Nano-imprinting Lithography Technology

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1 Nano-imprinting Lithography Technology

2 Agenda Limitation of photolithograph - Remind of photolithography technology - What is diffraction - Diffraction limit Concept of nano-imprinting lithography Basic process of nano-imprinting lithography technology

3 Remind of photolithography technology Photoresist process for lithography Clean substrate Development Apply Adhesion Promoter(HMDS) PR Spin Coating Post Baking Soft Baking Etching Limitation of photolithography UV Exposure Remove PR

4 Photolithography process and limitation UV Exposure Mask Ideal case of photolithography UV Exposure Real case of photolithography (ultra small pattern size) 회절로인해같은조건의촬영시위와같은상이한결과를초래 Diffraction effect (Image blur 현상발생 )

$What is diffraction?$

5 What is diffraction? Diffraction is the process by which light waves traveling through a small hole, slit or around a boundary will spread out Basic assumption : Light is wave

6 What is diffraction? Diffraction causes the loss of resolving power Image blur 현상은각종수차에의해영향을받지만공기중의 particle 에의한 diffraction 으로인해같은조건의촬영시위와같은상이한결과를초래한다

$Diffraction limit Example Diffraction of$

7 Diffraction limit Example Diffraction of circular aperture is a Bessel function of the first kind

8 Diffraction limit The radius of the Airy disk D θ

9 Imprinting Technology

10 Imprinting 현존하는가장오래된금속활자본직지심체요절 < 금속활자본 > < 목판본 > < 금속활자본표지 > 정식명칭 : 백운화상초록불조직지심체요절 1377년 ( 고려우왕 3) 7월청주흥덕사간행 세계에서가장오래된금속활자본 1372년쓰여진책을 77년금속, 78년목판으로간행 금속활자본은현재프랑스국립도서관에소장 2001년유네스코세계기록유산등재 자료출처 :

11 Imprinting 직지심체요절금속활자제작및인쇄과정 < 글자본선정 > < 자본붙이기 > < 어미자만들기 > < 주형틀만들기 > < 쇳물붓기 > < 활자떼어내기 > < 조판 > < 인쇄 > 자료출처 :

12 Nano-imprinting process 1. Mold fabricaion step - Using E-beam lithography, FIB, etc. 1. Mold fabrication Mold 2. Press mold Mold < Mold > 2. Imprinting step - Nano mold with nano-scale pattern is pressed into a resist 3. Remove mold Resist Substrate Mold Resist Substrate < Resist pattern >

13 Nano-imprinting 기술의종류

Basic process of nano-imprinting lithography technology Procedure

Imprint step - Nano mold with nano-scale pattern is pressed into a

Pattern transfer step - Pattern transfer to substrate by RIE

in the compressed area 1. Pressing mold 2.

14 Basic process of nano-imprinting lithography technology Procedure of nanoimprinting lithography : 2 basic step 1. Imprint step - Nano mold with nano-scale pattern is pressed into a resist 2. Pattern transfer step - Pattern transfer to substrate by RIE (Reactive Ion Etching) - RIE is used to remove the residual resist in the compressed area 1. Pressing mold 2. Remove mold mold resist resist substrate mold resist resist substrate < Mold > 3. Pattern transfer (RIE) resist substrate < Resist pattern > Ref) Proc. SPIE 4349, (2001), p. 82

Press mold with heat Application of Molding Pressure Cooling of Substrate and Mold to

15 Thermal nano-imprinting lithography technology Procedures Heating of Substrate and Mold to above Tg 1. Press mold with heat Application of Molding Pressure Cooling of Substrate and Mold to below Tg 2. Remove mold Mold Resist Substrate Mold < Mold > Demolding Resist Substrate Ref) < Imprinted resist >

& low pressure No fluidity problem Procedures <Lattice pattern> <Pyramid pattern> Substrate Photopolymer

