Micro-PackS, Technology Platform. Security Characterization Lab Opening

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1 September, 30 th 2008 Micro-PackS, Technology Platform Security Characterization Lab Opening Members :

2 Micro-PackS in SCS cluster From Silicium to innovative & commucating device R&D structure, gathering public laboratories and private companies to stimulate innovation in the frame of the competitiveness cluster Secured Communication Solutions. 2/17

3 Micro-PackS mission dedicated to Smart Card, RFid tag technologies and new generation of personal &contacless devices Missions Serve the regional community and its development towards new markets focused on secured communicating objects. Share R&D investments Lead programs in the field of innovative solutions Promote synergies between academics and business. 3/17

4 Micro-PackS target Smart card technology and new generation trusted devices New generation Support development of technology building blocks trusted devices 4/17

5 Micro-PackS is mainly hosted by the «Ecole des mines de Saint Etienne» on Georges Charpak site Micro-PackS OFFICE Clean room Security Lab 100 m 2 Security characterization lab for die and device 650 m 2 clean rooms Micropackaging prototype line Printed electronics platform Micro-fabrication and test facilities RF pre-certification (13,56 MHz) lab hosted by ISEN-IM2MP,Toulon 5/17

6 Micro-PackS today Scientific equipment ( characterization, modelling, imaging..) Micro-PackS means Micropackaging Pilot line jet printing, Laser ablation Thin layer Security Characterization Of die & devices Pre-certification Contactless devices coating Packaging Polymer Development of Innovative Products/ Projects (members) On flexible & low-cost substrate Electronic : Antennas Interconnection Low cost Contactless & personal Devices TTM Sensors.. 6/17

7 Micropackaging prototype line a tool dedicated to innovative device production 300 mm grinder ( > 50 µm) Electroless bumping Wafer mounting Wafer sawing Stud bumping Pick & place Die attach Flip-chip Wire bonding (Au, Al) Encapsulation 7/17

8 Printed electronics platform electronics with printing technologies Specifications: Substrate holder (30cm x 30 cm), mobile (1,5 m/s) and heated ( C) Atmospheric plasma surface treatment Automatic positioning by image analysis 3 piezoelectric inkjet heads: 256 nozzles, 80 pl, 287 dpi UV, IR and microwave iannealing Ps laser : 1.064, 0.532, 0,355 nm Spray deposition + characterization tools 8/17

9 Micro-fabrication facilities (200 m2, C1000 clean room) Thin film deposition Evaporators (Joule / e-gun): metals, organic materials Reactive sputter deposition : Si, Al, SiO2, Si3N4 Etching Wet benches RIE with laser end point detection Lithography (4 ) Contact mask aligner Spin coaters Hot plates Rapid thermal annealer 9/17

10 Test & characterization Electrical 4 probe station 1.6 GHz parameter analyzer Optical Spectroscopic ellipsometer Profilometer Microscopes Nano-indenter Profilometer Pull test Surface tension goniometer Others SEM AFM Micro-Raman spectroscopy Acoustic microscope X ray microscope 10/17

11 Contactless pre-certification RF 13,56 MHz Lab available in TOULON (IM2MP-ISEN) 2009, new lab focus on HF-UHF Tag In Marseille (IM2MP) RF lab is hosted by ISEN, Toulon 11/17

12 Security characterization lab Opening in 2008 Thanks to cooperative BTRS and CALISSON projects. involved members : EMSE-LETI, ST, GEMALTO Lab splitting : Basic «laser fault Injection» lab «electric Test» lab «SPA/DPA»lab «SEMA/DEMA»lab Ongoing development lab «contactless»lab advanced «laser fault Injection» lab 12/17

13 Global view on investment Investment splitting: - scientific equipment - dedicated labs, focus on projects : 8 M available >Polymer electronic (Project MICROPOLY) >Micro-packaging & reliability (Project PUF) >Security (Projects BTRS andcalisson ) >Contactless (Project CPC) Investment 2008 Equipements breakdown (Cumul) CPA/FEDER MO scientific equipment MS polymer Electronic MS contactless pre-certif MS chip Security carac. MS Micro-packaging carac. MS Micro-packaging, test &re... CG/CR/FEDER 13/17

14 How to use platform équipement As Member : Free access Opportunity to be involved in priority management Fix Annual fees ( 2008 ref): Industrial : 150k SME : 17 k Very small SME: 6k Academic : 10k but free ressources contribution As Customer Available Price list Special discount for ARCSIS ans SCS members: 30 % Special discount for academic: 50 % example : Laser Lab : 250 per day Management on: https: //ssl.arcsis.org/cimpaca.html 14/17

15 Access to equipment Non-member Demand of use and support (PDF) PROPOSAL Demand of adhesion Validation of the board Member Demand of use and support (website) No Order validation? Validation of eqpt responsible No Yes Yes Equipment Equipment Invoicing (,$,...) 15/17

16 16/17

17 Thank You for your attention to contact Micropacks : Platform Manager : Michel Thomas : michel.thomas@arcsis.org Cean room Manager: Gaëlle Rondeau rondeau@emse.fr Security Labs Manager: Anne-Lise Ribotta ribotta@emse.fr https: //ssl.arcsis.org/cimpaca.html 17/17

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