EV Group. Nano & Micro Imprint Technologies

Transcription

1 EV Group Nano & Micro Imprint Technologies

2 EV Group Solutions for NIL Micro- & Nanopatterning Solutions UV-Imprinting (UV-Molding) In UV-NIL, a substrate is spin coated or drop dispensed with a UV-curable monomer or oligomer. Imprinting is carried out with a transparent template (quartz glass or soft working stamps) and the imprinted structures are cured by UV-light exposure, which cross-links the resist. Subsequently, the template is released from the imprinted substrate. The use of quartz glass stamps is regarded as hard UV-NIL whereas the use of soft working stamps refers to soft UV-NIL. SmartNIL EVG s strongest differentiation factor in UV- nanoimprinting technology lies in its SmartNIL technology. SmartNIL enables manufacturing of extremely small features down to less than 40 nm, a wide range of structure sizes and shapes (including 3D) and nanopatterning of high-topography or rough surfaces. Since SmartNIL incorporates multiple-use soft stamp processing, it enables unmatched throughput with considerable cost-of-ownership advantages while preserving scalability and maintenance-friendly operation. In addition, the lifetime of the master template is extended to periods comparable to masks used for optical lithography. EVG s SmartNIL redeems the long-term promise of nanoimprinting being a low-cost and high-volume alternative lithography technology for mass manufacturing of micro- and nanoscale structures. Panel-Size Large-Area Nanoimprinting Recent advances in SmartNIL technology enabled implementation of nanopatterning in panel manufacturing. For biomedical applications, photonic elements and displays, which cannot be reduced in size, it is crucial to increase the substrate utilization efficiency by increasing the pattern area. NIL has proven to be the most cost-efficient way to enable fabrication of nano patterns on large areas as it is not limited by optical systems and can provide the best pattern fidelity for the smallest structures. Step-and-Repeat UV-Nanoimprinting The EVG770 NIL Stepper is designed for step-and-repeat UV-NIL processes and is compatible for 100 mm to 300 mm wafers. The special features of the EVG770 include a dual-stage alignment approach and the capability to imprint in a lower pressure environment (patented technology), which enables greater pattern fidelity compared to other technical solutions that imprint at ambient pressure. The step-and-repeat NIL system achieves < 500 nm overlay alignment accuracy and a lithography resolution in the sub-30 nm range. Hot Embossing The EVG600 Series precision alignment systems support stamp-to-substrate alignment for subsequent hot embossing. Stamp and substrate are brought in contact inside an EVG500 Series vacuum chamber. A precisely controlled temperature profile (typically up to 350 C, the system supports up to 650 C) and contact force sequence (up to 360 kn) create an imprint of the stamp on the substrate. Imprint areas up to 300 mm in diameter with high resolution features down to 50 nm have been demonstrated on the EVG500 hot embossing systems. Typical stamps are made out of Si, SiO 2 or metals (e.g. Ni). Substrates are typically polymer substrates or coated polymers on semiconductor wafers. The high-temperature option enables imprinting into materials where elevated temperatures are needed (e.g. glass substrates). Micro Contact Printing (µ-cp) In a µ-cp process, inked chemicals are transferred from an elastomeric stamp to a metal surface to build up a Self Assembling Monolayer (SAM). A SAM can be used as an etching mask or act as a precursor for binding specific molecules covalently. In most cases, thioles are transferred to gold surfaces on silicon wafers. Other common inks used are proteins for biomedical applications.

3 EV Group Solutions for NIL Application Examples Applications for Nano & Micro Imprint Lithography Nanoimprint Solutions Components & Functional Layers Devices & Applications UV-NIL Hot Embossing µ-contact Printing Photonic crystals Lense arrays Polarizers Antireflective layers 3D patterned layers Gratings Diffractive optical elements Light extraction layers Growth templates Filters LEDs / OLEDs Lightguiding plates Displays Image Sensors Metamaterials Biosensing / genomics / cell sorting Microfluidic chips / lab-on-chip systems Flexible electronics Solar cells Nanowire and quantum dot applications Plasmonic components Process Results Lab-on-Foil 12.5 nm half pitch L/S test structures 50 nm and 100 nm meander structures with a height of 100 nm Courtesy of IMI-CNRC SEM image of 500 nm imprinted patterned sapphire structures 50 nm resolution pattern utilizing UV-NIL Courtesy of Quantiscript Inc. Micro-lens structures for CMOS image sensor modules created utilizing UV-NIL Sub-µm aligned features of a 5-layer photonic crystal in Si/SiO2 utilizing UV-NIL Honeycomb texturing of Multicrystalline Silicon (mc-si) Courtesy of Fraunhofer ISE 20 µm TOPAS hot embossed micro fluidic structures utilizing soft working stamp polymers 180 µm deep hot embossed micro fluidic channels replicated with soft working stamps 50 nm hot embossed resolution lines replicated with soft working stamps Fully populated 6 Si substrate imprinted on EVG 720