16 UV nano-imprinting lithography technology UV nano-imprinting Material: UV-curable photopolymer Processing condition: room temp. & low pressure No fluidity problem Procedures <Lattice pattern> <Pyramid pattern> Substrate Photopolymer UV-transparent mold Photopolymer dispensation on substrate Covering the mold Aligning UV-light Releasing the mold Pressure Ref) JJAP, vol. 44, No. 7B, pp. 5600, 2005

17 Continuous UV nano-imprinting lithography technology Design and construction of continuous UV nano imprinting system For flexible substrate Fabrication results For rigid substrate 1. Can replicate nano patterns of large area with high precision 2. Can replace conventional lithography process

Roll NIL -Roll mold- Schematic diagram of

18 Roll NIL -Roll mold- Schematic diagram of the mold fabrication process performed in Ref Paper Ref) Resin micromachining by roller hot embossing, microsystem technology, 2007 Ref) Subdivision Surfaces for procedural Design of Imprint Rolls, SPM, 2008

Roll NIL -Flexible mold- Ref) Large-Area

19 Roll NIL -Flexible mold- Ref) Large-Area Roll-to-Roll and Roll-to-Plate Nanoimprint Lithography: A Step toward High-Throughput Application of Continuous Nanoimprinting, 2008, ACSNANO Ref) Rigiflex Lithography nanostructure transfer, Advanced Material, 2005

Roll NIL -Flat mold- Ref) Roller nanoimprint

20 Roll NIL -Flat mold- Ref) Roller nanoimprint lithography, America Vacuum Society, 1998 Ref) Fabrication of organic light-emitting devices on flexible substrates using a combined roller imprinting and photolithography-patterning Technique, American Vacuum Society, 2006

21 Roll to Roll Imprinting Technology

1. Introduction : Roll to roll process Roll-to-roll processing, also known as 'web' processing, reel-to-reel processing or R2R, is the process of creating electronic devices on a roll of flexible

$If semiconductor devices can be fabricated in this way on large substrates, many devices could be fabricated at a fraction of the cost of traditional semiconductor manufacturing methods.$

22 1. Introduction : Roll to roll process Roll-to-roll processing, also known as 'web' processing, reel-to-reel processing or R2R, is the process of creating electronic devices on a roll of flexible plastic or metal foil. Large circuits made with thin-film transistors and other devices can be easily patterned onto these large substrates, which can be up to a few metres wide and 50 km long. Roll-to-roll processing is a technology which is still in development. If semiconductor devices can be fabricated in this way on large substrates, many devices could be fabricated at a fraction of the cost of traditional semiconductor manufacturing methods. Applications could arise which take advantage of the flexible nature of the substrates, such as electronics embedded into clothing, large-area flexible displays, and roll-up portable displays. <R2R Process for OLED(GE)> Ref) <R2R Process for Flexible display(hp)>

2. Roll to roll micro lithography System formation Metal coated film feeding Polymer Coating UV roll Imprinting Lithography Unexposed Photopolym er removing Metal

23 2. Roll to roll micro lithography System formation Metal coated film feeding Polymer Coating UV roll Imprinting Lithography Unexposed Photopolym er removing Metal Etching Polymer Removing Final patterns A Unexposed polymer Removing B Rinse C Drying D Metal etching E Polymer Removing P P P Metal 증착방법 - 진공공정 <Method 1> <Method 2>

24 3. Roll to roll micro printing Ref)

25 3. Roll to roll micro printing : electronics printing Ref)

26 3. Roll to roll micro printing : printing Ref)

27 3. Roll to roll micro printing : limit of printing process printing is a micro structuring technique! but since hundreds of years, 99% of all printing applications are for visual usage, not for electronic functions. Printing is expanded all manufacture process Ref)

28 3. Roll to roll micro printing : application Ref)

3. Roll to roll micro printing : gravure printing What is Gravure? Gravure is an intaglio printing process.

On the gravure image carrier (usually a copper cylinder), all the images are screened, creating thousands of tiny cells.

As the image carrier rotates, ink fills the tiny cells and covers the surface of the cylinder.

