Application of 3D PLUS WDoD technology for the manufacturing of electronic modules 25/02/2017 for implantable medical products

Transcription

1 Application of 3D PLUS WDoD TM technology for the manufacturing of electronic modules for implantable medical products By Dr Pascal Couderc 1, Karima Amara², Frederic Minault 2 3D PLUS 1 408, Rue Hélène Boucher BUC France Phone: LIVANOVA 2 4 avenue Réaumur CLAMART France Phone: Pascal Couderc Application of 3D PLUS WDoD technology for the manufacturing of electronic modules 25/02/2017 for implantable medical products Buc, France p1

2 Outline 3D PLUS introduction Core Technologies WDoD Fan out Wafer Level Package Example of medical application 1 Example of medical application 2 Conclusion p2

3 Outline 3D PLUS introduction Core Technologies WDoD Fan out Wafer Level Package Example of medical application 1 Example of medical application 2 Conclusion p3

4 3D PLUS Corporate Profile French Company founded in 1995 Privately owned (HEICO, HEI on NYSE) Locations: Buc, France Fremont CA, USA Headquarters BUC, France Tech. Center USA Fremont, CA, USA Manufacturer of electronic products and System in Package for high reliability and high performance product applications ISO-9001:2008 certified ESA, CNES qualified manufacturing line for Space Applications One of the Largest Space Qualified MCM Manufacturer located in Europe (ITAR FREE) Flight proven for 14 years: modules in space end of Q p4

5 LIVANOVA Corporate Profile p5

6 Outline 3D PLUS introduction Core Technologies WDoD Fan out Wafer Level Package Example of medical application 1 Example of medical application 2 Conclusion p6

7 Core technologies 1 ) - Flex Design 4 ) Layers Stacking 5 ) Cube Molding FLOW 2 process 7 ) Cube Plating ( Ni + Au ) 2 ) Components attachment 8 ) Circuit interconnection by laser grooving 3 ) - Circuit Test & Screening 6 ) Cube Sawing 9 ) Cube Test & Screening p7

8 Outline 3D PLUS introduction Core Technologies WDoD Fan out Wafer Level Package Example of medical application 1 Example of medical application 2 Conclusion p8

9 WDoD TM technology WDoD (1) initial criteria Use of multi sourcing wafers Stacking of 5 to 10 levels per mm Size: 200µm around the larger Die Stacking of Known Good Rebuilt Wafer (KGRW) Possibility of several dice of different dimensions of the same level Parallel processing/panelization from A to Z Possibility to stack PCB levels ( flow 2) and rebuilt wafers in order to optimize performances and costs (1) Wirefree Die on Die Trade Mark from 3D Plus p9

10 WDoD TM technology p10

11 WDoD TM technology Dielectric passivation layer Metal track 2D routing: RDL Al Pads Si Molding resin p11

12 WDoD TM technology Fan-Out main technologies and actors ( source : YOLE 2016) p12

13 WDoD TM technology RDL example :DDR3 lay-out > MODULE Quad Die DDR3 p13

14 WDoD TM technology 300 mm wafer Single unit 2 layers RDL with ground plane Via interconnect at Al pad level RDL cross section p14

15 WDoD TM technology p15

16 WDoD TM technology Laser patterning p16

17 WDoD TM technology Similar technology than standard 3D-Plus technology Huge shrinkage allowing small form factor components p17

18 WDoD TM technology PoP and WDoD package relative sizes p18

19 Outline 3D PLUS introduction Core Technologies WDoD Fan out Wafer Level Package Example of medical application 1 Example of medical application 2 Conclusion p19

20 Example of medical application 1 Development in the frame of French PIA project (INTENSE) dedicated to neurostimulation for severe conditions, particularly refractory heart failure. One of the challenge was to reach a low volume for the device. With standard dice assembly process (COB, die stacking), specified volume could not be achieved Bill of material only contains dies ( ASICs and PICS) WDoD with Fan-Out levels is a good candidate p20

21 Example of medical application 1 Module structure : 2 levels with Fan-Out Maximum die dimensions = 10 x 8 mm 1 connectic level multilayer PCB with BGA solder balls p21

22 Example of medical application 1 2D Fan-Out has been designed versus the Design-Rules of Nanium Gap minimum between adjacent dies= 200 µm Proximity visible on reverse side below p22

