TAIPRO Engineering. Speaker: M. Saint-Mard Managing director. TAIlored microsystem improving your PROduct

Transcription

1 TAIPRO Engineering MEMS packaging is crucial for system performance and reliability Speaker: M. Saint-Mard Managing director TAIPRO ENGINEERING SA Michel Saint-Mard Administrateur délégué Tel Fax Siège Social WSL, Rue Des Chasseurs Ardennais, 4032 Angleur 04/05/ Compte en banque : N de TVA : BE RPM

2 Scope TAIPRO Engineering s objectives Microsystem definition TAIPRO s activities Goal of microsystem activities Microsystem prototyping summary Device versus smart sensor Miniaturization Packaging aspect 3 case studies Conclusions 04/05/2012 2

3 TAIPRO Engineering s objectives Taipro s goal is to give a high level support to identify and respond to industrial needs by: Proto/demo of tailored microsystems for specific applications. Proof of concept studies (design & and proto/demo fabrication Fabrication of very small series (~ 5 to 100 assemblies/badge) and Ir. support for larger series in a first step. 04/05/2012 3

4 Microsystem definition Microsystem Smart sensor Microsystem is a solution including: - sensors - Electronics and firmware - Micro actuators, receptors and/or emitters (interaction with external world) ; - Power supply Ex de µsystèmes 04/05/2012 4

5 TAIPRO s activities TAIPRO Engineering focuses its activities on innovative micro assembly (packaging) of existing sensors and microelectronic COTS (Components Off The Shelf) to perform customized solutions with new functionalities for industrial applications: Tailored development project for in situ proof of concept demonstration, Standard & nonstandard packaging/micro assembly consultancy and pre-production series before manufacturing, Training on specific packaging and testing equipment, Example 04/05/2012 5

6 Goal of microsystem activities Hybrid packaging Stacking 5/4/ Chip inspection before bonding Main goals of theses micro packaging activities: Micro sensor design and prototyping Health monitoring with smart sensors design and prototyping Specific follow-up of equipment or process Protection against copy Miniaturization

7 Soudure filaire (wire bonding) Encapsulation Caractérisation et test Examples Design & modélisation Réception composants Nettoyage/activation par plasma Placement/assemblage/collage Confidentiel Microsystem prototyping summary Etudes TECHNO TESTS Recherches Tests technologiques Découpe silicium 04/05/2012 7

8 Devices vs. Smart sensors According to: R. Grace (SSI Como Italy March 2010) & Microsys and TAIPRO Device What is the technical need? You need to package some microē components! Solution 5/4/2012 8

9 Proto / small series Large series Equipment and tooling Bare dies and electrical components Final customer Confidentiel Devices vs. Smart sensors Chain of value of a solution (macroscopical view) Fab Packaging D&E Research institute Integration level 9

10 Some words about packaging Did you know that: Development of a new die failed 80 times on 100 because nobody thinks of packaging. Packaging costs 50 to 80 % of the final solution. Packaging can change the environmental sustainability of a bare die. Solution 04/05/

11 Some evident words about solution Your end user want: Something reliable. Something robust (sustainability to the environment) Something close to the state of the art (good side of it!) -> do not use too challenging technologies If not, you are in a research program (which is also a part of the chain of value) 04/05/

12 Existing packaging solution -Miniaturization aspects Bare (unpackaged) die Die lateral dimensions: Usual:1-10mm2 Small die: below 1mm2 Large die: above 10mm2 04/05/

13 SMD IC SOP - Small Outline Package DIP - Dual-in-Line Package From public website From public website QFP - Quad Flat Pack From public website QFN - Quad Flat No Leads Package From public website BGA ball grid arrays From public website TAIlored microsystem improving your From PROduct public website With courtesy of Microsys Extract from Sensor expo presentation in