29 3. Roll to roll micro printing : gravure printing What is Gravure? Gravure is an intaglio printing process. The image carrier has the image cut or etched below the surface of the non-image area. On the gravure image carrier (usually a copper cylinder), all the images are screened, creating thousands of tiny cells. During printing, the image carrier is immersed in fluid ink. As the image carrier rotates, ink fills the tiny cells and covers the surface of the cylinder. The surface of the cylinder is wiped with a doctor blade, leaving the non-image area clean while the ink remains in the recessed cells. Summary of technology Cylinder pattern Good for flexible substrates, bad for glass Well suited for solvent-based organic semiconductors and thin films High throughput Demonstrated Flex OLED and TFT: DNP, Add-Vision, VTT, Berkeley Concerns Line resolution > 50um High pattern setup costs Source:

3. Roll to roll micro printing : gravure printing Definition: With gravure

is filled with ink, then the plate is rotated on a cylinder that transfers

high quality photographic images Opposite of relief printing plate created

dries immediately Gravure printing is often used for high-volume printing of

Although less common, gravure printing may also be used for printing

30 3. Roll to roll micro printing : gravure printing Definition: With gravure printing an image is etched on the surface of a metal plate, the etched area is filled with ink, then the plate is rotated on a cylinder that transfers the image to the paper or other material High quality and expensive Used for high quality photographic images Opposite of relief printing plate created with engraved image creating cells of ink color Ink is spirit based and dries immediately Gravure printing is often used for high-volume printing of packaging, wallpaper, and gift wrap. Although less common, gravure printing may also be used for printing magazines, greeting cards, and high-volume advertising. Ref) International paper knowledge center Gravure printing

31 3. Roll to roll micro printing : gravure printing Press Types: sheet-fed and web-fed Concept of offset printing Sheet-fed Wed-fed

3. Roll to roll micro printing : gravure printing Press components Feeding system: The feeding system is the device that

Printing system: The printing system for offset presses contain 3 major components: the plate cylinder, blanket cylinder, and

set of rollers, known as the roller train, which distribute the ink and carry it to the printing plate.

32 3. Roll to roll micro printing : gravure printing Press components Feeding system: The feeding system is the device that feeds the paper into the press. Printing system: The printing system for offset presses contain 3 major components: the plate cylinder, blanket cylinder, and the impression cylinder Inking system: The inking system on offset presses consists of a fountain which holds the ink and a set of rollers, known as the roller train, which distribute the ink and carry it to the printing plate. Dampening system: Delivery system: Summary of technology Blanket, ink paste, transfer Demonstrated 20 ~ 30μm line width Accuracy: 2.5μm / 400mm, Repeatability: <2.5 μm Concerns Line resolution > 50um High pattern setup costs Ref) Stanford University

3. Roll to roll micro printing : gravure-offset printing Gravure-offset printing In gravure-offset printing, the ink (or paste) is first doctored into the grooves of a gravures plate.

33 3. Roll to roll micro printing : gravure-offset printing Gravure-offset printing In gravure-offset printing, the ink (or paste) is first doctored into the grooves of a gravures plate. An offset pad or-roller, made of a rubber or silicone polymer, picks up the ink from the gravure grooves by pressing against it. Then the pad or roller transfers the ink to the substrate by pressing or rotating over it. After that, the conductor inks for ceramics are dried and fired at C. Flow of roller type gravure offset printing. Printed substrate (below) and ink left on blanket (above) Ref) Marko Pudas, Juha Hagberg, Seppo Leppa vuori, Printing parameters and ink components affecting ultra-fine-line gravure-offset printing for electronics applications Journal of the European Ceramic Society 24 (2004)

5 and 50 um wide dried lines printed with ink 50 mm wide

structure. Ref) M. Lahti, S. Leppa vuori, V.

fabrication of solid films Applied Surface Science 142

34 3. Roll to roll micro printing : gravure-offset printing Gravure-offset printing 300 and 20 um wide dried lines 37.5 and 50 um wide dried lines printed with ink 50 mm wide Au conductors on a PZT layer in a pressure sensor structure. Ref) M. Lahti, S. Leppa vuori, V. Lantto, Gravure-offset-printing technique for the fabrication of solid films Applied Surface Science mm wide Ag conductors printed over a 90 o corner of a ceramic substrate.