23 Example of medical application 1 Example of design with 2 nd level is given below: p23

24 Example of medical application 1 Pannelisation on the 300mm wafer has been performed in order to obtain 42 modules per wafer For prototyping, modules are stacked by pairs p24

25 Example of medical application 1 Side view with 250 µm pitch laser General view p25

26 Example of medical application 1 Several tens of modules were manufactured by 3D PLUS Functional tests were performed with success This product is a good example of what can be produced with WDoD technology This module is dedicated to be assembled on a PCB as a standard BGA component WDoD BGA modules are qualified according JEDEC MSL3@260 C p26

27 Outline 3D PLUS introduction Core Technologies WDoD Fan out Wafer Level Package Example of medical application 1 Example of medical application 2 Conclusion p27

28 Pacemaker Market More than pacemakers and more than defibrillators are implanted in the world each year Forecast global market revenue for pacemakers for 2020 is $5.3 bn All these devices need 3D heterogeneous integration to reduce the size of the electronics. Current technology is based on hybrid technology Leadless pacemakers are expected to be very innovative for the CRM (Cardiac Rhythm Management) industry, especially in the US and EU by eliminating the need for lead replacement. p28

29 Leadless pacemaker Pacemaker under skin vena cava aorta pulmonary artery right atrium Cardiac Resynchronization Therapy (CRT-D) right ventricle Leadless pacemaker p29

30 Example of medical application 2 MANpower FP7 NMP was launched in 2013 in order to develop a new leadless pacemaker system to be inserted in the cylindrical capsule, with LIVANOVA as prime 3D PLUS had the responsability to develop a new 3D module using its WDoD technology The BOM included a lot of SMD components and only one ASIC die The strategy would have been to stack one Fan-Out level with the die and other PCB levels with SMD components But due to time-schedule, we had to find another solution than Fan-Out for the level with the ASIC p30

31 Example of medical application 2 FLOW 3.5 ALTERNATIVE : 1. CONCEPT : FLAT WIREBONDING OVERMOLDING GRINDING STACKING DICING Patent deposited: «Procédé d Interconnexion Chip on Chip miniaturisée d un module electronique 3D», French Patent N FR , February 19, H can be limited to 100 µm with current WB equipment We decided to built the level with die With Flow 3,5 technology p31

32 Example of medical application 2 3D module has to fit with the volume available in a cylinder of 6 mm diameter and a maximum lenght of 6 mm All the SMD components were placed on 2 class 11 PCB. Some of them were on external sides Level with ASIC was placed in the middle of the module. p32

33 Example of medical application 2 Final dimensions of the module are in the specified limits Xray picture PCB 1 LEVEL FLOW3.5 LEVEL PCB 2 LEVEL p33

34 Example of medical application 2 MEMS CAPACITORS ZENERS Laser pitch at the die level is 150 µm pitch p34

35 Example of medical application 2 Integration of 3D PLUS module has been optimized by LIVANOVA p35

36 Example of medical application 2 Some pictures of 3D PLUS module integrated in the plastic frame: Electronic PCB-Flex-folded vs Electronic 3D PLUS module, same BOM for each technology : 3D PLUS module length = 65% of flex-folded solution length p36

37 Example of medical application 2 This example shows the interest of 3D PLUS technology for challenging dimensions with or without Fan-Out technology When design is adapted, Flow 3,5 technology can be used : When straight lines are acceptable When one layer routing is enough Moreover, more conventional pacemakers and defibrillators could take benefits of this technology compared with hybrid technology and /or folded technology. p37

38 Outline 3D PLUS introduction Core Technologies WDoD Fan out Wafer Level Package Example of medical application 1 Example of medical application 2 Conclusion p38

39 Conclusions The interest of WDoD with or without Fan-Out level ( Flow 3.5) has been shown in 2 examples of implantable applications where competitive technologies like Chip-On-Chip, Flex Folded or Hybrid technology would not have permitted the form-factors expected. WDoD or Flow3.5 allows 3D stacking of heterogeneous Bill of Material with mature 2D technologies ( PCB, Fan-Out) BGA modules or modules with specific connections can be obtained with this technology. p39

40 Acknowledgment This work has been supported by : -the French PSPC project INTENSE, -the FP7 NMP MANpower project We want to thank NANIUM for their expertise for the design and manufacturing of 2D Fan-Out levels p40

41 Thanks for your attention Questions? 3D PLUS 408, rue Hélène Boucher Buc - France D PLUS USA Inc. Tech Center 910 Auburn court Fremont, CA, USA (510) p41