14 Miniaturization aspects - Bare die vs. SMD Structure SMD Bare Die Format and dimension Technology Availability SMD, SOT, SOP, QFP, QFN, BGA etc. For 0402: x0.5 mm3 Soldering, conductive adhesive (CA) Only in specified format Not all dies are available Any:1-20mm thickness: 0.75 to 0.02mm WB (Al, Au etc), FC (any, including soldering, CA, other adhesives, gold studs etc) OK Miniaturization Lower density Highest density With courtesy of Microsys Extract from Sensor expo presentation in

15 Reliability consideration SMD Bare Die Count of interconnect Highest: All I/O are connected Double count of interconnection (IC I/O to pkg, pkg to mother board) Lowest: Only dedicated I/O are connected Direct contact IC I/O to mother board Interconnect distance Long Shortest Reliability High Highest With courtesy of Microsys Extract from Sensor expo presentation in

16 Integration density: Bare die vs. SMD (BGA) wire die substrate wire die substrate Bare die (flip chip option) Bare die (wire bonded option) wire die wire BGA package substrate With courtesy of Microsys Extract from Sensor expo presentation in

17 Miniaturization aspects - Bare die vs. SMD Thin die option Objectives: To reduce wafer thickness from µm (300mm, 12 ) to specified thickness 200µm is industrial standard 100µm is for advanced device 50µm and down to 25µm (in development) Requirement for the thinner dies, why: For miniaturized devices For better thermal management With courtesy of Microsys Extract from Sensor expo presentation in

18 Miniaturization aspects - Bare die vs. SMD Example of thinned die 750µm 50µm S.Stoukatch: research at IMEC Functional die before and after thinning 18 With courtesy of Microsys Extract from Sensor expo presentation in 2010

19 Miniaturization aspects - Packaging Why is FC method interesting? Performance The shortest possible interconnection between die and substrate Functionality Greatest I/O flexibility (area and perimeter bond pad distribution), greater I/O Miniaturization Smaller size Cost (product dependent) Main drivers for FC: Performance: RF application (example: GaAs die) Miniaturization (CSP) With courtesy of Microsys Extract from Sensor expo presentation in

20 Miniaturization aspects - Packaging FC for higher density integration die substrate wire die wire substrate With courtesy of Microsys Extract from Sensor expo presentation in

21 Miniaturization aspects - Packaging FC versus Wire bonding Wire bonding is still more matured technology Cost effective Flexible Recent progress in Wire bonding Wire length (down to 0.5mm) Wire diameter: 25µm standard, down to 10µm Wire bonding speed: 30wires/second With courtesy of Microsys Extract from Sensor expo presentation in

22 Partial conclusion A lot of existing technologies existing to obtain your miniaturized microsystem. Need for selecting the good one to be cost effective and reliable. 04/05/

23 Case studies 3 case studies to be placed on the chain of value: Wireless smart sensor/microsystem Stacked of a high density hybrid Flying sensor 04/05/

24 Why a microsystem? Case study N 1 General recap: We need to answer to an end user request (whatever the need) Vibration Temperature : -10 to 150 C Picture from Larousse dictionnary Arcelor Mittal (Liege, Belgium) 04/05/

25 What is the request? 04/05/

26 Confidentiel Potential solution? Yes, if: Reliable Efficient Easy to install The technologies to build it are available on the market And if the end user accept to use it 5/4/

27 Case study N 2 Request from customer - Scale down of an already designed solution. Technical need? Remaining the same technical characteristics (ex: wireless long range communication) Real need? Cost of the packaging lower than x Hybrid packaging 04/05/

28 Case study N 3 Request from customer Packaging of a flying sensor Technical need? Make some package of the solution for testing Real need? Efficient and robust solution at low cost in case of production 04/05/

29 Conclusions Packaging is an actor of the chain of value Never forget that the microsystem needs to answer to a request be sure that all the chain of value is ready to respond to that need. Step by step approaches are always possible if the actor(s) is (are) aware about the chain of value. Packaging is a part of the answer for innovative development of MEMS. 04/05/

30 Contact Michel Saint-Mard: Managing director Tel: /05/