35 4. Roll to roll ink-jet printing technology Ink jet technology Drop-on- Demand Continuous Thermal Piezoelectric Why ink-jet? Non contact Low impact to object Low cost Lithography and developing process unneeded Scalability It can be set up to produce very small quantities and size to very large quantities and size Efficient material use Ink jet is direct write, effectively no waste

36 4. Roll to roll ink-jet printing technology Continuous ink-jet Drop on demand ink-jet Piezoelectric ink jet process Thermal ink jet process

37 4. Roll to roll ink-jet printing technology : application

38 Imprinting system

EVG History 1980 Foundation of Electronic Visions 1985 Creation of the world s first double-side mask

nanotechnology market with the development of the first nanoimprinting system 1998 Development of the

systems 2001 Design & Installation of the first 300mm automated SOI production bonder 2006 Release of

39 EVG History 1980 Foundation of Electronic Visions 1985 Creation of the world s first double-side mask aligner 1992 Development of the first performance wafer bonding systems 1997 Entered the nanotechnology market with the development of the first nanoimprinting system 1998 Development of the revolutionary cavity coating technology 2000 Introduction of Fully-automated and integrated production systems 2001 Design & Installation of the first 300mm automated SOI production bonder 2006 Release of bond cluster module for SOI market 2008 Release of production wafer bonder for 3D applications Ref)

40 EVG Products Lithography Mask aligner Systems Resist Processing Systems Lithography Track Systems Nanoimprint Lithography Systems (UV-NIL, μcp, HE) Inspection Systems Bonding Wafer Bonding Systems Bond Alignment Systems Integrated Bonding Systems SOI Bonding Systems Temporary Bonding and Debonding Systems Inspection Systems Ref)

EVG EVG 620 Bond Aligner Features - bond alignment of 2~3 wafer stacks up 150nm wafer sizes - Manual or motorized alignment stage - Fully motorized high resolution bottom side microscopes - Quick

41 EVG EVG 620 Bond Aligner Features - bond alignment of 2~3 wafer stacks up 150nm wafer sizes - Manual or motorized alignment stage - Fully motorized high resolution bottom side microscopes - Quick tool change between different wafer sizes and bonding - Easy to use Windows based operation Technical Data - Alignment methods >Backside alignment : ± 2μm >Transparent alignment : ± 1μm >IR alignment : option Ref)

SUSS History 1949 Foundation of Karl Suess KG in Munich 1963 Development of first

production processes 1989 Development of first wafer bonder 1998 Launch of world s

Development of first mask aligner for sub-micron processes 2006 Release of bond

42 SUSS History 1949 Foundation of Karl Suess KG in Munich 1963 Development of first aligner for the production of transistors 1974 Release of first mask aligner for full production processes 1989 Development of first wafer bonder 1998 Launch of world s first 300mm probing system 2001 Renaming of Karl SUSS group in SUSS MicroTec 2004 Development of first mask aligner for sub-micron processes 2006 Release of bond cluster module for SOI market 2008 Release of production wafer bonder for 3D applications Ref)

$Refractive microlens$

43 SUSS Products Lithography Mask Aligner Lithography Clusters Photomask Design Alignment Verification Wet Processing Nanoimprint Lithography Spin & Spray Coaters Wafer Bonder Automated Bond Cluster Semi-Automated Wafer Bonders Manual Wafer Bonders Stand-Alone Related Tools Micro-optics Refractive microlens arrays Diffractive Optics, DOE 1D and 2D Diffuser Ref)

SUSS NPS 300 (Nano patterning stepper) Features - NIL tool combining hot embossing and UV-NIL on wafer - Possibility to add inert gas for faster print - High accuracy and low volume fluid dispense -

