spin coating. 4

5 NanoSpray Nanospray is an EV Group proprietary process for coating high aspect vias with photoresist or other polymers. Through-silicon-via (TSV) structure conformally coated utilizing NanoSpray Technology Schematic of Nanospray capability Thick Resists EV Group offers complete solutions for the application, exposure and development of thick resists. 400 µm SU-8 structure SEM image 100 µm tall SU-8 structures SEM image of 10 µm tall AZP4620 lines with near vertical side walls Development Systems EV Group has complete solutions for photoresist development for MEMS from R&D to HVM. These solutions include spray, puddle, stream and ultrasonically assisted development. Developer module bowl SEM images showing 1:23 aspect ratio structures in 470 µm thick SU-8 using megasonically enhanced development 5

6 EV Group Solutions for MEMS Bonding for MEMS Permanent Wafer Bonding EV Group is the world s leading supplier of permanent bonding systems and has been the market leader since the introduction of its first bonder in EV Group has a complete set of equipment solutions which supports wafer sizes from 50 mm to 300 mm for volumes from R&D to HVM which support all current bonding processes. These processes include anodic bonding, glass frit, solder or eutectic, thermocompression, adhesive, and direct bonding. Alignment for Wafer Bonding EV Group is the world leader in aligned wafer bonding and has a complete portfolio of equipment and processes for aligning wafers for bonding that support all current alignment techniques and decades of experience with these processes. These solutions span the size range from pieces to 300 mm wafers and from R&D to HVM. The SVA (SmartView aligner) is the industry-leading aligner and some of these have been in HVM applications for over a decade. The flagship SmartView NT2 aligner is capable of all the optical alignment techniques shown above and has demonstrated face to face alignment of opaque wafers with post-bond accuracies of better than 200 nm (3σ) on 300 mm Si wafers. The ability to do face-to-face alignment of opaque wafers eliminates the need to transfer alignment marks to the back side of one wafer or the need for design rule keep-outs around the alignment marks. EVG SmartView NT2 Alignment results from marathon tests on EVG SmartView NT2 aligner demonstrates all wafers aligned at < 100 nm accuracy. 6

7 Post Bond Alignment Measurement Post bond alignment metrology is necessary for controlling bond alignment and this measurement requires special metrology equipment which is not typically available in existing clean rooms. The Alignment Verification Module (AVM) provides an integrated solution for overlay alignment measurement in EVG s bond tools. The EVG 40NT is capable of measuring bond alignment, top to bottom alignment, CD and overlay. Repeatability of overlay measurements in postbond inspection with infrared illumination is better than 20 nm (3σ). In addition an overlay model is calculated which is used for an automated alignment compensation within a closed feedback loop. The EVG 40NT can also output summary statistics and vector fields showing the alignment as a function of position on the wafer. Summary Statistics Vector field of misalignment which makes it very easy to recognize translational, rotational, and magnification errors in alignment Schematic showing using reflected IR light to measure post-bond alignment on EVG 40 Fully automated EVG 40NT system for 300 mm wafers Repeatability of overlay measurement in post-bond inspection with infrared illumination in nm 7

8 EV Group Solutions for MEMS Direct Bonding and Plasma Activated Wafer Bonding Fusion or direct bonding allows two wafers to be joined directly together without the use of an intermediate layer. The surfaces of the wafers to be bonded must be very clean and very smooth. In addition, a thermal annealing step is necessary for the bonded wafer pair to achieve high strength. Typically this annealing step must be done at a high temperature ( C). This high temperature annealing step severely reduces the use of the direct bonding process. However, the use of plasma activation prior to direct bonding reduces the required anneal temperature to less than 400 C, which allows for using fusion bonding also for patterned substrates (e.g. CMOS). Bond strength vs. annealing temperature 2,8 2,6 100 C 2,8 2,6 200 C 2,4 2,4 2,2 2,2 Surface Energy (J/m 2 ) 2,0 1,8 1,6 1,4 1,2 1,0 0,8 0,6 Surface Energy (J/m 2 ) 2,0 1,8 1,6 1,4 1,2 1,0 0,8 0,6 0,4 0,2 0,0 Plasma activated Reference (no plasma activation) Time (hours) 0,4 0,2 0,0 Plasma activated Reference (no plasma activation) Time (hours) 2,8 2,6 300 C 2,8 2,6 400 C 2,4 2,4 2,2 2,2 Surface Energy (J/m 2 ) 2,0 1,8 1,6 1,4 1,2 1,0 0,8 0,6 Surface Energy (J/m 2 ) 2,0 1,8 1,6 1,4 1,2 1,0 0,8 0,6 0,4 0,2 0,0 Plasma activated Reference (no plasma activation) Time (hours) 0,4 0,2 0,0 Plasma activated Reference (no plasma activation) Time (hours) Some of the gases compatible with EV Group s plasma activation system SEM image of a micromachined turbine where direct bonding was used to assemble multiple wafers. Courtesy of C.-C. Lin and M. Schmidt of MIT, USA 8

