PCB technologies and manufacturing General Presentation

Transcription

1 PCB technologies and manufacturing General Presentation 1 Date : December 2014

2 3 plants for a global offer dedicated to the European market and export Special technologies, Harsh environment PCB for space industry ESA qualified Prototypes and small volumes, short lead time CIMULEC Group is mainly focused on military, aeronautics and space markets (75%) Prototypes, small and medium volume, in short lead time 170 people 22 M, second french group in PCB production 2 Date : December 2014

3 More than 30 years of technologies Applications : Avionics Defense Space Others Our will : propose innovative solutions according to our customer expectations, needs and constraints, and support them during the whole life of their projects. 3 Date : December 2014

4 Product technologies Standard products Special products Double sided PCB Multilayer PCB from standard plated through holes to sequential multilayer (buried and/or blind via holes) Multilayer PCB with microvias Rigid-Flex PCB Multilayer PCB with metal core Multilayer with external heat sink Impedance controlled PCB Mixed material PCB Microwave PCB PCB with embedded resistors Note for Microvias : Type I, II, or III according to IPC / JPCA Date : December 2014

5 CIMULEC in 2014 CIMULEC Ennery: o Strategy : Production of small and medium series dedicated to the professional sectors (aeronautics, defense and space) o High technology and high reliability for harsh environment o 9,3 M, export 38 % o 75 people o Surfaces plant : 4200 m² o Certifications : ISO 9000V2000, EN9100, polyimide multilayers and rigid-flex technologies (MIL) o Mains programs : Rafale, Eurofighter, Iridium Next, missiles, marine, 5 Date : December 2014

6 SYSTRONIC in 2014 SYSTRONIC Les Ulis: o Strategy : Production of small and medium series dedicated to the spatial sector (70%) and aeronautics (30%) o High technology and high reliability for harsh environment o 6 M, export 35% o 46 people o plant : 2000 m² o Certifications : ISO 9000, EN9100, ESA qualified, CNES qualified o Mains programs : European satellites, M51, Rafale o PCB for space industry : 70 % of our production 6 Date : December 2014

7 CSI in 2014 CSI Sud-Ouest Toulouse: o Strategy : prototypes, small series, short lead time for various o markets (Aeronautic and Military : 60%, Space : 5%, Industry : 35%) o Fast prototyping of complex products o 5,7 M, export 5% o 47 people o Surfaces plant : 2000 m² o 310 customers o Certifications : ISO 9000V2000, EN9100, UL 94V0 o Main programs : NH90, Dauphin, Tigre, A380, A400M, Falcon 7X, ARJ21, 7 Date : December 2014

8 Special Printed Circuit Board High reliability for harsh environment (thermal excursion, vibration, ) Built with different elementary bricks Options available depending on the application 8 Date : December 2014

9 Advanced technologies Microvias copper filling (Atotech) Embedded resistors (NiP or NiCr thin film) R & D : «Plated through holes thermomechanical simulation in printed circuit boards» 9 Date : December 2014

10 Base materials Epoxy HTg 170 C Low CTE Epoxy Polyimide Adhesiveless flexible material Heat sink : copper / aluminium Metal core : copper invar copper PTFE (Microwave PCB) Other materials (on request) Material manufacturers Cimulec is working with : 10 Date : December 2014

11 Available options Embedded passives : since almost 20 years Cimulec is producing embedded resistors based on thin film (NiP or NiCr) technology Copper Ohmega-foil 25 microsection NiP layer Mechanical blind holes with depth control Backdrills : improve buildup (less drilling sequences) and minimize antenna phenomenon 11 Date : December 2014

12 Available options RF openings : avoid issues with signal adaptation and reduces signal losses Internal or external heat sink for thermal management Mixed lay-up as for example PFTE based material and polyimide. Mixing materials has to be manage with care : - CTEz can cause reliability failure - only one prepreg type in one lamination cycle 12 Date : December 2014