44 SUSS NPS 300 (Nano patterning stepper) Features - NIL tool combining hot embossing and UV-NIL on wafer - Possibility to add inert gas for faster print - High accuracy and low volume fluid dispense - Automatic stamp pick-up - Manual or automated wafer loading / unloading - Long-term stability and reliability Technical Data - Imprinting Resolution : Sub-20nm - Alignment Accuracy : 100nm - Overlay Accuracy : 250nm Ref)

Drop Pattern Generation System is the heart of Molecular Imprint s advanced nanopatterning technology Precise placement of

45 Molecular Imprint About MII Molecular Imprints, Inc. (MII) was founded in Austin, Texas in 2001, spun out of the University of Texas. Drop Pattern Generation System is the heart of Molecular Imprint s advanced nanopatterning technology Precise placement of photoresist Uniform and consistent nanopatterning Low cost, down to 10nm feature Can be applied to HDD industry to take 1TB/in 2 Ref) Can be also economically extend the semiconductor industry s Moore s Law to the sub 30nm regime

Molecular Imprint Product Imprio HD2200 Resolution: Sub-20nm, half-pitch for discrete track and bit patterned media Throughput (double-sided): >150 disks per hour Alignment: <10 microns (relative to

46 Molecular Imprint Product Imprio HD2200 Resolution: Sub-20nm, half-pitch for discrete track and bit patterned media Throughput (double-sided): >150 disks per hour Alignment: <10 microns (relative to disk spindle hole) Disk Automation: Fully automated cassette-tocassette and template loading Imprio HD1100 Resolution: Sub-50nm, half-pitch Alignment: Not available Flexibility: Can be configured to accept 25mm to 76mm substrates Ref) Automation: Automated wafer and template loading

Alignment: <10um (template to substrate) Flexibility: Designed for 150mm synthetic quartz substrates Automation: Automated wafer

47 Molecular Imprint Product Imprio HD300 Resolution: Sub-32nm half pitch Alignment: < 10nm, 3σ (single point, X,Y) Automation: Fully automated wafer and mask loading Flexibility: 200mm and 300mm substrates (SEMI standard) Perfecta TR1100 Resolution: Sub-50nm Alignment: <10um (template to substrate) Flexibility: Designed for 150mm synthetic quartz substrates Automation: Automated wafer and template loading Field size: 26mm x 32mm (step-and-scan compatible) Throughput: Four wafers per hour Ref)

Nano & Device History 2003 NND established, NANOSIS TM launch 2004 30nm patterning with a silicon stamp 2005/02 Supplied NANOSIS

Nano Korea 2005 2005/10 Supplied NANOSIS 620 to LG Chem 2005/11 Supplied NANOSIS 610 to Korea University 2006/10 Supplied NANOSIS

48 Nano & Device History 2003 NND established, NANOSIS TM launch nm patterning with a silicon stamp 2005/02 Supplied NANOSIS 410 to ISRC in Seooul National University 2005/06 Supplied NANOSIS 620 to Sogang University 2005/08 Exhibition and operation at Nano Korea /10 Supplied NANOSIS 620 to LG Chem 2005/11 Supplied NANOSIS 610 to Korea University 2006/10 Supplied NANOSIS 420 to GIST 2007/10 Supplied NANOSIS 830 to KOPTI 2008/05 Supply over 10 sets NIL system in domestic market Ref)

49 Nano & Device Product Nanosis 620 Economic price Universal imprinter : UV curing, hot embossing Near zero residual layer Minimized footprint through a compact design Excellent pattern uniformity Ref) Nanosis 820 Economic price Universal imprinter : UV curing, hot embossing Powerful alignment system Near zero residual layer Excellent pattern uniformity Reduced process time

50 EVG 社 EVG 620 bond aligner Precise wafer/substrate alignment for wafer bonding applications High-resolution bottom side splitfield microscope 1 µm alignment accuracy Easy to use Windows based operation

51 .. SUSS 社 NPS 300 (Nano patterning stepper) 250 nm overlay accuracy Unmatched sub-20 nm embossing capability Submicron Stamp-to-Wafer alignment with state-of-the-art pattern recognition system

52 Molecular Imprint 社 Imprio 250 Resolution: Sub-50 nm Alignment: < 10 nm Flexibility: 200 mm and 300mm substrates with automated loading Field size: 26 x 32 mm active print area.