9 Permanent Wafer Bonding Applications Wafer Level Capping and Packaging MEMS contain extremely small mechanical components as part of the device. It is normally necessary to protect this device from the outside world to ensure it functions reliably for its planned life time. This protection is normally done by WLC (Wafer Level Capping) or WLP (Wafer Level Packaging), which is typically done using optically aligned wafer level bonding. Surface micromachining MEMS Bulk micromachined MEMS Si (MEMS wafer) Build MEMS Si (MEMS wafer) Capping wafer Si (MEMS wafer) Si, glass Adhesive SOG Metal Capping wafer (Si, glass) Capping wafer (Si, glass) Si (MEMS wafer) Bonding Capping wafer (Si, glass) Examples of wafer level packaging using wafer level bonding Engineered Substrates for MEMS Some MEMS devices are built on SOI (Silicon On Insulator) wafers or C-SOI (Cavity Silicon On Insulator) wafers. These wafers may also be referred to as BOX (Buried Oxide) wafers. Most commonly these wafers are used in surface micromachining processes and the buried oxide layer is used as an etch stop or a release layer or both. With cavity already present in the C-SOI wafer it may be easier or more cost effective to build the necessary structure for the device. Okmetic C-SOI structure Schematic cross section of Cavity SOI wafer. Courtesy of Okmetic Cross section picture of 5 µm thick membrane on 200 µm wide cavity built using Okmetic C-SOI. Courtesy of Okmetic 9

10 EV Group Solutions for MEMS Temporary Wafer Bonding EV Group has a complete set of solutions for the temporary bonding of product wafers to carrier wafers and is a leader in this market. EV Group s field proven solutions include tape and adhesive and are being used on silicon as well as III-V substrates. In MEMS manufacturing the need to thin wafers from their original thickness may be driven by mechanical requirements of the device being built, electrical requirements of the device being built or the desire to reduce the depth of TSV (Through Silicon Via) and therefore its cost. In a standard temporary bonding process flow the product wafer is bonded to a carrier wafer which provides the mechanical strength for the bonded pair. The product wafer can then be thinned to the desired thickness and the new surface of the thinned product wafer may be further processed using standard equipment. Once the processing of the thinned product wafer is completed. Temporary Bonding/Debonding Principle Temporary Bonding/Debonding Features: Temporary Bonding Device Wafer Front-End Processing (Lithography, etching, etc.) Device Wafer Carrier Wafer with Adhesive Film Temporary Bonding Device Wafer bonded on Carrier Wafer Debonding Wafer Stack mounted on Film Frame Debonding Cleaning Automated thermal-layer bonding and debonding Wide temperature range for low- and high temperature adhesives and tapes Precise contact force control Integrated dry film lamination from 50 mm mm Precision aligned lamination on carrier wafer Protective film remover (de-lamination) Automated cleaning of debonded wafer and carrier Back Thinning and further Processing Device Wafer (thinned) on Carrier Wafer Thin Wafer on Film Frame EV Group's equipment platforms for Temporary Bonding EVG 101 Advanced Resist Processing System EVG 520IS Semi-automated Wafer Bonding System EVG 820 Dry Film Lamination System EVG 850TB Automated Temporary Bonder EVG 850DB XT Frame Automated Bonding System up to 300 mm EV Group's equipment platforms for Debonding EVG 805 Semi-automated Debonding System EVG 301 Semi-automated Cleaning System EVG 850DB Automated Debonder EVG 850DB XT Frame Automated Debonding System up to 300 mm 10