4 Technical Data UV-NIL and µ-cp Systems EVG 610/620 / 6200 EVG 720 / 7200 EVG 7200 LA IQ Aligner EVG 770 HERCULES NIL Max. Substrate Diameter Min. Substrate Diameter (Substrate Diagonal) 150 (610/620) 200 (6200 pieces (610/620) 75 (6200) 150 / x470 mm (Gen 2) / Exposure Source 350 W, (not 6200) 500 W, 1000 W Hg Narrow band exposure Narrow band exposure 1000 W, 5000 W Hg, 3500 W high intensity pulsed lamp Hg broad band exposure Narrow band exposure Automated Detachment Manual Substrate Transfer / / - Automated Substrate Transfer - (610) (620/6200) / - Resolution sub-40 nm* (demonstrated sub-10 nm) sub-40 nm* sub-40 nm* sub-50 nm* sub-50 nm* (demonstrated sub-10 nm) sub-40 nm* Residual Layer sub-15 nm** Alignment Capabilities sub-100 nm using Moiré sub-3 µm < 0.1 sub-1 µm sub-20 nm standard; sub-1 µm for non-cmos applications sub-3 µm Throughput ** 40 W/h ** 20 U/h** > 10 W/h ** 10 W/h ** up to 40 W/h ** Process hard + soft UV- NIL, µ-cp SmartNIL (6200) SmartNIL SmartNIL hard + soft UV-NIL; micro molding hard + soft UV-NIL SmartNIL R&D Customer / Application Pilot Line + * resolution dependent upon template and process ** depending on process UV-NIL Imprinting Principle Imprint Nanostructures Detach Stamp UV Curing Reuse Soft Stamp

5 Technical Data Hot Embossing Systems EVG 501/510 UV-NIL/HE EVG 520HE EVG 540 EVG 750 EVG 750R2R Heater Size = Max. Wafer Diameter Min. Wafer Diameter (Substrate Diagonal) mm pieces pieces 200 mm mm mm foil width 150 mm EVG620, EVG6200 EVG620, EVG6200 Hot Embossing Chuck System / Alignment System 200 mm EVG620, EVG6200 EVG620, EVG6200 alignment integrated 300 mm IQ Aligner Smart View Max. Contact Force for HE [kn] Cooling System (bottom side) (top & bottom side) (top & bottom side) (top & bottom side) air knife cooling Automated De-embossing Manual Wafer/Stamp Transfer Automated Wafer/Stamp Transfer Temperature 350 C 350 C 350 C 200 C Throughput / Speed ** ** 20 wafer / h 30 wafer / h** 0,5-20 m/min R&D R&D Pilot Line + Pilot Line + Customer / Application Hot Embossing Principle Molding Detach Stamp Pressurized heating Reuse (Soft) Stamp**

6 Global Locations Headquarters Worldwide Sales and Customer Support EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse St.Florian am Inn Austria Phone: Fax: Sales@EVGroup.com Germany EV Group E. Thallner GmbH Hartham Neuhaus Germany Phone: Fax: Sales@EVGroup.com Europe Tech Support Phone: TechSupportEurope@EVGroup.com Japan EV Group Japan KK Yokohama Business Park East Tower 1F 134, Godo-cho, Hodogaya-ku, Yokohama-shi, Kanagawa, Phone: Fax: Sales@EVGroup.jp Japan Tech Support Phone: (Yokohama) Phone: (Fukuoka) TechSupportJapan@EVGroup.com North America EV Group Inc South River Parkway Tempe, AZ Phone: Fax: SalesNorthAmerica@EVGroup.com EV Group Inc. 100 Great Oaks Blvd; Suite #119 Albany, NY SalesNorthAmerica@EVGroup.com North America Tech Support Phone: TechSupportNorthAmerica@EVGroup.com Taiwan Sales EVG-JOINTECH CORP. No. 400, Hwang-Pei Road Chung-Li City, Phone: Fax: Sales@EVG-Jointech.com.tw Taiwan Customer Support EV Group Taiwan Ltd. North Office: No. 400, Hwang-Pei Road Chung-Li City, South Office: Rm203, NO.12, Nanke 2nd RD, Xinshi Dist., Tainan City, Phone: Fax: (North Office) Fax: (South Office) TechSupportTaiwan@EVGroup.com EV Group (EVG). All rights reserved. V17/01 Korea EV Group Korea Ltd. Room 503, Seokun Tower, 178, Pangyoyeok-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, , South Korea Phone: Fax: Sales@EVGroup.co.kr China EV Group China Ltd. Room , Building No. 3, No. 498 Guo Shou Jing Road, Zhangjiang High-Tech Park, Pudong New Area, Shanghai, PR China, Shanghai Phone: Fax: Sales@EVGroup.cn TechSupportChina@EVGroup.com Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond, CoverSpin, EZB, EZ Bond, EZD, EZ Debond, EZR, EZ Release, GEMINI, HERCULES, HyperIntegration, IQ Aligner, LowTemp, NanoAlign, NanoFill, NanoSpray, NIL-COM, NILPhotonics, OmniSpray, SmartEdge, SmartNIL, SmartView, The Triple "i" Company Invent-Innovate-Implement, Triple i. Other product and company names may be registered trademarks of their respective owners. Printed on paper from sustainable sources