13 Surface finish Typical thickness Electrolytic Ni/Au (subcontracted) Electroless Ni / Immersion Gold (ENIG) Immersion Tin Tin Lead reflow Organic Surface Passivation (MecSeal) 5 µm / from 0.5 to 3 µm Ni 4-7 µm ; Au µm > 1µm 7-12 µm 0.2 µm Hot Air Levelling (SnPb) Chemical silver (subcontracted) 0.15 µm Mixed Surfaces on request 13 Date : December 2014

14 Capabilities Standard (µm) Special (µm) Line Space A Line Width B C E D A G F Micro Via Pad Diameter C Micro Via Drill Diameter D Line to Pad Space E Mechanical Drill Diameter F Board Edge to Route Clearance F I B Unplated Hole to Route Clearance I Pad Diameter for Mechanical Drills G H Notes : - values given in this table are minimum that can achieved - Design Rules Check is performed according to the board size and copper thicknesses 14 Date : December 2014

15 Via types and PTHs E A G C F Standard (µm) Special (µm) Diameter of Blind Via (Depth Controlled) A Diameter of Buried Via (Resin Filled) C Diameter of Micro Via (Laser Drilled) E Diameter of Blind Via (Resin Filled) F Diameter of Through Via (Mechanical Drilled) G Aspect Ratio of Blind Via (Depth Controlled) A <=0.8 <= 1 Aspect Ratio of Buried Via (Resin Filled) C <= 8 <= 8 Aspect Ratio of Micro Via (Laser Drilled) E <=0.8 <= 1 Aspect Ratio of Blind Via (Resin Filled) F <= 8 <= 8 Aspect Ratio of Through Via (Mechanical Drilled) G <= 8 <= 8 NOTE: Aspect ratio is the relation between the drill diameter and depth. 15 Date : December 2014

16 Miscellaneous Solder Mask (Probimer HF ) Standard (µm) Special (µm) Solder Mask Line Width Solder Mask Clearance Diameter Solder Mask Coating Thickness 20 N.A. EtchingTolerances Routing Tolerances Standard : according to copper thickness Special : down to 10 µm on agreement Standard : 150 µm Special : 100 µm Laser routing : 40 µm Board Size Standard : up to 580 x 467 mm Special : greater on request Overall Thickness : up to 5.0 mm 16 Date : December 2014

17 Polyimide SBU with stacked µvias Sequential build-up using polyimide material 22 layers 3 level of stacked µvias 17 Date : December 2014

18 RF and Microwave Standard multilayer 8 layers board full Rogers 4003 Prepreg Rogers 4450 Dk : 3.54 Df : Microsection picture Sequential build-up using polyimide prepreg (antenna application) Date : December 2014

19 SBU RF board 19 Date : December 2014

20 Ohmega Layers OhmegaPly resistors : - 96 resistors implemented on 3 different layers in the BGA (pitch 0.8 mm) region. - Resistor nominal value : 700 Ohms - Resistor dimensions : 1960 x 280 µm - Ohmegafoil characteristic : layers board with 3 drilling sequences dimension : 330x230 mm thickness : 3 mm aspect ratio : 10 mixed materials impedance controlled, 3 resistive layers, pad-on-hole technology, backdrilling with three different height, surface finish : ENIG and electrolytic AuCo 20 Date : December 2014

21 Mixte HDI board GPY/RO Date : December 2014

22 Inspection report - Qualification and conformance inspection according to MIL-PRF Qualification and conformance inspection according to MIL-P IPC-6011, 6012, 6013, 6016 class I, II or III - ECSS-Q and ECSS-Q According to your requirements - Acceptability of printed boards according to IPC-600 class III or ECSS - Electrical Test : flying probes ; test voltage : up to 500 V DC (> 10 M ) 22 Date : December 2014

23 We can offer to our customers o Capacity to manage simple and high tech products for demanding markets o Co-design for special PCB o Confidently relationship o High reactivity o Reliable quality system o Industrial synergy between the 3 plants o Continuous improvement process o Suppliers strategy o Industrial and humans regulars investments 23 Date : December 2014