11 Hot Embossing and Nanoimprinting EV Group has taken its market leading technology for wafer bonding, alignment and lithography and applied the fundamentals from these technologies to hot embossing, nanoimprint lithography and micro-contact printing. Hot embossing allows the formation of channels or other mechanical structures in thermoplastic materials, UV-NIL allows the patterning of photoresist and other UV curable liquids at higher resolutions than can be done optically, and micro-contact printing allows the precise application of adhesives and other materials to substrates. Hot Embossing (HE) Nanoimprint Lithography (NIL) Micro Contact Printing (µcp) Temperature > Tg Contact force ~2-600 kn Vacuum Achieved resolution: < 50 nm Substrates: Standard size mm Non-standard size possible Room temperature Contact force ~1-150 N UV Light ( nm) Achieved resolution: < 10 nm Substrates: Standard size mm Larger size possible on request Room temperature Contact force ~1-40 N inked stamp Achieved resolution: < 50 nm Substrates: Standard size mm 100 µm wide microfluidic channels hot embossed into bulk polymer 2 µm 10 µm 100 nm resolution lines replicated using SmartNIL TM Biological sample interacting with directly imprinted functional array - Courtesy of FH Wels 11

12 EV Group Solutions for MEMS Application Laboratories EV Group has application laboratories in Austria, the USA and Japan. These laboratories are staffed by experienced process engineers and are available for customer demonstrations, process development, joint R&D with partners, small volume pilot production, and process training. The capabilities of these application laboratories include lithography (spin or spray coating, align, expose, develop and metrology), bonding (align, all bonding processes and metrology), temporary bonding and debonding, hot embossing, nano-imprint lithography, and micro-contact printing. View of bay in EV Group s Clean Room in St Florian am Inn, Austria ASU flexible display center where EV Group s North American applications laboratory is located. Temporary bonding system in EV Group s North American Applications Laboratory Yokohama, Japan building where EV Group s Application Laboratory is located 12

13 Resist Processing EVG 101 Advanced Resist Processing System up to 300 mm Spin Coating Spray Coating EVG 120 Automated Resist Processing System up to 300 mm Spin Coating Spray Coating Bake EVG 150 Automated Resist Processing System up to 300 mm Spin Coating Spray Coating Bake Lithography EVG 620 GEN II Automated Mask Alignment System up to 150 mm Mask Alignment EVG 620NT Automated Mask Alignment System up to 150 mm Mask Alignment Bond Alignment EVG 6200 Automated Mask Alignment System up to 200 mm Mask Alignment Bond Alignment IQ Aligner NT Automated Mask Alignment System up to 300 mm Mask Alignment Integrated Lithography HERCULES Lithography Track System coat/align & expose/develop configuration up to 300 mm Spin Coating Spray Coating Bake Mask Alignment HERCULES L Lithography Track System resist processing & expose configuration up to 300 mm Spin Coating Spray Coating Bake Mask Alignment Bond Alignment 13

14 EV Group Solutions for MEMS Introduction Nano Imprint Lithography EVG 620NT Semi-Automated UV-NIL, µ-cp System up to 150 mm EVG 6200NT Semi-Automated UV-NIL, µ-cp System up to 200 mm EVG 770 Automated NIL Stepper up to 300 mm UV Nano Imprinting Lens Molding Microcontact Printing UV Nano Imprinting Lens Molding Microcontact Printing UV Nano Imprinting Step-and-Repeat Imprinting Master Fabrication Metrology Temporary Bonding EVG 40 NT Semi-automated Measurement System up to 300 mm EVG 40NT Automated Measurement System up to 300 mm EVG 805 Semi-automated Debonding System up to 300 mm Overlay Alignment Verification Front-to-Backside Alignment Verification Overlay Alignment Verification Front-to-Backside Alignment Verification Debonding Advanced Wafer Handling Temporary Bonding EVG 820 Lamination System up to 300 mm EVG 850TB Automated Temporary Bonding System up to 300 mm EVG 850DB Automated Debonding System up to 300 mm EVG 850TB XT Frame / EVG 850DB XT Frame Automated Temporary Bonding System up to 300 mm Automated Temporary Debonding System up to 300 mm Integrated dry film lamination from 2" mm Precision aligned lamination on carrier wafer Protective film remover (delamination) Temporary Bonding Coat, Bake and Bond Modules Debonding Wafer cleaning Film Frame Mounting EFEM FOUP storage system Up to 9 process modules Continuous mode of operation Significantly increased throughput 14