53 Nano & Device 社 Nanosis 610 No align option Near zero residual layer UV curing & hot embossing (universal) Good pattern uniformity 6 inch direct imprinting

54 Issues of nanoimprinting Fabrication of nano master / mold Thickness of residual layer Large area patterning Demolding Imprinting material Mass productivity and system itself

55 Thickness of residual layer

56 What is residual layer? UV-transparent mold Imprinting material (photopolymer) Pressure UV- curing This is the residual layer! After the residual layer etching

57 Importance of thickness of residual layer Purpose of the nano imprinting lithography Use the pattern itself - AR Surface - Optical nano grating - Wave guider - Nano structure for optoelectronic devices Use the pattern as a barrier for after process - Replace the photolithography process

58 AR coating on mold AR coating (Anti reflection coating) UV Reflection of UV Mold without AR coating PHotopolymer Optical substrate has about 4% reflection in general AR coating on mold surface is very important

59 Importance of thickness of residual layer Nano structure for optoelectronic devices (MLA on VCSEL) n 1 R n 1 R Emitting area n 1 R VCSEL array Bonding pad VCSEL Micro-Lens Fiber We must control the residual layer for designed focal length

60 Importance of thickness of residual layer Use the pattern as a barrier for after process (critical reason) UV-transparent mold UV photopolymer Preparation Mold lamination and Appling pressure UV curing Demolding Remove the residual layer Etch the substrate Remove the photopolymer 이때 pattern 의크기에비해너무두꺼운 residual layer 가남아있다면 이를제거할때 pattern 은모두손실되고만다

61 Zero residual layer process Conventional imprint Zero residual imprint

62 Application of nano-imprinting technology I

63 Super hydrophobic surface 연꽃잎 자료출처 : Manhui Sun, Langmuir, Vol.21, pp.8978, 2005 L. Feng, Advanced Material,Vol.14, pp.1857, 2002 Alexander Otten, Langmuir, Vol.20, pp.2405, 2004

64 Super hydrophobic surface 연꽃잎의모사 응용분야 매미날개의모사 < 자동차 > 자료출처 : Manhui Sun et at al.,langmuir, vol.21, pp.8978, 2005 Woo Lee et at al., Langmuir, Vol.20, pp.7665, < 유리창 >

65 Anti-reflective surface 나방의눈 자료출처 :

66 Anti-reflective surface 나방눈의모사패턴 무반사면의응용 자료출처 : MNE 06 Micro- and Nano- Engineering Kenji Sogo, Journal of Photopolymer Science Technology, Vol.19, pp.647, 2006

67 Drag reduction of surface 상어의피부 자료출처 : D. W. Bechert, Naturwissenschaften, Vol. 87, pp.157, 2004

68 Drag reduction of surface 상어피부 상어피부형상의응용 - 수영복 10% 감소효과 <Drag reduction of surface> 자료출처 : D. W. Bechert, Naturwissenschaften, Vol. 87, pp.157, 2004 <Speedo Fastskin II>

69 Application of nano-imprinting technology II

70 Bio chip fabrication using nano-imprinting Imprinting of bio chip 자료출처 : macrogen.co.kr

71 Bio chip fabrication using nano-imprinting

72 Lab-on-a-chip fabrication using nano-imprinting LOC with microfluidic channels 자료출처 :

Part 5-1: Lithography

Part 5-1: Lithography Yao-Joe Yang 1 Pattern Transfer (Patterning) Types of lithography systems: Optical X-ray electron beam writer (non-traditional, no masks) Two-dimensional pattern transfer: limited