15 Bond Alignment EVG 620 Semi-Automated Bond Alignment System up to 150 mm EVG 6200 Semi-Automated Bond Alignment System up to 200 mm SmartView NT Automated Bond Alignment System for Universal Alignment up to 300 mm Bond Alignment Bond Alignment Bond Alignment Wafer Bonding EVG 510 Semi-automated Wafer Bonding System up to 200 mm Permanent Bonding Multi-Substrate Bonding EVG 520IS Semi-automated Wafer Bonding System up to 200 mm Permanent Bonding Multi-Substrate Bonding EVG 540 Automated Wafer Bonding System up to 300 mm Permanent Bonding Multi-Substrate Bonding Integrated Wafer Bonding EVG 560 Automated Wafer Bonding System up to 300 mm Mechanical Alignment Permanent Bonding Multi-substrate Bonding GEMINI Automated Production Wafer Bonding System up to 300 mm Optical Alignment Permanent Bonding Multi-substrate Bonding Plasma Activation Wafer Cleaning 15

16 Global EV Locations Group Solutions for MEMS Headquarters Worldwide Sales and Customer Support EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse St.Florian am Inn Introduction Austria Phone: Fax: Sales@EVGroup.com Germany EV Group E. Thallner GmbH Hartham Neuhaus Germany Phone: Fax: Sales@EVGroup.com Europe Tech Support Phone: TechSupportEU@EVGroup.com Japan EV Group Japan KK Yokohama Business Park East Tower 1F 134, Godo-cho, Hodogaya-ku, Yokohama-shi, Kanagawa, Phone: Fax: Sales@EVGroup.jp Japan Tech Support Phone: (Yokohama) Phone: (Fukuoka) TechSupportJP@EVGroup.com North America EV Group Inc South River Parkway Tempe, AZ Phone: Fax: SalesUS@EVGroup.com EV Group Inc. 100 Great Oaks Blvd; Suite #119 Albany, NY SalesUS@EVGroup.com North America Tech Support Phone: TechSupportUS@EVGroup.com Taiwan Sales EVG-JOINTECH CORP. No. 400, Hwang-Pei Road Chung-Li City, Phone: Fax: Sales@EVG-Jointech.com.tw Taiwan Customer Support EV Group Taiwan Ltd. North Office: No. 400, Hwang-Pei Road Chung-Li City, South Office: Rm203, NO.12, Nanke 2nd RD, Xinshi Dist., Tainan City, Phone: Fax: (North Office) Fax: (South Office) CustomerSupportTW@EVGroup.com EV Group (EVG). All rights reserved. V18/01 Korea EV Group Korea Ltd. Room 503, Seokun Tower, 178, Pangyoyeok-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, , South Korea Phone: Fax: Sales@EVGroup.co.kr China EV Group China Ltd. Room , Building No. 3, No. 498 Guo Shou Jing Road, Zhangjiang High-Tech Park, Pudong New Area, Shanghai, PR China, Shanghai Phone: Fax: Sales@EVGroup.cn ServiceCN@EVGroup.com Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond, CoverSpin, EZB, EZ Bond, EZD, EZ Debond, EZR, EZ Release, GEMINI, HERCULES, HyperIntegration, IQ Aligner, LowTemp, NanoAlign, NanoFill, NanoSpray, NIL-COM, NILPhotonics, OmniSpray, SmartEdge, SmartNIL, SmartView, The Triple "i" Company Invent-Innovate-Implement, Triple i. Other product and company names may be registered trademarks of their respective owners. Printed on paper from sustainable sources 16